JPH07109552A - Production of extremely thin soft copper foil - Google Patents
Production of extremely thin soft copper foilInfo
- Publication number
- JPH07109552A JPH07109552A JP27615793A JP27615793A JPH07109552A JP H07109552 A JPH07109552 A JP H07109552A JP 27615793 A JP27615793 A JP 27615793A JP 27615793 A JP27615793 A JP 27615793A JP H07109552 A JPH07109552 A JP H07109552A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- copper
- annealing
- cold
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Metal Rolling (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Insulated Conductors (AREA)
- Communication Cables (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電線等のシールド材と
して好適に使用しうる極薄軟質銅箔の製造方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an extremely thin soft copper foil which can be suitably used as a shield material for electric wires and the like.
【０００２】[0002]
【従来の技術】従来より、電線を被覆するためのシール
ド材として、厚さ10μｍ以下の銅箔が使用されている。
この銅箔を電線に被覆する工程では、電線に緊密に銅箔
を密着させて被覆させるため、銅箔に高張力が負荷され
る。しかるに、銅箔の厚さが10μｍ以下と極薄であるた
め、銅箔の引張強さ及び伸びが低く、銅箔が切断すると
いうことがあった。また、厚さ10μｍ以下の銅箔と合成
樹脂製フィルムとを貼合する場合にも、銅箔に高張力が
負荷され、クラックが発生するということもあった。2. Description of the Related Art Conventionally, a copper foil having a thickness of 10 μm or less has been used as a shield material for covering electric wires.
In the step of coating the electric wire with the copper foil, high tension is applied to the copper foil because the copper foil is closely adhered to the electric wire to cover the electric wire. However, since the thickness of the copper foil is as extremely thin as 10 μm or less, the tensile strength and elongation of the copper foil are low, and the copper foil sometimes breaks. Further, even when a copper foil having a thickness of 10 μm or less and a synthetic resin film are bonded together, high tension is applied to the copper foil, and cracks may occur.
【０００３】銅箔の厚さが薄くなるにしたがって、銅箔
の伸びが低くなり、またその引張強さが低くなること
は、当業者にとって自明である。従って、電線を被覆す
る場合等において、当業者は、銅箔に高張力が負荷され
ないような試みをすることが一般的である。例えば、銅
箔に合成樹脂製シート等を積層して、銅箔自体に高張力
が負荷されないようにする試みがなされている。It is obvious to those skilled in the art that the thinner the copper foil is, the lower the elongation of the copper foil and the lower the tensile strength thereof. Therefore, when covering an electric wire, etc., a person skilled in the art generally makes an attempt not to apply high tension to the copper foil. For example, an attempt has been made to prevent a high tension from being applied to the copper foil itself by laminating a synthetic resin sheet or the like on the copper foil.
【０００４】ところで、従来、使用されている銅箔は、
以下のような方法によって製造されているものである。
即ち、厚さ50〜300mmのタフピッチ銅や無酸素銅の鋳塊
に、熱間圧延を施し、次いで冷間圧延と中間焼鈍を繰り
返して、厚さ10μｍ以下の箔とし、その後、箔を軟化さ
せるために、再結晶温度以上の温度で仕上焼鈍を施し
て、銅箔を得ているのである。そして、タフピッチ銅や
無酸素銅は、冷間圧延による加工度を高くすることがで
きるため、最後の中間焼鈍を終えたのち、冷間加工度が
95％を超える程度に冷間圧延を施し、その後仕上焼鈍を
施している。By the way, conventionally used copper foil is
It is manufactured by the following method.
That is, an ingot of tough pitch copper or oxygen-free copper having a thickness of 50 to 300 mm is subjected to hot rolling, and then cold rolling and intermediate annealing are repeated to form a foil having a thickness of 10 μm or less, and then the foil is softened. Therefore, the copper foil is obtained by performing the finish annealing at a temperature equal to or higher than the recrystallization temperature. Since tough pitch copper and oxygen-free copper can be increased in workability by cold rolling, the cold workability is improved after the final intermediate annealing.
