JPH07120850B2 - Terminal joining method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal connecting method for interconnecting a plurality of connecting terminals, and particularly to a method for accurately aligning connecting terminals having a large number of terminals and a narrow pitch. It is about.

[Conventional technology]

As a method of connecting a plurality of terminals to each other, Japanese Patent Application Laid-Open No. 60-1584
There is something shown in 22. Conventionally, in this type of multi-terminal connection, it is very important to accurately align the terminals to be connected, and it is important to improve the accuracy of pattern formation, to reduce the relative expansion and contraction dimensional error between materials with small dimensional changes and the materials to be connected. We have dealt with small material selection.

[Problems to be solved by the invention]

However, in the above-mentioned conventional technique, since the connection terminal width and the terminal pitch are made constant over the entire connection region, there is a drawback that the relative positional deviation between the connection terminals becomes large as the distance from the alignment reference point increases. It was

An object of the present invention is to eliminate the above-mentioned drawbacks and to reduce the displacement amount as a whole by averaging the displacement amounts in all connection regions.

[Means for solving problems]

The above object is achieved by changing the width of the connection terminal according to the terminal arrangement position.

[Action]

In other words, regarding the width of the terminals to be interconnected, by making the width of the terminals farther from the reference point wider than the width of the terminals near the alignment reference point, the positional deviation between terminals at positions far from the reference point becomes relatively large. Can be kept small.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a plan view in which the connection terminals are aligned, and the connection terminals 2 and 3 are formed on the upper surface of the printed board 1 using a glass epoxy base material. Lead terminals 5 connected to the connection terminals 2 and 3 are formed on the tape substrate 4 using a polyimide base material in a shape with one end protruding. A connection terminal shape and arrangement near the alignment reference point
B shows the shape and arrangement of the connection terminals at positions apart from the alignment reference point. It is assumed that the terminal width of the connection terminal 2 at the A position is b _A , the terminal width of the connection terminal 3 at the B position is b _B, and the terminal width of the lead terminal 5 is w. The dimensional relationships of b _A , b _B and w are b _A > w and b _B > b _A.

In the above configuration, the connection terminals 2 and 3 and the lead terminal 5
The procedure for alignment with and is shown below. First printed circuit board 1
Is fixed, and the tape substrate 4 is arranged so that the lead terminals 5 on the tape substrate 4 overlap the connection terminals 2 on the printed circuit board. In this state, the parallelism between the printed board 1 and the tape board 4 is adjusted to make the overlapping lengths of the connection terminals 2 and 3 and the lead terminal 5 at the A position and the B position equal to each other. Next, at the position A , the tape substrate 4 is moved in parallel to the printed circuit board 1 to a position where the center lines of the connection terminal 2 and the lead terminal 5 overlap each other, and the alignment is completed.

In FIG. 2, the terminal pitch is changed at the A position and the B position, and the other components are the same as in FIG. In FIG. 2, the terminal pitch at the A position is p _A , the terminal pitch at the B position is p _B, and the relationship between p _A and p _B is p _B > p _A. In such a structure, the alignment is performed by the same procedure as described with reference to FIG.

In FIG. 3, the B'position is arranged between the A position and the B position, and
The width of the connection terminal 6 at the position is b _B ′ and the terminal pitch is p _B ′, and the relationship between b _A and b _B ′ b _B is b _B > b _B ′> b _A and p _A ,
The relation between p _B ′ and p _B is p _B > p _B > p _C. In such a configuration, the alignment is performed by the same procedure as described with reference to FIG.

Since p _B > p _{A in the} configuration shown in FIG. 2, there is an effect that the terminal interval is not changed even if the connection terminal width is widened. That is, in FIG. 2, the gap between the widths of the patterns of the connection terminals is made constant. Third
Since the configuration shown in the figure can change the terminal width in proportion to the distance from the alignment reference point, it has the effect of averaging the relative positional deviation amount in the entire connection area.

Although the printed wiring board of the glass epoxy base material is used for one of the substrates in the above embodiment, it is naturally applicable to paper epoxy board other than the glass epoxy base material, paper phenol board, ceramic material and glass base material. Is. Further, the other base material is not limited to the polyimide base material.

Although FIG. 1 to FIG. 3 show an example in which the connection terminal width and the terminal pitch are hierarchically changed, a case where they are continuously changed is naturally included.

〔The invention's effect〕

As described above, according to the present invention, it is possible to sufficiently absorb by the connection terminal in which the width of the terminal alignment deviation due to the expansion and contraction variation of the substrate material at the position away from the alignment reference position is widened, and the conventional defects can be completely eliminated. This makes it possible to simplify the alignment process and greatly improve the connection yield.

[Brief description of drawings]

 1 to 3 are plan views of an embodiment of the present invention. 1 ... Printed circuit board, 2 ... Connection terminal, 4 ... Tape board, 5 ... Lead terminal,

Claims (1)

[Claims] 1. One substrate having a plurality of connection terminals,
In the terminal joining with the other substrate having the lead terminal for interconnecting with the terminal, the width of the lead terminal is made constant, and the width and pitch of the connecting terminal are continuous or hierarchical according to the direction away from the reference point. The terminal joining method is characterized in that the width of each pattern of the connection terminal is made constant and the gap between the widths is made constant.