JPH0712699B2 - Thermal print head device - Google Patents

Thermal print head device

Info

Publication number
JPH0712699B2
JPH0712699B2 JP60236875A JP23687585A JPH0712699B2 JP H0712699 B2 JPH0712699 B2 JP H0712699B2 JP 60236875 A JP60236875 A JP 60236875A JP 23687585 A JP23687585 A JP 23687585A JP H0712699 B2 JPH0712699 B2 JP H0712699B2
Authority
JP
Japan
Prior art keywords
lead
wiring board
head
leads
common
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60236875A
Other languages
Japanese (ja)
Other versions
JPS6295249A (en
Inventor
弘朗 大西
博 福本
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP60236875A priority Critical patent/JPH0712699B2/en
Publication of JPS6295249A publication Critical patent/JPS6295249A/en
Publication of JPH0712699B2 publication Critical patent/JPH0712699B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Electronic Switches (AREA)

Description

【発明の詳細な説明】 （産業上の利用分野） この発明はサーマルプリントヘッド装置に関する。TECHNICAL FIELD The present invention relates to a thermal print head device.

（従来の技術） 周知のようにこの種サーマルプリントヘッド装置は、セ
ラミック製の基板の表面に設けられた発熱部と、これか
ら導出されてあるリードとよりなるヘッドと、フレキシ
ブルプリント配線板（以下単にFP配線板）とによって構
成される。そしてヘッドのリードをFP配線板のリードと
を接続することによって、前記リードを外部に導出する
ようにしている。(Prior Art) As is well known, a thermal print head device of this type includes a heating portion provided on a surface of a ceramic substrate, a head including leads extending from the heating portion, and a flexible printed wiring board (hereinafter, simply referred to as a head). FP wiring board) and. Then, by connecting the lead of the head to the lead of the FP wiring board, the lead is led to the outside.

第３図は一般のこの種ヘッドを示し、１はセラミックな
どからなる基板、２はその表面に設けられた発熱部で、
図では例として６箇の発熱部を備えたものを示してい
る。３は各発熱部２の一方の端部に接続されてある個別
リード、４は他方の各端部に共通に接続されてある統一
共通リードである。５はFP配線板で、その樹脂製のベー
ス６の一方の面に、前記各個別リード３に接続される個
別リード７と、統一共通リード４に接続される統一共通
リード８とを備えている。FIG. 3 shows a general head of this type, 1 is a substrate made of ceramic or the like, 2 is a heat generating portion provided on the surface thereof,
In the figure, as an example, one having six heat generating parts is shown. Reference numeral 3 is an individual lead connected to one end of each heat generating portion 2, and 4 is a unified common lead commonly connected to each of the other ends. Reference numeral 5 denotes an FP wiring board, which has an individual lead 7 connected to each of the individual leads 3 and an integrated common lead 8 connected to the integrated common lead 4 on one surface of a resin base 6. .

実際にはヘッド１上のリードとFP配線板５上のリードと
は互いに重ね合せてから、半田によって接続されるのが
一般的である。そのためにFP配線板５にはヘッド１の表
面と向い合う面、すなわち図では裏側の面に各リード7,
8が現れるようにし、これをそのままヘッド１の表面に
重ね合わすようにしている。In practice, the leads on the head 1 and the leads on the FP wiring board 5 are generally superposed on each other and then connected by soldering. Therefore, the FP wiring board 5 has the leads 7, 7 on the surface facing the surface of the head 1, that is, the back surface in the figure.
8 is made to appear, and this is directly laminated on the surface of the head 1.

ところでこのような構成は発熱部２の列がヘッド１のほ
ぼ中央あるいは端部からある程度離れたところに設置さ
れてあって、その列の一方の側に統一共通リード４が設
置できる余裕のある空間が存在しているときに限って製
作できる。しかしヘッドの種類によっては発熱部をヘッ
ドの一方の側縁に近接して設置することが要求されるこ
とがある。このような場合は発熱部の列の一方の側とヘ
ッドの側縁との間の空間が狭くなりすぎてしまい、そこ
に前記したような統一共通リードを設置することができ
ないようになる。By the way, in such a structure, the row of the heat generating portions 2 is installed at a position apart from the center or the end of the head 1 to some extent, and there is a space in which the unified common lead 4 can be installed on one side of the row. Can be made only when is present. However, depending on the type of the head, it may be required to install the heat generating portion close to one side edge of the head. In such a case, the space between one side of the row of heat generating portions and the side edge of the head becomes too narrow, and it becomes impossible to install the unified common lead as described above.

