JP2003270426A - Film forming apparatus, head cleaning method, apparatus for manufacturing device, and device - Google Patents

Film forming apparatus, head cleaning method, apparatus for manufacturing device, and device

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Publication number
JP2003270426A
JP2003270426A JP2002073067A JP2002073067A JP2003270426A JP 2003270426 A JP2003270426 A JP 2003270426A JP 2002073067 A JP2002073067 A JP 2002073067A JP 2002073067 A JP2002073067 A JP 2002073067A JP 2003270426 A JP2003270426 A JP 2003270426A
Authority
JP
Japan
Prior art keywords
wiping sheet
ink
wiping
roller
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002073067A
Other languages
Japanese (ja)
Inventor
Shinichi Nakamura
真一 中村
Original Assignee
Seiko Epson Corp
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, セイコーエプソン株式会社 filed Critical Seiko Epson Corp
Priority to JP2002073067A priority Critical patent/JP2003270426A/en
Publication of JP2003270426A publication Critical patent/JP2003270426A/en
Application status is Withdrawn legal-status Critical

Links

Abstract

<P>PROBLEM TO BE SOLVED: To provide a means for preventing deterioration in work efficiency caused by the inappropriate feeding of a wiping sheet when cleaning each nozzle surface of a plurality of ink jet heads in a lump. <P>SOLUTION: A wiping unit is provided with the wiping sheet 75 and a roller 76, and a wiping sheet control part for adjusting the feeding speed of the wiping sheet 75 according to the feeding speed of the roller 76. The feeding speed of the wiping sheet 75 is adjusted according to the feeding speed of the roller 76. <P>COPYRIGHT: (C)2003,JPO

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a plurality of heads.
In particular, each nozzle surface of a plurality of heads
Improper feeding of the wiping sheet when cleaning
Film formation that can prevent a decrease in work efficiency due to dispensing
Apparatus, head cleaning method, and device manufacturing apparatus
And devices manufactured thereby. 2. Description of the Related Art Recently, for example, computers and portable information
With the development of various electronic devices such as
The demand and application range of color liquid crystal devices are on the rise
is there. In this type of liquid crystal device, the displayed image is colored.
A color filter substrate is used. Soshi
In the manufacture of this color filter substrate,
R (red), G (green), and B (blue) filter elements
As a method for forming an ink jet in a predetermined pattern, an ink jet
There is a cut method. It is assumed that this ink jet system is used.
Multiple inkjet heads that eject ink droplets
An equipped inkjet device is being developed. Each Inn
The jet head collects ink drops supplied from the outside.
The ink chamber that temporarily stores the ink and the ink in the ink chamber
Pressure generating element (e.g.
Ejecting ink droplets from the ink chamber
Nozzle surface is provided with a perforated nozzle surface
You. And these inkjet heads are equal to each other.
The heads are arranged at pitch intervals to form a head group.
Orienting a group of chips in one direction (for example, X direction)
By ejecting ink droplets while scanning,
R, G, B ink droplets can land on the substrate.
I am able to do it. On the other hand, Y intersecting in one direction
To adjust the position of the substrate in the direction,
Is to be done. [0004] By the way, it is manufactured
As the substrate (color filter substrate, etc.),
The patterns tend to be finer. this
Due to such background, as each inkjet head,
R, G, and B ink droplets with respect to a predetermined position on the substrate
It is necessary to supply clean and accurate
You. Naturally, each ink jet head has a predetermined amount of ink.
Drops need to be blown straight to the desired point on the substrate
However, when residual ink is attached to each nozzle surface,
This can have adverse effects. This residual ink
Indicates that some of the ink droplets ejected from each nozzle
That is left attached to the surface but uses ink
Moreover, it is difficult to completely avoid the occurrence of this residual ink.
It is. As one solution to such a problem,
Is a wipe that removes any residual ink adhering to the nozzle surface.
A possible solution is to provide a leaning mechanism.
You. As the cleaning mechanism in this case, for example,
A wide cleaning cloth is wrapped around the roller around the nozzle surface.
Of each nozzle face while pushing out the cleaning cloth.
What wipes and cleans is being developed. This cree
In the cleaning mechanism, the cleaning cloth (wiping
G) is not delivered at an appropriate speed.
Problems such as looseness of the sheet or breakage due to excessive tension
The cleaning mechanism itself functions satisfactorily.
May be lost. Such a problem occurs
Cleaning of each nozzle surface becomes impossible,
Work efficiency is significantly impaired. The present invention has been made in view of the above circumstances.
When cleaning the nozzle surfaces of multiple heads at once
Work efficiency due to improper feeding of the wiping sheet
The purpose is to provide means for preventing the rate from decreasing. Means for Solving the Problems (Changes According to Claims)
The present invention is to solve the above problems
The following measures were adopted. [1] A plurality of heads for discharging droplets, and these heads
Film formation with a head cleaning mechanism for cleaning each nozzle surface
In the apparatus, the head cleaning mechanism is provided with each of the nozzle surfaces.
The wiping sheet and the wiping sheet
The wiping sheet is provided at the turning point of
Rollers that press against each nozzle surface, and feed of the rollers
The feed speed of the wiping sheet according to the
Wiping sheet control unit
Characteristic film forming equipment. According to the film forming apparatus described in [1].
Then, feed the wiping sheet toward each nozzle surface.
While pressing with a roller,
The remaining ink that has been worn is wiped off. At this time
The ipping sheet was too fast for the roller feed speed
Wiping not to be too slow or too slow
It is adjusted by the seat control unit. [2] The film forming apparatus according to the above [1]
The wiping sheet to the head cleaning mechanism.
A take-up unit is further provided.
Is based on an instruction from the wiping sheet control unit.
To make the feeding speed of the wiping sheet variable
A film forming apparatus characterized in that: The film forming apparatus according to [2].
According to the arrangement, a normal surface is
The wiping sheet is supplied at the supply speed.
Winding of wiping sheet for relatively many nozzle surfaces
Increase the wiping sheet supply rate by increasing the
Can be. [3] The method according to the above [1] or [2]
In the film forming apparatus, the wiping sheet control unit may
The feeding direction of the wiping sheet is controlled in the forward and reverse rotation directions.
A film forming apparatus characterized by being controllable. In this [3]
According to the film forming apparatus described above, the nozzle surface with a predetermined amount of contamination
Then supply the wiping sheet in the normal forward rotation direction,
For a relatively dirty nozzle surface, wipe
By rotating the feed of the sheet forward and reverse,
Wipe the rubbing surface with the cleaning surface of the wiping sheet.
Will be able to [4] Cleaning a plurality of heads for discharging droplets
In the head cleaning method for sweeping, each of the heads
Feeding speed of wiping sheet to wipe all nozzle surfaces
Is provided at a turning point of the wiping sheet,
Pressing the iping sheet against each of the nozzle surfaces
The head according to the feed speed of the
Cleaning method. The head cleaner according to [4]
According to the wiping method, a wiping sheet is
By pressing with a roller while feeding toward,
Residual ink adhering to each nozzle surface is wiped
Good. At this time, the wiping sheet is
Never too fast or too slow
Adjusted accordingly. [5] The head cleaner according to the above [4]
In the polishing method, after the roller is folded back,
By winding the wiping sheet, each of the nozzles
Supply the wiping sheet to the surface, and
The winding speed of the winding sheet is variable.
Head cleaning method. The head according to [5].
