JPH0710511Y2 - Three-dimensional wiring circuit board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a three-dimensional wiring circuit board on which a printed wiring circuit board can be three-dimensionally mounted, and more particularly to a mounting structure of the three-dimensional wiring circuit board.

[Conventional technology]

2. Description of the Related Art In recent years, for example, a portable remote control device (hereinafter, simply referred to as a remote control device) that remotely controls loads such as lighting and air-conditioning equipment in general homes and shops is convenient for carrying, and load control of lighting equipment and the like is possible. Since it can be done at any place, it is widely used. Below, FIGS. 7 to 9
The schematic structure of the remote controller A will be described with reference to the drawings.

In the figure, a hand-held flat box 1 that can be connected to an arbitrary indoor outlet by a power cord (not shown) is provided in a pair of upper and lower casings 2a and 2b. The transmitter circuit 3 is provided, and an address setting key switch 4 is provided on one half of the upper surface of the upper casing 2a.
And a load control key switch 4a are arranged in a matrix to provide a keyboard 5, and a display window 6 is opened in the other half of the upper surface of the upper casing 2a, and the display window 6 is used as the address setting key. It is divided into the same arrangement as the switch 4, and each section 7 is provided with a display LED 8 for displaying load information such as load position and type in characters and for displaying the state of the corresponding address setting key switch 4. ing. The components of the transmission circuit 3, the address setting key switch 4, and the display LED 8 are mounted on a flat plate-shaped printed board 9 arranged in the upper portion of the flat box 1 as shown in FIG. . Further, a rubber switch 10 made of an elastic member such as conductive rubber is inserted between the keyboard 5 and the printed circuit board 9 so as to correspond to the key switches 4 and 4a, and when the key switches 4 and 4a are pressed, The rubber switch 10 is provided so as to be elastically deformed to electrically connect between the electrodes provided on the printed board 9. A printed circuit board 11 on which a power supply circuit, a transmission circuit 3a, etc. are mounted is provided below one end of the printed circuit board 9.
Is arranged on the lower casing 2b side in parallel with the printed circuit board 9 via the connector 12 and in an electrically connected state. Reference numeral 13 is a hook hole for hooking the flat box 1 on a wall or the like.

[Problems to be solved by the device]

In the remote controller A having the above-mentioned configuration, the printed circuit board 9 on which the transmitter circuit 3, the key switches 4, 4a, etc. are mounted is mounted.
And a printed circuit board 11 on which the power supply circuit and the oscillator circuit 3a are mounted.
Are arranged in the flat box 1 with a step through the connector 12, that is, because the flat printed boards 9 and 11 are used, the space in the flat box 1 is There is a problem in that it is difficult to effectively use and arrange the remote controller, and the remote controller A itself becomes large.

The flat printed boards 9 and 11 are generally sheet-like glass substrates, for example, thermosetting phenolic resin,
Alternatively, after impregnating with epoxy resin to form in a B-stage state (semi-cured state), a required number of these are laminated and copper foil is placed on the surface thereof, and heat and pressure treatment is performed by a laminating press. I used the one I made. The printed board manufactured as described above is called a so-called hard board, and if it is forcibly bent, it will be damaged. Therefore, it can usually be used only in a flat state. In other words, it is three-dimensional by bending it with a certain curvature.
Dimensional use was completely impossible.

Therefore, as described above, in the remote control device A, which is required to be small and lightweight, when a flat printed circuit board is used, its mounting space must be made wider than necessary, which becomes a neck and dead space. However, there is a problem in that the remote control device A is enlarged and the new design cannot be performed.

As a result, the printed circuit boards currently in practical use can only be used in a simple and planar manner, so it is possible to reduce the size and weight of electrical equipment such as remote control devices that use this type of printed circuit board. It was difficult.

In view of the above problems, the present invention provides a circuit board in which a required conductive pattern is formed on a flat insulating board that has been specially processed.
An object of the present invention is to provide a three-dimensional wiring circuit board in which a curved surface is formed with an arbitrary curvature corresponding to a mounting space of a device to be used and a printed circuit board can be used three-dimensionally.

