JPS60235423A - Semiconductor manufacturing apparatus - Google Patents

Semiconductor manufacturing apparatus

Info

Publication number
JPS60235423A
JPS60235423A JP59093482A JP9348284A JPS60235423A JP S60235423 A JPS60235423 A JP S60235423A JP 59093482 A JP59093482 A JP 59093482A JP 9348284 A JP9348284 A JP 9348284A JP S60235423 A JPS60235423 A JP S60235423A
Authority
JP
Japan
Prior art keywords
wafer
chuck
electrostatic
plane
manufacturing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59093482A
Other languages
Japanese (ja)
Inventor
Masahiro Shimizu
雅裕 清水
Junichi Mihashi
三橋　順一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59093482A priority Critical patent/JPS60235423A/en
Publication of JPS60235423A publication Critical patent/JPS60235423A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

Abstract

PURPOSE:To secure a wafer so that the plane thereof is perpendicular to light rays regardless of any possible warpage of the wafer, by employing an electrostatic wafer chuck. CONSTITUTION:An electrostatic chuck 7 secures a wafer 3 thereon by means of electrostatic force so that the plane of the wafer 3 is perpendicular to light rays 1. This is effected because the electrostatic force is sufficiently strong, and the wafer 3 can be retained in this state even if it has warpage. The wafer 3 is removed by blowing air against it through air holes 6. Since the chuck 7 reliably secures the wafer 3 so that the plane thereof is perpendicular to the light rays, there is no offset of focal point within the wafer 3, so that it is possible to increase the production yield.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は、半導体製造装置に関し、特に光露光装置に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor manufacturing apparatus, and particularly to a light exposure apparatus.

〔従来技術〕[Prior art]

従来、この種の光露光装置として第１図に示すものがあ
った。図において、１は光線、２はフォトマスク、３は
ウェハ、５は真空チャック、４は該真空チャック５に形
成された溝である。Conventionally, there has been an optical exposure apparatus of this type as shown in FIG. In the figure, 1 is a light beam, 2 is a photomask, 3 is a wafer, 5 is a vacuum chuck, and 4 is a groove formed in the vacuum chuck 5.

光露光装置によるウェハの固定は、真空チャック５の溝
４を真空に引くことにより、真空チャック５上のウェハ
３を固定する。ウェハは、真空を引くのを止めれば容易
に取りはずすことができる。The wafer is fixed by the optical exposure device by evacuating the groove 4 of the vacuum chuck 5 to fix the wafer 3 on the vacuum chuck 5 . The wafer can be easily removed once the vacuum is stopped.

従来の光露光装置は以上のように構成されているので、
ウェハに０．１ｍｍ程度のソリがあった場合、真空力が
弱いためウェハが真空チャックに固定されないか、また
は、真空チャックに固定されてもソリが残り、焦点がず
れ歩留りが落ちる欠点があった。Conventional light exposure equipment is configured as described above.
If the wafer has a warp of about 0.1 mm, the vacuum force is weak and the wafer is not fixed to the vacuum chuck, or even if the wafer is fixed to the vacuum chuck, the warp remains, causing the wafer to shift focus and reduce yield. .

〔発明の概要〕[Summary of the invention]

この発明は、上記のような従来のものの欠点を除去する
ためになされたもので、ウェハチャックに静電チャック
を用いることにより、ウェハに大きなソリがあっても該
ウェハを光線に対し垂直に固定することができる半導体
製造装置を提供することを目的としている。This invention was made to eliminate the drawbacks of the conventional ones as described above, and by using an electrostatic chuck for the wafer chuck, the wafer can be fixed perpendicular to the light beam even if the wafer has a large warp. The purpose of the present invention is to provide a semiconductor manufacturing apparatus that can perform the following steps.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を図について説明する。第２
図において、■は光線、２はフォトマスク、３はウェハ
、７は静電気力によりウェハを吸着する静電チャック、
６は該静電チャック７に形成された空気穴である。An embodiment of the present invention will be described below with reference to the drawings. Second
In the figure, ■ is a light beam, 2 is a photomask, 3 is a wafer, 7 is an electrostatic chuck that attracts the wafer by electrostatic force,
6 is an air hole formed in the electrostatic chuck 7.