According to the cleaning method, a predetermined amount of dirt on the nozzle surface
On the other hand, the wiping sheet is
For nozzle surfaces with relatively large amounts of contamination
Increase the winding speed of the wiping sheet to
The amount of heat supplied can be increased. [6] The method according to the above [4] or [5]
In the head cleaning method, the wiping sheet
Rotate the feeding direction of the nozzle forward and reverse to rub each nozzle surface.
Head cleaning method characterized by wiping
Law. According to the head cleaning method described in [6],
If the nozzle surface has a certain amount of dirt,
Supply the wiping sheet in the direction
Reverse wiping sheet supply for many nozzle surfaces
By rotating the nozzle, a dirty nozzle surface can be
So that it can be wiped by rubbing it on the cleaning surface of the
Become. [7] Any one of the above [1] to [3]
Specially, manufacturing devices using the film forming apparatus described in
Device manufacturing equipment. The device described in [7]
According to the film manufacturing apparatus, the film forming apparatus
To prevent a drop in work efficiency due to improper delivery of
Device productivity.
Can be reliably improved. [8] Any of the above [4] to [6]
Manufacturing method including the head cleaning method described in
And a device manufactured. This [8]
According to the device described in the above, the film forming apparatus used for the manufacture thereof
Work due to improper feeding of the wiping sheet
So we can prevent a drop in efficiency.
This will definitely increase the productivity of this device.
I will be able to. DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a plurality of ink jets.
An inkjet device with a head and each inkjet
Cleaning method for cleaning the print head
Device manufacturing apparatus for manufacturing
Apparatus or manufacturing process using the head cleaning method
In particular, with regard to devices manufactured by
When cleaning the nozzle surfaces of the ink jet head all at once,
Improper feeding of wiping sheet reduces work efficiency
Ink jet device and printer capable of preventing deterioration
Cleaning method and device manufacturing apparatus and these
With devices manufactured by
One embodiment is described below with reference to the drawings,
Needless to say, the present invention is not limited to this.
It is a theory. In the following description, first, FIG.
To FIG. 4, the device manufacturing apparatus and the
And device examples, and then refer to FIGS.
The film forming equipment provided in the device manufacturing equipment
And a head cleaning method will be described. [Description of Device Manufacturing Apparatus and Device]
First, the device manufacturing apparatus according to the present embodiment will be described with reference to FIG.
I do. FIG. 1 shows each device in the device manufacturing apparatus.
It is a top view which shows arrangement | positioning of a component device. As shown in the figure
The device manufacturing apparatus according to the present embodiment
(A glass substrate; hereinafter, referred to as a wafer Wf)
Wafer supply unit 1 to be accommodated and transfer from wafer supply unit 1
Rotating unit 2 for determining the drawing direction of the processed wafer Wf
And the wafer Wf transferred from the wafer rotating unit 2
Film forming device for forming R (red) filter element
Inkjet device 3 and inkjet device
Baking furnace 4 for drying wafer Wf transferred from 3
And a robot for transferring the wafer Wf between these devices.
5a, 5b and wafer W transferred from baking furnace 4
Determine the cooling and drawing direction before sending f to the next process
The intermediate transfer section 6 and the wafer transferred from the intermediate transfer section 6
Form a G (green) filter element for Wf
An ink jet device 7 as a film forming device;
A wafer for drying the wafer Wf transferred from the jetting device 7.
Work furnace 8 and transfer work of wafer Wf between these devices
Robots 9a and 9b to be transferred and transferred from the baking furnace 8
Cooling and drawing direction decision before sending wafer Wf to next process
Intermediate transfer unit 10 and transfer from the intermediate transfer unit 10
B (blue) filter element for the processed wafer Wf
Inkjet apparatus 11 as a film forming apparatus for forming
And the wafer W transferred from the inkjet device 11
b, a baking furnace 12 for drying the f.
(C) Robots 13a and 13b for performing the Wf transfer operation, and
The storage direction of the wafer Wf transferred from the work furnace 12
Wafer rotating unit 14 and the wafer transferred from the wafer rotating unit 14.
And a wafer accommodating portion 15 for accommodating the wafer Wf
It is schematically configured. The wafer supply unit 1 has a capacity of, for example, 20
An elevator mechanism that accommodates one wafer Wf in the vertical direction
Equipped with two magazine loaders 1a and 1b,
The wafers Wf can be sequentially supplied. Wafer rotation
The unit 2 is provided with the ink jet device 3 for the wafer Wf.
Direction to determine which direction to draw by
And the temporary positioning before transfer to the inkjet device 3
And two wafer rotating tables 2a and 2b.
To the vertical axis at 90 ° pitch intervals.
The wafer Wf is rotatably held. Regarding inkjet devices 3, 7, 11
Is explained here in order to explain the details later.
The description is omitted. The bake furnace 4 is, for example, 120
By placing the wafer Wf in a heating environment at a temperature of
The wafer W transferred from the inkjet device 3
f to dry the red ink droplets.
And red ink scatters while the wafer Wf is moving.
Can be prevented. The robots 5a and 5b extend around the base.
Arm (not shown) that can operate
Equipped with vacuum suction at the end of the arm
By holding the wafer Wf with a pad by suction, each device
Smooth and efficient transfer of wafers Wf between
Can be used. The intermediate transport section 6 is moved by the robot 5b to a base.
The heated wafer Wf transferred from the work furnace 4 is processed next.
Cooler 6a for cooling before sending the wafer, and wafer Wf after cooling
In which direction is drawn by the ink jet device 7
Determining the drawing direction of whether to draw and ink jet in the future
Wafer turntable 6 for temporary positioning before transfer to apparatus 7
and between the cooler 6a and the wafer turntable 6b.
And absorbs the difference in processing speed between the inkjet devices 3 and 7.
And a buffer 6c. Wafer
The turntable 6b has a 90-degree pitch around a vertical axis.
Or rotate the wafer Wf at a pitch of 180 degrees.
I can do it. The in forming the red filter element
Form a green filter element with the jet device 3
Required for the above-mentioned drying with the inkjet device 7
Time, each inkjet head (ink jet)
Cleaning operation described later in the description of the jet devices 3, 7, and 11).
The time required for each business is different,
A difference in processing speed between the jetting devices 3 and 7
Become. The buffer 6c absorbs this processing speed difference.
It is provided for the elevator-like stock
It is possible to temporarily place a plurality of wafers Wf on the table temporarily.
I am able to do it. The baking furnace 10 is similar to the baking furnace 6 described above.
A heating furnace having a structure, for example, heating at 120 ° C. or less
By placing the wafer Wf in the environment for 5 minutes,
Of the wafer Wf transferred from the inkjet device 7
For drying the ink droplets.
f to prevent inconvenience such as splashing of green ink while moving.
It can be stopped. The robots 9a and 9b are
It has the same structure as a and 5b, with the base as the center
An arm (not shown) capable of extending and rotating
), The vacuum suction provided at the tip of the arm
By holding the wafer Wf with a pad by suction, each device
Smooth and efficient transfer of wafers Wf between
Can be used. The intermediate transport section 10 is the same as the intermediate transport section 6 described above.
The baking furnace 8 is operated by the robot 9b.
The wafer Wf in the heated state transferred from the
Cooler 10a for cooling before cooling and wafer Wf after cooling.
In which direction is drawn by the ink jet device 11
To determine the drawing direction of the
Rotating table 1 for performing temporary positioning before transfer to mounting unit 11
0b, between the cooler 10a and the wafer turntable 10b.
