JPH0682763U - Contact for board connection - Google Patents

Abstract

(57) [Summary] [Purpose] To be able to perform automatic soldering work while maintaining the contact posture. [Structure] Through hole 1 of substrate 11 of first connecting portion 1
2, a posture holding portion 4 that comes into contact with the end surface of the substrate 11 in the vicinity of
And the substrate 11 is held by the first connecting portion 1 and the posture holding portion 4 while holding the posture.
Then, the first connecting portion 1 is automatically soldered. The conductive portion 3 connected to the first connection portion 1 has bendable neck portions 6 and 7.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a board connecting contact, and more particularly to a board connecting contact used for electrically connecting a circuit of a mutual board such as a printed circuit board used for internal wiring of an electronic device or the like.

[0002]

[Prior art]

 Conventionally, as shown in FIGS. 4 and 5, a board connecting contact has a plurality of first connecting portions 21, a plurality of second connecting portions 22, and first and second connecting portions 21 and 22. Each of them has a conductive portion 23 connected to each other in a one-to-one manner.

The first and second connecting portions 21 and 22 and the conductive portion 23 are arranged in parallel without contacting each other. The first connecting portion 21 is inserted into a through hole 26 formed in the substrate 25 and connected to the substrate 25 on the opposite side to the insertion side. That is, the first connecting portion 21 is inserted into the through hole 26 formed in the substrate 26, and is connected by soldering to the circuit conductor provided on the surface of the substrate 26 opposite to the insertion side. Further, the second connecting portion 22 is inserted into the mating through hole 28 formed in the mating substrate 27, and is connected by soldering to the circuit conductor provided on the mating substrate 27 surface opposite to the insertion side. It

In addition, this board connection contact has a pair of insulators 31 and 32 that are grounded to the board 25 and the mating board 27, and the posture of the board connection contact is maintained, and an automatic soldering process is performed. Is being sent to.

The pair of insulators 31 and 32 are arranged at both ends of the plurality of conductive parts 23 and arranged at a predetermined interval to fix the conductive parts 23, and these are fixed by molding. Molded.

[0006]

[Problems to be solved by the device]

 However, in the conventional board connecting contact, if the conductive portion 23 needs to be long in design, the attitude of the board connecting contact cannot be maintained on the board 26, and the soldering work cannot be performed. There is a problem.

In this case, the first and second connecting portions 21 and 22 are automatically soldered to the board 25 and the mating board 27 while maintaining the posture by using the pair of insulators 31 and 32. There is a problem in that the insulators 31 and 32 formed in a shape must be used, and material costs and molding costs for the insulators 31 and 32 are required.

Further, since the insulators 31 and 32 are used, an assembling work is required, resulting in an increase in cost and a complicated work.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a contact for board connection which can easily perform automatic soldering work even if the contact has a long dimension and its posture is difficult to maintain. is there.

[0010]

[Means for Solving the Problems]

 According to the present invention, a board connection including a first connection section connected to a board, a second connection section connected to a mating board, and a conductive section connecting the first and second connection sections to each other. In the contact for board, there is obtained a contact for board connection, which has an attitude holding part extending so as to be able to come in contact with the one end surface of the board from the conductive part.

Further, according to the present invention, the first connecting portion to be inserted into the through hole of the substrate, the second connecting portion to connect to the mating substrate, and the first and second connecting portions are connected to each other. A contact for board connection including a conductive portion, and a posture holding portion extending from the conductive portion to one end surface of the substrate, wherein the posture holding portion and the first connecting portion are It extends in the same direction from the conductive portion, and the mutual distance between the posture holding portion and the first connection portion is set to the distance between the through hole and the one end surface of the substrate so as to sandwich the substrate portion. It is possible to obtain a contact for connecting a substrate, which is characterized in that

Further, according to the present invention, the contact for board connection is characterized in that the conductive portion has a neck portion that can be bent in correspondence with desired positioning of the board and the mating board. can get.

[0013]

[Action]

 According to the board connecting contact, since the first connecting portion is connected to the board and the posture holding portion engages with the end surface of the board, the board is sandwiched between the two, and the board connecting contact is self-supporting. You can In this way, the posture can be maintained and the automatic soldering work between the first connecting portion and the circuit conductor of the substrate can be performed.

[0014]

【Example】

 Next, an embodiment of the board connecting contact of the present invention will be described with reference to the drawings.

With reference to FIGS. 1 and 2, the substrate connecting contact includes a first connecting portion 1 for connecting to a substrate, a second connecting portion 2 for connecting to a mating substrate, and the first and the second connecting portions. It has a conductive portion 3 in which two connecting portions 1 and 2 are connected to each other. In the vicinity of the first connecting portion 1, there is provided a pair of posture holding portions 4 extending from the conducting portion 3 so as to be able to contact one end surface of the substrate. Further, in the conductive portion 3, a carrier 5 extends from the conductive portion 3 in the vicinity of the second connection portion 2. The carrier 5 keeps the conductive portion 4 and the first and second connecting portions 1 and 2 in a continuous state, and is cut and removed from the conductive portion 4 at a predetermined time. Further, the conductive portion 3 has a plurality of neck portions 6 and 7 which can be bent according to a desired positioning of the board and the other board.