Cold rolling is applied to the extent that exceeds 95%, and then finish annealing is applied.
【０００５】[0005]
【発明が解決しようとする課題】以上のような技術状況
下において、本発明者は、厚さが10μｍ以下になっても
高い引張強さを保持する銅箔を得るべく、種々研究を重
ねた。その結果、上記した従来法によらずに、ある特定
の方法で極薄銅箔を得ると、厚さが10μｍ以下となって
も、当業者の常識に反して、比較的高い伸び及び比較的
高い引張強さを保持することを見出したのである。即
ち、タフピッチ銅や無酸素銅は、一般的に冷間加工にお
ける加工度が非常に高く（95％を超える程度に）設定さ
れるが、本発明においては、特定の冷間圧延工程におけ
る加工度を低く設定すると、厚さが10μｍ以下となって
も、比較的高い伸び及び比較的高い引張強さを保持する
ことを見出したのである。Under the above technical circumstances, the present inventor has conducted various studies in order to obtain a copper foil that retains high tensile strength even when the thickness is 10 μm or less. . As a result, when an ultra-thin copper foil is obtained by a specific method instead of the conventional method described above, even if the thickness is 10 μm or less, contrary to common sense of those skilled in the art, a relatively high elongation and a relatively high elongation are obtained. It has been found that it retains high tensile strength. That is, tough pitch copper and oxygen-free copper are generally set to have a very high workability in cold working (to a degree exceeding 95%), but in the present invention, workability in a particular cold rolling step is set. It has been found that when the value is set low, a relatively high elongation and a relatively high tensile strength are maintained even when the thickness is 10 μm or less.
【０００６】[0006]
【課題を解決するための手段】即ち、本発明は、タフピ
ッチ銅又は無酸素銅の鋳塊に、熱間圧延，冷間圧延及び
中間焼鈍，仕上焼鈍を施して、厚さ10μｍ以下の極薄軟
質銅箔を製造する方法において、最後の中間焼鈍と仕上
焼鈍との間において施される冷間圧延による冷間加工度
が95％以下であり、且つ仕上焼鈍温度（Ｔ℃）が、再結
晶温度≦Ｔ℃≦（再結晶温度＋80℃）であることを特徴
とする極薄軟質銅箔の製造方法に関するものである。Means for Solving the Problems That is, according to the present invention, an ingot of tough pitch copper or oxygen-free copper is subjected to hot rolling, cold rolling, intermediate annealing and finish annealing to obtain an ultrathin film having a thickness of 10 μm or less. In the method for producing a soft copper foil, the cold workability by cold rolling performed between the final intermediate annealing and finish annealing is 95% or less, and the finish annealing temperature (T ° C) is recrystallization. The present invention relates to a method for producing an ultrathin soft copper foil, characterized in that temperature ≤ T ° C ≤ (recrystallization temperature + 80 ° C).
【０００７】本発明においては、まずタフピッチ銅又は
無酸素銅の鋳塊を準備する。タフピッチ銅は、酸素をCu
2Oの形で0.02〜0.05重量％程度が含有している純銅のこ
とである。また、無酸素銅は、酸素の含有量が極端に少
ない純銅のことである。In the present invention, first, an ingot of tough pitch copper or oxygen-free copper is prepared. Tough pitch copper Cu oxygen
It is pure copper containing about 0.02 to 0.05% by weight in the form of 2 O. Oxygen-free copper is pure copper with an extremely low oxygen content.