And the processing speed between the inkjet devices 7 and 11
And a buffer 10c that absorbs the difference.
You. The wafer turntable 10b is rotated 90 degrees around the vertical axis.
Rotate the wafer Wf at a pitch of 180 degrees or 180 degrees
You can make it. The wafer rotating unit 14 is provided for each ink jet device.
R, G, and B patterns are formed by placements 3, 7, and 11.
Each of the subsequent wafers Wf will face a certain direction.
Rotational positioning is possible. That is, the wafer
The rotation unit 14 includes two wafer rotation tables 14a and 14b.
At 90 ° pitch intervals around the vertical axis.
The wafer Wf can be held rotatably.
You. The wafer accommodating portion 15 is transferred from the wafer rotating portion 14.
Finished product wafer Wf (color filter substrate)
Are stored in the vertical direction, for example, 20 sheets per unit.
Two magazine unloaders 15 equipped with an elevator mechanism
a, 15b, and can sequentially accommodate wafers Wf
And The device manufacturing apparatus of the present embodiment described above
Filter including RGB pattern forming process
A series of flows of the manufacturing process of the substrate will be described with reference to FIGS.
This will be described below. FIG. 2 shows the device manufacturing equipment.
Series of colors including RGB pattern forming process
It is a figure which shows a filter substrate manufacturing process, (a)-(f).
Are shown in this order. FIG.
Formed by each inkjet device of device manufacturing equipment
FIGS. 6A and 6B are diagrams showing an example of an RGB pattern, wherein FIG.
Perspective view showing a lip type, (b) a part showing a mosaic type
The enlarged view, (c) is a partially enlarged view showing the delta type. The wafer Wf used for manufacturing is, for example, a long
It is a rectangular thin transparent substrate with moderate mechanical strength and
Both have the property of high light transmission. This wafer
As Wf, for example, a transparent glass substrate, an acrylic glass
, Plastic substrate, plastic film and this
These surface-treated products are preferably used. This c
In the wafer Wf, a pre-process of the RGB pattern forming process is included.
From the viewpoint of increasing productivity,
The areas are pre-formed in a matrix,
-Cut the filter area after the RGB pattern forming process
Color filters compatible with liquid crystal devices
It is intended to be used as a substrate. As shown in FIG. 3, each color filter area
Has an R (red) filter element and a G (green)
Filter element and B (blue) filter element
A predetermined number of ink jets are
It is formed in a pattern. This formation pattern
In addition to the stripe type shown in FIG.
The mosaic type shown in FIG. 3B and the Dell model shown in FIG.
The present invention relates to the formation pattern.
However, there is no particular limitation. First, the black matrix used in the previous step
In the forming process, as shown in FIG.
One surface of Wf (the surface serving as the basis of the color filter substrate)
In contrast, a resin (preferably black) having no light transmission property
A predetermined thickness (for example, 2
μm) and then photolithography
Black matrix in a matrix form
.. are formed. These black matrices
The smallest display elements surrounded by the grids b,.
Luter element (symbol e,...)
Axial width is 30 μm, Y-axis length is 10
The window has a size of about 0 μm. This black mat
After forming the licks b,...
The resin on the wafer Wf by applying heat.
You. Thus, the black matrix b is
After the formation of the wafer Wf, the wafer supply shown in FIG.
Each magazine loader 1a, 1b of the unit 1 accommodates and continues
An RGB pattern forming step is performed. That is, first
Stored in one of the magazine loaders 1a and 1b
Robot 5a sucks the wafer Wf
After attaching and holding, any of the wafer rotating tables 2a and 2b
Place on either side. Then, each wafer turntable 2a, 2
b is a preparation before supplying a red ink droplet from now on.
Then, the drawing direction and positioning are performed. After that, the robot 5a moves each wafer rotating table.
The wafer Wf on the wafers 2a and 2b is sucked and held again.
Transfer to the ink jet device 3. This inkjet
In the device 3, as shown in FIG.
Filter element e in position to form
, A red ink droplet R is supplied. At this time
The amount of ink droplet R is determined by reducing the volume of ink droplet R in the heating step.
It is a sufficient amount considering a small amount. Note that this inn
The details of the supply of the ink droplet R by the jet device 3 will be described.
Will be described later. In this way, all the predetermined filter
After the elements e,... Are filled with the red ink R.
The wafer Wf is dried at a predetermined temperature (for example, about 70 ° C.).
Is managed. At this time, when the solvent of the ink droplet R evaporates,
As shown in FIG. 2C, the volume of the ink droplet R decreases.
If the volume is drastically reduced,
Until a sufficient ink film thickness is obtained.
The feeding operation and the drying operation are repeated. With this process,
The solvent of the ink droplet R evaporates and finally the solid of the ink droplet R
Only the form remains to form a film. In the process of forming the red pattern,
The drying operation is performed by the baking furnace 4 shown in FIG.
You. Then, the wafer Wf after the drying operation is in a heated state.
Therefore, the robot 5b shown in FIG.
Conveyed and cooled. The cooled wafer Wf is buffered.
After being temporarily stored in the filer 6c and timed,
The green ink drop is transferred to the e-rotary table 6b
As a preparation before supply, the drawing direction and positioning
Done. Then, the robot 9a moves the wafer turntable 6b
After sucking and holding the upper wafer Wf,
Transfer to the remote control device 7. In the ink jet apparatus 7, FIG.
(B) As shown in FIG.
In the filter elements e,...
The ink droplet G is supplied. At this time, the amount of each ink droplet G is
In consideration of the volume reduction of the ink droplet G in the heating process,
It is a reasonable amount. In this manner, all of the predetermined filter
C after the green ink G is filled in the elements e,.
The wafer Wf is dried at a predetermined temperature (for example, about 70 ° C.).
Is managed. At this time, when the solvent of the ink droplet G evaporates,
As shown in FIG. 2C, the volume of the ink droplet G decreases.
If the volume is drastically reduced,
Until ink droplet G is obtained.
The feeding operation and the drying operation are repeated. With this process,
The solvent of the ink droplet G evaporates and finally the solid of the ink droplet G
Only the form remains to form a film. In the process of forming the green pattern,
The drying operation is performed by the baking furnace 8 shown in FIG.
You. Then, the wafer Wf after the drying operation is in a heated state.
To the cooler 10a by the robot 9b shown in FIG.
And cooled. The cooled wafer Wf is
Temporarily stored in file 10c and time adjusted
Thereafter, the wafer is transferred to the wafer turntable 10b, and the blue
As a preparation before supplying ink droplets, the drawing direction and position
Decisions are made. Then, the robot 13a
After sucking and holding the wafer Wf on the turntable 10b,
It is transferred to the inkjet device 11. In this ink jet apparatus 11, FIG.
(B) As shown in FIG.
In the filter elements e,...
The ink droplet B is supplied. At this time, the amount of each ink droplet B is
In consideration of the volume reduction of the ink droplet B in the heating process,
It is a reasonable amount. In addition, this inkjet device 1
1 will be described later in detail.
You. In this manner, all of the predetermined filter
C after the blue ink B is filled in the elements e,.
The wafer Wf has a predetermined temperature (for example, as shown in FIG.
(For example, about 70 ° C.). At this time, ink drop B
When the solvent evaporates, the volume of the ink droplet B decreases.