これを解決しようとしたのが第４図に示す構成である。
これは各発熱部の２箇を１群としその各群に属する２個
の発熱部2A,2Bの一方の端部を短絡導体９によって短絡
しておき、またひとつの群のひとつの発熱部2Aと、これ
に隣接する他の群に属する他のひとつの発熱部2Bとに共
通する共通リード10を設けたものである。The structure shown in FIG. 4 is intended to solve this problem.
This is because two heat generating parts are set as one group and one end of two heat generating parts 2A and 2B belonging to each group is short-circuited by a short-circuit conductor 9 and one heat generating part 2A of one group is also formed. And a common lead 10 that is common to the other heat generating portion 2B belonging to another group adjacent thereto.

これによれば発熱部の列の一方の側とヘッドの側縁との
間には、幅が狭くてよい短絡導体９を設置するだけの空
間が確保されるだけでよいので、発熱部をヘッドの側縁
に可及的に接近して設置できるようになって都合がよ
い。なおこの構成ではひとつの個別リードとこれに隣合
う共通リードとの間に電圧を印加すれば、両リード間に
ある２箇の発熱部が同時に発熱するようになっている。According to this, a space for installing the short-circuit conductor 9, which may have a small width, may be secured between one side of the row of heat generating parts and the side edge of the head. It is convenient because it can be installed as close as possible to the side edge of the. In this configuration, if a voltage is applied between one individual lead and the common lead adjacent to the individual lead, the two heat generating portions between both leads generate heat at the same time.

しかしこのような構成のヘッドに連なるFP配線板のリー
ドは、ヘッドのリードパターンと合致させなければなら
ない。そのためFP配線板の共通リードは個別リードの間
に点在するようになり、第３図に示すようにすべてを一
括したものにはならない。したがってこのFP配線板に接
続される他の回路との接続作業が極めて煩雑となる。However, the leads of the FP wiring board connected to the head having such a structure must be matched with the lead pattern of the head. Therefore, the common leads of the FP wiring board are scattered between the individual leads, and not all are integrated as shown in FIG. Therefore, the connection work with other circuits connected to this FP wiring board becomes extremely complicated.

（発明が解決しようとする問題点） この発明は発熱部の列をヘッドの側縁に接近して設置し
ても、FP配線板では全ての共通リードを統一して一括す
ることを目的とする。(Problems to be Solved by the Invention) An object of the present invention is to unify and integrate all common leads in an FP wiring board even if a row of heat generating parts is installed close to a side edge of a head. .

（問題点を解決するための手段） この発明はFP配線板として、ヘッドの個別リードおよび
共通リードのそれぞれに接続される個別リードおよび共
通リードと、この個別リードの群の少なくとも一方の側
に並設される統一共通リードと、前記個別リードをまた
いで前記各共通リードを前記統一共通リードに電気的に
接続する接続リードとを設け、このFP配線板をヘッドに
重ねてそれぞれの個別リードと、それぞれの共通リード
とを互いに接続したことを特徴とする。(Means for Solving the Problems) As an FP wiring board, the present invention includes an individual lead and a common lead connected to each of the individual lead and the common lead of a head, and at least one side of the group of the individual leads. A unified common lead to be provided and a connection lead that electrically connects each common lead to the unified common lead across the individual leads are provided, and each FP wiring board is overlaid on the head, and each individual lead, It is characterized in that the respective common leads are connected to each other.

（実施例） この発明の実施例を第１図乃至第２図によって説明す
る。ここに使用するヘッドは第４図に示したものとほぼ
同じで、これに図のようなFP配線板５を使用する。この
FP配線板５の面（図では裏側）に、ヘッド１の個別リー
ド３に接続される個別リード７と、共通リード10に接続
される共通リード11と、前記個別リード７の群の少なく
とも一方の側に並設される統一共通リード12と、共通リ
ード10を前記統一共通リード12に接続する接続リード13
が設けてある。(Embodiment) An embodiment of the present invention will be described with reference to FIGS. The head used here is almost the same as that shown in FIG. 4, and the FP wiring board 5 as shown in the figure is used for this. this
On the surface (back side in the figure) of the FP wiring board 5, at least one of the individual leads 7 connected to the individual leads 3 of the head 1, the common lead 11 connected to the common lead 10, and the individual lead 7 is provided. Side common side common lead 12 and connecting lead 13 for connecting the common lead 10 to the common side common lead 12
Is provided.

