JPH0684745A - Semiconductor processing equipment - Google Patents
Semiconductor processing equipmentInfo
- Publication number
- JPH0684745A JPH0684745A JP23323392A JP23323392A JPH0684745A JP H0684745 A JPH0684745 A JP H0684745A JP 23323392 A JP23323392 A JP 23323392A JP 23323392 A JP23323392 A JP 23323392A JP H0684745 A JPH0684745 A JP H0684745A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- stage
- pattern
- held
- processing equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体製造装置に関し、
特に半導体ウェーハにパターンを転写するステッパを有
する半導体製造装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus,
In particular, it relates to a semiconductor manufacturing apparatus having a stepper for transferring a pattern onto a semiconductor wafer.
【０００２】[0002]
【従来の技術】従来のステッパは図２に示すように、半
導体ウェーハ（以下、ウェーハと記す）１をステージ２
で吸着保持してウェーハ１にレチクル上のパターンを転
写しており、ウェーハ１を吸着保持するステージ１の材
質はセラミックスで固い表面で構成されていた。2. Description of the Related Art As shown in FIG. 2, a conventional stepper includes a semiconductor wafer (hereinafter referred to as a wafer) 1 on a stage 2
The pattern on the reticle is transferred to the wafer 1 by suction and held by, and the material of the stage 1 that holds and holds the wafer 1 is ceramics and has a hard surface.
【０００３】[0003]
【発明が解決しようとする課題】この従来のステッパで
は、ウェーハを吸着保持するステージがセラミックスで
ある為、表面が固く、ウェーハのステージ間にごみが入
った場合、ウェーハ表面に高低差が発生し、レチクル上
のパターンを転写する際、フォーカスが合わずにパター
ンに欠陥が生ずるという問題点があった。In this conventional stepper, since the stage for adsorbing and holding the wafer is made of ceramics, the surface is hard, and if dust enters between the stages of the wafer, a height difference occurs on the wafer surface. However, when the pattern on the reticle is transferred, there is a problem that the pattern is not focused and a defect occurs in the pattern.
【０００４】本発明の目的は、ステーパのステージにウ
ェーハを吸着保持したときにウェーハ表面に高低差の発
生がなく、欠陥のないパターンが得られる半導体装置を
提供することにある。An object of the present invention is to provide a semiconductor device which can obtain a defect-free pattern without causing a height difference on a wafer surface when the wafer is sucked and held on a taper stage.
【０００５】[0005]
【課題を解決するための手段】本発明は、半導体ウェー
ハを吸着保持するステージを備え、該ステージ上に吸着
保持された前記半導体ウェーハにレチクル上のパターン
を転写するステッパを有する半導体製造装置において、
前記ステージの前記半導体ウェーハを吸着保持する面が
弾力性のある樹脂にて被覆されている。The present invention provides a semiconductor manufacturing apparatus having a stage for sucking and holding a semiconductor wafer, and a stepper for transferring a pattern on a reticle to the semiconductor wafer sucked and held on the stage,
The surface of the stage that holds the semiconductor wafer by suction is covered with a resin having elasticity.
【０００６】[0006]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００７】図１は本発明の一実施例のステージにウェ
ーハを吸着保持した断面である。FIG. 1 is a cross section of a stage according to one embodiment of the present invention in which a wafer is held by suction.
【０００８】図１に示すように、ウェーハ１を吸着保持
するステージ２の表面が弾力性のある樹脂３で被覆され
ている。ステージ２，樹脂３のそれぞれには排気孔４が
設けらえており、排気孔４から吸引することによりウェ
ーハ１を弾力性のある樹脂３上に吸着保持する。As shown in FIG. 1, the surface of the stage 2 that holds the wafer 1 by suction is covered with an elastic resin 3. An exhaust hole 4 is provided in each of the stage 2 and the resin 3, and the wafer 1 is sucked and held on the elastic resin 3 by suction from the exhaust hole 4.
【０００９】ステージ２をこのような構造にすることに
より、ウェーハ１とステージ２間にごみが存在しても、
ごみはウェーハ１とステージ２間の樹脂３が変形するこ
とで吸収されウェーハ１の表面に高低差の発生をなくす
ことができる。By making the stage 2 such a structure, even if dust is present between the wafer 1 and the stage 2,
The dust is absorbed by the deformation of the resin 3 between the wafer 1 and the stage 2 and the height difference on the surface of the wafer 1 can be eliminated.
【００１０】[0010]
【発明の効果】以上説明したように本発明は、ステージ
表面を弾力性のある樹脂にて被覆したので、ごみがウェ
ーハとステージとの間に入った場合でも樹脂が変形する
ことで吸収しウェーハに高低差の発生を防止できる。つ
まり、パターン転写の際フォーカスが合わずパターン欠
陥が発生することがなくなるという効果がある。As described above, according to the present invention, since the surface of the stage is coated with the elastic resin, even if dust enters between the wafer and the stage, the resin is deformed to absorb the dust. It is possible to prevent the height difference from occurring. That is, there is an effect that the focus does not match at the time of pattern transfer and a pattern defect does not occur.
【図１】本発明の一実施例のステージにウェーハを吸着
保持した断面図である。FIG. 1 is a cross-sectional view in which a wafer is suction-held on a stage according to an embodiment of the present invention.
【図２】従来の半導体製造装置のステージの一例にウェ
ーハを吸着保持させた断面図である。FIG. 2 is a cross-sectional view in which a wafer is suction-held on an example of a stage of a conventional semiconductor manufacturing apparatus.
１ ウェーハ ２ ステージ ３ 樹脂 ４ 排気孔 1 Wafer 2 Stage 3 Resin 4 Exhaust hole
Claims (1)
を備え、該ステージ上に吸着保持された前記半導体ウェ
ーハにレチクル上のパターンを転写するステッパを有す
る半導体製造装置において、前記ステージの前記半導体
ウェーハを吸着保持する面が弾力性のある樹脂にて被覆
されていることを特徴とする半導体製造装置。1. A semiconductor manufacturing apparatus having a stage for sucking and holding a semiconductor wafer and having a stepper for transferring a pattern on a reticle to the semiconductor wafer sucked and held on the stage, wherein the semiconductor wafer on the stage is sucked. A semiconductor manufacturing apparatus, wherein a surface to be held is coated with a resin having elasticity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23323392A JPH0684745A (en) | 1992-09-01 | 1992-09-01 | Semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23323392A JPH0684745A (en) | 1992-09-01 | 1992-09-01 | Semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0684745A true JPH0684745A (en) | 1994-03-25 |
Family
ID=16951847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23323392A Withdrawn JPH0684745A (en) | 1992-09-01 | 1992-09-01 | Semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0684745A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6911596B2 (en) | 2001-05-15 | 2005-06-28 | 3M Innovative Properties Company | Method for covering an article with a tubular cover member, tubular cover member and covered article |
-
1992
- 1992-09-01 JP JP23323392A patent/JPH0684745A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6911596B2 (en) | 2001-05-15 | 2005-06-28 | 3M Innovative Properties Company | Method for covering an article with a tubular cover member, tubular cover member and covered article |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991102 |