【０００８】このタフピッチ銅又は無酸素銅の鋳塊に、
従来公知の条件で熱間圧延を施し、その後、数回に亙っ
て冷間圧延及び中間焼鈍を施す。そして、最後の中間焼
鈍を施して、厚さ0.02〜0.2mm程度の銅板を得る。最後
の中間焼鈍の後、仕上焼鈍を施す前に、この銅板を冷間
圧延工程に通す。本発明の特徴は、この冷間圧延工程に
おける冷間加工度を95％以下に設定したことにある。こ
の冷間加工度が95％を超えると、得られる極薄銅箔の伸
びが低下し、且つ引張強さも低下するので、好ましくな
い。なお、ここで言う冷間加工度（％）は、次の式で定
義されるものである。即ち、最後の中間焼鈍後における
銅板の厚さをｔ0とし、冷間圧延工程を終えた銅箔の厚
さをｔ1としたとき、［（ｔ0−ｔ1）／ｔ0］×100で定
義されるものである。This ingot of tough pitch copper or oxygen-free copper,
Hot rolling is performed under conventionally known conditions, and then cold rolling and intermediate annealing are performed several times. Then, the final intermediate annealing is performed to obtain a copper plate having a thickness of about 0.02 to 0.2 mm. After the final intermediate anneal, the copper sheet is subjected to a cold rolling process before applying a finish anneal. A feature of the present invention is that the cold workability in this cold rolling step is set to 95% or less. If the cold workability exceeds 95%, the elongation of the obtained ultra-thin copper foil is lowered and the tensile strength is lowered, which is not preferable. The cold workability (%) here is defined by the following formula. That is, when the thickness of the copper plate after the final intermediate annealing is t 0 and the thickness of the copper foil after the cold rolling step is t 1 , [(t 0 −t 1 ) / t 0 ] × 100 Is defined in.
【０００９】最後の中間焼鈍のあと、冷間加工度を95％
以下に設定して冷間圧延工程を通すことによって、厚さ
10μｍ以下の銅箔を得る。そして、この銅箔に仕上焼鈍
を施す。仕上焼鈍の温度条件（Ｔ℃）は、再結晶温度≦
Ｔ℃≦（再結晶温度＋80℃）で行なう。再結晶温度未満
で仕上焼鈍を施しても、得られる銅箔が十分に軟化せ
ず、伸びが高くならないので好ましくない。また、（再
結晶温度＋80℃）を超える温度で仕上焼鈍を施した場
合、伸びが高くならず、且つ引張強さも低下するので、
好ましくない。なお、本発明で言う再結晶温度とは、加
熱時間を30分としたとき、再結晶の完了する加熱温度の
ことである。再結晶温度の具体的な温度は、材質及び冷
間加工度によって変わるものであるが、一般的に130〜2
20℃程度であるため、仕上焼鈍の具体的条件は、以下の
ようになる。即ち、銅箔を平板の状態で仕上焼鈍する場
合には、温度160〜180℃で1時間程度が一般的であり、
銅箔をコイルの状態で仕上焼鈍する場合には、170〜200
℃で5時間程度が一般的である。After the final intermediate annealing, the cold workability is 95%.
By setting the following and passing through the cold rolling process, the thickness
A copper foil of 10 μm or less is obtained. Then, the copper foil is subjected to finish annealing. The temperature condition (T ° C.) for finish annealing is recrystallization temperature ≦
Perform at T ° C. ≦ (recrystallization temperature + 80 ° C.). Even if finish annealing is performed below the recrystallization temperature, the obtained copper foil is not sufficiently softened and the elongation does not increase, which is not preferable. In addition, when finish annealing is performed at a temperature exceeding (recrystallization temperature + 80 ° C), elongation does not increase and tensile strength also decreases.
Not preferable. The recrystallization temperature referred to in the present invention is the heating temperature at which recrystallization is completed when the heating time is 30 minutes. Although the specific recrystallization temperature varies depending on the material and the degree of cold working, it is generally 130 to 2
Since the temperature is about 20 ° C, the specific conditions for finish annealing are as follows. That is, when finish annealing the copper foil in a flat plate state, a temperature of 160 to 180 ° C. is generally about 1 hour,
170 to 200 when finishing annealing the copper foil in the coil state.
About 5 hours at ℃ is common.
【００１０】仕上焼鈍前或いは仕上焼鈍後に、銅箔に脱
脂処理を施してもよい。脱脂処理は、銅箔を冷間圧延す
る際、銅箔表面に圧延油が施されるため、この圧延油を
除去するために行なわれるものである。一般的には、仕
上焼鈍前に脱脂処理を施すのが好ましい。The copper foil may be degreased before or after the finish annealing. The degreasing treatment is performed to remove the rolling oil, since the rolling oil is applied to the surface of the copper foil when the copper foil is cold-rolled. Generally, it is preferable to perform degreasing treatment before finish annealing.
