JPH0684915A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPH0684915A
JPH0684915A JP23121492A JP23121492A JPH0684915A JP H0684915 A JPH0684915 A JP H0684915A JP 23121492 A JP23121492 A JP 23121492A JP 23121492 A JP23121492 A JP 23121492A JP H0684915 A JPH0684915 A JP H0684915A
Authority
JP
Japan
Prior art keywords
semiconductor integrated
integrated circuit
input
blocks
output cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP23121492A
Other languages
Japanese (ja)
Inventor
Tamotsu Yoshiki
保 吉木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
Kawasaki Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Steel Corp filed Critical Kawasaki Steel Corp
Priority to JP23121492A priority Critical patent/JPH0684915A/en
Publication of JPH0684915A publication Critical patent/JPH0684915A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To provide a semiconductor integrated circuit which allows less bus lines to be arranged in a core region, arranges many blocks, etc., in the core region so as to efficiently use the core region and reduces noise on a bus line which connects the blocks. CONSTITUTION:Bus lines 42 which connect blocks 38a, 38b and 38c are overlapped with a power source line 40 which is arranged on an input/output cell region 34 whereupon input/output cells 32 are formed along the periphery.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、いわゆる階層的レイア
ウト手法によって構成された半導体集積回路に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit constructed by a so-called hierarchical layout method.

【0002】[0002]

【従来の技術】半導体集積回路の構成要素のレイアウト
設計、およびそれら構成要素間の配線設計を行うにあた
り、回路の大規模化に伴ってその設計工数が飛躍的に増
大するため、回路全体を、各所定の機能を分担する複数
のブロックに分担し、これら複数のブロックそれぞれの
内部の回路構成要素の配置配線処理と、ブロックどうし
の配置配線処理とを分けて行う階層的レイアウト手法が
採用される場合がある。
2. Description of the Related Art When designing the layout of the components of a semiconductor integrated circuit and designing the wiring between these components, the design man-hours increase dramatically with the increase in the scale of the circuit. A hierarchical layout method is adopted, in which a plurality of blocks are assigned to each predetermined function, and the layout and wiring processing of circuit components inside each of the plurality of blocks and the layout and wiring processing between the blocks are performed separately. There are cases.

【0003】図2を参照して、上記階層的レイアウト手
法を用いて構成された従来の半導体集積回路の概略構成
を説明する。図2は、従来の3層配線の半導体集積回路
の概略構成を示す平面図である。半導体集積回路10
は、周縁部に沿って形成された入出力セル12が配置さ
れた入出力セル領域14とこの入出力セル領域14に囲
まれたコア領域16とに分かれており、コア領域16に
は、各所定の回路機能を構成する複数のブロック18
a、18b、18cが隣接して配置されている。各ブロ
ック18a、18b、18cでは、コア領域16に配線
されたバスライン20により信号の送受信が行われる。
With reference to FIG. 2, a schematic structure of a conventional semiconductor integrated circuit formed by using the hierarchical layout method will be described. FIG. 2 is a plan view showing a schematic configuration of a conventional semiconductor integrated circuit having three layers of wiring. Semiconductor integrated circuit 10
Is divided into an input / output cell region 14 in which the input / output cells 12 formed along the peripheral portion are arranged and a core region 16 surrounded by the input / output cell region 14, and each of the core regions 16 includes A plurality of blocks 18 constituting a predetermined circuit function
a, 18b, and 18c are arranged adjacent to each other. In each of the blocks 18a, 18b, 18c, signals are transmitted and received by the bus line 20 wired in the core region 16.

【0004】[0004]

【発明が解決しようとする課題】上記従来の半導体集積
回路では複雑な回路機能を実現しようとするブロックの
数も増え、それらのブロックを結ぶバスライン20やそ
の他の信号線等の配線によりコア領域上の大きな面積が
占められてしまい、コア領域の有効利用が損なわれるこ
ととなる。また、このバスライン20に平行して配線さ
れた他の信号線とのカップリングによりノイズが発生
し、誤動作を生じる場合がある。
In the above-mentioned conventional semiconductor integrated circuit, the number of blocks for realizing complicated circuit functions also increases, and the core region is formed by wiring such as bus lines 20 connecting these blocks and other signal lines. The large area above is occupied and the effective utilization of the core region is impaired. Further, noise may occur due to coupling with other signal lines wired in parallel with the bus line 20, and malfunction may occur.