[Means for Solving the Problems]

The present invention is a thermoplastic, high-viscosity polyester resin with excellent heat resistance, and is kneaded by adding a filler such as an inorganic filler, a glass single fiber, a flame retardant, and the like. An insulating substrate is provided, and a circuit pattern is formed by forming a required conductor pattern on the insulating substrate, and the circuit substrate is crystallized at a crystallization temperature by hot pressing or the like under the non-crystalline state, and at a predetermined curvature, for example, By performing curved surface molding in a U-shape, the self-recovery property and elasticity with a required conductor pattern are excellent, and when an external force is applied to the curved surface molded portion, the curved surface is temporarily deformed, A three-dimensional wiring circuit board that enables the original state to be restored by self-recovery performance with the elimination of external force is provided, and predetermined mounting component parts are provided on inner surfaces of the three-dimensional wiring circuit board (U-shaped) that face each other. Instrumentation and, after this, mounting parts are included in the inner surface of the substrate mounted with the mounting part, for example,
With a synthetic resin such as polyester or silicon, which has excellent insulation properties, being foamed and filled with dry air at a specified pressure, the interior wiring space of the three-dimensional wiring circuit board is closed, and the board mounting part of the electrical equipment It is characterized in that it is three-dimensionally attached to, and its operation is as follows.

[Action]

The present invention uses a specially processed circuit board to effectively utilize the dead space of the board mounting portion of an electric device, for example, U
On the three-dimensional wiring circuit board that is formed by forming a curved surface in the shape of a letter, mounting the mounting components using the inner surfaces facing each other,
Since it can be performed over two sides, it is possible to increase the mounting area, which can reduce the dead space of the board mounting part to reduce the size of the electric device and the board on which the mounting parts are mounted. By filling and closing the inner space while foaming synthetic resin such as polyester, the insulation of the mounted parts is strengthened and the curved surface is molded to enable three-dimensional wiring circuit board itself. It is characterized in that the mechanical strength is prevented from decreasing.

〔Example〕

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 2 to 4, the same parts as those in FIGS. 7 to 9 are designated by the same reference numerals and will be described. The present invention will be described as an example implemented in a portable remote control device.

First, the production of an insulating substrate that constitutes the three-dimensional wiring circuit board of the present invention will be described.

The insulating substrate is a high viscosity saturated polyester resin that is thermoplastic and excellent in heat resistance, and is kneaded by adding a filler composed of an inorganic filler, a glass single fiber, a flame retardant, etc. to a required thickness ( It is manufactured by continuously extruding into a sheet with a thickness of about 1.2 mm. This insulating substrate is, for example, an electrical insulating material developed by Unitika Ltd., and the product name "Unilate" corresponds to this. When this insulating substrate is extruded into a sheet, it is in an amorphous state and has a high elasticity, and when heated at a required temperature, it is crystallized and permanently maintains a predetermined shape, and more than necessary. Even when an external force is applied, it does not become flat and has elasticity so that it can self-return to a predetermined shape.

Next, using the insulating substrate formed as described above, a third
As shown in the figure, a case where the three-dimensional wiring circuit board 15 is manufactured by forming a curved surface in a U shape will be described.

In FIG. 1, an adhesive sheet is applied on an insulating substrate in an amorphous state, which is extruded into a sheet and molded to a required thickness.
Temporarily adhered under a pressure condition of 10 kg / cm ² for about 20 minutes at a temperature of 50 ° C., then, on the adhesive sheet,
A 35 μm-thick copper foil is heated and pressed at a temperature of about 70 ° C. under a condition of 10 kg / cm ² by a hot roll press to perform a laminating process. Next, an etching resist for forming a conductor pattern is printed on the copper foil and cured, and then an edging treatment is performed using an edging liquid, and then, when mounting components, soldering work is performed. The solder resist is printed and cured except for the necessary parts. Thereafter, the insulating substrate that has been subjected to each of the above-mentioned treatments is subjected to a punching operation for mounting electronic parts and a punching work for adjusting the outer shape at the same time using a press die to form a flat circuit board 15a.
To produce. The circuit board 15a at this point
Is in a flexible, amorphous state that is highly flexible.

Next, the case where the three-dimensional wiring circuit board 15 is manufactured by forming the curved surface of the circuit board 15a into a U shape with a predetermined curvature will be described.

