JPH0697612A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH0697612A
JPH0697612A JP4268095A JP26809592A JPH0697612A JP H0697612 A JPH0697612 A JP H0697612A JP 4268095 A JP4268095 A JP 4268095A JP 26809592 A JP26809592 A JP 26809592A JP H0697612 A JPH0697612 A JP H0697612A
Authority
JP
Japan
Prior art keywords
recognition
printed wiring
wiring board
marks
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4268095A
Other languages
Japanese (ja)
Inventor
Kazuhito Yamada
和仁 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP4268095A priority Critical patent/JPH0697612A/en
Publication of JPH0697612A publication Critical patent/JPH0697612A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Structure Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To prevent the error of the flow direction of a printed wiring board, before happens by forming recognition marks in the manner in which, in the vicinity of the end surface or at the ear part position of a printed wiring board, the position of point symmetry from the center of the printed wiring board is set as a reference, and the position of one recognition mark is shifted by specified times the recognition mark area from the reference. CONSTITUTION:Recognition marks 3a, 3b on the surface (a) and recognition marks 3c, 3d on the rear (b) are formed in the vicinity of the end surface of a printed wiring board 1 in the following manner. The position of point symmetry from the center of the printed wiring board is set as a reference. The one mark 3a out of the two recognition marks 3a, 3b or the one recognition mark 3c out of the two recognition marks 3c, 3d is formed at a position shifted by three times the recognition mark from the reference. The recognition marks 3c, 3d are formed at positions of the rear (b) which positions are seen by looking through the recognition marks 3a, 3b on the surface (a). Thereby the error of the flow direction of the printed board is prevented, and the fault that a surface mount parts is packaged while the flow direction is mistaken as it is can be avoided.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、自動搭載機により表面
実装部品を自動実装するプリント配線板に関し、特には
部品搭載機に配置してある認識装置により画像認識し、
位置補正を行うための認識マークを有するプリント配線
板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for automatically mounting surface mounting components by an automatic mounting machine, and particularly, for recognizing an image by a recognition device arranged in the component mounting machine,
The present invention relates to a printed wiring board having a recognition mark for position correction.

【0002】[0002]

【従来の技術】表面実装部品をプリント配線板に自動実
装する場合、部品搭載機のコンベア上でプリント配線板
を端面、またはピン穴で固定して表面実装部品を搭載し
ている。最近では、搭載精度を向上させるために認識マ
ークが使用されている。
2. Description of the Related Art When a surface mount component is automatically mounted on a printed wiring board, the surface mount component is mounted by fixing the printed wiring board by an end face or a pin hole on a conveyor of a component mounting machine. Recently, recognition marks have been used to improve mounting accuracy.

【0003】従来の認識マークは、図2、図3に示すよ
うに、プリント配線板の中心から点対称の位置に2個認
識マークが形成されているのである。すなわち、図2で
はプリント配線板の表面(a)には認識マーク4a、4
bが形成され、裏面(b)には表面(a)と異なる位置
に認識マーク4c、4dが形成されている。
As shown in FIGS. 2 and 3, the conventional recognition mark has two recognition marks formed at positions symmetrical with respect to the center of the printed wiring board. That is, in FIG. 2, the recognition marks 4a and 4a are formed on the surface (a) of the printed wiring board.
b is formed, and recognition marks 4c and 4d are formed on the back surface (b) at positions different from the front surface (a).

【0004】また、図3ではプリント配線板の表面
(a)には認識マーク5a、5bが形成され、裏面
(b)には表面(a)と同じ位置に認識マーク5c、5
dが形成されている。
In FIG. 3, recognition marks 5a and 5b are formed on the front surface (a) of the printed wiring board, and recognition marks 5c and 5c are formed on the back surface (b) at the same positions as the front surface (a).
d is formed.