【００１１】以上の方法で得られた銅箔は、高い伸び及
び高い引張強さを保持している。具体的には、従来技術
で得られた銅箔の伸び（3.0〜4.5％）よりも高く、また
従来技術で得られた銅箔の引張強さ（12〜14kgf／mm2）
よりも高いものである。従って、電線を被覆する際のシ
ールド材として使用した場合、電線に被覆しやすく、且
つ高張力を負荷しても切断されにくいものである。な
お、以上の説明では、電線被覆用のシールド材として使
用した場合を、主として説明したが、本発明に係る方法
で得られた極薄軟質銅箔は、合成樹脂製フィルムとの貼
合用等としても、好適に使用しうるものである。The copper foil obtained by the above method retains high elongation and high tensile strength. Specifically, it is higher than the elongation (3.0-4.5%) of the copper foil obtained by the conventional technology, and the tensile strength (12-14 kgf / mm 2 ) of the copper foil obtained by the conventional technology.
Is more expensive than. Therefore, when it is used as a shield material when covering an electric wire, it is easy to cover the electric wire and is difficult to be cut even if a high tension is applied. In the above description, the case where it is used as a shield material for covering an electric wire is mainly described, but the ultrathin soft copper foil obtained by the method according to the present invention is used for bonding with a synthetic resin film, etc. However, it can be preferably used.
【００１２】[0012]
実施例１〜６及び比較例１〜６ 溶解・鋳造により、厚さ30mm×巾200mm×長さ300mmのタ
フピッチ銅の鋳塊を準備した。この鋳塊に熱間圧延を施
した後、冷間圧延と中間焼鈍を数回繰り返して、最後の
中間焼鈍を終えて、表１に示した厚さの銅板を得た。そ
して、この銅箔に、冷間加工度が表１に示した値となる
ようにして冷間圧延を施し、最終厚さ9μｍ又は7μｍの
極薄銅箔を得た。そして、表１に記載した条件で仕上焼
鈍を施し、極薄軟質銅箔を得た。なお、各例で使用した
極薄銅箔の再結晶温度は、表１に記載したとおりであっ
た。Examples 1 to 6 and Comparative Examples 1 to 6 Ingots of tough pitch copper having a thickness of 30 mm, a width of 200 mm and a length of 300 mm were prepared by melting and casting. After hot rolling this ingot, cold rolling and intermediate annealing were repeated several times, and the final intermediate annealing was completed to obtain copper plates having the thickness shown in Table 1. Then, this copper foil was cold-rolled so that the cold workability was the value shown in Table 1 to obtain an ultrathin copper foil having a final thickness of 9 μm or 7 μm. Then, finish annealing was performed under the conditions shown in Table 1 to obtain an ultrathin soft copper foil. The recrystallization temperature of the ultrathin copper foil used in each example was as shown in Table 1.
【００１３】[0013]
【表１】 [Table 1]
【００１４】以上のような方法で得られた極薄軟質銅箔
の引張強さ（kgf／mm2）及び伸び（％）は、表１に記載
したとおりであった。なお、引張強さ及び伸びの測定方
法は、以下のとおりである。即ち、巾10mmの試料（長手
方向が圧延方向である）の両端部をチャックで把持し、
チャック間距離50mm，引張速度10mm／minで、試料が破
断するまで引っ張って、荷重−歪曲線を描き、最大荷重
を断面で除したものを引張強さ（kgf／mm2）とする。一
方、破断時における試料の長さをＬ1（mm）とした場
合、［（Ｌ1−50）／50］×100の式で算出されるものを
伸び（％）とする。The tensile strength (kgf / mm 2 ) and elongation (%) of the ultrathin soft copper foil obtained by the above method are as shown in Table 1. The methods for measuring the tensile strength and elongation are as follows. That is, hold both ends of a 10 mm wide sample (longitudinal direction is the rolling direction) with a chuck,
With a distance between chucks of 50 mm and a pulling speed of 10 mm / min, pull the sample until it breaks, draw a load-strain curve, and divide the maximum load by the cross section to obtain the tensile strength (kgf / mm 2 ). On the other hand, when the length of the sample at break is L 1 (mm), the elongation (%) is calculated by the formula [(L 1 −50) / 50] × 100.
