JPH0697645A - Method and equipment for reducing oxygen concentration in reflow soldering furnace - Google Patents
Method and equipment for reducing oxygen concentration in reflow soldering furnaceInfo
- Publication number
- JPH0697645A JPH0697645A JP780992A JP780992A JPH0697645A JP H0697645 A JPH0697645 A JP H0697645A JP 780992 A JP780992 A JP 780992A JP 780992 A JP780992 A JP 780992A JP H0697645 A JPH0697645 A JP H0697645A
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- oxygen concentration
- gas
- reflow soldering
- nitrogen gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板上に各種
電子部品を実装する際、はんだ付け箇所にあらかじめは
んだを供給しておき、これを熱風、ヒーター、赤外線、
レーザーなどの熱源を用いて溶かしてはんだ付けを行う
リフローはんだ付け炉内の酸素濃度を減少させる方法及
びその装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention, when mounting various electronic components on a printed circuit board, previously supplies solder to a soldering point, and supplies this with hot air, a heater, infrared rays,
The present invention relates to a method and an apparatus for reducing the oxygen concentration in a reflow soldering furnace in which a heat source such as a laser is used for melting and soldering.
【０００２】[0002]
【従来の技術】リフローはんだ付け炉では、プリント基
板上に各種電子部品をはんだ付けする際、２３０〜２５
０℃まで昇温させているが、その加熱雰囲気が一般には
空気であるため、ただ単にはんだを乗せるだけでは、基
板上の銅製プリント箔表面、電子部品のリード線や脚、
はんだ表面が酸化してしまい、はんだと銅製プリント箔
表面、リード線・脚が十分に濡れず、良好なはんだ接合
が得られなくなる。この現象を防止するため、一般的に
は活性フラックスを併用することにより、酸化膜を除去
し、さらに入熱時の酸化進行を防止する方法がとられて
いる。2. Description of the Related Art In a reflow soldering furnace, when various electronic components are soldered on a printed circuit board, 230 to 25
Although the temperature is raised to 0 ° C, the heating atmosphere is generally air, so simply placing solder on the surface of the copper printed foil on the board, lead wires and legs of electronic parts,
The surface of the solder is oxidized, the solder and the surface of the copper print foil, the lead wires and legs are not sufficiently wet, and good solder joint cannot be obtained. In order to prevent this phenomenon, a method of removing the oxide film and further preventing the progress of oxidation at the time of heat input is generally taken by using an active flux together.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、活性フ
ラックスは通常腐食性が強く、基板上に残留すると基板
の寿命を減じることになり兼ねない。そこで、はんだ付
け施工後の基板洗浄が必要となり、しかも洗浄剤として
環境破壊をもたらす恐れのあるフロンの使用を強いられ
ることとなる。また、銅製プリント箔表面に、あらかじ
めはんだメッキを施したり、耐熱コーティング剤を塗布
して、銅製プリント箔表面の酸化を防ぐ方法もあるが、
大変な工程増加となり、信頼性も低い。However, the active flux is usually highly corrosive, and if it remains on the substrate, the life of the substrate may be shortened. Therefore, it is necessary to clean the substrate after soldering, and it is necessary to use CFC as a cleaning agent that may cause environmental damage. In addition, there is also a method of pre-soldering the copper print foil surface or applying a heat-resistant coating agent to prevent oxidation of the copper print foil surface.
The number of processes has increased and reliability is low.
【０００４】近年、はんだ付け雰囲気を空気から不活性
な窒素ガスに置換することにより、酸化膜生成を防止す
る方法が開発、実用化されているが、この方法では、加
熱炉内の酸素濃度を少なくとも数百ｐｐｍ程度に保持す
るために膨大な量の窒素ガスを消費してしまう。In recent years, a method for preventing the formation of an oxide film by replacing the soldering atmosphere with air from inert nitrogen gas has been developed and put into practical use. In this method, the oxygen concentration in the heating furnace is controlled. A huge amount of nitrogen gas is consumed in order to maintain at least about several hundred ppm.