【0005】これらのプリント配線板は、段積みストッ
カーにセットされ、表面実装ライン(クリーム半田印
刷、部品搭載機、リフロー炉)を流す。次に、プリント
配線板の裏側面に向きを変え段積みストッカーにセット
し、表面実装ラインを流すのである。
These printed wiring boards are set in a stacking stocker and flow through a surface mounting line (cream solder printing, component mounting machine, reflow oven). Next, change the direction to the back side of the printed wiring board and set it on the stacking stocker, and let the surface mounting line flow.

【0006】[0006]

【発明が解決しようとする問題点】従来、プリント配線
板を段積みストッカーにセットする際に、プリント配線
板の向きを回転、または反転させてしまい表面実装ライ
ンの流し方向を間違える場合があった。
Problems to be Solved by the Invention Conventionally, when the printed wiring boards were set on the stacking stocker, the printed wiring boards may be rotated or reversed, and the surface mounting line may be misdirected. .

【0007】流し方向を間違えて段積みストッカーにセ
ットすると、プリント配線板は流し方向が違うままクリ
ーム半田印刷、表面実装部品搭載が行われ、リフロー炉
で半田付けされるのである。即ち、流し方向が違うまま
表面実装部品が実装され不良となるのである。
When the flow direction is wrongly set in the stacking stocker, the printed wiring board is subjected to cream solder printing and surface mounting component mounting while the flow direction is different, and is soldered in the reflow furnace. That is, the surface-mounted component is mounted while the flowing direction is different, resulting in a defect.

【0008】プリント配線板を端面、またはピン穴で固
定し表面実装部品を搭載する場合には、認識機能がない
ためプリント配線板の流し方向の間違えによる不良を防
止することができないのである。
When the printed wiring board is fixed by the end face or the pin hole to mount the surface mount component, it is not possible to prevent a defect due to a mistake in the flow direction of the printed wiring board because it has no recognition function.

【0009】また、図2、図3に示すような従来の認識
マークを画像認識して表面実装部品を搭載する場合に
は、プリント配線板の認識マークが重なるという不具合
点がありプリント配線板の流し方向の間違えによる不良
を防止することができないのである。
Further, when the conventional recognition marks as shown in FIGS. 2 and 3 are image-recognized to mount the surface mount component, there is a problem that the recognition marks of the printed wiring board overlap each other. It is impossible to prevent defects due to mistakes in the flow direction.

【0010】図2の認識マーク4a、4b、4c、4d
において、プリント配線板1の表面(a)、裏面(b)
を各々回転させると表面(a)では認識マーク4aと4
bとが重なり、裏面(b)では認識マーク4cと4dと
が重なるのである。また、表面(a)と裏面(b)を比
較すると認識マーク4aと4c、4bと4dとが重なる
のである。
Recognition marks 4a, 4b, 4c and 4d shown in FIG.
In, the front surface (a) and the back surface (b) of the printed wiring board 1
When each is rotated, the recognition marks 4a and 4
b and the recognition marks 4c and 4d overlap on the back surface (b). Further, when the front surface (a) and the back surface (b) are compared, the recognition marks 4a and 4c, 4b and 4d overlap each other.

【0011】次に、図3の認識マーク5a、5b、5
c、5dにおいても図2と同様に表面(a)では認識マ
ーク5aと5b、裏面(b)では認識マーク5cと5d
とが重なるのである。すなわち、認識マークが重なると
いうことは、流し方向を間違えた場合に認識マークを認
識装置で画像認識しても流し方向が合っていると判断
し、流し方向が違うまま表面実装部品が実装され不良と
なってしまう。
Next, the recognition marks 5a, 5b and 5 shown in FIG.
Also in c and 5d, the recognition marks 5a and 5b on the front surface (a) and the recognition marks 5c and 5d on the back surface (b) as in FIG.
And overlap. That is, if the recognition marks are overlapped, it means that the recognition direction is correct even if the recognition mark is recognized by the recognition device when the recognition direction is wrong. Will be.