【００１５】表１の引張強さ及び伸びの結果から明らか
なとおり、最後の中間焼鈍と仕上焼鈍の間に施される冷
間圧延工程における冷間加工度を95％以下にし、且つ仕
上焼鈍の温度を再結晶温度又はそれよりも一定値高い温
度で行って得られた極薄軟質銅箔（実施例１〜６）は、
冷間加工度が95％を超えたり、再結晶温度未満の温度で
仕上焼鈍を行ったり、或いは再結晶温度よりも一定値以
上高い温度で仕上焼鈍を行い得られた極薄軟質銅箔（比
較例１〜６）に比べて、その引張強さは高く且つ伸びも
高いものであった。As is clear from the results of the tensile strength and elongation in Table 1, the cold workability in the cold rolling step performed between the final intermediate annealing and the finish annealing was 95% or less, and the finish annealing was not performed. The ultrathin soft copper foils (Examples 1 to 6) obtained by performing the temperature at a recrystallization temperature or a temperature higher by a certain value than the
Ultra-thin soft copper foil obtained by cold workability exceeding 95%, finish annealing at a temperature lower than the recrystallization temperature, or finish annealing at a temperature higher than the recrystallization temperature by a certain value or more. The tensile strength and elongation were higher than those of Examples 1 to 6).
【００１６】[0016]
【作用】本発明に係る方法で得られた極薄軟質銅箔が、
高い引張強さを保持し、且つ高い伸びを保持する理由は
定かではないが、以下のように推定しうる。即ち、タフ
ピッチ銅又は無酸素銅の銅板は、延性に優れているた
め、一般的に大きな冷間加工が施される。しかし、大き
な冷間加工を施すと、結晶組織の融通性が低下し、従っ
て、伸びが低下すると共に引張強さが低下するのであ
る。これに対し、本発明の如く、延性に優れている銅板
であっても、この延性を利用した大きな冷間加工を施さ
ない場合は、結晶組織の融通性が大きく、冷間加工後も
高延性となっている。この結果、比較的高い引張強さ及
び比較的高い伸びを有する、厚さ10μｍ以下の極薄軟質
銅箔が得られると推定しうるのである。The ultrathin soft copper foil obtained by the method according to the present invention is
The reason for maintaining high tensile strength and high elongation is not clear, but it can be estimated as follows. That is, since a copper plate of tough pitch copper or oxygen-free copper has excellent ductility, it is generally subjected to large cold working. However, when a large amount of cold working is performed, the flexibility of the crystal structure decreases, and therefore the elongation decreases and the tensile strength also decreases. On the other hand, even in the case of a copper plate having excellent ductility as in the present invention, when large cold working utilizing this ductility is not performed, the flexibility of the crystal structure is large and the ductility is high even after cold working. Has become. As a result, it can be estimated that an ultra-thin soft copper foil having a thickness of 10 μm or less, which has a relatively high tensile strength and a relatively high elongation, can be obtained.
【００１７】[0017]
【発明の効果】以上説明したように、本発明に係る方法
で得られた極薄軟質銅箔は、比較的高い引張強さと伸び
とを有しており、電線を被覆するためのシールド材とし
て使用した場合、シールド材に高張力が負荷されても、
シールド材が切断しにくいという効果を奏するものであ
る。また、合成樹脂製フィルムと貼合する場合に、銅箔
に高張力が負荷されても、銅箔にクラックが発生しにく
いという効果を奏するものである。As described above, the ultrathin soft copper foil obtained by the method according to the present invention has a relatively high tensile strength and elongation, and is used as a shield material for coating electric wires. When used, even if high tension is applied to the shield material,
This has the effect that the shield material is difficult to cut. Further, when it is attached to a synthetic resin film, even if a high tension is applied to the copper foil, the copper foil is less likely to be cracked.