If the volume decreases drastically, use it as a color filter.
Until a sufficient ink film thickness is obtained, supply operation of ink droplet B
Work and drying work are repeated. This process allows
The solvent of the ink droplet B evaporates and finally the solid content of the ink droplet B
Only remains to form a film. In the process of forming the blue pattern,
The drying operation is performed by the baking furnace 12 shown in FIG.
Done. Then, the wafer Wf after the drying operation is
One of the wafer rotating tables 14a and 14b
And then rotate to a certain direction.
A decision is made. The wafer Wf after rotational positioning is
The magazine unloaders 15a and 15b are
It is housed in either one. As described above, the RGB pattern forming step is completed.
Complete. Then, the post-process shown in FIG.
Is performed. That is, the protective film forming process shown in FIG.
In order to completely dry the ink droplets R, G, B
Then, heating is performed at a predetermined temperature for a predetermined time. Drying ends
And the surface protection and surface of the wafer Wf on which the ink film is formed.
The protective film c is formed for the purpose of planarizing the surface. This security
The protective film c is formed by, for example, a spin coating method or a roll coating method.
It is possible to adopt a method such as a heating method or a ripping method.
Wear. In the subsequent transparent electrode forming step shown in FIG.
The transparent electrode t is formed by using a sputtering method or a vacuum evaporation method.
The protective film c is formed to cover the entire surface. The following figure 2
In the patterning step shown in FIG.
It is patterned as an elementary electrode. Note that the liquid crystal device
Active matrix panel for driving liquid crystal
To TFT (Thin Film Transistor)
This patterning is unnecessary in the case of using, for example. By each manufacturing process described above, FIG.
Is manufactured. And
This color filter substrate CK and a counter substrate (not shown)
Manufactured with a liquid crystal device manufactured by disposing
Thus, for example, the notebook personal computer 20 shown in FIG.
(Device) will be manufactured. No shown in the figure
The personal computer 20 is housed in a housing 21 and the housing 21.
And the input unit.
Keyboard 23, display information output source not shown, display
Various circuits such as information processing circuits and clock generation circuits
A display signal consisting of a power supply circuit that supplies power to these circuits
And a generating unit. In the liquid crystal device 22,
For example, based on information input from the keyboard 23,
The display signal generated by the display signal generator is supplied.
Thus, a display image is formed. The color filter substrate CK according to the present embodiment
The devices equipped with
Not limited to 20, mobile phone, electronic organizer, pager, P
OS terminal, IC card, mini disk player, LCD
Projector, engineering workstation (E
WS), word processor, television, viewfinder
Type or monitor direct view type video recorder, electronic desk calculator
, Car navigation system, equipment with touch panel
Devices, clocks, game machines, etc.
You. [Inkjet apparatus and head cleaner]
Description of the printing method] Then, referring to FIGS.
A film forming apparatus provided in the device manufacturing apparatus;
Detailed description of each of the inkjet devices 3, 7, and 11
Shall be clarified. In addition, each inkjet device 3,
7 and 11 have the same structure,
The device 3 will be described below, and other inkjet devices will be described.
The same applies to the remote control devices 7 and 11, and the description thereof is omitted.
Shall be. As shown in FIG. 5 to FIG.
The ink jet device 3 is, as its main component, an ink jet device.
A jet unit 30, a cap unit 60,
Wiping unit 70 (head cleaning mechanism)
And a dot missing detection unit 90 (omitted in FIG. 5).
And a knit 100 (omitted in FIG. 5). In addition,
FIG. 5 is a schematic diagram showing main components of the inkjet apparatus.
FIG. FIG. 6 shows an example of the inkjet apparatus.
FIG. 2 is a side view as viewed from an arrow A in FIG.
You. FIG. 7 is a diagram showing the ink jet device.
7 is a plan view as viewed from the arrow B in FIG. (1) Description of the ink jet unit 30
To the wafer Wf.
This is a unit that discharges ink. As shown in FIG.
In the inkjet unit 30, first, nitrogen gas or the like is used.
Is supplied to the air filter 31, where the inert gas g
After removing impurities contained in the active gas g,
Through the mist separator 32 into the inert gas g
The contained mist is removed. Inactivity after removing mist
The gas g is used to pump the ink and the cleaning liquid.
The system is branched into two systems:
Either system, ink and cleaning liquid
It can be switched by the switching valve 35
ing. That is, a system for pumping ink is selected.
The inert gas g passed through the mist separator 32
Is supplied to the ink pressure regulating valve 33, where the
After the pressure is cut off, the ink side residual pressure exhaust valve 34 and the ink
・ The cleaning liquid pressure sending pressure switching valve 35 and the air filter 36
Passes and is further supplied by the inert gas pressure detection sensor 37
After the pressure has been checked, the ink
Is supplied. On the other hand, if a system for pumping the cleaning liquid is selected,
In this case, the inert gas g passing through the mist separator 32 is
It is supplied to the cleaning fluid pressure regulating valve 39, where it is appropriately
After the pressure has been adjusted, the cleaning liquid side residual pressure exhaust valve 40 and the ink / wash
Passed through the pressure switch valve 35 and the air filter 71
Further, the supply pressure change is detected by the inert gas pressure detection sensor 72.
After the check has been performed, the cleaning liquid
Is to be paid. Continuation of flow in this system
The wiping unit 70 (head cleaning machine)
)). The ink pressure feed tank 38 is
The ink in the ink bottle 41 is transferred to the ink pressure pump 42.
Is more replenished.
Is detected by the load detection by the ink presence / absence detection load sensor 45.
Is to be done. Therefore, the ink
When the ink level in the ink 38 falls below a predetermined level.
Is detected by the ink presence / absence load detection sensor 45.
Activate the pump 42 for pumping the ink pressure until it reaches the predetermined level.
Is used to replenish the ink. Note that
No. 43 is an air filter provided in the degassing ink bottle 41.
Reference numeral 44 denotes a tank exhaust pressure valve. Inert gas g in the ink pressure feed tank 38
When supplied, the ink pressure increases because the internal pressure increases.
The surface is pushed down, and the extruded
The hydraulic pressure is measured by the hydraulic pressure detection sensor 46 before the hydraulic pressure
After passing through the feed ON / OFF switching valve 47,
It is pumped to 48. Reference numeral 49 indicates static electricity.
3 shows a flow path portion ground joint for escape. The sub tank 48 has an air filter 50 and
And sub tank upper limit detection sensor 51 and ink level control
A detection sensor 52 is provided. Sub tank upper limit
The detection sensor 51 detects the ink level in the sub tank 48.
If the level exceeds a certain level, ink
This is a detection sensor for stopping supply. Also,
The liquid level control detection sensor 52 includes a plurality of ink jets.
Head 53 (see FIG. 6 for the arrangement thereof.
In FIG. 5, for the sake of explanation, the inkjet head 53 is simply
(Described as a body) for each nozzle face 53a.
The head value head of the ink level in the ink tank 48 is set to a predetermined value.
Range for adjustment (for example, 25 mm ± 0.5 mm).
Outgoing sensor. The ink supplied from the sub tank 48
Is the ink jet after passing through the head bubble elimination valve 54.
The power is supplied to the head 53. Note that
No. 55 indicates a flow path ground joint for releasing static electricity.
are doing. The head portion bubble elimination valve 54 is an inkjet
By closing the upstream flow path of the head 53, the ink
The ink in the jet head 53 is filled with a cap unit described later.
