JPH0710492Y2 - Wafer reversing sticker - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer reversing sticking apparatus for sticking a wafer to a sticking plate that supports the wafer in order to polish the wafer smoothly.

[0002]

2. Description of the Related Art In the manufacture of semiconductors, in order to polish the surface of a wafer, the wafer is adhered to a sticking plate of a polishing machine with an adhesive. In this case, if the adhesive layer is formed nonuniformly, the surface to be polished is affected, and the wafer cannot be polished flat and highly accurately. Also, the above-mentioned pasting work is performed manually.

In view of the above-mentioned circumstances, the applicant has applied a method in which an adhesive is applied thinly on the surface of a wafer with a spin coater, and the adhesive is inverted to continuously adhere the adhesive onto a sticking plate. And proposed the device. FIG. 4 shows the method, in which the wafer (1) is placed on the transfer means (4) in a horizontal state by raising and lowering the holding part (3) of the receiving device (2). By moving laterally, it is conveyed above the spin chuck means (5). The holding part (6) of the spin chuck means (5) rises to carry the wafer (1) into the adhesive coating device (7) and rotate, diluted with an organic solvent and nozzle (8). The adhesive that is dripped from is applied thinly on the surface of the wafer. The wafer (1) is placed again on the transfer means (4) by lowering the holding part (6) of the spin chuck means (5).

A reversing sticking device (9) is provided at a position indicated by a chain line in which the transport means moves laterally. The reversing sticking device (9) has a chuck (1) at the tip of the reversing arm (10).
1) and when the reversing arm (10) rotates as shown by an arrow (12), it receives the wafer from the transfer means and adheres it to the upper surface of the sticking plate (13). The sticking plate (13) is heated to a predetermined temperature, and a heating means (14) is appropriately provided around the sticking plate (13) to accelerate evaporation of the organic solvent in the adhesive and to solidify the adhesive. I try to play an adhesive action quickly. Further, a stamp means (15) is provided above the sticking plate (13), and the wafer (1) adhered to the sticking plate (13) is pressed against the sticking plate (13). Then, the sticking plate (13) is rotated by a predetermined angle by the indexing means (16) to bond the wafers one after another. After adhering a plurality of wafers, the sticking plate (13) is conveyed from the indexing means to the next step, and the plurality of wafers on the upper surface are uniformly pressed together to make the adhesive layer uniform. And then cooled.

[0005]

In the above-mentioned method, in the reversing sticking device (9), the reversing arm (10) supports the support shaft (17) of the vacuum suction chuck (11) as shown in FIG. 18) is slidably inserted and biased in the direction away from the arm (10) by a plurality of springs (19) ... When bonding the wafer to the sticking plate (13), The chuck (11) has a cushioning function to press the wafer. The strength of the spring (19) is
Although it can be adjusted with (20) ..., this adjustment is delicate and the chuck (11) may become slanted. Therefore, the wafer cannot be pressed uniformly against the attachment plate (13) by the chuck, or the support shaft (17) and the bearing (18) of the chuck rub against each other to generate fine dust.
Such dust particles contaminate the periphery of the sticking part, which should originally be clean or super-clean, and adhere to the surface of the sticking plate or the like, which causes the failure to obtain highly accurate flatness.

An object of the present invention is to provide a wafer reversing sticking apparatus as described above, which is capable of uniformly adhering a wafer to a sticking plate and preventing dust particles from being generated. It is to be.

[0007]

According to the present invention, in a wafer reversing sticking device for supporting a wafer having an adhesive applied on its surface by a chuck, reversing it and adhering it to a sticking plate, the tip of the reversing arm is A chuck means for holding a wafer is provided, a hollow pad is formed between the chuck means and the arm, and a pressurizing fluid is introduced into the pad to maintain a constant pressure in the pad. A wafer reversing sticking device equipped with
The above object is achieved.

[0008]

The chuck means provided at the tip of the reversing arm is elastically and uniformly supported entirely by the pad which is inflated by the pressure means and pressurized to a constant pressure, and the wafer is evenly attached to the sticking plate. Since it can be adhered to the substrate and does not have a conventional bearing portion, dust particles are not generated.

[0009]

EXAMPLES Examples will be described below. Referring to FIG. 1 and FIG. 2, the apparatus main body (21) is guided by a guide rod (22) and is moved by a cylinder (23) in a direction of an arrow (24).
And a vertical moving frame (29) provided on the horizontal moving frame (25) and guided by a guide rod (26) to move in the direction of the arrow (28) by a cylinder (27). (29) has a shaft support so that it can be rotated by rotating means (30) such as a motor and an air actuator.
An inverted arm (32) which is (31) is provided. The entire device body (21) can be raised and lowered.

A mounting plate (33) is attached to the tip of the reversing arm (32).
Are secured with bolts (34) and chuck means are provided on the mounting plate (33), but the mounting plate (33) is not formed and
The chuck means may be provided directly on the frame (32).
The chuck means is a chuck head (35) formed of a ceramic material, and a through hole (36) formed in the shaft portion (36) of the head (35) so that the upper surface of the chuck head (35) exerts a vacuum suction action. Although a connecting pipe (38) for connecting a vacuum source (not shown) provided separately from 37) is provided, other suitable chucking method can be adopted.