【0005】本発明は、上記事情に鑑み、コア領域を有
効に利用でき、しかもこれらのブロック間をつなぐ信号
線のノイズによる誤動作が極力低減される半導体集積回
路を提供することを目的とする。
In view of the above circumstances, it is an object of the present invention to provide a semiconductor integrated circuit in which the core region can be effectively used and the malfunction due to the noise of the signal line connecting these blocks is reduced as much as possible.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
の本発明の半導体集積回路は、周縁部に沿って入出力セ
ルが形成された入出力セル領域と、この入出力セル領域
上に配線された電源線及び接地線と、各所定の回路機能
を構成する複数のブロックが隣接し配置されて入出力セ
ル領域に囲まれたコア領域とを備えた半導体集積回路に
おいて、電源線及び/又は接地線と重ねて配線された、
ブロック間をつなぐ信号線を備えたことを特徴とするも
のである。
To achieve the above object, a semiconductor integrated circuit of the present invention has an input / output cell region in which input / output cells are formed along a peripheral portion, and wiring is provided on the input / output cell region. A power supply line and / or a ground line, and a core region surrounded by an input / output cell region in which a plurality of blocks constituting each predetermined circuit function are arranged adjacent to each other. Wired over the ground wire,
It is characterized by having a signal line connecting between blocks.

【0007】[0007]

【作用】本発明の半導体集積回路では、複数のブロック
間における信号の授受は、少なくともその一部が電源線
及び/又は接地線と重ねて配線されたバスライン等の信
号線を経由して行われる。この信号線は、入出力セル領
域上に配線されているため、半導体集積回路の回路機能
を固定した場合は、従来より狭いコア領域で済むことと
となり、この結果、半導体集積回路のサイズを小型化で
きる。一方、半導体集積回路のサイズを従来と同じにし
た場合は、従来コア領域に配線されていた信号線が入出
力セル領域上に配線されたため、コア領域に一層多くの
回路機能を配置することができる。
In the semiconductor integrated circuit of the present invention, signals are transmitted and received between a plurality of blocks via a signal line such as a bus line at least a part of which is overlapped with a power line and / or a ground line. Be seen. Since these signal lines are laid out in the input / output cell area, if the circuit function of the semiconductor integrated circuit is fixed, a smaller core area will suffice than in the past, and as a result, the size of the semiconductor integrated circuit can be reduced. Can be converted. On the other hand, when the size of the semiconductor integrated circuit is the same as the conventional one, since the signal line that was conventionally wired in the core region is wired in the input / output cell region, more circuit functions can be arranged in the core region. it can.

【0008】また、電位の安定した電源線や接地線の上
に少なくとも一部の信号線が配線されているため、これ
ら電源線や接地線がシールド効果をなし、従来のように
他の信号線との間の影響が少なくなり、ノイズによる誤
動作を防止できる。
Further, since at least a part of the signal lines are wired on the power supply line or the ground line whose potential is stable, the power supply line and the ground line have a shielding effect, and other signal lines are used as in the conventional case. The influence between and can be reduced, and malfunction due to noise can be prevented.

【0009】[0009]

【実施例】次に、図面を参照して本発明の半導体集積回
路の一実施例を説明する。図1は本実施例の半導体集積
回路の概略構成を示す平面図である。この半導体集積回
路30は、この半導体集積回路30の周縁部に沿って複
数の入出力セル32が形成された入出力セル領域34
と、この入出力セル領域34に囲まれたコア領域36と
に分かれており、3層配線構造となっている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the semiconductor integrated circuit of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a schematic configuration of the semiconductor integrated circuit of this embodiment. The semiconductor integrated circuit 30 has an input / output cell region 34 in which a plurality of input / output cells 32 are formed along the peripheral portion of the semiconductor integrated circuit 30.
And a core region 36 surrounded by the input / output cell region 34, and has a three-layer wiring structure.

【0010】第1層のコア領域36には、各所定の回路
機能を構成する複数のブロック38a、38b、38c
が隣接して配置されている。また、第1層の入出力セル
領域34の上には絶縁膜(図示せず)を挾んで電源線4
0、接地線41が配線された第2層が形成されており、
この第2層の上には絶縁膜(図示せず)を挾んでバスラ
イン42が配線された第3層が形成されている。このバ
スライン42により、複数のブロック38a、38b、
38c相互間での信号の送受信が行われる。このバスラ
イン42は従来の半導体集積回路(図2参照)のように
コア領域に配線(図2参照)されておらず、入出力セル
領域34の上の従来何も使用されていなかったところに
配線されている。このため、半導体集積回路30の回路
機能を固定した場合は、従来より狭いコア領域とするこ
とができ、半導体集積回路のサイズを小型化できる。一
方、半導体集積回路のサイズを従来と同じにした場合
は、従来コア領域に配線されていたバス配線が入出力セ
ル領域上に配線されたため、コア領域に空きができ、こ
の空いた部分に一層多くの回路機能を搭載することがで
きる。
In the core region 36 of the first layer, a plurality of blocks 38a, 38b, 38c constituting respective predetermined circuit functions are provided.
Are adjacent to each other. Further, an insulating film (not shown) is sandwiched over the input / output cell region 34 of the first layer and the power supply line 4 is provided.
0, the second layer in which the ground wire 41 is wired is formed,
On this second layer, a third layer is formed in which a bus line 42 is wired with an insulating film (not shown) in between. By this bus line 42, a plurality of blocks 38a, 38b,
Signals are transmitted and received between the 38c. Unlike the conventional semiconductor integrated circuit (see FIG. 2), the bus line 42 is not wired in the core region (see FIG. 2), and the bus line 42 above the input / output cell region 34 where nothing has been conventionally used. It is wired. Therefore, when the circuit function of the semiconductor integrated circuit 30 is fixed, the core area can be made narrower than in the conventional case, and the size of the semiconductor integrated circuit can be reduced. On the other hand, when the size of the semiconductor integrated circuit is made the same as the conventional size, the bus wiring that was conventionally wired in the core area was laid in the input / output cell area, so there is an empty space in the core area, and this empty area is further expanded. Many circuit functions can be installed.

