JPH0682950B2 - Parts feeder - Google Patents

Description

Description: TECHNICAL FIELD The present invention is mainly applied to an electronic component mounting machine that mounts electronic components represented by chip resistors, chip multilayer capacitors, ICs, etc. on a substrate that constitutes an electronic circuit. The present invention relates to a component supply device used in.

2. Description of the Related Art In an electronic component mounting machine, as shown in Japanese Patent Application Laid-Open No. 55-118698, a plurality of recesses are formed in a row in a tape body to accommodate electronic components, and a covering tape is attached to the tape body. A component supply device using a tape-shaped component assembly adhered to the surface of the component has been conventionally known.

As shown in FIG. 3, the component supply device intermittently transfers the tape-shaped component assembly P in one direction by a transfer device f having a toothed wheel arranged at the front end of a predetermined transfer path. While being transported on the transport path, the peeling tape d is peeled off and wound up by the tape peeling device g, and the electronic component c accommodated in the accommodation recess b is adsorbed and taken out by the component ejecting device h, The component take-out device h is configured to be mounted at a predetermined position on the board i. The tape main body a after taking out the electronic component c is configured to be wound around a toothed wheel of the transfer device f and turned over, and transferred to the rear to be appropriately wound or cut and disposed of.

By the way, as a specific configuration of the tape-shaped component assembly P, the following is conventionally used.

When the electronic component is small, a notch for forming a recess for accommodating the electronic component is formed in the thick tape body as disclosed in JP-A-55-118698, and a supporting tape is attached to the back surface of the notch. It is used with a covering tape attached to the surface. Further, in the case of a relatively large electronic component, as shown in FIG. 4, in order to provide necessary strength, a tape body a in which a large number of housing recesses b are embossed in a row at a predetermined pitch on a synthetic resin tape. Is used to house an electronic component (not shown) in the housing recess b, and
There is used a tape body a in which a covering tape d is attached to the surface of the tape body a to hold the electronic component. Further, on both sides of the tape body a, feed holes e are formed which engage with feed teeth of the transfer device f.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the component supply device as shown in FIG. 3, the toothed wheel of the transfer device f arranged at the front end of the transfer path is
The tape-shaped component assembly P cannot be stably transferred unless the tape body a after the electronic component c is taken out is smoothly wound. However, in the case of the tape-shaped component assembly P using the synthetic resin tape body a as shown in FIG. 4, since it is difficult to bend at the transfer device f with a small radius of curvature, it does not wind smoothly and is fed. The hole e and the feed dog of the transfer device f are easily disengaged from each other, and there is a possibility that the transfer cannot be performed reliably. In order to avoid this, the radius of curvature of the transfer device f must be increased, which not only increases the size of the device but also cannot be shared with other transfer devices for the tape-shaped component assembly. .

The present invention is intended to solve the above problems.

Means for Solving the Problems In order to achieve the above object, the present invention provides a transfer device for intermittently transferring a tape-shaped component assembly along a predetermined transfer path, and peels the coating tape from the transfer path. A tape peeling device, a component take-out device that takes out a component from the accommodation recess opening and supplies it to a predetermined position, and a cutting device that cuts the tape body after taking out the component are sequentially arranged toward the front of the transfer path. A discharging device for transferring the cut piece of the tape body backward is disposed below the transfer path.

Action Since the present invention has the above-described configuration, the tape main body after the components are taken out from the tape-shaped component assembly is cut at the front end of the transfer path, and is not wound around a tooth ring or the like so as to be inverted. The device is also compact when applied to a tape-shaped component assembly accommodating relatively large components. Further, since the cut pieces are transferred rearward by the discharging device to be processed, there is no fear that scraps and the like will drop onto the work table for mounting the taken-out parts, and the work pieces will be separated from the work table and the like. Since the cut pieces can be discharged to the rear position, a large processing space can be easily secured.

Embodiment An embodiment of the present invention will be described below with reference to FIG.

In the component supply device shown in FIG. 1, a tape-shaped component assembly 1 is configured by accommodating an electronic component 2 in an accommodating recess 4 formed in a tape body 3 and covering it with a covering tape 5. Similar to the conventional example shown in FIG. 4, the tape main body 3 is formed by embossing a large number of accommodating recesses 4 in a row at a predetermined pitch on a synthetic resin tape, and feed holes are formed at a predetermined pitch on both side edges thereof. Many are formed.

