JPH07108449A - Device for removing foreign matter on filter base - Google Patents

Abstract

PURPOSE:To prevent loss of substrate smoothness by floating and pressurizing the abrasive tape of a foreign matter removing part by means of an air blasting part and by partially polishing a filter base by means of the continuously transferred abrasive tape to remove a foreign matter on the filter base. CONSTITUTION:In removing a foreign matter M on the surface of the filter layer of a filter base W, the filter base W is mounted on a mounting base 11 for adsorption and fixture. The mounting base 11 is moved in the right and left, and the back and forth directions through a moving mechanism by means of a position controlling part, using a foreign matter position detecting signal from foreign matter detecting means. The foreign matter removing part 30 of a tape transfer mechanism is faced the foreign matter M. Next, a vertically moving base 14 is lowered, using the actuation of a motor for vertical movement while continuously transferring an abrasive tape T in the right and left directions on the mounting base 11 by means of the tape transfer mechanism. Air flow blasted from the nozzle 38 of an air blasting part forms a floated and pressurized state. The foreign matter removing part 30 consisting of the abrasive tape T is pressed against the foreign matter on the filter base W to locally polish and remove the foreign matter.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a filter substrate foreign substance removing apparatus used for removing foreign substances from a color filter substrate as a component of a color liquid crystal panel, for example.

[0002]

2. Description of the Related Art Generally, for example, a color filter substrate W
As shown in FIG. 10, each of the R, G, and B filter layers F made of a water-soluble polymer material and a dye is provided on a glass substrate G made of blue plate glass having a square plate shape with a thickness of about 1 mm. A black matrix as a light-shielding layer S made of chrome black obtained by etching a metal thin film, for example, is provided between the filter layers F arranged corresponding to the pixels, and a protection made of acryl, epoxy resin, or the like is provided thereon. An overcoat layer is provided as the film P, and ITO (Indium Tin) as the transparent conductive film D is further provided.
Oxide) films are formed in a stacked manner.

By the way, these color filter substrates W are strongly required to be smooth without foreign matter and abnormal protrusions, along with required characteristics such as spectral characteristics, heat resistance and chemical resistance. Foreign substances including dust, hand dust, hair or solvent or metal adhesion, and other abnormal protrusions on the surface of the transparent conductive film D, the surface of the transparent conductive film D, and the surface of the filter layer F significantly impair the characteristics, and thus are removed as much as possible. It has to be done.

Conventionally, in this type of color filter substrate, the entire surface is polished in a rotation mode which is performed for ceramics or semiconductors to remove dirt and foreign matter on the filter layer F, and unevenness on the protective film P due to the presence of the filter layer. It is known to have a structure for flattening, removing stains on the ITO film, and removing foreign substances.

[0005]

However, in the case of the structure based on the above rotation mode, since the material of the filter layer F has low hardness, chipping easily occurs at the end of the filter layer F and the hardness of the light shielding layer S and the filter layer F. Since the phenomenon in which the position of the light-shielding layer S is dug out easily occurs due to the difference, the filter layer F
Of the protective film P and the smoothing of the transparent conductive film D may be affected, and it is very difficult to find optimum polishing conditions. Therefore, it has a disadvantage that it is difficult to remove foreign matter.

[0006]

An object of the present invention is to solve such a problem, and a filter substrate foreign matter removing apparatus of the first invention mounts a filter substrate used for a liquid crystal panel or the like. A possible mounting table, a tape transfer mechanism having a foreign matter removing section formed by continuously transporting the polishing tape above the mounting table and guiding the polishing tape back, and a polishing tape in the foreign matter removing section. A pressure-controllable air jetting unit, a moving mechanism for moving the mounting table in the front-back and left-right directions, and a position control for controlling the movement of the mounting table to a position where the foreign matter removing unit faces foreign matter existing on the filter substrate. And a section.