【０００５】又、はんだ付け炉は、その左右に基板の入
口と出口が夫々開口しており、この２つの口を経由して
炉内に侵入する空気を阻止することは実際上不可能であ
ることから、炉内の酸素濃度の減少には限界がある。Further, in the soldering furnace, an inlet and an outlet of the board are opened on the left and right sides, respectively, and it is practically impossible to block the air that enters the furnace through these two ports. Therefore, there is a limit to the reduction of oxygen concentration in the furnace.
【０００６】本発明の目的は、簡単な方法と装置によ
り、可及的に炉内の酸素濃度を減少させて品質の向上と
消費する窒素ガスの量の減少を図るように工夫したリフ
ローはんだ付け炉内の酸素濃度を減少させる方法及びそ
の装置を提供することである。It is an object of the present invention to use a simple method and apparatus to reduce the oxygen concentration in the furnace as much as possible to improve the quality and reduce the amount of nitrogen gas consumed. A method and apparatus for reducing the oxygen concentration in a furnace.
【０００７】[0007]
【課題を解決するための手段】本発明に係るリフローは
んだ付け炉内の酸素濃度を減少させる方法及びその装置
は以下のとおりである。The method and apparatus for reducing the oxygen concentration in the reflow soldering furnace according to the present invention are as follows.
【０００８】１．リフローはんだ付け炉内に触媒を配置
すると共にこの炉内に窒素ガスと炉内において自己燃焼
濃度以下の可燃性ガスを送入し、配置した触媒により炉
内において前記可燃性ガスを炉内の酸素をとり込みなが
ら触媒燃焼させて炉内の酸素濃度を減少させる方法。1. A catalyst is placed in the reflow soldering furnace, and a nitrogen gas and a flammable gas having a self-combustion concentration or less in the furnace are fed into the furnace, and the placed catalyst causes the flammable gas to move to the oxygen in the furnace. A method of reducing the oxygen concentration in the furnace by performing catalytic combustion while taking in oxygen.
【０００９】２．リフローはんだ付け炉内の１ケ所又は
複数箇所に触媒を配置すると共にこの炉内に窒素ガスと
可燃性ガスを混合した雰囲気ガス送入ラインを接続し、
前記雰囲気ガス送入ラインに結ばれた窒素ガス及び可燃
性ガス送入ラインに夫々流量制御器を取り付け、この両
制御器を炉内雰囲気中の酸素濃度値に基づいて制御する
演算器を設けて成るリフローはんだ付け炉内における酸
素濃度減少装置。2. A catalyst is arranged in one or more places in the reflow soldering furnace, and an atmosphere gas feed line in which nitrogen gas and flammable gas are mixed is connected to this furnace,
A flow rate controller is attached to each of the nitrogen gas and combustible gas introduction lines connected to the atmosphere gas introduction line, and an arithmetic unit for controlling both controllers based on the oxygen concentration value in the atmosphere in the furnace is provided. Oxygen concentration reducing device in reflow soldering furnace.
【００１０】なお、炉に対して窒素ガス送入ラインと可
燃性ガス送入ラインを別々に接続し、炉内において窒素
ガスと可燃性ガスを混合するように構成してもよい。触
媒はパラジュウム又は白金系のものを使用し、配置する
位置は炉内の出入り口、中央及び炉内ガス循環ライン等
任意である。又、触媒は炉内雰囲気と良く接触するよう
に、網目状、ハニカム状等に形成するとよい。次に、可
燃性ガス（アルコール、水素）はリフローはんだ付け炉
内の酸素量の燃焼反応理論量に対して０．９〜１．４倍
が適量で、これより少ないと燃焼効果が悪く、多いと触
媒に対する接触率が低下してやはり燃焼効果が悪く、酸
素の除去率が低下する。The nitrogen gas feed line and the flammable gas feed line may be separately connected to the furnace so that the nitrogen gas and the flammable gas are mixed in the furnace. A catalyst of palladium or platinum type is used, and the catalyst may be arranged at any position such as the entrance and exit of the furnace, the center, and the gas circulation line in the furnace. Further, the catalyst may be formed in a mesh shape, a honeycomb shape or the like so as to be in good contact with the atmosphere in the furnace. Next, the flammable gas (alcohol, hydrogen) is 0.9 to 1.4 times the theoretical amount of the combustion reaction of the amount of oxygen in the reflow soldering furnace. When the contact rate with the catalyst is reduced, the combustion effect is also poor and the oxygen removal rate is reduced.