具体的にはFP配線板５の先端側に共通リード11を、また
この各共通リード11と隔離され、FP配線板５の後端側に
向かって延びるように個別リード７を設け、また共通リ
ード11の端部に連なるように接続リード13を設ける。接
続リード13はFP配線板４をヘッド１に重ねたとき、個別
リード３を絶縁してまたぐようにする。そのために接続
リード13の表面を絶縁性のカバーレイ14で覆っておく。Specifically, the common lead 11 is provided on the front end side of the FP wiring board 5, and the individual lead 7 is provided so as to be separated from each common lead 11 and extend toward the rear end side of the FP wiring board 5. A connection lead 13 is provided so as to be continuous with the end of 11. The connection leads 13 insulate and straddle the individual leads 3 when the FP wiring board 4 is placed on the head 1. Therefore, the surface of the connection lead 13 is covered with an insulating cover lay 14.

なお図では共通リード11と個別リード７との隔離のため
にFP配線板５のベース６に孔15を設け、この孔15の一方
の側縁に共通リード11の端部が、また他方の側縁に個別
リード７の端部がのぞむむように設置しておくとよい。
16は個別リード７、統一共通リード12の表面を覆うカバ
ーレイである。In the figure, a hole 15 is provided in the base 6 of the FP wiring board 5 for separating the common lead 11 and the individual lead 7, and one end of the hole 15 has an end portion of the common lead 11 and the other side. It is advisable to install the ends of the individual leads 7 at the edges.
Reference numeral 16 is a coverlay that covers the surfaces of the individual leads 7 and the unified common lead 12.

以上の構成において、ヘッド１の端部にFP配線板５の端
部を重ね合せ、ヘッド１の共通リード10の先端とFP配線
板５の共通リード11とが重ね合わされるようにし、また
ヘッド１の個別リード３とFP配線板５の個別リード７同
志とが重ね合わされるようにし、各重ね合わされたリー
ドを半田などで接続する。In the above structure, the end of the FP wiring board 5 is overlapped with the end of the head 1 so that the tip of the common lead 10 of the head 1 and the common lead 11 of the FP wiring board 5 are overlapped. The individual leads 3 and the individual leads 7 of the FP wiring board 5 are superposed on each other, and the superposed leads are connected by soldering or the like.

このようにすれば、ヘッド１の表面において個別リード
３、共通リード10が入り乱れて存在していても、共通リ
ード10はFP配線板５の共通リード11および接続リード13
を介して統一共通リード12に一括接続されるようにな
る。したがってFP配線板としては第３図に示したと同様
に、個別リードの一括された群と、その一方の側に並設
される統一共通リードとによって構成することができる
ようになる。By doing so, even if the individual leads 3 and the common leads 10 are present on the surface of the head 1 in a disordered manner, the common leads 10 will be the common leads 11 and the connection leads 13 of the FP wiring board 5.
It will be collectively connected to the unified common lead 12 via. Therefore, as shown in FIG. 3, the FP wiring board can be composed of a group of individual leads and a unified common lead arranged in parallel on one side thereof.

なお図では統一共通リード12を個別リード７の群の一方
の側のみに設けているが、その両側に設けるようにして
もよい。Although the unified common lead 12 is provided only on one side of the group of individual leads 7 in the figure, it may be provided on both sides thereof.

（発明の効果） 以上詳述したようにこの発明によれば、発熱部の列をヘ
ッドの側縁に接近して設置しても、FP配線板では全ての
共通リードを統一して一括することができるとともに、
統一共通リードを個別リードの群のいずれかの側に並設
することができるといった効果を奏する。(Effects of the Invention) As described in detail above, according to the present invention, it is possible to unify all common leads in the FP wiring board even if the row of the heat generating portion is installed close to the side edge of the head. As well as
It is possible to arrange the unified common lead side by side on either side of the group of individual leads.