次に作用効果について説明する。静電チャ・ツク７は静
電気力で該静電チャック７上のウエノ＼３を光線１に対
して垂直に固定する。これは、静電気力が強いためであ
り、大きなソリがウェハにあっても可能である。ウェハ
の取りはずしは、空気穴６がら空気をウェハに吹きつけ
ることにより行う。Next, the effects will be explained. The electrostatic chuck 7 fixes the Ueno\3 on the electrostatic chuck 7 perpendicularly to the light beam 1 by electrostatic force. This is because the electrostatic force is strong, and even if the wafer has a large warp, it is possible. The wafer is removed by blowing air onto the wafer through the air holes 6.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば、ウェハチャックを静
電チャックとしたので、ウェハに大きな−ソリがあって
も該ウェハを確実に光線に対して垂直に固定できるため
、ウェハ内で焦点のずれがなくなり、歩留りが上がる効
果がある。As described above, according to the present invention, since the wafer chuck is an electrostatic chuck, even if the wafer has a large warp, the wafer can be reliably fixed perpendicular to the light beam. This has the effect of eliminating deviations and increasing yield.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の真空チャックを備えた光露光装置を示す
図、第２図はこの発明の一実施例による半導体製造装置
の一部を示す図である。 １・・・光線、２・・・フォトマスク、３・・・ウェハ
、４・・・溝、５・・・真空チャック、６・・・空気穴
、７・・・静電チャック。 なお図中同一符号は同−又は相当部分を示す。 第１図 第２図FIG. 1 is a diagram showing a conventional optical exposure apparatus equipped with a vacuum chuck, and FIG. 2 is a diagram showing a part of a semiconductor manufacturing apparatus according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Light beam, 2...Photomask, 3...Wafer, 4...Groove, 5...Vacuum chuck, 6...Air hole, 7...Electrostatic chuck. Note that the same reference numerals in the figures indicate the same or equivalent parts. Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] （１）半導体ウェハに光露光によりパターン形成を行う
半導体製造装置において、該光露光の際、静電気力によ
りウェハを吸着固定する静電チャ°ツクを備えたことを
特徴とする半導体製造装置。(1) A semiconductor manufacturing apparatus for forming a pattern on a semiconductor wafer by light exposure, characterized by comprising an electrostatic chuck that attracts and fixes the wafer by electrostatic force during the light exposure.
JP59093482A 1984-05-08 1984-05-08 Semiconductor manufacturing apparatus Pending JPS60235423A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59093482A JPS60235423A (en) 1984-05-08 1984-05-08 Semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59093482A JPS60235423A (en) 1984-05-08 1984-05-08 Semiconductor manufacturing apparatus

Publications (1)

Publication Number Publication Date
JPS60235423A true JPS60235423A (en) 1985-11-22

Family

ID=14083563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59093482A Pending JPS60235423A (en) 1984-05-08 1984-05-08 Semiconductor manufacturing apparatus

Country Status (1)

Country Link
JP (1) JPS60235423A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1548502A1 (en) * 2003-12-15 2005-06-29 ASML Netherlands BV Lithographic apparatus and device manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1548502A1 (en) * 2003-12-15 2005-06-29 ASML Netherlands BV Lithographic apparatus and device manufacturing method
JP2005183959A (en) * 2003-12-15 2005-07-07 Asml Netherlands Bv Lithographic device and manufacturing method therefor
US7187433B2 (en) 2003-12-15 2007-03-06 Asml Netherlands B.V. Electrostatic clamp assembly for a lithographic apparatus
CN102645852A (en) * 2003-12-15 2012-08-22 Asml荷兰有限公司 Lithographic apparatus and device manufacturing method

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