【００１１】[0011]
【作用】リフローはんだ付け炉に窒素ガスと共に可燃性
ガスが送入されると、炉内においてこの可燃性ガスは触
媒に付着し、炉内の温度常温〜２５０℃の温度で炉内の
酸素をとり込み、触媒燃焼する。炉内においては、雰囲
気温度の均一化のためにファンが取り付けられており、
この作用で、炉内雰囲気中の可燃性ガスは酸素と効率よ
く結合し、触媒燃焼する。この結果、酸素濃度を１００
ｐｐｍ以下まで減少することが可能である。例えば、 Ｏ２＋２Ｈ２ → Ｐｄ−Ａｌ２Ｏ３ → ２Ｈ２Ｏ ３／２Ｏ２＋ＣＨ３ＯＨ → Ｐｄ−Ａｌ２Ｏ３ → ＣＯ２＋２Ｈ２Ｏ ３Ｏ２＋Ｃ２Ｈ５ＯＨ → Ｐｄ−Ａｌ２Ｏ３ → ２ＣＯ２＋３Ｈ２Ｏ と変化する。When the combustible gas is sent into the reflow soldering furnace together with the nitrogen gas, the combustible gas adheres to the catalyst in the furnace, and the oxygen in the furnace is removed at a temperature in the room temperature to 250 ° C. Take in and burn catalytically. In the furnace, a fan is attached to make the ambient temperature uniform,
By this action, the flammable gas in the furnace atmosphere is efficiently combined with oxygen and catalytically burned. As a result, the oxygen concentration is 100
It is possible to reduce to below ppm. For example, O 2 + 2H 2 → Pd -Al 2 O 3 → 2H 2 O 3 / 2O 2 + CH 3 OH → Pd-Al 2 O 3 → CO 2 + 2H 2 O 3O 2 + C 2 H 5 OH → Pd-Al 2 O 3 → 2CO 2 + 3H 2 O changes.
【００１２】図１〜図５に酸素除去テストの結果を示
す。この結果から、はんだ付け炉の実用温度の範囲内に
おいて、酸素は９０％以上まで除去できていることが理
解できる。The results of the oxygen removal test are shown in FIGS. From this result, it can be understood that oxygen can be removed up to 90% or more within the practical temperature range of the soldering furnace.
【００１３】炉内における雰囲気の酸素濃度は、酸素濃
度センサーにより常時検出され、フィードバッグ制御に
より窒素ガスと可燃性ガスの混合比は制御される。The oxygen concentration of the atmosphere in the furnace is constantly detected by an oxygen concentration sensor, and the mixture ratio of nitrogen gas and combustible gas is controlled by feed bag control.
【００１４】[0014]
【実施例】図６に本発明の実施例を示す。１はリフロー
はんだ付け炉にして、２は窒素ガス供給ライン、３は可
燃性ガス（実施例は水素）供給ライン、４は混合ガス送
入ラインにして、前記炉１に結ばれている。EXAMPLE FIG. 6 shows an example of the present invention. Reference numeral 1 is a reflow soldering furnace, 2 is a nitrogen gas supply line, 3 is a flammable gas (hydrogen in the embodiment) supply line, and 4 is a mixed gas feed line, which are connected to the furnace 1.
【００１５】５は窒素ガス流量制御器、６は可燃性ガス
流量制御弁、７は炉１内の雰囲気をサンプリングするサ
ンプリングライン、８はサンプリングポンプ、９はサン
プリングした雰囲気中の酸素濃度を判定するための酸素
濃度計、１０は演算器にして、この演算器１０は炉１内
の酸素濃度に基づいて窒素ガスに混合する可燃性ガス量
をリフローはんだ付け炉内の酸素量の燃焼反応理論量の
０．９〜１．４倍に制御している。Reference numeral 5 is a nitrogen gas flow rate controller, 6 is a flammable gas flow rate control valve, 7 is a sampling line for sampling the atmosphere in the furnace 1, 8 is a sampling pump, and 9 is the oxygen concentration in the sampled atmosphere. For this purpose, an oxygen concentration meter 10 is used as a calculator, and this calculator 10 calculates the combustion reaction theoretical amount of the oxygen amount in the reflow soldering furnace based on the oxygen concentration in the furnace 1 to determine the amount of combustible gas to be mixed with nitrogen gas. It is controlled to 0.9 to 1.4 times.