【0011】また、電位の安定した電源線40,接地線
41の上にバスライン42が配線されているため、従来
のように他の信号線の影響を受けることがなく、ノイズ
の影響を防止できる。尚、上記実施例ではバスライン4
2は第3層に配線されているが、第3層である必要はな
いことはもちろんである。
Further, since the bus line 42 is laid on the power supply line 40 and the ground line 41 with stable potential, it is not affected by other signal lines as in the conventional case and the influence of noise is prevented. it can. In the above embodiment, the bus line 4
2 is wired to the third layer, but needless to say, is not necessarily the third layer.

【0012】[0012]

【発明の効果】上記のように、発明では入出力領域上に
ブロック間をつなく、例えばバスライン等の信号線を配
置したため、空いた部分の面積を有効に使用することが
できる。また、電位が安定している電源線、接地線に重
ねて信号配線を配線することにより、ノイズの影響を防
止できる。
As described above, according to the present invention, since the blocks are connected to each other in the input / output region and the signal line such as the bus line is arranged, the area of the vacant portion can be effectively used. In addition, the influence of noise can be prevented by wiring the signal wiring so as to overlap the power supply line and the ground line whose potential is stable.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の半導体集積回路の概略構成
を示す平面図である。
FIG. 1 is a plan view showing a schematic configuration of a semiconductor integrated circuit according to an embodiment of the present invention.

【図2】従来の半導体集積回路の概略構成を示す平面図
である。
FIG. 2 is a plan view showing a schematic configuration of a conventional semiconductor integrated circuit.

【符号の説明】[Explanation of symbols]

30 半導体集積回路 32 入出力セル 34 入出力セル領域 36 コア領域 38a、38b、38c ブロック 40 Al電源線 42 バスライン 30 semiconductor integrated circuit 32 input / output cell 34 input / output cell area 36 core area 38a, 38b, 38c block 40 Al power supply line 42 bus line

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 周縁部に沿って入出力セルが形成された
入出力セル領域と、該入出力セル領域上に配線された電
源線及び接地線と、各所定の回路機能を構成する複数の
ブロックが隣接し配置されて前記入出力セル領域に囲ま
れたコア領域とを備えた半導体集積回路において、 前記電源線及び/又は前記接地線と重ねて配線された、
前記ブロック間をつなぐ信号線を備えたことを特徴とす
る半導体集積回路。
1. An input / output cell region in which input / output cells are formed along a peripheral edge portion, a power supply line and a ground line wired on the input / output cell region, and a plurality of components each forming a predetermined circuit function. In a semiconductor integrated circuit having a core region surrounded by the input / output cell region, the blocks being arranged adjacent to each other, the wiring being overlapped with the power supply line and / or the ground line,
A semiconductor integrated circuit comprising a signal line connecting the blocks.
JP23121492A 1992-08-31 1992-08-31 Semiconductor integrated circuit Withdrawn JPH0684915A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23121492A JPH0684915A (en) 1992-08-31 1992-08-31 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23121492A JPH0684915A (en) 1992-08-31 1992-08-31 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPH0684915A true JPH0684915A (en) 1994-03-25

Family

ID=16920120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23121492A Withdrawn JPH0684915A (en) 1992-08-31 1992-08-31 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPH0684915A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6163042A (en) * 1998-07-02 2000-12-19 Oki Electric Industry Co., Ltd. Semiconductor integrated circuit
JP2007235002A (en) * 2006-03-03 2007-09-13 Renesas Technology Corp Semiconductor device
US7348680B2 (en) * 2002-12-23 2008-03-25 Koninklijke Philips Electronics N.V. Electronic device and use thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6163042A (en) * 1998-07-02 2000-12-19 Oki Electric Industry Co., Ltd. Semiconductor integrated circuit
US7348680B2 (en) * 2002-12-23 2008-03-25 Koninklijke Philips Electronics N.V. Electronic device and use thereof
JP2007235002A (en) * 2006-03-03 2007-09-13 Renesas Technology Corp Semiconductor device
US8242541B2 (en) 2006-03-03 2012-08-14 Renesas Electronics Corporation Semiconductor device
US8482038B2 (en) 2006-03-03 2013-07-09 Renesas Electronics Corporation Semiconductor device

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Legal Events

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Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19991102