【0012】本発明は以上のような問題点に鑑みなされ
たもので、その目的は、プリント配線板の流し方向間違
えを防止することができる認識マークを有するプリント
配線板を提供することにある。
The present invention has been made in view of the above problems, and an object thereof is to provide a printed wiring board having a recognition mark capable of preventing a mistake in the flowing direction of the printed wiring board.

【0013】[0013]

【問題点を解決するための手段】以上のような問題点を
解決するために本発明の採った手段は、「画像認識装置
を用いて位置補正を行うための認識マークを有するプリ
ント配線板において、プリント配線板の端面付近、また
は耳部の位置で、プリント配線板の中心から点対称の位
置を基準として、2個の認識マークのうち片方の認識マ
ークの位置を前記基準より認識マークの面積の2〜10
倍の位置にズラして形成し、前記2個の認識マークを透
かして見たプリント配線板の裏側面の位置に2個の認識
マークを形成したことを特徴とするプリント配線板。」
である。
[Means for Solving the Problems] In order to solve the above problems, the means adopted by the present invention is "in a printed wiring board having a recognition mark for performing position correction using an image recognition device. , Near the end face of the printed wiring board, or at the position of the ear, with reference to the position of point symmetry from the center of the printed wiring board, the position of one of the two recognition marks is the area of the recognition mark based on the reference. 2 to 10
A printed wiring board, wherein the two recognition marks are formed in a doubled position, and two recognition marks are formed at a position on the back side of the printed wiring board seen through the two recognition marks. "
Is.

【0014】[0014]

【発明の作用】本発明が上述したような手段を採ること
により、プリント配線板の流し方向を間違えた場合に認
識マークを認識装置を用いて画像認識を行うと、プリン
ト配線板上には重なる認識マークがないため認識装置は
認識エラーと判断して部品搭載機が停止するため、プリ
ント配線板の流し方向間違えを防止することができる。
According to the present invention, by adopting the means as described above, when the recognition mark is recognized by the recognition device when the printed wiring board is misoriented in the flowing direction, the recognition mark is overlapped on the printed wiring board. Since there is no recognition mark, the recognition device judges that there is a recognition error and the component mounting machine stops, so it is possible to prevent the printed wiring board from being mistaken in the flowing direction.

【実施例】【Example】

【0015】以下、図面に示す実施例に従って本発明を
詳細に説明する。図1は本発明による認識マークを示す
平面図であり、(a)はプリント配線板1の表面であ
り、(b)は表面(a)をA−A線に沿って裏返した裏
面である。
The present invention will be described in detail below with reference to the embodiments shown in the drawings. FIG. 1 is a plan view showing a recognition mark according to the present invention, where (a) is the front surface of the printed wiring board 1 and (b) is the back surface obtained by turning the front surface (a) over along the line AA.

【0016】表面(a)の認識マーク3a,3bと裏面
(b)の認識マーク3c,3dは、プリント配線板1の
端面付近に、プリント配線板の中心2から点対称の位置
を基準として2個の認識マーク3a,3b、または3
c,3dのうち片方の認識マーク3a、または3cの位
置が前記基準より認識マークの面積の3倍の位置にズラ
して形成され、表面(a)の認識マーク3a,3bを透
かして見た裏面(b)の位置に認識マーク3c,3dが
形成されている。
The recognition marks 3a, 3b on the front surface (a) and the recognition marks 3c, 3d on the back surface (b) are located near the end surface of the printed wiring board 1 with reference to a point symmetrical position from the center 2 of the printed wiring board. Individual recognition marks 3a, 3b, or 3
The position of one of the recognition marks 3a or 3c among c and 3d is formed by being shifted to a position which is three times the area of the recognition mark from the reference, and the recognition marks 3a and 3b on the surface (a) are seen through. Recognition marks 3c and 3d are formed on the back surface (b).

