JP2000013093A - System and method for mounting electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a system and a method for mounting electronic parts that reduce machine trouble, by normally ejecting vacant tapes after electronic parts are picked up. SOLUTION: In an electronic part mounting system where electronic parts are picked up from the electronic part supply unit transferred on the substrate by the transferring head, the section of the bottom surface, which is a contact surface with a vacant tape 25 in the tape shooter 40 guiding the vacant tape 25 fed from a number of tape feeders provided in line in the supply unit to the collection box, is a corrugation having a plurality of concaves 44a provided continuously in the direction of ejection. Consequently, even in the cases of a plurality of types of tapes with different behaviors inside the tape shooter 40, the vacant tapes moving straight in the concaves 44a and the vacant tapes bent and moving on the convexes 44b are ejected separately to prevent machine trouble caused by jamming of vacant tapes 25.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art As a method for supplying an electronic component in an electronic component mounting apparatus, a method using a tape feeder is known. In this method, electronic components such as semiconductor chips are held at a constant pitch on a tape, stored in a state wound on a supply reel, and the tape is fed out at the time of mounting, so that the electronic components are transferred to a transfer head. It supplies to the pickup position. The empty tape after the electronic components have been picked up is sent out from the tape feeder by continuously feeding the tape at a constant pitch.

Conventionally, as a method of treating this empty tape, it has been often the case that the tape is cut short when it is fed from the end of the tape feeder, and the cut tape is disposed of as waste. However, tapes made of paper,
There are several types of materials such as those made of resin, and it is difficult to separate and collect waste if cut at the time of sending out, and harmful dust is generated at the time of cutting. It has become common for tapes to be uncut and collected in a continuous tape state. For this reason, the mounting apparatus is provided with a tape shooter as a guide body for guiding the empty tape sent from the tape feeder and discharging the tape into the collection box.

[0004]

However, when the empty tape after the electronic components have been picked up is guided by the above-described tape shooter, the normal operation of the mounting apparatus is hindered by jamming of the empty tape as described below. Sometimes. As described above, there are several types of empty tapes, and the behavior in the tape shooter differs depending on these types. Hereinafter, the behavior of the empty tape inside the tape shooter will be described with reference to the drawings.

FIG. 7 is a partial perspective view of a tape shooter of a conventional electronic component mounting apparatus. In FIG. 7, a tape shooter 1 is a thin duct-shaped member disposed at an angle, and guides an empty tape sent from a tape feeder (not shown) diagonally downward. The empty tape A is a paper tape, and as shown in FIG. 7, because the tape was wound on a tape reel, the empty tape is sent out in the tape shooter 1 in a discharge direction. It is difficult to feed in a straight direction, and it is discharged while being curved and skewed. On the other hand, the empty tape B is an embossed tape in which a cavity for holding electronic components is provided in a resin tape, and has a strong tendency to go straight without skew due to the rigidity of the tape itself.

[0006] These different types of empty tapes A, B
When the tapes are sent in the tape shooter 1 in a state where the tapes are mixed, empty tapes are entangled with each other as shown in FIG.
Jamming such as hindering the progress of other empty tapes is likely to occur. When such jamming occurs, the normal feeding of the empty tape sent from the tape feeder is prevented, and the empty tape projects upward from the end of the tape feeder and interferes with the nozzle of the transfer head. Machine trouble. As described above, the conventional electronic component mounting apparatus has a problem that a machine trouble is likely to occur due to a normal ejection of the empty tape.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting apparatus and a mounting method capable of normally discharging an empty tape after picking up electronic components and reducing machine trouble.

[0008]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus for picking up an electronic component from a supply section of the electronic component by a transfer head and transferring the electronic component to a substrate. A plurality of tape feeders for feeding electronic components to the pickup position of the transfer head by feeding the tape holding the electronic components to the supply unit at a pitch are arranged in parallel, and empty tapes sent from these tape feeders are discharged. A plurality of concave portions continuous in the discharge direction were provided on the contact surface of the guide body with the empty tape.

According to a second aspect of the present invention, there is provided the electronic component mounting apparatus according to the first aspect, wherein at a distal end of the guide body on a discharge side, a convex portion separating the concave portion is disposed in the discharge direction. It is cut in an oblique direction.

According to a third aspect of the present invention, there is provided a method of mounting an electronic component, wherein the electronic component is picked up from a supply section of the electronic component by a transfer head and transferred to a substrate. The electronic components are supplied to the pick-up position of the transfer head by feeding the tape holding the electronic components at pitches by the tape feeders arranged side by side, and the empty tapes sent from these tape feeders are brought into contact with the empty tape. The discharge is performed by a guide body provided with a plurality of concave portions continuous in the discharge direction.

According to the invention described in each claim, a plurality of concave portions continuous in the discharging direction are provided on the contact surface with the empty tape inside the guide body for discharging the empty tape after picking up the electronic component. The empty tapes can be prevented from interfering with each other.