【図面の簡単な説明】[Brief description of drawings]

第１図はこの発明の実施例を示す平面図、第２図は同断
面図、第３図は従来例の平面図、第４図はヘッドの平面
図である。 １……ヘッド、2A,2B……発熱部、３……個別リード、
５……FP配線板、７……個別リード、９……短絡導体、
10……共通リード、11……共通リード、12……統一共通
リード、13……接続リード、FIG. 1 is a plan view showing an embodiment of the present invention, FIG. 2 is a sectional view of the same, FIG. 3 is a plan view of a conventional example, and FIG. 4 is a plan view of a head. 1 ... Head, 2A, 2B ... Heating part, 3 ... Individual lead,
5 ... FP wiring board, 7 ... individual lead, 9 ... short-circuit conductor,
10 …… Common lead, 11 …… Common lead, 12 …… Unified common lead, 13 …… Connection lead,

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】ヘッドの表面に設けられてあるプリント用
の複数の発熱部につき、その各２個を１群とし、その各
群に属する２個の発熱部の一方の端部を短絡導体によっ
て短絡し、またひとつの群のひとつの発熱部と、これに
隣接する他の群に属しかつ前記ひとつの発熱部に隣接す
る発熱部とに共通する共通リードを、および隣合わない
発熱部に個別リードを、前記共通リードに並べて設け、 またフレキシブルプリント配線板には孔を設け、個別リ
ードをその端部が前記孔の向い合う一方の側縁にのぞむ
ように並べて設置し、共通リードをその端部が前記孔の
向い合う他方の側縁にのぞむように並べて設置し、更に
前記個別リードの群の少なくとも一方の側に並設される
統一共通リードと、前記個別リードをまたいで前記各共
通リードを前記統一共通リードに接続する接続リードと
を設け、 前記フレキシブルプリント配線板を前記ヘッドに重ね合
わせて、前記ヘッドの個別リードと共通リードとを、前
記フレキシブルプリント配線板の個別リードと共通リー
ドとに互いに重ね合わして接続してなるサーマルプリン
トヘッド装置。1. A plurality of heat generating parts for printing provided on the surface of the head, each two of which form one group, and one end of the two heat generating parts belonging to each group is formed by a short-circuit conductor. Short-circuited, and a common lead common to one heat generating part of one group and a heat generating part that belongs to another group adjacent to this and is adjacent to the one heat generating part, and separate heat generating parts not adjacent to each other. Leads are arranged side by side with the common lead, holes are formed in the flexible printed wiring board, and individual leads are arranged side by side so that the ends of the flexible printed wiring board can be seen on one side edge of the hole. Parts are arranged side by side so as to look at the other side edge of the hole facing each other, and further, a unified common lead is provided side by side on at least one side of the group of individual leads, and each common lead across the individual leads. The above A connecting lead connected to one common lead, the flexible printed wiring board is superposed on the head, and the individual lead and the common lead of the head are separated from each other to the individual lead and the common lead of the flexible printed wiring board. A thermal print head device that is connected by overlapping.
JP60236875A 1985-10-22 1985-10-22 Thermal print head device Expired - Fee Related JPH0712699B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60236875A JPH0712699B2 (en) 1985-10-22 1985-10-22 Thermal print head device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60236875A JPH0712699B2 (en) 1985-10-22 1985-10-22 Thermal print head device

Publications (2)

Publication Number Publication Date
JPS6295249A JPS6295249A (en) 1987-05-01
JPH0712699B2 true JPH0712699B2 (en) 1995-02-15

Family

ID=17007085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60236875A Expired - Fee Related JPH0712699B2 (en) 1985-10-22 1985-10-22 Thermal print head device

Country Status (1)

Country Link
JP (1) JPH0712699B2 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5874541U (en) * 1981-11-16 1983-05-20 沖電気工業株式会社 thermal head
JPS58120047U (en) * 1982-02-12 1983-08-16 沖電気工業株式会社 thermal head
JPS6221559A (en) * 1985-07-20 1987-01-29 Ricoh Co Ltd Thermal head

Also Published As

Publication number Publication date
JPS6295249A (en) 1987-05-01

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