The board connection contact is made by punching a conductive plate material and then bending it.

The first connecting portion 1 is bent at a right angle from the end of the conductive portion 3 to the conductive portion 3. The pair of posture holding portions 4 extends in the same direction as the first connecting portion 1. The carrier 5 is bent at a right angle to the conductive portion 3 opposite to the first connecting portion 1 so that the plate portion having the carrier hole 5a formed therein faces the conductive portion 3.

Further, the first connecting portion 1 penetrates a through hole of a substrate which will be described later, and a bulging portion 9 is formed at an intermediate portion of the first connecting portion 1. The second connecting portion 2 penetrates into a mating through hole of a mating substrate, which will be described later, and a mating bulging portion 10 is formed at an intermediate portion of the second connecting portion 2.

The mutual distance between the posture holding unit 4 and the first connecting unit 1 is set to a distance between the through hole of the substrate and the one end surface of the substrate so as to sandwich the substrate portion. The parallel distance between the first connecting portion 1 and the posture holding portion 4 is set to be slightly smaller than the distance from the through hole of the substrate to the end face of the substrate.

Further, the neck portions 6 and 7 are smaller in width dimension than the predetermined portion in the longitudinal direction of the conductive portion 4. Any of the parts with the smaller width dimension becomes the bent part when the substrate and the mating substrate are set at a predetermined angle.

Next, a procedure for attaching the board connection contact to the board and the mating board will be described.

First, as shown in FIG. 3 (a), the substrate connecting contact is automatically carried by the carrier 5 and penetrates the first connecting portion 1 in the plate thickness direction of the substrate 11. It is inserted into the through hole 12. At this time, the posture holding portion 4 is engaged with the end surface of the substrate 11, and the bulging portion 9 holds the first connecting portion 1 in the through hole 1 in a state of being press-fitted. With this configuration, the posture holding unit 4 and the first connecting unit 1 sandwich the substrate 11, and the other portions maintain the posture without support. In this state, the circuit conductor of the substrate 11 and the first connecting portion 1 can be automatically soldered to the automatic soldering process.

After that, as shown by arrow A in FIG. 3B, the neck portion 6 of the conductive portion 3 is bent at a right angle, and as shown by arrow B in FIG. 2 is inserted into the other through hole 16 of the mating substrate 15. At this time, the mating bulging portion 10 holds the second connecting portion 2 in the mating through hole 16 in a state of being press-fitted. In this state, the circuit conductor of the mating substrate 15 and the second connecting portion 2 are automatically soldered.

When the arrangement of the board 11 and the mating board 15 is changed, as shown by an arrow C in FIG. 3D, the conductive section 3 is bent around the neck 7 and the board 11 and The mating substrate 15 is arranged at a desired position.

[0025]

[Effect of device]

 As described above with reference to the embodiments, according to the above-mentioned board connecting contact, the first connecting portion and the circuit conductor of the board are automatically soldered in the state where the board connecting contact is held on the board in the posture. The soldering work can be performed, which can contribute to the speeding up of the assembly work.

Moreover, since it is not necessary to use a conventional insulator for maintaining the posture, the posture can be maintained even with a contact for connecting a substrate having a long shape, which is extremely advantageous in terms of cost.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a substrate connecting contact according to the present invention.

FIG. 2 is a plan view of the substrate connecting contact shown in FIG.

FIG. 3 is an explanatory view showing an arrangement procedure for connecting the board connection contact of FIG. 1 to a board and a mating board, FIG.
Is a side view showing a state where the substrate connecting contact is connected to the substrate while holding the posture, (b) is a side view showing a state where the substrate connecting contact is bent, and (c) is a substrate connecting contact connected to the mating substrate. A side view of the state, (d) is a side view showing a state in which the substrate and the mating substrate are arranged at desired positions with the substrate connecting contacts connected.

FIG. 4 is a partial cross-sectional perspective view showing a conventional board connecting contact.

5 is a side sectional view showing a state in which substrates are connected using the substrate connecting contact of FIG.

[Explanation of symbols]

 1,21 1st connection part 2,22 2nd connection part 3,23 Conductive part 4 Posture holding part 5 Carrier 6,7 Neck part 9,10 Swelling part 31,32 Insulator

Claims (3)

[Scope of utility model registration request] 1. A substrate connecting device, comprising: a first connecting portion connected to a substrate; a second connecting portion connecting to a mating substrate; and a conductive portion connecting the first and second connecting portions to each other. The contact for board connection is characterized in that the contact has a posture holding portion extending from the conductive portion to one end surface of the substrate. 2. A first connecting part to be inserted into a through hole of a substrate, a second connecting part to be connected to a mating substrate, and the first connecting part.
A contact for board connection including a conductive part connecting the second connecting part to each other, the contact holding part extending from the conductive part to the one end surface of the substrate, The first connecting portion extends in the same direction from the conductive portion, and the mutual distance between the posture holding portion and the first connecting portion is such that the through hole and the one end surface of the substrate are separated from each other. A contact for connecting a substrate, characterized in that the interval is set so as to sandwich the substrate portion. 3. The board connecting contact according to claim 1, wherein the conductive portion has a neck portion that can be bent in correspondence with desired positioning of the board and the mating board. .