[0012]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus, and FIG. 3 is a side view of a tape feeder of the electronic component mounting apparatus. 4 (a) is a perspective view of a tape shooter of the electronic component mounting apparatus, and FIGS. 4 (b), 5 (a),
(B) and (c) are partial cross-sectional views of a tape shooter of the electronic component mounting apparatus, and FIG. 6 is a partial side view of the tape shooter of the electronic component mounting apparatus.

First, an electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a transport path 2 is provided in the center of a base 11 in the X direction. Conveyance path 2
Transports and positions the substrate 3. On both sides of the transport path 2,
A supply unit 4 for electronic components is arranged, and a number of tape feeders 5 are arranged in each supply unit 4. The tape feeder stores the electronic components held on the tape, and feeds the electronic components by feeding the tape at a pitch.

An electronic component transfer head 7 is mounted on the X-axis table 6. The X-axis table 6 is supported on both ends by a Y-axis table 8A and a guide 8B arranged side by side opposite to the Y-axis table 8A. Therefore, by driving the X-axis table 6 and the Y-axis table 8A, the transfer head 7 moves in the horizontal direction,
The electronic component is picked up from the pickup position 9 of the tape feeder 5 by the nozzle 7a (see FIG. 3) mounted on the lower end, and is transferred onto the substrate 3. A recognition unit 10 for recognizing electronic components is provided on a moving path of the transfer head 7. A collection box 12 is provided below the supply unit 4 to collect empty tapes after picking up electronic components.

Next, the tape feeder 5 will be described with reference to FIG. 3, a large number of tape feeders 5 are arranged side by side on a table 20 (see also FIG. 2). The tape feeder 5 is mainly composed of a rod-shaped base 21, and a holder 22 for holding a supply reel 23 is mounted on a rear portion of the base 21. The base 21 is provided with a drive mechanism 30 for feeding the tape 24 at a pitch. The drive mechanism 30 is provided at the distal end of the base 21, and
4 and a lever member 32, 33, 34 which constitutes a driving means for rotating the sprocket 31 by a pitch.

A take-up reel 37 is provided behind the base 21. The take-up reel 37 is rotated by a lever 35 with the pitch rotation of the sprocket 31. When the sprocket 31 rotates, the tape 24
Is fed out (arrow c). The tape 24 is the main tape 2
5 is covered with a cover tape 26, and the main tape 25 holds electronic components. Cover tape 26
Is folded back near the front end of the base 21, peeled off from the main tape 25, wound up on a take-up reel 37, and collected.

When the cover tape 26 is peeled off, the electronic components are exposed. The electronic components are picked up by the nozzle 7a of the transfer head 7 and transferred to the substrate 3. The empty main tape (hereinafter referred to as empty tape) 25 from which the electronic components have been picked up is sent downward from the leading end of the tape feeder 5. Hereinafter, the tape shooter 40 as a guide body for guiding the sent empty tape 25 to the collection box 12 will be described with reference to FIGS.

As shown in FIG. 3, an opening of the tape shooter 40 is located near the leading end of the tape feeder 5, and the fed empty tape 25 is guided into the tape shooter 40 through this opening. (See arrow d shown in FIGS. 3 and 4). The tape shooter 40 is a thin duct that is disposed obliquely downward from the tip of the tape feeder 5 and that extends above the collection box 12. The inclined portion is bent in the middle, and the bent portion makes the steeply inclined portion 41,
It is divided into two gently inclined portions 42.

As shown in FIG. 4A, a concave portion 44a is formed on the lower surface inside the gentle inclined portion 42, which is the contact surface with the empty tape 25, in the discharge direction (inclination direction) of the empty tape 25. A corrugated bottom surface 44 is provided. As shown in the cross section of FIG.
The shape is set so that the empty tape 25 can enter the inside a and go straight in the discharge direction along the concave portion 44a. As shown in FIG. 3, a plate 45 is provided on the upper surface 43 at the end on the discharge port side of the gentle slope 42 so as to protrude in the discharge direction. The plate 45 is for preventing the discharged empty tape 25 from jumping upward.

Here, the behavior of the empty tape 25 guided into the tape shooter 40 will be described. The empty tape 25 sent downward from the opening firstly has the steeply inclined portion 4.
1 and is fed down along this inclined surface. In the steeply inclined portion 41, a force to guide the empty tape 25 downward due to gravity acts, so that troubles such as jamming hardly occur. When the empty tape 25 is further fed and reaches the gentle inclined portion 42, the empty tape 25B which has a strong tendency to proceed in the straight direction, such as an embossed tape made of resin, is shown in FIG. Into the concave portion 44a of the corrugated bottom surface 44, and travels along the concave portion 44a. On the other hand, the empty tape 25A having a strong “winding” such as a paper tape advances in a curved state while sliding on the upper surface of the convex portion 44b separating the concave portion 44a without entering the concave portion 44a.