The suction flow rate when suctioning with
So that air bubbles in the head 53 can be quickly exhausted
Has become. Details of each ink jet head 53
This will be described below with reference to FIGS. What
FIG. 8 shows a nozzle head unit of the inkjet apparatus.
FIG. FIG. 9 shows the nozzle head.
FIG. 9 is a side view of the storage unit viewed from an arrow C in FIG. 8. Ma
FIG. 10 shows the configuration of the nozzle head unit.
Of the mechanism that ejects ink in an inkjet head
FIG. FIG. 11 shows the ink jet printer.
FIG. 3A is a view showing a part of a printhead, wherein FIG.
(B) is a cross section taken along line DD in FIG.
FIG. FIG. 12 shows the same inkjet head.
It is a figure explaining, (a) is an explanation showing a scanning direction.
FIG. 3B is an explanatory diagram showing a change in the nozzle pitch. As shown in FIG. 8 and FIG.
Each of the ink jet heads 53 is a diagonal of six ink heads.
Head row 121A arranged in one row so as to overlap
And the second head row 121B with respect to the head holding plate 122.
And fix it to form the head unit 120
I have. First head row 121A and second head row 121B
Are parallel to each other and each axis
Lines c1 and c2 indicate how to feed a wiping sheet 75 described later.
Direction (the direction of arrow S in FIG. 8).
Have been. As shown in FIG.
The head 53 uses, for example, a piezo element (piezoelectric element).
And the nozzle surface 53a of the main body 53b
Has a plurality of nozzles 53c. And this
A piezo element 53d is provided for each of these nozzles 53c.
Is provided. The piezo element 53d is
3c and the ink chamber 53e.
When the voltage Vh is applied, it expands and contracts in the direction of arrow P, and
The ink chamber 53e is pressurized to apply a predetermined amount of ink droplet R to each nozzle.
From the nozzle 53c. As shown in FIGS. 11A and 11B, each
The nozzle surface 53a of the ink jet head 53 has a plurality of rows.
The grooves 53a1 and 53a2 (two rows in this embodiment) are
Are formed in parallel with each other.
Each of the nozzles 53c is arranged at an equal pitch inside 53a2.
It is drilled in. As described above, these inkjets
The heads 53 are arranged so as to be obliquely overlapped with each other.
I have. As shown in FIG.
While passing through the inkjet head 53, the ink droplet R
When performing the ejection in the scanning direction as shown in FIG.
(Heading direction)
The color filter substrate that is manufactured by tilting it to a sharp angle
The apparent nozzle interval p2 according to the pixel pitch p1 of
It is to match. (2) Description of the cap unit 60 Following the ink jet unit 30 described above,
The unit 60 will be described below. As shown in FIG.
Unit 60 is provided for each of the inkjet heads 53.
Pressed from just below against the nozzle surface 53a
A plurality of caps 61 (the arrangement thereof is shown in FIG. 6 and FIG.
7), the suction force of the ink suction pump 62 is reduced.
Suck ink waste into the ink waste tank 65 using
Can be used. Note that reference numeral 63 is
When sucking ink in each ink jet head 53
The pressure variation between each inkjet head 53 and the suction side
Key to reduce the time required to take
A valve provided in the vicinity of the cap 61.
No. 64 is an ink suction pressure detection for detecting a suction abnormality.
It is a sensor. The ink waste liquid tank 65 has a waste liquid tank
The ink waste liquid tank is provided with an ink
It has been detected that the liquid level in the reservoir 65 has exceeded a predetermined level.
In this case, the ink waste pump 67 is activated to
The waste liquid can be transferred to the tor 68.
According to the cap unit 60, each ink
Before starting ejection of ink droplet R from jet head 53,
A negative pressure is applied to each nozzle of the inkjet head 53.
To fill the nozzle surface 53a with ink.
Each inkjet head 5 to remove clogging
Suction by applying negative pressure to each nozzle of No. 3 or manufacturing
During standby, the ink in each nozzle dries
Cover the nozzle surface 53 with the cap 61 so that there is no moisture
You can do it. (3) Description of Wiping Unit 70 Following the cap unit 60 described above, FIGS.
The wiping unit 70 will be described with reference to FIGS.
The (head cleaning mechanism) will be described below. FIG.
Is the wiping sheet supply of the wiping unit 70
It is a perspective view showing a unit. FIG.
FIG. 4 is a view showing a ping sheet supply unit, and is shown in FIG.
From a section perpendicular to the axis of the roller and take-up roller
FIG. FIG. 15 shows a wiping unit.
6 is a perspective view showing a roller unit of the slot 70. FIG. Also,
FIG. 16 shows the roller unit perpendicular to the axis of the roller.
FIG. 4 is a longitudinal sectional view as seen from a straight section. FIG.
The cleaning of each nozzle surface by the iping unit 70 will be described.
FIG. FIG. 18 shows the wiping unit.
FIG. 7 is a side view illustrating cleaning of each nozzle surface by
(A) pushes the wiping sheet against the nozzle surface
Shows the state before attaching, (b) shows the pressing state
I have. The wiping unit 70 is operated periodically or
Represents each nozzle of each ink jet head 53 at any time
The surface 53a is collectively cleaned, as shown in FIG.
A wiping sheet 75 for wiping each nozzle face 53a;
Push the wiping sheet 75 toward each nozzle face 53a.
Roller 76 and the wiping sheet 75
A cleaning liquid supply unit 77 for spraying and supplying a cleaning liquid;
Unwinding sheet 75 toward each nozzle face 53a
The unwind roller 78 to be supplied by the
Take up the wiping sheet 75 after wiping
Roller 79 and an electric motor for driving the winding roller 79 to rotate.
The motor 153 is provided. In addition,
For example, the polyester sheet 100%
Is preferably used. The roller 76 is a rubber roller.
And repels the pressing force against its peripheral surface
It has elasticity. Then, the wiping unit 70
If it is, the wiping unwound from the unwind roller 78
While supplying the sheet 75 toward each nozzle face 53a
By pressing with the roller 76, the wiping sheet
75 new cleaning surfaces constantly for each nozzle surface 53a
It can be supplied. And low
The wiping sheet 75 by the pressing force of the
Since the nozzle surface 53a is pressed against the nozzle surface 53a, each nozzle surface
Cleaning surface can be reliably applied to 53a.
It has become. Incidentally, for example, a color filter to be manufactured
If the board has changed specifications such as size,
The pitch dimension between the inkjet heads 53 and the like
It will need to be changed. At this time, for example,
Individual wiping unit for each inkjet head 53
So that each nozzle face 53a is cleaned individually.
If it is made to be comprised between, each inkjet head 53
Each wiping to accommodate changes in pitch
It is necessary to change all the arrangement of units etc.
Will be. In contrast, the wiping unit of the present embodiment
The nozzle 70 collectively cleans the nozzle surfaces 53a by one unit.
Each inkjet head
May be affected by changes in pitch size etc.
Not to be. As shown in FIG. 13 and FIG.
The take-out roller 78 and the take-up roller 79
The roller casing 151 is rotatable around the axis.
, And drives the take-up roller 79 to rotate.
As a result, the wiping sheet 7
5 (not shown) can be unwound
You. Here, the rotation drive of the take-up roller 79 is
Coaxially attached to the end of the rotating shaft 79a of the take-up roller 79
The pulley 79b is connected to the electric motor via the belt 152.