The filter substrate foreign matter removing device according to the second aspect of the present invention comprises a mounting table on which a filter substrate used for a liquid crystal panel or the like can be mounted, and the polishing tape is continuously transferred above the mounting table and the polishing tape. Tape transfer mechanism having a foreign matter removing portion formed by folding back and guiding the air, an air jetting portion capable of floating pressure the polishing tape of the foreign matter removing portion, and a moving mechanism for moving the tape transporting mechanism back and forth and left and right. And a position control unit that controls the movement of the tape transfer mechanism to a position where the foreign matter removing unit faces the foreign matter present on the filter substrate.

[0008]

The filter substrate used for the liquid crystal panel is mounted on the mounting table, and the mounting table or the tape transfer mechanism is moved left and right and front and back by the position control section according to the position of the foreign matter existing on the filter substrate. Controlled, the foreign matter removing unit faces the foreign matter, the polishing tape of the foreign matter removing unit is floated by the air jetting unit, and the filter substrate is partially polished by the polishing tape continuously transferred by the tape transfer mechanism to be on the filter substrate. The foreign matter is removed by the polishing tape in a floating pressure state.

[0009]

1 to 9 show an embodiment of the present invention, in which 1 is a machine base, 2 is a moving mechanism, and in this case, a sliding portion 3 is mounted on the machine base 1 so as to be movable back and forth in the front-rear direction. A slide base 4 is provided, and the front and rear slide base 4 is movably provided by a front and rear movement motor 5 and a ball screw mechanism 6, and a left and right slide base is freely movable on the front and rear slide base 4 by a sliding portion 7. 8 is provided, and the left and right slide bases 8 are movably provided by a left and right moving motor 9 and a ball screw mechanism 10. The filter substrate W is fixed on the left and right slide bases 8 by a suction fixing mechanism (not shown) in a positioned state. A mounting table 11 that can be mounted is arranged.

Reference numeral 12 denotes a tape transfer mechanism. In this case, a machine body 13 is erected on the rear portion of the machine body 1, and a vertical moving table 14 is provided on the front portion of the machine body 13 so as to be vertically movable by a sliding portion 15.
A vertical movement motor 16 and a ball screw mechanism 17 for moving the vertical moving table 14 up and down are provided, and aluminum oxide, chrome oxide, silicon carbide, diamond, etc. are formed on the left and right side portions of the vertical moving table 14 as a base material such as polyester film, metal and cloth. The actual winding reel 18 and the take-up reel 19 of the polishing tape T having a width of about 5 to 10 mm formed by coating or binding the polishing particles of
A feeding motor 20 for feeding and rotating the actual winding reel 18.
And a winding motor 22 for winding and rotating the winding roller 21. The winding motor 22 winds and rotates the winding reel 19 via the belt 23 to move the vertical moving table 14
The tension mechanism 24 is disposed on the plunger 25, and the tension roller 26 is attached to the plunger 25 capable of moving the tension mechanism 24 forward and backward.
Attached, and the polishing tape T pulled out from the actual reel 18
The roller 27, tension roller 26, roller 2
8. The foreign matter removing section 30 guides the sheet back through the roller 29, and the take-up roller 2 through the roller 31 and the roller 32.
The winding tape 19 is wound around the take-up reel 19 through the space between the winding roller 1 and the sandwiching roller 33, and the polishing tape 21 is continuously transferred in one direction by the take-up roller 21 while rotating the actual winding reel 18 and the take-up reel 19. is doing.

In this case, the foreign matter removing unit 30 mounts a mounting member 34 on the lower central portion of the vertical moving table 14, mounts a guide guide 35 on the mounting member 34, and a lateral vibration prevention guide 36 on both side surfaces of the guide guide 35. Provided, the polishing tape T is folded back into a substantially horizontal U shape by the guide guide 35, and
The foreign matter removing portion 30 is formed.

Reference numeral 37 is an air injection portion, and a nozzle body 39 having a nozzle hole 38 is attached to the guide guide 35.
The connection joint 40 is attached to the attachment member 34, the connection joint 40 is connected to an air pressure source (not shown) through a pressure control valve and a flow path switching valve, compressed air P is jetted from the nozzle hole 38, and the polishing tape T is attached. It is configured to be in a floating pressure state.

