JPH07114182B2 - Method for producing dry plate in charged particle beam exposure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A step of coating and forming at least a single-layer resin film on a dry plate so as to extend from a region where this layer is formed to a region where this layer is not formed, and then this On the resin film,
A step of forming a water-soluble conductive layer so as to extend from an area overlapping with the layer in the same plane to an area where the layer is not formed, and then, passing through the conductive layer and the resin film to form the layer Electrically contacting the conductive pin with the conductive pin, then irradiating the resin film with a charged particle beam to discharge the electric charge accumulated in the resin film through the conductive pin, and then washing the dry plate with water. And a step of removing the water-soluble conductive layer, the method for producing a dry plate in charged particle beam exposure.

[Industrial application field]

The present invention relates to a dry plate manufacturing method, and more particularly to improvement of a dry plate manufacturing method in charged particle beam exposure.

In the process of manufacturing a dry plate used for manufacturing a semiconductor device, when a pattern of a metal layer is formed by charged particle beam exposure, if a portion around the dry plate where the metal layer does not exist is exposed to the charged particle beam, this part is exposed. Due to the charge-up, the irradiation direction of the charged particle beam is deviated, and the pattern is deviated.

Under the circumstances as described above, there is a demand for a method of manufacturing a dry plate in charged particle beam exposure, which is capable of irradiating a charged particle beam without causing charge-up.

[Conventional technology]

As shown in FIG. 3, the conventional method for manufacturing a dry plate in electron beam exposure is to apply a resist 2 to the surface of the dry plate 1 to be subjected to electron beam exposure, and attach a conductive pin 5 to a holder 4 on which the dry plate 1 is placed. The charge is released to the holder 4 by contacting the chrome layer 1b so that charge-up does not occur.

The conventional manufacturing method will be described in order of steps with reference to FIG.

First, as shown in FIG. 4 (a), a resist 2 is applied to the surface of the dry plate 1 on which the chrome layer 1b is provided.

Next, as shown in FIG. 4 (b), the dry plate 1 is attached to the holder 4, the resist 2 is broken, and the conductive pin 5 is brought into contact with the chrome layer 1b and fixed to the holder 4.

In this state, the resist 2 is exposed to an electron beam, and the dry plate 1
Is removed from the holder 4 and the resist 2 is developed and the chromium layer 1b is etched to form a pattern of the chromium layer 1b.

[Problems to be solved by the invention]

The problem with the conventional electron beam exposure described above is that if the surface of the resist 2 applied to the portion of the dry plate 1 where the chromium layer 1b is not sputtered is unavoidably exposed to the electron beam during electron beam exposure, This is because the electron beam irradiation direction shifts due to charge-up, resulting in a pattern shift.

In view of the above situation, the present invention has an object to provide a method for manufacturing a dry plate in electron beam exposure which can be easily and inexpensively implemented.

[Means for solving problems]

The above-mentioned problem is that, in the process of manufacturing a dry plate in which a metal layer is not formed in the peripheral portion by charged particle beam exposure, from the region of the dry plate where the metal layer is formed to the region where the metal layer is not formed. A step of coating and forming at least a single-layer resin film so as to extend, and then on the resin film,
A step of forming a water-soluble conductive layer so as to extend from a peripheral region of the metal layer to a region where the metal layer is not formed, and then through the conductive layer and the resin film to form the metal layer A step of electrically contacting the conductive pin, a step of irradiating the resin film with a charged particle beam to discharge the electric charge accumulated in the resin film through the conductive pin, and then a step of washing the dry plate with water. And a step of removing the water-soluble conductive layer, which is solved by a method for manufacturing a dry plate in charged particle beam exposure.

[Action]

That is, in the present invention, since the conductive layer is applied to the surface of the resin film applied to the portion of the dry plate where the metal layer is not formed, the charged particle beam is irradiated while deviating from the resin film on the metal layer. In some cases, the conductive layer is irradiated,
Since the conduction pin and the holder are connected by the conduction pin and the electric charge can be released to the holder, charge-up does not occur.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS.

As shown in FIG. 1, in the present embodiment, the conductive material 3 in which polyvinyl alcohol (PVA) and chromium fine powder are mixed is applied to the peripheral portion of the surface of the resist 2 applied to the dry plate 1, The holder 4 on which the dry plate 1 is placed is provided with a conduction pin 5 for releasing the electric charge of the electron beam applied to the chrome layer 1b of the dry plate 1, and is in contact with the chrome layer 1b.

Even if the electron beam is deviated from the chromium layer 1b, the conductive material 3 is applied to the peripheral portion of the surface of the resist 2, so that the charge of the conductive material 3 is in contact with the conductive material 3. It is released to the holder 4 through the conduction pin 5.

An embodiment according to the present invention will be described in order of steps with reference to FIG.

First, as shown in FIG. 2A, a resist 2 is applied to the entire surface of the dry plate 1 on which the chromium layer 1b is provided.

Next, as shown in FIG. 2B, a water-soluble conductive material 3 is applied in a ring shape on the peripheral portion of the surface of the resist 2 so as to overlap the peripheral portion of the chromium layer 1b as shown in the drawing.

Next, as shown in FIG. 2C, the dry plate 1 is attached to the holder 4, the conductive material 3 and the resist 2 are broken, and the conductive pin 5 is brought into contact with the chrome layer 1b and fixed to the holder 4.

If the resist 2 is exposed to an electron beam in this state, the electric charge is surely applied to the conduction pin 5 no matter where the electron beam is exposed.
Can be released to the holder 4.

After that, remove the dry plate 1 from the holder 4 and wash it with water.
Since the conductive material 3 made of water is water-soluble, it can be easily removed.

Next, the resist 2 is developed and the chromium layer 1b is etched to form a pattern of the chromium layer 1b.

Even if the electron beam is radiated from the periphery of the chrome layer 1b in this way, the electric charge can always be released to the holder 4 by the conduction pin 5, so that the dry plate 1 is not charged up and therefore the pattern shift is caused. Will not occur.

〔The invention's effect〕

As described above, according to the present invention, it is possible to prevent charge-up due to electron beam exposure by applying a very simple conductive material, so that there is an advantage that it is possible to manufacture a dry plate with high accuracy because no pattern deviation occurs, which is extremely economical. Moreover, the effect of improving reliability can be expected, and it is extremely useful industrially.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment according to the present invention, FIG. 2 is a side sectional view showing an embodiment of the present invention in the order of steps, FIG. 3 is a plan view of a conventional manufacturing method, and FIG. It is a sectional side view which shows a manufacturing method in order of process. In the figure, 1 is a dry plate, 1a is a glass substrate, 1b is a chrome layer, 2 is a resist, 3 is a conductive material, 4 is a holder, and 5 is a conduction pin.

Claims (1)

[Claims] 1. In a process of manufacturing a dry plate having no metal layer formed in a peripheral portion by charged particle beam exposure, from a region of the dry plate where the metal layer is formed to a region where the metal layer is not formed. A step of coating and forming at least a single-layer resin film so as to extend, and then, extending on the resin film from a peripheral region of the metal layer to a region where the metal layer is not formed. ,
A step of forming a water-soluble conductive layer, a step of penetrating the conductive layer and the resin film to electrically contact a conductive pin with the metal layer, and then irradiating the resin film with a charged particle beam And then discharging the electric charge accumulated in the resin film through the conduction pin, and then washing the dry plate with water to remove the water-soluble conductive layer. Method for producing dry plate in exposure.