This is performed by driving with the data 153. The guide roller 154 shown in FIG.
To correctly guide the flow of the seating sheet 75
The tachometer 155 (enco
To detect the rotation speed of the guide roller 154
Is used to detect the feed speed of the wiping sheet 75.
And can be done. And the winding of the explanation above
The take-out roller 78, the take-up roller 79, and the roller casing
Sing 151, wiping sheet 75, electric motor
153, a guide roller 154, a tachometer 155
(Encoder) and a wiping sheet supply unit
A unit 150 is configured. As shown in FIG. 15 and FIG.
6 is a roller casing which is rotatable around its axis.
To the wiping sheet.
Wiping sheet fed from unit 150
It is driven to rotate in synchronization with the feed rate of 75
I have. Here, the rotation of the roller 76 is
Pulley 7 attached coaxially to the end of the rotary shaft 76a
6b by the electric motor 163 via the belt 162
It is performed by driving. Then, adjacent to the roller 76,
The nozzle unit 171 of the cleaning liquid supply unit 77 is arranged and fixed.
Have been. This nozzle unit 171 is
A plurality of nozzle holes 1 parallel to the axis and along the longitudinal direction
Reference numeral 71a denotes a rod-shaped pipe that is bored upward,
Back side of wiping sheet 75 passing above
By spraying an appropriate amount of cleaning solution from
The cleaning surface of the wiping sheet 75 for wiping the surface 53a
It can be moistened. In this way, the cleaning liquid supply unit 77
The reason why the cleaning sheet 75 is wetted in advance is that the cleaning effect of the cleaning liquid is high.
To wipe off each nozzle face 53 more
Needless to say, in addition to this, the following reason is also provided. You
That is, for example, a dry wiping sheet 75 is
When pressed against the surface 53a (dry type),
Each ink jet is drawn by sucking the ping sheet 75.
Extra ink in the head 53 is drawn toward the nozzle surface 53a.
There is a risk of getting it out. In contrast, in the present embodiment,
As described above, the cleaning liquid is
The cleaning surface of the cleaning sheet 75 (wet)
In this way, extra ink can be
Without pulling out from each nozzle face 53a
Can be wiped off. The roller 76 described above and the roller 76
Casing 161, electric motor 163, and cleaning liquid supply
The roller unit 160 is configured to include the portion 77 and
I have. The wipe pin including the roller unit 160
As shown in FIG.
It is installed and fixed integrally on the
It is relatively movable in the horizontal direction of the drawing. As shown in FIG. 17, the wiping sheet 7
5 and the roller 76 are connected to these wiping sheets 75 and
Relative width between roller 76 and each nozzle surface 53a
The methods W1 and W2 are all the respective nozzle surfaces 53a.
The total width W3 is equal to or larger than W3. Similarly, the nozzle
Total width dimension of each nozzle hole 171a of unit 171
W4 is also longer than the total width dimension W3. This
By configuring as shown in FIG.
The range of the cleaning surface, the pressing range of the roller 76, the nozzle
Nozzle out of range of application of cleaning liquid from unit 171
Since there is no surface 53a, all nozzle surfaces 53a can be reliably
Can be wiped off without leaving. By the way, the wipe pins to each nozzle face 53a
The pressing pressure of the sheet 75 is 100 to 1000 gf.
The pressure is set to be within a predetermined range. this is,
By keeping the pressing pressure appropriate, the wiping system
The nozzles 53 are scratched due to excessive pressing of the nozzle 75
The nozzle surface 5
Prevents the ink on 3a from remaining after being wiped
To do that. More specifically, the predetermined pressure is 1
If it is smaller than 00 gf, the pressing force is too weak and
Ink on the surface 53a may remain without being wiped.
And the predetermined pressure becomes larger than 1000 gf.
Pressing too strongly may damage each nozzle surface 53a
The predetermined pressure should be 100 to 1000 g.
It is set so as to fall within the range of f. this
The predetermined pressure depends on the material of the wiping sheet and the hardness of the roller 76.
More preferably, it is set according to the degree. For example,
Roller using polyester as the iping sheet 75
When a rubber member having a hardness of about 20 to 70 degrees is used as 76
In the case, a predetermined pressure within the range of 200 to 400 gf
It is preferable that the setting is made as follows. When setting the pressing pressure, the pressing
Although there is also a method of directly measuring the applied pressure, in this embodiment, FIG.
18 (a) and 18 (b), the wiping sheet 7
Roller 76 was pressed against each nozzle face 53a via 5
At this time, the displacement amount of the wiping sheet 75 and the roller 76
(Crush amount) Displacement amount of these nozzle surfaces 53a (increase
Movement amount) is set to a predetermined size
Good. More specifically, the amount of displacement is
Depending on the material and thickness of the sheet 75 and the hardness of the roller 76
The proper range is defined. For example, wiping sheet 7
0.6mm thick sheet of polyester fiber as 5
Using a rubber having a hardness of 30 to 60 degrees as the roller 76.
When used, the nozzle surface 53a, the wiping sheet 75 and
Of the rotation axis of the roller 76 in a state where the roller 76 is in contact with the roller 76
And the position of the rotating shaft after pressing in the pressing direction
The displacement is set so that it is within the range of 0.1 to 1 mm.
Have been. That is, before pressing shown in FIG.
Then, log in to a position distant from each inkjet head 53.
Roller unit 160 is located and the wiper
The vertical height of the upper surface (cleaning surface) of the
And And the nozzle of each ink jet head 53
When the vertical height of the surface 53a is H2, H2-H
1 is set to be in the range of 0.1 to 1 mm
I have. As a result, as shown in FIG.
Roller 7 of roller unit 160 for cleaning
Roller 6 so that it is directly under nozzle unit 120
When moved horizontally by a unit drive mechanism (not shown)
Then, the wiping sheet 75 and the roller 76 are
Each nozzle surface 5 of each fixed inkjet head 53
It is pushed downward by 3a and deformed. And this deformation
When the amount is G, the deformation amount G is in the range of 0.1 to 1 mm.
It is set to be within the box. The displacement G is less than 0.1 mm.
If not, the pressing pressure by the wiping sheet 75
Is judged to be insufficient, and conversely, if
In this case, the pressing pressure by the wiping sheet 75 increases.
It will be possible to judge it as dead. Accordingly
So that the displacement G is within 0.1 to 1 mm.
In this way, the pressing pressure applied to each nozzle face 53a is directly
The pressing pressure of the wiping sheet 75 is
Can be easily set to fall within the specified pressure
It is. The wiping unit described above
70 has a wiping system corresponding to the feed speed of the roller 76.
Wiping sheet controller that adjusts the feed speed of the sheet 75
(Not shown) is further provided. This wiping
The seat control unit includes the electric motor 153 and the electric motor
Control the rotation speed of the motor 163 and the forward and reverse rotation directions.
Circuit, the residual ink adhering to each nozzle surface 53a.
Feed the wiping sheet 75 when wiping
If the speed is too high for the rotation speed of the roller 76, or
Is responsible for adjusting the speed so that it is not too slow
Have. By this speed adjustment, the wiping sheet 7
Problems such as loosening of 5 or breaking due to excessive tension
Can be effectively prevented from occurring.
You. Further, the wiping sheet control unit includes:
Feeding speed of wiping sheet 75 and rotation speed of roller 76
When the wiping sheet 75 is
The feeding speed can be constant or variable
It has become. According to this wiping sheet control unit,
For example, for a nozzle surface 53a with a predetermined stain amount,
The wiping sheet 75 is supplied at the supply speed, and
Wiping is performed on the relatively large nozzle surface 53a.