Reference numeral 41 denotes a position control section, which is composed of a microcomputer or the like, is connected to the forward / backward moving motor 5 and the left / right moving motor 9 of the moving mechanism 2 and is also connected to the foreign matter detecting means 42, for example, a CCD. The foreign matter M on the filter substrate W is detected by a camera or the like, the position is detected as the X and Y coordinates with respect to the origin O, and a position detection signal is input to the position control unit 41 corresponding to these coordinates to detect the position. The rotation amounts of the motor 5 and the motor 9 are controlled according to the signal, and the mounting table 11 is controlled to move to a position where the foreign matter removing unit 30 faces the foreign matter M existing on the filter substrate W.

Since this embodiment has the above-mentioned structure, when removing the foreign matter M (including abnormal protrusions) on the surface of the filter layer F, the surface of the protective film P or the transparent conductive film D, the filter substrate W is mounted. It is placed on the table 11 and fixed by a suction fixing mechanism or the like (not shown), and the table 11 is moved to the left and right and back and forth by the position controller 41 in response to a foreign object position detection signal from the foreign object detection means 42. The movement of the mounting table 11 is controlled so that the foreign matter removing unit 30 of the tape transport mechanism 12 faces the foreign matter M. In this state, the tape transport mechanism 1 is moved.
2, the polishing tape T is continuously transferred in the left-right direction of the mounting table 11, and the vertical movement motor 16 is operated to operate the vertical movement table 1.
4 will be lowered.

At this time, air of a predetermined pressure is jetted from the nozzle hole 38 of the air jetting part 37, the polishing tape T is in a floating pressure state, and the foreign matter composed of the polishing tape T is removed by lowering the vertical moving table 14. The portion 30 is pressed against the foreign matter W on the filter substrate W with the back pressure of the compressed air P to locally polish and remove the foreign matter W. After the foreign matter M is removed, other foreign matter M is subsequently removed. The position control unit 41 controls the movement of the moving mechanism 2 so that the foreign matter removing units face each other, and the foreign substances are sequentially removed.

Therefore, instead of polishing the entire surface of the filter substrate W, only a specific portion where the foreign matter M is present can be removed by the polishing tape T, and the other portion where the foreign matter M is not present is not affected as much as possible. The foreign matter M can be removed by polishing only the portion in which the foreign matter M is present. Therefore, a good removing action by the polishing tape T can be obtained, and the removal can be performed well by selecting the type of the polishing tape T. And the nozzle hole 38 of the air injection part 37
Since the polishing tape T is in a floating state by injecting air of a predetermined pressure from the foreign matter removing section 30 made of the polishing tape T, the foreign matter W on the filter substrate W is accompanied by a back pressure of the compressed air P. Since the polishing tape T is pressed against the foreign matter M in a soft state, the height is 5 μm to 20 μm.
m, even the foreign matter M having a fine projection shape with a diameter of about 20 μm to 80 μm can be locally polished and removed satisfactorily, and thus the foreign matter can be removed as well and the removal work efficiency can be improved. it can.

The present invention can also be applied to polishing of other filter substrates, for example, a black and white filter substrate, and the structure of the moving mechanism, the tape transfer mechanism, the tape oscillating mechanism, etc. is not limited to the above-mentioned embodiment. Instead, it is designed by appropriately changing it. Further, in the above-mentioned embodiment, the foreign matter on the transparent conductive film D is removed, but the foreign matter on the surface of the protective film P is formed before the transparent conductive film D is formed, and the foreign matter on the surface of the protective film P is formed before the transparent conductive film D is formed. It is also possible to remove foreign matter on the surface of the black matrix as the light shielding layer S.

Further, in the above embodiment, the mounting table 11 is moved to the left and right and back and forth, and the foreign matter M existing on the filter substrate W is moved.
The foreign matter removing unit 30 and the foreign matter removing unit 30 are opposed to each other. On the contrary, the tape transporting mechanism 12 is configured as a moving mechanism that moves the tape transporting mechanism 12 back and forth and left and right.
The same applies to a structure in which the foreign matter M and the foreign matter removing unit 30 are opposed to each other by moving 2 to the left and right and back and forth by this moving mechanism.