The head (35) of the chuck means and the arm
A hollow pad (39) is provided between the mounting plates (33) of the frame (32). The pad (39) is made of a heat-resistant elastic material such as a silicone rubber material, is formed in a substantially donut shape as shown in FIG. 3, and is formed in a substantially C-shaped cross-section with an open lower surface. Then, insert the holding plate (40) through the opening,
The (41) is sandwiched between the mounting plate (33) and the holding plate (40) is fixed to the mounting plate (33) with bolts (42).

An engaging projection (44) is provided on the upper surface of the pad (39) so as to be fitted in an engaging hole (43) in the lower surface of the chuck head (35) to prevent lateral movement. Further, between the engaging protrusions (44), a supporting protrusion (45) is formed so as to support the lower surface of the head (35).

The shaft portion (36) of the chuck head (35) is inserted through the central hole (46) of the pad (39) and is made of a heat-resistant elastic material such as a silicone rubber material. 47)
Is attached to the outer periphery, the holding ring (47) is brought into contact with the lower edge of the pad (39), and the stop ring (48) is hooked to elastically displace.

Pressurizing fluid is introduced into the pad (39) to maintain a constant pressure in the pad. The pressurizing means shown in the figure supplies a fluid (gas) such as N ₂ gas or air from a pressurizing fluid supply source (not shown) to a fluid stop valve (49),
It is equipped with a circuit which adjusts the pressure to about 0.01 to 1 kg / cm ² by a precision regulator (50) and supplies it to the inside of the pad. The connection pipe (51) of the end of the circuit made of a heat-resistant elastic material such as silicon rubber material is connected to the connection pipe (52) such as a stainless pipe attached to the holding plate (40) of the pad. Has been done.

The circuit is provided with a digital pressure switch (53), which may cause the pad (39) to burst or
When the internal pressure of the pad (39) suddenly decreases due to disconnection of the connecting pipe, the pressure drop is detected and the introduction of the pressurized fluid is stopped, and at the same time, the entire apparatus shown in FIG. 4 is stopped.

When the above-mentioned reversing sticking device is used in a clean or super-clean state so that dust particles do not adhere to the surface of the sticking plate, the surrounding dust particles are counted near the device. A dust counter (not shown) is provided, and when the pressurized fluid is ejected or the counter counts a predetermined number of dusts, a solenoid valve (not shown) provided at an appropriate position of the circuit is controlled at that time, It is also possible to configure the circuit so that the introduction of the pressurized fluid is stopped and the entire device is stopped.

Thus, as shown in FIG. 4, the wafer (1) whose surface is coated with the adhesive has the reversing arm (32) of the above-mentioned wafer reversing sticking device in the direction of the arrow (28). When the reversing arm (32) is raised by the arrow (5
It is inverted by rotating in the 4) direction and placed on the sticking plate (13). Since the chuck means is elastically attached to the reversing arm by the hollow pad (39), the wafer (1) is bonded to the attaching plate (13) without cracking or damage. .

[0018]

The present invention is constructed as described above, and the chuck head of the chuck means can be elastically displaced through the hollow pad and the elastic holding ring which are pressurized by the pressurized fluid.
Since the supporting means is supported by the reversing arm, the chuck means can be attached to the sticking plate when the wafer is stuck to the sticking plate.
It is supported by an average elastic force along the reversing arm without tilting and tilting, so that the wafer can be evenly adhered and an elastic holding lever can be attached to the shaft of the chuck head.
The shaft of the head to the arm
Therefore, even if the chuck head moves , there can be no sliding portion between the chuck head and the reversing arm.
Therefore, dust particles are not generated due to sliding, and the sticking part
It can prevent contamination of the surrounding area , and
It can be attached so that dust is not sandwiched between them.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention, mainly an enlarged cross-sectional view of a tip portion of an inversion arm.

FIG. 2 is a side view of the wafer reversing sticking apparatus of the present invention.

FIG. 3 is a plan view of a pad.

FIG. 4 is an explanatory view of an apparatus that supplies wafers and sequentially attaches them to an attachment plate.

FIG. 5 is an enlarged cross-sectional view of a tip portion of a reversing arm of a conventional wafer reversing / pasting device.

[Explanation of symbols]

 32 reverse arm 35 chuck head 39 pad

Claims (3)

[Scope of utility model registration request] 1. A adhesive wafer reversing attachment device to adhere to the pasted plate supporting inverts the applied wafer by a chuck to the surface of the chuck of the chuck means provided chucking means for holding the wafer on the tip of the inverted arms A hollow pad is formed between the head and the arm, and a pressurizing means is provided to introduce a pressurized fluid into the pad to keep the inside of the pad at a constant pressure, and at the same time, elastic force is applied to the shaft portion of the chuck head. material
A retaining ring made of can be fitted to elastically displace the shaft.
Wafer reversing sticking apparatus was attached only to the arm ability. 2. The wafer reversing sticking apparatus according to claim 1, wherein the pressurizing means stops the introduction of the pressurized fluid when the internal pressure of the pad suddenly decreases. 3. The pressurizing means stops the introduction of the pressurized fluid when the dust particles rapidly increase.
The wafer reversal sticking device according to [4].