The winding speed of the sheet 75 is increased (that is,
Rotational speed of both dynamic motor 153 and electric motor 163
Supply rate of wiping sheet 75)
Can be increased. Therefore,
Wiping according to the degree of dirt on the nozzle surface 53a to be swept
The feeding speed of the sheet 75 can be made variable
Has become. Further, the wiping sheet control section includes:
As shown by an arrow Y in FIG.
75 and the rotation direction of the roller 76
Rotate forward and reverse with the respective rotation speeds synchronized.
It is possible to control in the direction. That is,
Set the feeding direction of the iping sheet 75 clockwise in FIG.
(Forward rotation) and counterclockwise (reverse rotation)
Or switch at a preset timing
It has become. Therefore, the nozzle surface 53 having a predetermined amount of contamination can be used.
a for the wiping sheet 75 in the normal forward rotation direction.
And the nozzle surface 53 with a relatively large amount of dirt
a, the supply of the wiping sheet 75 is rotated in the forward and reverse directions.
Wiping the nozzle surface 53a with much dirt
You can wipe it by rubbing it with the cleaning surface of the board 75
Swelling. (4) Description of the Weight Measurement Unit 90 Following the wiping unit 70 described above, see FIG.
The weight measurement unit 90 will be described below.
This weight measuring unit 90 is provided for each ink jet head.
Per drop of ink droplet R ejected from each of the 53 nozzles
It is for measuring and managing the weight of the. For example,
Each inkjet head 53 for weight measurement
After receiving 2,000 ink drops R, the 200
To divide the weight of 0 ink drop R by 2000 number
More accurately measure the weight per ink drop R
It has become. The weight measurement result of the ink droplet R is:
Of the ink droplet R ejected from each inkjet head 53
Used to optimally control the amount. (5) Theory of the missing dot detection unit 100
Subsequently, the description of the missing dot detection unit 100 will be given below.
Do it below. This dot missing detection unit 10 shown in FIG.
0 controls the clogging of each nozzle of each nozzle unit 53.
The upper position of each ink jet
The figure provided here after moving the head 53
Block laser light from laser equipment not shown
Inspection is performed by discharging from each inkjet head 53
U. And, despite the ejection instruction, the laser light
If the nozzle is not blocked, the nozzle may become clogged.
Ink is not discharged, and there is a
Is determined to be present, and the cap unit 60
Nozzle of inkjet head 53 which is more problematic
The nozzle is sucked and clogging is removed. The ink jet devices 3, 7, and
11 and the head cleaning method
, A wiping sheet 75 and a roller 76,
The wiping sheet 75 is moved according to the feed speed of the roller 76.
A wiping sheet control unit for adjusting the feed speed.
The feed speed of the wiping sheet 75 is
A configuration / method that adjusts according to the speed is adopted. to this
According to the description, for example, the wipe
The feeding speed of the bucking sheet 75 is too slow, causing bending,
This prevents problems such as equipment shutdown.
And be able to do it. Also, the rotation speed of the roller 76
On the other hand, the wiping sheet 75 is wound at an excessive winding speed.
Problems such as scraping and breaking can be prevented.
I am able to do it. Therefore, the wiping sheet
Prevent work efficiency from dropping due to improper delivery of 75
It becomes possible. The ink jet apparatus of the present embodiment
3, 7, 11 and the head cleaning method
To the wiping sheet control unit.
The sending speed of the wiping sheet 75 based on the instruction.
The variable winding section (ie, the winding roller 79)
And the electric motor 153), and the wiping sheet 7
The structure / method of changing the winding speed of No. 5 was adopted.
According to this, depending on the degree of dirt on each nozzle face 53a, the nozzles 53a have different shapes.
Or to increase the supply speed of the iping sheet 75.
Therefore, it is effective according to the degree of contamination of each nozzle surface 53a.
It becomes possible to perform cleaning. Further, the ink jet apparatus of the present embodiment
3, 7, 11 and the head cleaning method
The ping sheet control unit sends out the wiping sheet 75
Direction can be controlled in the forward and reverse rotation directions.
Rotate the feeding direction of the nozzle 75 forward and reverse to
a configuration / method that can be wiped to rub
Was. According to this, according to the amount of dirt on each nozzle face 53a,
Rotate the wiping sheet 75 forward and backward, especially when there is a lot of dirt
The nozzle surface 53a can be wiped intensively by rubbing it.
Therefore, more effective cleaning can be performed. Further, the device manufacturing apparatus of the present embodiment
Each of the ink jet devices 3, 7, 11 and the head
The device is manufactured through manufacturing processes including cleaning methods.
The structure to build was adopted. According to this configuration, wiping
Reduced work efficiency due to improper feeding of sheet 75
Can be prevented, so the device
Can be reliably improved. The device of the present embodiment has
Ink jet devices 3, 7, 11 and the above head cleaner
A structure for manufacturing a device by a manufacturing process including a
Was adopted. According to this configuration, the wiping sheet 7
5 to prevent a drop in work efficiency due to improper delivery
Device productivity.
Can be reliably improved. The present invention
Is not limited to the above embodiment, and departs from the scope of the claims.
Various changes can be made within a range that does not
In the embodiment, first, an R (red) pattern shape is used.
Formation, followed by G (green) pattern formation, and
Later, B (blue) pattern formation was performed.
Not limited to this, pattern formation in other order as necessary
It is good to do. Further, the device manufacturing apparatus of the present invention
For example, color filters for liquid crystal display devices
It is not limited to the production of
Electroluminescence) can be applied to display devices.
is there. EL display devices are made of fluorescent inorganic and organic
Having a configuration in which a thin film containing the compound is sandwiched between a cathode and an anode,
Recombination by injecting electrons and holes into the thin film
This produces excitons,
Emission (fluorescence / phosphorescence) when the excitons of the
It is an element that emits light by utilizing. Such an EL display element
Of the fluorescent materials used for red, green and blue
A material that emits luminescent color, that is, a luminescent layer forming material and a hole injection
The material that forms the input / electron transport layer is ink, and each
Device substrate such as TFT using the device manufacturing apparatus of the invention
By patterning on top, self-luminous full-color EL
Vise can be manufactured. Debye in the present invention
The EL device range includes such EL devices.
You. In this case, for example, the color filter
1 pixel using resin resist as well as matrix
A partition is formed for each layer, and the lower layer
In order to make it easier for droplets discharged to adhere to the surface,
The wall repels the ejected droplets and mixes with the droplets in the adjacent compartment
In order to prevent collisions, the
For substrate, plasma, UV treatment, coupling, etc.
Surface treatment. Then, the hole injection / electron transport layer
Film-forming in which a material for forming a film is supplied as droplets to form a film
And a second film forming step for forming a light emitting layer in the same manner.
Manufactured. EL devices manufactured in this way are
Image display and full-screen simultaneous flash still image display, for example,
To low information fields such as letters and labels
Application, or as a light source with point, line, or surface shape
Can be used. In addition, passively driven display elements
And active devices such as TFTs for driving.