In addition, a tape oscillating mechanism is incorporated in the above embodiment, the polishing tape T is oscillated in the transport direction of the polishing tape T, and the foreign matter M is moved by the polishing action of the polishing tape T and the oscillation motion of the polishing tape T. It is also possible to have a structure for removing.

Further, the shape of the nozzle hole 38 of the air injection portion 37 is not limited to, for example, a round hole, but may be designed by appropriately changing a slit-like square hole, and the air pressure may be appropriately selected.

[0021]

As described above, the present invention mounts this filter substrate on the mounting table and moves it by the position controller when removing foreign matters on the surface of the filter layer, the surface of the protective film or the transparent conductive film. Mechanism or tape transfer mechanism is controlled to move to the left and right and back and forth, whereby the foreign matter removing unit made of the polishing tape is made to face the foreign matter, and in this state, the tape transporting mechanism continuously transfers the polishing tape, and the foreign matter removing unit made of the polishing tape. Is locally pressed against foreign matter on the filter substrate, and this local pressure contact allows the foreign matter to be removed by the polishing action of the polishing tape. Instead of polishing the entire surface of the filter substrate, only the specific portion where foreign matter is present is removed by the polishing tape. You can
The foreign matter can be removed by polishing only the portion where the foreign matter is present without affecting the other portions where the foreign matter is not present as much as possible, and thus a good removal action by the polishing tape can be obtained, Moreover, good removal can be performed by selecting the type of polishing tape, and since the polishing tape is in a floating state due to the air injection unit, the foreign matter removal unit made of the polishing tape is soft against foreign matter on the filter substrate. Since the pressure contact is made in the state, the foreign matter can be removed more favorably and the removal work efficiency can be improved.

As described above, the intended purpose can be sufficiently achieved.

[Brief description of drawings]

FIG. 1 is an overall front sectional view of an embodiment of the present invention.

FIG. 2 is an overall side sectional view of an embodiment of the present invention.

FIG. 3 is an overall plan view of an embodiment of the present invention.

FIG. 4 is a partial front view of the embodiment of the present invention.

FIG. 5 is a partial front view of the embodiment of the present invention.

FIG. 6 is a partial side sectional view of an embodiment of the present invention.

FIG. 7 is a partially enlarged sectional view of the embodiment of the present invention.

FIG. 8 is a block diagram of an embodiment of the present invention.

FIG. 9 is an explanatory plan view of the embodiment of the present invention.

FIG. 10 is an explanatory cross-sectional view of a color filter substrate.

[Explanation of symbols]

 W Filter Substrate T Polishing Tape M Foreign Material 2 Moving Mechanism 11 Mounting Table 12 Tape Transfer Mechanism 30 Foreign Material Removing Section 37 Air Ejecting Section 41 Position Control Section

Claims (2)

[Claims] 1. A mounting table on which a filter substrate used for a liquid crystal panel or the like can be mounted, and a foreign matter removing unit formed by continuously transferring the polishing tape above the mounting table and guiding the polishing tape back. A tape transfer mechanism having an air jet unit, an air jetting unit capable of floating the polishing tape of the foreign matter removing unit, a moving mechanism for moving the mounting table in the front-back and left-right directions, and the mounting table on the filter substrate. A filter substrate foreign matter removing device comprising: a position control unit that controls movement of the foreign matter to a position where the foreign matter removing unit faces the foreign matter. 2. A mounting table on which a filter substrate used for a liquid crystal panel or the like can be mounted, and a foreign matter removing unit formed by continuously transferring the polishing tape above the mounting table and guiding the polishing tape back. A tape transport mechanism, an air jetting unit capable of floating the polishing tape of the foreign matter removing unit, a moving mechanism for moving the tape transport mechanism in the front-back and left-right directions, and the tape transport mechanism on the filter substrate. A filter substrate foreign matter removing device, comprising: a position control unit that controls the movement of existing foreign matter to a position where the foreign matter removing unit faces.