When the circuit board 15a is formed into a curved surface, the curved and curved portion 16 is formed by bending the circuit board 15a in a flat and amorphous state into a U-shape.
5 and 6 at the position where (see FIG. 3) is formed.
As shown in the figure, arcuate notches 17 or horizontally elongated holes are formed at both ends of the circuit board 15a in the width direction so that curved surfaces can be easily formed.
Punch 17a. The cutout portion 17 and the elongated hole 17a may be provided at the stage when the insulating substrate is manufactured.

After forming the notch 17 and the like at the position where the curved portion 16 is provided on the circuit board 15a, the flat circuit board 15a is placed in a heating furnace (not shown) and heated at a temperature of about 160 ° C. for about 30 minutes to produce an amorphous state. The circuit board 15a below is crystallized by about 30 to 40% to reduce the toughness of the circuit board 15a itself and to bend the curved portion 16a.
Easy to form. That is, the circuit board 15a is almost crystallized in the flat state. In this state, when the circuit board 15a is bent in a U-shape, the transmitting circuit 3, the power supply circuit, and the transmitting circuit 3a are formed on one or both of the inner surfaces facing each other, as shown in FIG. The mounted components are mounted at the predetermined conductor pattern positions. Also, as shown in FIG. 2, on one of the outer side surfaces (the position which becomes the upper surface when bent into a U shape), key switches 4 and 4a for address setting and load control are provided in one half thereof. The LEDs are arranged and arranged in a matrix, and the display LEDs 8 are mounted on the other half at predetermined conductor pattern positions like the key switches 4 and 4a.

After mounting the required mounting components on the predetermined conductor pattern positions of the circuit board 15a as described above, the circuit board 15
A is curved in a U shape with each key switch 4, 4a and the display LED 8 being located above the notch 17 (long hole 17a) provided at the position where the curved portion 16 is formed. At this time, since the circuit board 15a itself has reduced toughness, it can be smoothly curved at the position of the cutout portion 17 (long hole 17a). Moreover, in this bending forming work, since the portion of the bending portion 16 is provided with the cutout portion 17 and the like, the width is narrower than other flat portions,
Combined with the toughness being halved, the circuit board 15a
Can be curved smoothly and satisfactorily.

In this state, that is, since the curved portion 16 is not completely crystallized by simply bending the circuit board 15a in a U shape, the curvature of the curved portion 16 may change if left as it is, Since it may be deformed when an external force is applied, after the circuit board 15a is curved at the position of the cutout portion 17, the curved portion is further provided to set and hold the curved portion 16 at a predetermined curvature. A curved molding tool (not shown) is sandwiched between the curved portions 16, the molding jig is heated by a heater or the like, and the curved portion 1 of the circuit board 15a sandwiched by the molding jig.
Force heating 6 at a crystallization temperature of about 200 ° C. for about a few minutes.
When the heating operation is completed and the molding jig is removed by lowering it to room temperature, the curved portion 16 of the circuit board 15a is crystallized and loses its toughness, and as shown in FIG. 3, it is curved with a predetermined curvature. Three-dimensional printed circuit board 15 having curved portion 16 formed
Is formed. In this three-dimensional wiring circuit board 15 bent in a U shape, the flat portion other than the curved portion 16 is not completely crystallized, but the curved portion 16 is crystallized, so that the curved portion 16 is As a result of an experiment, it was found that when an external force is applied, its curvature changes temporarily, but when the external force disappears, the curved portion 16 immediately recovers to its original state and maintains a predetermined curvature.

In the case of this example, the free end of the three-dimensional printed circuit board 15
Due to the relationship with the board mounting portion 18, the mounting leg portions 19 are formed by being bent at a substantially right angle in directions opposite to each other. After the mounting leg 19 is provided with the three-dimensional wiring circuit board 15, for example,
The free end side may be heated and bent using an electric iron or the like. After the three-dimensional wiring circuit board 15 is formed as described above, polyester and silicone having excellent electrical insulation and heat resistance are provided in the inner side surface space of the three-dimensional wiring circuit board 15 on which mounting components such as the transmission circuit 3 are attached. A synthetic resin such as the above is foamed and filled with dry air at a predetermined pressure, and the inner space space is closed by the resin filling layer 20. Three-dimensional wiring circuit board 15
As described above, the three-dimensional wiring circuit board 15 bent in a U shape by closing the inner side surface of the above with the resin filling layer 20 is
The mechanical strength can be increased to maintain the curved shape, and since the mounted component is not exposed to the outside, good electrical insulation can also be maintained.