【0017】従って、段積みストッカーにプリント配線
板1をセットする際に、プリント配線板1を回転させ流
し方向を間違えても表面(a)では認識マーク3aと3
bとが重なることがなく、裏面(b)では認識マーク3
cと3dとが重なることがないのである。さらに、表面
(a)を反転させ裏面(b)と比較すると認識マーク3
aと3c、3bと3dの各々が重ならないのである。
Therefore, when the printed wiring boards 1 are set in the stacking stocker, even if the printed wiring boards 1 are rotated and the flow direction is wrong, the recognition marks 3a and 3 are recognized on the surface (a).
b does not overlap with the recognition mark 3 on the back surface (b).
That is, c and 3d do not overlap. Further, when the front surface (a) is inverted and compared with the back surface (b), the recognition mark 3
That is, a and 3c, 3b and 3d do not overlap each other.

【0018】すなわち、認識マークが重なることがない
ため、プリント配線板の流し方向や表裏を間違えても部
品搭載機に配置された認識装置を用いて画像認識を行う
と認識エラーと判断され部品搭載機が停止し、プリント
配線板の流し方向や表裏の間違えが判り不良を未然に防
止することができる。
That is, since the recognition marks do not overlap with each other, even if the printed wiring board is misplaced in the flowing direction or the front and back, if the image recognition is performed using the recognition device arranged in the component mounting machine, it is judged as a recognition error and the component mounting is performed. When the machine stops, the flow direction of the printed wiring board and the mistake in the front and back can be recognized, and defects can be prevented in advance.

【0019】プリント配線板の中心から点対称の位置を
基準として、認識マーク2個のうち片方の認識マークの
位置を前記基準より認識マークの面積の2〜10倍の位
置にズラして形成するのであるが、ズラす位置としては
認識マークを認識装置で画像認識する際の認識装置のサ
ーチエリア範囲、つまり画像認識の対象となる認識マー
クを探す範囲以外の位置、つまり認識マークの面積の2
〜10倍の位置にズラすのである。望ましくは認識マー
クの面積の3〜5倍であり、このことによりプリント配
線板の流し方向間違えによる不良が完全に防止すること
ができる。
With respect to a point-symmetrical position from the center of the printed wiring board as a reference, one of the two recognition marks is formed by shifting the position of one of the recognition marks to a position which is 2 to 10 times the area of the recognition mark from the reference. However, the deviation position is a search area range of the recognition device when the recognition mark is used for image recognition by the recognition device, that is, a position other than a range in which the recognition mark to be the target of image recognition is searched, that is, the area of the recognition mark is 2
It shifts to the position of 10 times. Desirably, the area is 3 to 5 times the area of the recognition mark, and this makes it possible to completely prevent defects due to a mistake in the flow direction of the printed wiring board.

【0020】なお、認識マークは銅箔のバッド、半田メ
ッキ処理されたパッド、金メッキ処理されたパッド、貫
通穴、ザグリ加工等による底付穴でも良いのである。ま
た、認識マークの形状は円形、四角形、三角形、十字形
等でも良く、2個の認識マークの形状が各々異なってい
ても良いのである。また、認識マークを設ける位置はプ
リント配線板の端面付近に限らず、プリント配線板の耳
部(ダミー基板)に設けても良い。
The recognition mark may be a copper foil pad, a solder-plated pad, a gold-plated pad, a through hole, or a bottomed hole by counterboring or the like. Further, the shape of the recognition mark may be a circle, a quadrangle, a triangle, a cross, or the like, and the shapes of the two recognition marks may be different from each other. Further, the position where the recognition mark is provided is not limited to the vicinity of the end surface of the printed wiring board, and may be provided at the ear (dummy substrate) of the printed wiring board.