【００１６】[0016]
【発明の効果】本発明は以上のように、炉内に可燃性ガ
スを供給し、炉内の酸素と触媒を利用して触媒燃焼させ
ることにより、炉内の酸素を除去するようにした。この
結果、次のような効果を奏する。INDUSTRIAL APPLICABILITY As described above, the present invention removes oxygen in the furnace by supplying the combustible gas into the furnace and catalytically burning the oxygen and the catalyst in the furnace. As a result, the following effects are achieved.
【００１７】ａ．炉内の出入口付近及び複数箇所に触媒
を配置することにより効果的に酸素を除去することで、
炉内の酸素濃度を窒素ガスの置換だけでは多量の窒素ガ
スを必要としたが、本法を用いると従来の１／２〜１／
３程度の窒素量にて炉内酸素濃度を１００ｐｐｍ以下に
減少させることができる。この結果、従来より少量の窒
素ガス量で高品質な製品の製造が可能である。この結
果、窒素ガスを利用したリフローはんだ付けにおいて、
コストの低下が可能である。A. By effectively removing oxygen by arranging a catalyst near the entrance and exit of the furnace and at multiple points,
A large amount of nitrogen gas was required just by replacing the oxygen concentration in the furnace with nitrogen gas.
The oxygen concentration in the furnace can be reduced to 100 ppm or less with a nitrogen amount of about 3. As a result, it is possible to manufacture high quality products with a smaller amount of nitrogen gas than before. As a result, in reflow soldering using nitrogen gas,
Cost can be reduced.
【００１８】ｂ．炉内の酸素濃度を可燃性ガスの添加だ
けで減少させることができることにより、この装置を簡
単に構築できる。この結果、本発明を実施してもその設
備費は安い。B. Since the oxygen concentration in the furnace can be reduced only by adding the combustible gas, this device can be easily constructed. As a result, the equipment cost is low even if the present invention is implemented.
【図１】（Ａ）（Ｂ）可燃性ガスに水素を用い、入口酸
素濃度が５０００ｐｐｍの際の酸素除去テスト結果の説
明図。FIG. 1 (A) and (B) are explanatory views of oxygen removal test results when hydrogen is used as a combustible gas and an inlet oxygen concentration is 5000 ppm.
【図２】（Ａ）（Ｂ）可燃性ガスに水素を用い、入口酸
素濃度が１０００ｐｐｍの際の酸素除去テスト結果の説
明図。2A and 2B are explanatory diagrams of oxygen removal test results when hydrogen is used as a combustible gas and an inlet oxygen concentration is 1000 ppm.
【図３】（Ａ）（Ｂ）可燃性ガスにメタノールを用い、
入口酸素濃度が５０００ｐｐｍの際の酸素除去テスト結
果の説明図。FIG. 3 (A) and (B) use methanol as a combustible gas,
Explanatory drawing of the oxygen removal test result when inlet oxygen concentration is 5000 ppm.
【図４】（Ａ）（Ｂ）可燃性ガスにメタノールを用い、
入口酸素濃度が１０００ｐｐｍの際の酸素除去テスト結
果の説明図。FIG. 4 (A) and (B) use methanol as a flammable gas,
Explanatory drawing of the oxygen removal test result when an inlet oxygen concentration is 1000 ppm.
【図５】（Ａ）（Ｂ）可燃性ガスにエタノールを用い、
入口酸素濃度が１０００ｐｐｍの際の酸素除去テスト結
果の説明図。FIG. 5 (A) and (B) use ethanol as a flammable gas,
Explanatory drawing of the oxygen removal test result when an inlet oxygen concentration is 1000 ppm.