When the three-dimensional wiring circuit board 15 constructed as described above is incorporated in the remote control device B, as shown in FIGS. 3 and 4, the mounting legs 19 and 19 are provided on the upper casing 2a. 18 is fastened with a screw or the like, and the curved portion 16 is mounted on the arc-shaped support base 21 provided in the lower casing 2b, and the upper and lower casings 2a, 2b are fastened with the fastening screw 22. This completes the assembly of the remote control device B.

Remote control device B configured as described above
When using, i.e., when operating the key switches 4 and 4a, even if this is strongly pressed, the three-dimensional wiring circuit board 15 has an internal space closed by the resin insulating layer 20,
Electrodes (not shown) provided on the substrate can be smoothly connected or disconnected via the rubber switch 10 without bending.

In this invention, the key switches 4, 4a are connected to the three-dimensional wiring circuit board 15
Although the example of installing on the upper surface side of is described, the invention is not limited to this, and may be installed separately on the upper and lower surfaces.
In addition, the curved portion 16 of the three-dimensional printed circuit board 15 may be manufactured by cutting the inner surface of the curved portion 16 so that the plate thickness is thinner than that of the flat portion in order to favorably form the curved surface. Of course.

[Advantages of the Invention] Since the present invention is configured as described above, it has the following effects.

(1) In the present invention, the printed circuit board for mounting the mounted component can be used three-dimensionally by forming the curved surface of the circuit board formed by using the insulating substrate that has been specially processed. The mounting area can be expanded, and the mounting area of the board in the board mounting portion of the electric device using this type of printed board can be reduced.

In addition, since the circuit board can be formed into a curved surface, the dead space of the board mounting portion can be effectively used for mounting, and as a result, it is necessary to make the board mounting portion of the electric device larger than necessary as in the past. Since the electric device is small and lightweight, and the circuit board can be molded three-dimensionally, the design and design of the electric device can be greatly improved and the degree of freedom can be significantly increased.

(2) Further, according to the present invention, when the circuit board is curved, the internal space is foamed and filled with a synthetic resin to enhance the mechanical strength and insulation performance of the curved circuit board. It is possible to remarkably improve the reliability of the circuit board on which the curved surface is formed.

[Brief description of drawings]

FIG. 1 is a schematic process diagram for manufacturing the three-dimensional wiring circuit board of the present invention, FIG. 2 is a plan view of a remote control position equipped with the three-dimensional wiring circuit board of the present invention, and FIG. Fig. 4 is a side view showing a longitudinal section of a portion, Fig. 4 is a sectional view taken along line XX in Fig. 3, Fig. 5 is an explanatory view showing a curved portion of a three-dimensional wiring circuit board in a developed state, and Fig. 6 is the same curved portion. FIG. 7 is an exploded view showing another embodiment of the part, FIG. 7 is a plan view of a remote control device equipped with a conventional printed circuit board (flat shape), and FIG. FIG. 9 is also a vertical sectional front view of the main part. 15 ... Three-dimensional wiring circuit board, 15a ... Circuit board, 16 ... Curved part, 1
9 ... Mounting legs, 20 ... Resin filling layer

Claims (2)

[Scope of utility model registration request] 1. A thermoplastic high-viscosity polyester resin is filled with a glass single fiber, an inorganic filler, and a filler such as a flame retardant, and the mixture is extruded to form a sheet-like non-crystalline insulating substrate. This insulating substrate is provided with a required conductor pattern on its upper surface and is substantially crystallized at a predetermined temperature to form a flat circuit board. The circuit board has a predetermined curvature at a predetermined position in the longitudinal direction. The three-dimensional wiring circuit board is bent in a U-shape at the crystallization temperature to provide a three-dimensional wiring circuit board, and the required mounting components are mounted on the inner side surface of the three-dimensional wiring circuit board. A three-dimensional wiring circuit board characterized by being foamed and filled with synthetic resin in some places. 2. The three-dimensional wiring circuit board according to claim 1, wherein a cutout or a through hole is provided in a bent portion of the circuit board.