【0021】以上のように、本発明はプリント配線板の
流し方向間違えを未然に防止することができるので、流
し方向が間違ったまま表面実装部品が実装される不良を
なくすことができる。
As described above, according to the present invention, it is possible to prevent a mistake in the flow direction of the printed wiring board, so that it is possible to eliminate the defect that the surface mount component is mounted with the flow direction wrong.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の認識マークを有するプリント配線板の
平面図であり、(a)はプリント配線板の表面、(b)
は表面(a)をA−A線に沿って裏返したプリント配線
板の裏面
FIG. 1 is a plan view of a printed wiring board having a recognition mark of the present invention, (a) being the surface of the printed wiring board, and (b).
Is the back surface of the printed wiring board with the front surface (a) turned inside out along the line AA.

【図2】従来の認識マークを有するプリント配線板の平
面図であり、(a)はプリント配線板の表面、(b)は
表面(a)をB−B線に沿って裏返したプリント配線板
の裏面
2A and 2B are plan views of a conventional printed wiring board having an identification mark, wherein FIG. 2A is a front surface of the printed wiring board, and FIG. 2B is a printed wiring board in which the surface (a) is turned upside down along the line BB. Back of

【図3】従来の別の認識マークを有するプリント配線板
の平面図であり、(a)はプリント配線板の表面、
(b)は表面(a)をC−C線に沿って裏返したプリン
ト配線板の裏面
FIG. 3 is a plan view of a conventional printed wiring board having another recognition mark, where (a) is the surface of the printed wiring board;
(B) is the back surface of the printed wiring board in which the surface (a) is turned upside down along the line C-C.

【符号の説明】[Explanation of symbols]

1 プリント配線板 2 プリント配線板の中心 3a 認識マーク 3b 認識マーク 3c 認識マーク 3d 認識マーク 4a 認識マーク 4b 認識マーク 4c 認識マーク 4d 認識マーク 5a 認識マーク 5b 認識マーク 5c 認識マーク 5d 認識マーク 1 printed wiring board 2 center of printed wiring board 3a recognition mark 3b recognition mark 3c recognition mark 3d recognition mark 4a recognition mark 4b recognition mark 4c recognition mark 4d recognition mark 5a recognition mark 5b recognition mark 5c recognition mark 5d recognition mark

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 画像認識装置を用いて位置補正を行うた
めの認識マークを有するプリント配線板において、 プリント配線板の端面付近、または耳部の位置で、プリ
ント配線板の中心から点対象の位置を基準として、2個
の認識マークのうち片方の認識マークの位置を前記基準
より認識マークの面積の2〜10倍の位置にズラして形
成し、前記2個の認識マークを透かして見たプリント配
線板の裏側面の位置に2個の認識マークを形成したこと
を特徴とするプリント配線板。
1. A printed wiring board having a recognition mark for position correction using an image recognition device, wherein a position of a point object from the center of the printed wiring board near the end face of the printed wiring board or at the position of the ear. Of the two recognition marks, the position of one of the recognition marks is shifted to a position that is 2 to 10 times the area of the recognition mark from the reference, and the two recognition marks are seen through. A printed wiring board having two recognition marks formed on the back side of the printed wiring board.
JP4268095A 1992-09-10 1992-09-10 Printed wiring board Pending JPH0697612A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4268095A JPH0697612A (en) 1992-09-10 1992-09-10 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4268095A JPH0697612A (en) 1992-09-10 1992-09-10 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH0697612A true JPH0697612A (en) 1994-04-08

Family

ID=17453825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4268095A Pending JPH0697612A (en) 1992-09-10 1992-09-10 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH0697612A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319100A (en) * 2005-05-12 2006-11-24 Mitsubishi Electric Corp Method of manufacturing high-density electronic substrates, and aggregate substrate
CN117255488A (en) * 2023-10-25 2023-12-19 苏州博湃半导体技术有限公司 Method for distinguishing copper thickness of front and back sides of copper-clad ceramic substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319100A (en) * 2005-05-12 2006-11-24 Mitsubishi Electric Corp Method of manufacturing high-density electronic substrates, and aggregate substrate
CN117255488A (en) * 2023-10-25 2023-12-19 苏州博湃半导体技术有限公司 Method for distinguishing copper thickness of front and back sides of copper-clad ceramic substrate

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