【図６】本発明に係る酸素濃度減少方法及びその装置の
実施例の説明図。FIG. 6 is an explanatory diagram of an embodiment of an oxygen concentration reducing method and apparatus according to the present invention.
１ リフローはんだ付け炉 ２ 窒素ガス供給ライン ３ 可燃性ガス供給ライン ４ 混合ガス供給ライン ５ 窒素ガス流量制御器 ６ 可燃性ガス流量制御器 ７ サンプリングライン ８ サンプリングポンプ ９ 酸素濃度計 １０ 演算器 1 Reflow soldering furnace 2 Nitrogen gas supply line 3 Combustible gas supply line 4 Mixed gas supply line 5 Nitrogen gas flow controller 6 Combustible gas flow controller 7 Sampling line 8 Sampling pump 9 Oxygen concentration meter 10 Computing unit
【手続補正書】[Procedure amendment]
【提出日】平成５年３月２６日[Submission date] March 26, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１２[Correction target item name] 0012
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１２】図１〜図10に酸素除去テストの結果を示
す。この結果から、はんだ付け炉の実用温度の範囲内に
おいて、酸素は９０％以上まで除去できていることが理
解できる。[0012] Figures 1-10 show the results of the oxygen scavenging tests. From this result, it can be understood that oxygen can be removed up to 90% or more within the practical temperature range of the soldering furnace.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１４[Correction target item name] 0014
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１４】図11に本発明の実施例を示す。１はリフロ
ーはんだ付け炉にして、２は窒素ガス供給ライン、３は
可燃性ガス（実施例は水素）供給ライン、４は混合ガス
送入ラインにして、前記炉１に結ばれている。FIG. 11 shows an embodiment of the present invention. Reference numeral 1 is a reflow soldering furnace, 2 is a nitrogen gas supply line, 3 is a flammable gas (hydrogen in the embodiment) supply line, and 4 is a mixed gas feed line, which are connected to the furnace 1.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図面の簡単な説明[Name of item to be corrected] Brief description of the drawing
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図面の簡単な説明】[Brief description of drawings]
【図１】可燃性ガスに水素を用い、入口酸素濃度が５０
００ｐｐｍの際の出口酸素濃度の説明図。Fig. 1 Hydrogen is used as a flammable gas, and the inlet oxygen concentration is 50.
Explanatory drawing of the outlet oxygen concentration at the time of 00 ppm.
【図２】可燃性ガスに水素を用い、入口酸素濃度が５０
００ｐｐｍの際の酸素除去率の説明図。[Fig. 2] Hydrogen is used as a flammable gas and the inlet oxygen concentration is 50.
Explanatory drawing of the oxygen removal rate at 00 ppm.
【図３】可燃性ガスに水素を用い、入口酸素濃度が１０
００ｐｐｍの際の出口酸素濃度の説明図。FIG. 3 uses hydrogen as a combustible gas and has an inlet oxygen concentration of 10
Explanatory drawing of the outlet oxygen concentration at the time of 00 ppm.
【図４】可燃性ガスに水素を用い、入口酸素濃度が１０
００ｐｐｍの際の酸素除去率の説明図。FIG. 4 shows that hydrogen is used as a combustible gas and the oxygen concentration at the inlet is 10
Explanatory drawing of the oxygen removal rate at 00 ppm.
【図５】可燃性ガスにメタノールを用い、入口酸素濃度
が５０００ｐｐｍの際の出口酸素濃度の説明図。FIG. 5 is an explanatory diagram of the outlet oxygen concentration when methanol is used as the combustible gas and the inlet oxygen concentration is 5000 ppm.
【図６】可燃性ガスにメタノールを用い、入口酸素濃度
が５０００ｐｐｍの際の酸素除去率の説明図。FIG. 6 is an explanatory diagram of an oxygen removal rate when methanol is used as a combustible gas and an inlet oxygen concentration is 5000 ppm.
【図７】可燃性ガスにメタノールを用い、入口酸素濃度
が１０００ｐｐｍの際の出口酸素濃度の説明図。FIG. 7 is an explanatory diagram of the outlet oxygen concentration when methanol is used as the combustible gas and the inlet oxygen concentration is 1000 ppm.
