JPH0689951A - Ic socket - Google Patents

Abstract

PURPOSE:To provide an IC socket which can prevent the occurrence of insufficient contact between the leads of an IC package and contactors of the IC socket and deformation of the leads by bringing the leads into contact with the contactors without giving any external force to the leads in the IC socket. CONSTITUTION:A contact pusher 1 is connected with an IC socket main body 3 incorporating contactors 2 by means of links 4 with grooves for perpendicularly moving the pusher 1 against an IC package 5 and slide guides 6 and is constituted of a clamp 7 which fixes the pusher 1. Therefore, the IC package 5 can be pressed against the contactors 2 without giving any bending force to the leads of the package 5 even when the leads are arranged at short intervals.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket used to measure the electrical characteristics of an IC package or the like.

[0002]

2. Description of the Related Art A conventional IC socket has a movable or fixed contact pusher attached to a swivel type lid for contacting the IC package. It was pressed against the contact. In this case, at the moment when the contact pusher comes into contact with the lead of the IC package, a force acts in a sliding direction with the contactor, which causes deformation of the lead of the IC package. Become.

[0003]

According to the prior art, IC is used.
The contact of the contact pusher with the lead of the package causes a force in the direction of sliding with the contactor, which causes a deformation of the lead of the IC package. The present invention solves the above-mentioned problems and provides an I package without applying an external force to the lead of the IC package.
The lead of the C package and the contact of the IC socket are brought into contact with each other to eliminate the poor contact between the lead of the IC package and the contact of the IC socket and the deformation of the lead of the IC package. The purpose is to

[0004]

In order to solve the above problems and to achieve the above objects, the present invention provides a contact pusher for an IC socket, which is connected through a parallel link or a fixed groove cam. It is characterized in that it has means for vertically moving the contact pusher of the IC socket with respect to the lead of the IC package.

[0005]

EXAMPLE An example of the present invention will be described below.

FIG. 1 is a side view of an IC socket according to the present invention.

FIG. 2 is a locus diagram of the contact pusher-1 of the IC socket according to the present invention.

An IC socket main body 3 in which the contactor 2 is incorporated, a parallel link 4 having a groove as shown in FIG. 1, and a contact pusher 1 connected by a slide guide 6, and a contact. It is composed of a clamp 7 for fixing the pusher-1.

When measuring the electrical characteristics of the IC package 5, the IC package 5 is inserted into the IC socket of the present invention by a handling device or manually.

Next, the contact pusher-1 is used to IC
When the package 5 is pressed against the contactor 2, the contact pusher -1 moves by the slide guide 6 in a locus as shown in FIG. 2, and the IC package 5 is pressed against the contactor 2.

At this time, the contact force can be applied perpendicularly to the lead 8 of the IC package 5.

Therefore, unlike the conventional IC socket shown in FIG. 3, the force for sliding the IC package 5 does not work, so that the lead 8 of the IC package 5 is not bent. The contactor 2 can be surely brought into contact.

FIG. 5 shows the IC socket of the present invention.
This is an embodiment in which the contact pusher-1 is independently installed in the direction of each lead 8 with respect to the IC package 5 in which the leads 8 are arranged in two or four directions. .

A slide guide 6 is attached to each contact pusher-1 in each direction.

As shown in the locus diagram of FIG. 6, the IC package 5
A contact force can be applied perpendicularly to the lead 8 of the IC package 5 when pressing the contact 2 onto the contact 2.

Therefore, unlike the conventional IC socket shown in FIG. 3, a force for sliding the IC package 5 does not work, so that the lead 8 of the IC package 5 is not bent. The contactor 2 can be surely brought into contact.

[0017]

According to the present invention, the IC package can be pressed against the contact without giving a force to bend the lead even if the lead pitch is small. The effect of is obtained.

1. Improving the read quality of IC packages.

2. Improved contact between the IC package and the contact of the IC socket.

[Brief description of drawings]

FIG. 1 is a side view of an IC socket according to the present invention.

FIG. 2 is a locus diagram of a contact pusher of the IC socket shown in FIG.

FIG. 3 is a side view of a conventional IC socket.

FIG. 4 is a locus diagram of a contact pusher of a conventional IC socket.

FIG. 5 is a side view of an IC socket in which contact pushers are independent in each direction with respect to an IC package in which leads are arranged in two or four directions according to the present invention.

6 is a locus diagram of a contact pusher of the IC socket shown in FIG.

[Description of symbols] 1 contact pusher 2 contactor 3 IC socket body 4 link 5 IC package 6 slide guide 7 clamp 8 lead

Claims (1)

[Claims] 1. A contact pusher for inserting an IC package into an IC socket and pressing the contact against a contact, which is used to measure the electrical characteristics of the IC package and the like, with respect to the IC package. An IC socket that moves vertically.