Full color display device with high brightness and excellent response
It is possible to obtain Further, the film forming apparatus of the present invention is
If metal or insulating materials are provided, metal wiring or insulating film
A new high-performance device that enables fine patterning
It can also be applied to the fabrication of functional devices. Note that the above embodiment
For convenience, the “inkjet device” and “I”
The ink jet head is called
Although described as “ink”, this inkjet head
The ejected material ejected from the ink is not limited to so-called ink,
If it is adjusted so that it can be ejected as droplets from the head
For example, the materials of the above-mentioned EL devices, metal materials
Various materials such as materials, insulating materials, or semiconductor materials are included
Needless to say. Also, in the above embodiment,
Of inkjet heads using piezoelectric elements
However, the present invention is not limited to this.
Bubbles that are generated inside the chamber and ejected by this pressure
A jet head can also be used. further,
Not only for these inkjet heads, but also
It is also possible to use a dispenser as a means to deliver
It is. The film forming apparatus of the present invention has its head cleaning machine
In short, the wiping sheet and the roller, and the feed of the roller
Adjust the feed speed of the wiping sheet according to the speed.
With an iping sheet control section to collectively clean each nozzle surface.
A sweeping configuration was adopted. According to this configuration, for example,
Feed speed of wiping sheet relative to feed speed of roller
It is too slow to bend, causing the machine to stop and other malfunctions.
It becomes possible to prevent the condition from occurring. did
Therefore, improper feeding of the wiping sheet
It is possible to prevent a decrease in work efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing one embodiment of a device manufacturing apparatus provided with an ink jet apparatus of the present invention, and is a plan view showing an arrangement of each component in the device manufacturing apparatus. FIG. 2 is a view showing a series of steps of manufacturing a color filter substrate including an RGB pattern forming step by the device manufacturing apparatus, and shows a flow of manufacturing in the order of (a) to (f). FIG. 3 is a diagram showing an example of an RGB pattern formed by each inkjet device of the device manufacturing apparatus,
(A) is a perspective view showing a stripe type, (b) is a partially enlarged view showing a mosaic type, and (c) is a partially enlarged view showing a delta type. FIG. 4 is a perspective view showing a notebook computer which is an example of a device manufactured with the liquid crystal display device manufactured by the device manufacturing apparatus. FIG. 5 is a schematic configuration diagram showing main components of an inkjet device of the device manufacturing apparatus. FIG. 6 is a view showing a part of the ink jet apparatus, and is a side view as viewed from an arrow A in FIG. 1; FIG. 7 is a plan view of the same ink-jet apparatus as viewed from an arrow B in FIG. 6; FIG. 8 is a plan view showing a nozzle head unit of the ink jet device. FIG. 9 is a side view of the nozzle head unit as viewed from an arrow C in FIG. 8; FIG. 10 is an explanatory diagram illustrating a mechanism for ejecting ink of an ink jet head provided in the nozzle head unit. FIG. 11 is a diagram showing a part of the ink jet head, wherein (a) is a diagram viewed from a side facing a nozzle surface,
(B) is DD sectional drawing of (a). FIGS. 12A and 12B are diagrams illustrating the ink jet head, wherein FIG. 12A is an explanatory diagram showing a scanning direction, and FIG. 12B is an explanatory diagram showing a change in nozzle pitch. FIG. 13 is a perspective view showing a wiping sheet supply unit of the wiping unit of the inkjet apparatus. FIG. 14 is a view showing the wiping sheet supply unit, and is a longitudinal sectional view seen from a section perpendicular to the axis of the unwinding roller and the winding roller. FIG. 15 is a perspective view showing a roller unit of the wiping unit. FIG. 16 is a longitudinal sectional view of the roller unit as viewed from a section perpendicular to the axis of the roller. FIG. 17 is a plan view illustrating cleaning of each nozzle surface by the wiping unit. FIG. 18 is a side view for explaining cleaning of each nozzle surface by the wiping unit, where (a) shows a state before the wiping sheet is pressed against the nozzle surface;
(B) shows a pressing state. [Description of Signs] 3, 7, 11: Inkjet device (film-forming device) 20: Notebook computer (device) 53: Inkjet head (head) 53a: Nozzle surface 70: Wiping Unit (head cleaning mechanism) 75 Wiping sheet 76 Roller 79 Winding roller (winding unit) 153 Electric motor (winding unit) CK Color filter substrate (substrate) R: Ink

Claims (1)

  1. Claims: 1. A film forming apparatus comprising: a plurality of heads for discharging liquid droplets; and a head cleaning mechanism for cleaning nozzle surfaces of the heads. A wiping sheet for wiping each nozzle surface at once, a roller provided at a turning point of the wiping sheet and pressing the wiping sheet toward each nozzle surface, and feeding the wiping sheet according to a feed speed of the roller. A film forming apparatus comprising: a wiping sheet control unit for adjusting a speed. 2. The film forming apparatus according to claim 1, wherein the head cleaning mechanism further includes a winding unit configured to wind up the wiping sheet, and the winding unit is configured to receive a signal from the wiping sheet control unit. Wherein the feeding speed of the wiping sheet is made variable based on the instruction. 3. The film forming apparatus according to claim 1, wherein the wiping sheet control unit is capable of controlling a direction in which the wiping sheet is fed in a forward or reverse rotation direction. 4. A head cleaning method for cleaning a plurality of heads that discharge droplets, wherein a feed speed of a wiping sheet for wiping a nozzle surface of each of the heads is provided at a turning point of the wiping sheet. A head cleaning method comprising: adjusting a wiping sheet according to a feed speed of a roller that presses the wiping sheet toward each of the nozzle surfaces. 5. The head cleaning method according to claim 4, wherein the wiping sheet is supplied to each nozzle surface by winding up the wiping sheet after the roller has been turned back. A head cleaning method, wherein a winding speed is variable. 6. The head cleaning method according to claim 4, wherein the wiping sheet is wiped so as to rub the nozzle surfaces by rotating the wiping sheet in a forward / reverse direction. 7. A device manufacturing apparatus, wherein a device is manufactured by the film forming apparatus according to claim 1. Description: 8. A device manufactured by a manufacturing process including the head cleaning method according to claim 4. Description:
JP2002073067A 2002-03-15 2002-03-15 Film forming apparatus, head cleaning method, apparatus for manufacturing device, and device Withdrawn JP2003270426A (en)

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JP2005230802A (en) * 2004-01-22 2005-09-02 Seiko Epson Corp Cleaning liquid spraying method, cleaning liquid spraying apparatus, wiping apparatus provided with the same, plotting apparatus, method for manufacturing optoelectronic apparatus, optoelectronic apparatus and electronic equipment
KR100700394B1 (en) * 2004-01-22 2007-03-28 세이코 엡슨 가부시키가이샤 Wiping apparatus, drawing device having the same, method for manufacturing electro-optic device, electo-optic device and electronic apparatus
US7703412B2 (en) 2004-09-08 2010-04-27 Seiko Epson Corporation Liquid discharging apparatus, method of cleaning head, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
JP2010234666A (en) * 2009-03-31 2010-10-21 Fujifilm Corp Head cleaning method and apparatus
JP2010264675A (en) * 2009-05-15 2010-11-25 Seiko Epson Corp Head cleaning device, liquid droplet discharging apparatus, and head cleaning method
US20120194610A1 (en) * 2011-01-28 2012-08-02 Tadashi Kyoso Nozzle surface cleaning apparatus and method, and inkjet recording apparatus
US8342639B2 (en) 2009-03-31 2013-01-01 Fujifilm Corporation Head cleaning method and head cleaning apparatus
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