【図８】可燃性ガスにメタノールを用い、入口酸素濃度
が１０００ｐｐｍの際の酸素除去率の説明図。FIG. 8 is an explanatory diagram of an oxygen removal rate when methanol is used as a combustible gas and an inlet oxygen concentration is 1000 ppm.
【図９】可燃性ガスにエタノールを用い、入口酸素濃度
が１０００ｐｐｍの際の出口酸素濃度の説明図。FIG. 9 is an explanatory view of the outlet oxygen concentration when ethanol is used as the combustible gas and the inlet oxygen concentration is 1000 ppm.
【図10】可燃性ガスにエタノールを用い、入口酸素濃度
が１０００ｐｐｍの際の酸素除去率の説明図。FIG. 10 is an explanatory diagram of an oxygen removal rate when ethanol is used as a combustible gas and the inlet oxygen concentration is 1000 ppm.
【図11】本発明に係る酸素濃度減少方法及びその装置の
実施例の説明図。FIG. 11 is an explanatory diagram of an embodiment of an oxygen concentration reducing method and apparatus according to the present invention.
【符号の説明】 １ リフローはんだ付け炉 ２ 窒素ガス供給ライン ３ 可燃性ガス供給ライン ４ 混合ガス供給ライン ５ 窒素ガス流量制御器 ６ 可燃性ガス流量制御器 ７ サンプリングライン ８ サンプリングポンプ ９ 酸素濃度計 １０ 演算器[Explanation of symbols] 1 Reflow soldering furnace 2 Nitrogen gas supply line 3 Combustible gas supply line 4 Mixed gas supply line 5 Nitrogen gas flow controller 6 Combustible gas flow controller 7 Sampling line 8 Sampling pump 9 Oxygen concentration meter 10 Calculator
【手続補正４】[Procedure amendment 4]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】全図[Correction target item name] All drawings
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図１】 [Figure 1]
【図２】 [Fig. 2]
【図３】 [Figure 3]
【図４】 [Figure 4]
【図５】 [Figure 5]
【図６】 [Figure 6]
【図７】 [Figure 7]
【図８】 [Figure 8]
【図９】 [Figure 9]
【図１０】 [Figure 10]
───────────────────────────────────────────────────── フロントページの続き (72)発明者 松岡 太郎 東京都千代田区丸の内２丁目６番１号古河 電気工業株式会社内 (72)発明者 平野 正 東京都大田区南蒲田２−４−20 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Taro Matsuoka 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. (72) Tadashi Hirano 2-4-20 Minami Kamata, Ota-ku, Tokyo
Claims (8)
ると共にこの炉内に窒素ガスと炉内において自己燃焼濃
度以下の可燃性ガスを送入し、配置した触媒により炉内
において前記可燃性ガスを炉内の酸素をとり込みながら
触媒燃焼させて炉内の酸素濃度を減少させる方法。1. A reflow soldering furnace is provided with a catalyst, and nitrogen gas and a combustible gas having a self-combustion concentration or less in the furnace are fed into the furnace, and the combustible gas is provided in the furnace by the arranged catalyst. Method to reduce the oxygen concentration in the furnace by catalytic combustion while taking in oxygen in the furnace.
請求項１記載のリフローはんだ付け炉内の酸素濃度を減
少させる方法。2. A method of reducing oxygen concentration in a reflow soldering furnace as claimed in claim 1, wherein the catalyst comprises a palladium or platinum system.
可燃性ガスの供給ラインを結び、両ラインに取り付けた
流量制御器により窒素ガスと可燃性ガスの混合量を制御
しながら炉内に窒素ガスと可燃性ガスを送入する請求項
１、２記載のリフローはんだ付け炉内の酸素濃度を減少
させる方法。3. A furnace, while connecting a combustible gas supply line to a nitrogen gas supply line for supplying nitrogen gas into the furnace, and controlling a mixing amount of the nitrogen gas and the combustible gas by a flow rate controller attached to both lines. The method for reducing the oxygen concentration in the reflow soldering furnace according to claim 1 or 2, wherein nitrogen gas and flammable gas are introduced into the chamber.