Thus, the empty tape 25A and the empty tape 2
5B travels in the same direction in the discharge direction after being divided into upper and lower parts in the same tape shooter 40, and the embossed tape does not interfere with the paper tape having a strong “winding”. Therefore, jamming due to interference between empty tapes, unlike a conventional tape shooter having a flat surface, does not occur, and machine troubles caused by defective ejection of the empty tape 25 can be eliminated. In the present embodiment, the corrugated bottom surface is provided only in the gentle slope portion 42, but the corrugated bottom surface may be provided in the entire range of the tape shooter 5 including the steep slope portion 41. As the concave portion 44a, in addition to the waveform cross section shown in this embodiment, FIG.
(B) and (c), such as a cross section having rectangular irregularities, a saw-toothed cross section, a comb-shaped cross section, or the like that forms a continuous concave portion 44a in the empty tape discharging direction is adopted. be able to.

As shown in FIG. 6, at the end of the tape shooter 40 on the discharge side, the end of the convex portion 44b separating the concave portion 44a (the hatched portion in FIG. 6) is inclined with respect to the discharge direction. Cut in the direction.
By providing such a cut portion, the empty tape 25
Can be prevented from being caught on the end of the convex portion 44b when the hollow portion of the large-sized embossed tape 25B is pulled out in the direction opposite to the discharge direction (the direction of the arrow).

The electronic component mounting apparatus is configured as described above, and the operation will be described below. First, in FIG. 2, the substrate 3 is positioned at a mounting position on the transport path 2. Next, the X-axis table 6 and the Y-axis table 8A are driven to move the transfer head 7, and the electronic components are picked up at the pickup position 9 of the tape feeder 5 for supplying predetermined electronic components. Thereafter, the transfer head 7 moves to the recognition unit 1.
0, and the position of the electronic component is recognized here.
Based on this recognition result, position correction at the time of mounting on the board 3 is performed, and the electronic component is mounted on the board 3.

While the above mounting operations are sequentially performed, the empty tape 25 after picking up the electronic components is discharged from each tape feeder 5 and guided to the collection box 12 by the tape shooter 40. At this time, since the corrugated bottom surface 44 is provided inside the tape shooter 40,
Jamming between the empty tapes 25 does not occur, and therefore, no machine trouble due to defective ejection of the empty tapes 25 occurs.

[0025]

According to the present invention, a concave portion which is continuous in the discharging direction is provided on the contact surface with the empty tape inside the guide body for discharging the empty tape after picking up the electronic component. Even when using a plurality of types of tapes having different tapes, the empty tape is divided into upper and lower parts and proceeds in the discharge direction. Therefore, jamming due to mutual interference of the empty tapes is prevented to reduce machine trouble. Can be.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a side view of a tape feeder of the electronic component mounting apparatus according to the embodiment of the present invention;

4A is a perspective view of a tape shooter of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4B is a partial cross-sectional view of a tape shooter of the electronic component mounting apparatus of one embodiment of the present invention.

5A is a partial cross-sectional view of a tape shooter of an electronic component mounting apparatus according to one embodiment of the present invention. FIG. 5B is a partial cross-sectional view of a tape shooter of an electronic component mounting apparatus according to one embodiment of the present invention. (C) Partial sectional view of a tape shooter of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 6 is a partial side view of a tape shooter of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 7 is a partial perspective view of a tape shooter of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 3 substrate 4 supply section 5 tape feeder 7 transfer head 12 collection box 24 tape 25 empty tape 30 drive mechanism 40 tape shooter 41 steep slope section 42 gentle slope section 44 bottom face 44a recess

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Hironori Kitajima 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Yasuo Tagami 1006 Kadoma Kadoma, Kadoma City, Osaka Pref. 72) Inventor Satoshi Kadohata 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 5E313 AA01 AA11 AA15 CD03 DD35

Claims (3)

[Claims] An electronic component mounting apparatus for picking up an electronic component from a supply unit of the electronic component by a transfer head and transferring the electronic component to a substrate, wherein a tape holding the electronic component is pitch-fed to the supply unit. A number of tape feeders that supply electronic components to the pick-up position of the transfer head are arranged side by side, and on the contact surface with the empty tape inside the guide body that discharges the empty tape sent from these tape feeders, in the discharge direction. An electronic component mounting device comprising a plurality of continuous concave portions. 2. The discharge device according to claim 1, wherein the guide body has a discharge end.
2. The electronic component mounting apparatus according to claim 1, wherein a convex portion separating the concave portion is cut obliquely to the discharge direction. 3. A method for mounting electronic components, wherein electronic components are picked up by a transfer head from a supply unit of the electronic components and transferred to a substrate, wherein the electronic components are provided by a plurality of tape feeders juxtaposed in the supply unit. Electronic components are supplied to the pick-up position of the transfer head by feeding the tape holding the tape at a pitch, and a plurality of recesses continuous in the discharge direction are provided on the contact surface with the empty tape, which is fed from these tape feeders. A method of mounting an electronic component, wherein the electronic component is discharged by a provided guide body.