A guide member 6 that guides the tape-shaped component assembly 1 in a straight line is arranged in the component supply device to form a predetermined transfer path 7. At an appropriate position on this transfer path 7,
Tooth wheel 8 that engages with the feed hole formed in the tape body 3
A transfer device 9 is provided. Further, on the transfer path 7, a tape peeling device 10 for peeling and winding the covering tape 5 forward, and an electronic component 2 in the accommodating recess 4 are adsorbed and taken out, and a printed circuit board 11 is attached. A component take-out device 12 to be mounted at a predetermined position and a cutting device 13 for cutting the tape body 3 immediately after taking out the electronic component 2 are provided. At the front part of the cutting device 13, a pressing piece 14 that pushes down the cutting piece 15 and drops it is disposed so as to be able to move up and down. Further, a partition wall 16 for partitioning the falling path of the cut pieces 15 from the front space is provided, and a discharging device 17 such as a belt conveyor for discharging the cut pieces 15 backward is provided rearward from the lower end of the partition wall 16 of the transfer path 7. It is located below. This ejector
At the rear end of the cut piece 17, a cut piece processing box 18 for accommodating the cut piece 15 is arranged.

In addition to the belt conveyor, the discharging device 17 may employ appropriate means such as blowing off with air.

In the above structure, the tape-shaped component assembly 1 is intermittently transferred by the transfer device 9 on the transfer path 7 in the direction of arrow 19 in FIG. Then, while moving on the transfer path 7, first, the covering tape 5 is peeled by the tape peeling device 10, and then the electronic component 2 in the housing recess 4 is taken out by the component taking-out device.
It is adsorbed and taken out at 12, and this parts takeout device 12 is the first
It moves as shown by arrows 20, 21, 22 in the figure and is mounted on the printed circuit board 11. Next, the portion of the accommodating recess 4 from which the electronic component 2 of the tape body 3 is taken out is immediately cut by the cutting device 13, and the cut piece 15 drops downward and is transferred backward by the discharging device 17 to be cut. It is discarded in the single processing box 18.

In this way, since the tape body 3 is cut at the front end of the transfer path 7, the component supply device can be made compact, and the cut pieces 15 can be processed at the rear side, so that a wide processing space can be secured and it is easy. It can be disposed of, and the cut pieces 15 do not drop on the work table on which the printed circuit board 11 and the like are arranged.

In the above embodiment, the transfer device 9 is provided with the toothed wheel 8 that engages with the feed hole of the tape body 3, but the feed claw 25 that moves in a rectangular shape as shown in FIG. It is also possible to engage the holes for intermittent transfer.
In FIG. 2, the transfer device 9 mounts an operating plate 26 provided with a pair of feed claws 25 projecting on the upper end of the output shaft of a solenoid 27 for vertical drive, and this solenoid 27 can be moved in the front-back direction of the transfer path. This moving body 28
Is configured to be driven by a cylinder device 29 or a solenoid, and the feeding claw 25 is configured to move in a rectangular shape by combining the withdrawal operation of the solenoid 27 and the cylinder device 29. Further, a position regulating device 30 having the same configuration as that of the operation plate 26 and the solenoid 27 of the transfer device 9 is provided.
Are arranged in the vicinity of the component take-out device 12.

EFFECTS OF THE INVENTION According to the component supply device of the present invention, it is not necessary to wind the tape-shaped component assembly around a tooth ring or the like and invert it as described above, and therefore, the invention is applied to a tape-shaped component assembly that accommodates a relatively large component. Even in this case, the device can be made compact. Further, since the tape body after the parts are taken out is cut at the front end of the transfer path and the cut pieces are transferred to the rear side by the discharging device for processing, a work table for mounting the taken out parts There is no risk that scraps and the like will fall on the top, and since the cut pieces can be discharged to a rear position away from the work table and the like, a large processing space can be easily secured.

[Brief description of drawings]

FIG. 1 is a vertical sectional front view showing an embodiment of the present invention, FIG. 2 is a vertical sectional front view of a main portion of another embodiment, FIG. 3 is a sectional front view of a conventional example, and FIG. 4 is a conventional tape. It is the perspective view which showed the electronic parts assembly by omitting the electronic parts. 1 ... Tape-shaped component assembly 2 ... Electronic component 3 ... Tape body 4 ... Accommodating recess 5 ... Coating tape 9 ... Transfer device 10 ... Tape peeling device 12 ... Parts removing device 13 ... Cutting device 17 ... Ejection device.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-60-245300 (JP, A) Actual development S57-37282 (JP, U) JP-B 53-6702 (JP, B2)

Claims (1)

[Claims] 1. A component supply device using a tape-shaped component assembly in which components are accommodated in a plurality of accommodating recesses formed in the longitudinal direction of a tape body, and an opening of the accommodating recess is closed by a covering tape. A transfer device for intermittently transferring the tape-shaped component assembly along a predetermined transfer path is provided, and in the transfer path, a tape peeling device for peeling the covering tape, and a part for taking out the component from the accommodation recess opening and setting it at a predetermined position. A parts take-out device for supplying and a cutting device for cutting the tape body after taking out the parts are sequentially arranged toward the front of the transfer path,
A component supply device, wherein a discharge device for transferring the cut pieces of the tape body to the rear is disposed below the transfer path.