入する請求項１、２記載のリフローはんだ付け炉内の酸
素濃度を減少させる方法。4. The method for reducing the oxygen concentration in the reflow soldering furnace according to claim 1, wherein nitrogen gas and combustible gas are separately fed into the furnace.
ーはんだ付け炉内の酸素量の燃焼反応理論量に対して
０．９〜１．４倍に設定して成る請求項１、２、３、４
記載のリフローはんだ付け炉内の酸素濃度を減少させる
方法。5. The method according to claim 1, wherein the amount of the combustible gas fed into the furnace is set to 0.9 to 1.4 times the theoretical amount of the combustion reaction of the amount of oxygen in the reflow soldering furnace. 2, 3, 4
A method for reducing the oxygen concentration in a reflow soldering furnace as described.
る請求項１、２、３、４、５記載のリフローはんだ付け
炉内の酸素濃度を減少させる方法。6. The method for reducing the oxygen concentration in a reflow soldering furnace according to claim 1, 2, 3, 4, 5, wherein the combustible gas comprises alcohol or hydrogen.
数箇所に触媒を配置すると共にこの炉内に窒素ガスと可
燃性ガスを混合した雰囲気ガス送入ラインを接続し、前
記雰囲気ガス送入ラインに結ばれた窒素ガス及び可燃性
ガス送入ラインに夫々流量制御器を取り付け、この両制
御器を炉内雰囲気中の酸素濃度値に基づいて制御する演
算器を設けて成るリフローはんだ付け炉内における酸素
濃度減少装置。7. A reflow soldering furnace is provided with a catalyst at one location or at a plurality of locations, and an atmosphere gas feed line in which nitrogen gas and a combustible gas are mixed is connected to the furnace, and the atmosphere gas feed line is provided. In the reflow soldering furnace, which is equipped with a flow controller for each of the nitrogen gas and combustible gas feed lines connected to each other, and an arithmetic unit for controlling both controllers based on the oxygen concentration value in the furnace atmosphere. Oxygen concentration reducing device.
ガス送入ラインを別々に接続し、炉内において窒素ガス
と可燃性ガスを混合するように構成して成る請求項７記
載のリフローはんだ付け炉内における酸素濃度減少装
置。8. The nitrogen gas feed line and the flammable gas feed line are separately connected to the furnace, and the nitrogen gas and the flammable gas are mixed in the furnace. Oxygen concentration reduction device in reflow soldering furnace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP780992A JPH0697645A (en) | 1992-01-20 | 1992-01-20 | Method and equipment for reducing oxygen concentration in reflow soldering furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP780992A JPH0697645A (en) | 1992-01-20 | 1992-01-20 | Method and equipment for reducing oxygen concentration in reflow soldering furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0697645A true JPH0697645A (en) | 1994-04-08 |
Family
ID=11675941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP780992A Withdrawn JPH0697645A (en) | 1992-01-20 | 1992-01-20 | Method and equipment for reducing oxygen concentration in reflow soldering furnace |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0697645A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002368044A (en) * | 2001-06-13 | 2002-12-20 | Matsushita Electric Ind Co Ltd | Method for assembling electronic component with solder ball and electronic component |
| JP2018093137A (en) * | 2016-12-07 | 2018-06-14 | 日機装株式会社 | Manufacturing method for optical semiconductor device |
| US11440116B2 (en) * | 2017-08-22 | 2022-09-13 | Illinois Tool Works Inc. | Reflow oven with a zeolite box, and a method for recovering gas with such zeolite box |
-
1992
- 1992-01-20 JP JP780992A patent/JPH0697645A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002368044A (en) * | 2001-06-13 | 2002-12-20 | Matsushita Electric Ind Co Ltd | Method for assembling electronic component with solder ball and electronic component |
| JP4590783B2 (en) * | 2001-06-13 | 2010-12-01 | パナソニック株式会社 | Method for forming solder balls |
| JP2018093137A (en) * | 2016-12-07 | 2018-06-14 | 日機装株式会社 | Manufacturing method for optical semiconductor device |
| US11440116B2 (en) * | 2017-08-22 | 2022-09-13 | Illinois Tool Works Inc. | Reflow oven with a zeolite box, and a method for recovering gas with such zeolite box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
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