Claims (1)
間圧延，冷間圧延及び中間焼鈍，仕上焼鈍を施して、厚
さ10μｍ以下の極薄軟質銅箔を製造する方法において、
最後の中間焼鈍と仕上焼鈍との間において施される冷間
圧延による冷間加工度が95％以下であり、且つ仕上焼鈍
温度（Ｔ℃）が、再結晶温度≦Ｔ℃≦（再結晶温度＋80
℃）であることを特徴とする極薄軟質銅箔の製造方法。1. A method for producing an ultrathin soft copper foil having a thickness of 10 μm or less by subjecting an ingot of tough pitch copper or oxygen-free copper to hot rolling, cold rolling, intermediate annealing, and finish annealing.
The cold workability by cold rolling performed between the final intermediate annealing and the finish annealing is 95% or less, and the finish annealing temperature (T ° C) is recrystallization temperature ≤ T ° C ≤ (recrystallization temperature +80
C)), a method for producing an ultrathin soft copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27615793A JP2907415B2 (en) | 1993-10-06 | 1993-10-06 | Manufacturing method of ultra-thin soft copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27615793A JP2907415B2 (en) | 1993-10-06 | 1993-10-06 | Manufacturing method of ultra-thin soft copper foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07109552A true JPH07109552A (en) | 1995-04-25 |
| JP2907415B2 JP2907415B2 (en) | 1999-06-21 |
Family
ID=17565545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27615793A Expired - Lifetime JP2907415B2 (en) | 1993-10-06 | 1993-10-06 | Manufacturing method of ultra-thin soft copper foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2907415B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10202178A (en) * | 1997-01-27 | 1998-08-04 | Nippon Foil Mfg Co Ltd | Manufacture of soft copper foil with high water wettability |
| JP2009158382A (en) * | 2007-12-27 | 2009-07-16 | Hitachi Cable Ltd | Copper foil |
| CN103026499A (en) * | 2010-08-30 | 2013-04-03 | 古河电气工业株式会社 | Solar cell lead wire and method of manufacturing thereof |
| JP2014078338A (en) * | 2012-10-09 | 2014-05-01 | Hitachi Metals Ltd | Differential signal transmission cable |
| CN110814029A (en) * | 2019-10-25 | 2020-02-21 | 菏泽广源铜带有限公司 | Rolling method of 6-micron high-strength rolled copper foil |
| CN115921571A (en) * | 2022-12-19 | 2023-04-07 | 富威科技（吴江）有限公司 | Rolled copper foil and manufacturing method thereof |
-
1993
- 1993-10-06 JP JP27615793A patent/JP2907415B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10202178A (en) * | 1997-01-27 | 1998-08-04 | Nippon Foil Mfg Co Ltd | Manufacture of soft copper foil with high water wettability |
| JP2009158382A (en) * | 2007-12-27 | 2009-07-16 | Hitachi Cable Ltd | Copper foil |
| CN103026499A (en) * | 2010-08-30 | 2013-04-03 | 古河电气工业株式会社 | Solar cell lead wire and method of manufacturing thereof |
| JP2014078338A (en) * | 2012-10-09 | 2014-05-01 | Hitachi Metals Ltd | Differential signal transmission cable |
| CN110814029A (en) * | 2019-10-25 | 2020-02-21 | 菏泽广源铜带有限公司 | Rolling method of 6-micron high-strength rolled copper foil |
| CN115921571A (en) * | 2022-12-19 | 2023-04-07 | 富威科技（吴江）有限公司 | Rolled copper foil and manufacturing method thereof |
| CN115921571B (en) * | 2022-12-19 | 2024-01-09 | 江苏富威科技股份有限公司 | Rolled copper foil manufacturing method and rolled copper foil |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2907415B2 (en) | 1999-06-21 |
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