JPH0679121A - System for making waste gas harmless - Google Patents

System for making waste gas harmless

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Publication number
JPH0679121A
JPH0679121A JP23751692A JP23751692A JPH0679121A JP H0679121 A JPH0679121 A JP H0679121A JP 23751692 A JP23751692 A JP 23751692A JP 23751692 A JP23751692 A JP 23751692A JP H0679121 A JPH0679121 A JP H0679121A
Authority
JP
Japan
Prior art keywords
waste gas
exhaust gas
exhaust
parallel
harmful components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23751692A
Other languages
Japanese (ja)
Inventor
Kazushige Komatsu
一茂 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu VLSI Ltd
Fujitsu Ltd
Original Assignee
Fujitsu VLSI Ltd
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu VLSI Ltd, Fujitsu Ltd filed Critical Fujitsu VLSI Ltd
Priority to JP23751692A priority Critical patent/JPH0679121A/en
Publication of JPH0679121A publication Critical patent/JPH0679121A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To provide a system for post-treating and making waste gas harmless immediate after the waste gas is discharged out of a semiconductor fabricating apparatus wherein the system is compact, does not leak the waste gas, and has a waste gas discharging duct through which the waste gas is discharged efficiently. CONSTITUTION:A system for making waste gas harmless is a system to remove harmful components contained in the waste gas and the system has a transverse-type parallel-flow wet-way harmful components removing apparatus 1 in the middle of a waste gas discharging duct 2 wherein the apparatus has two times or less wide cross section surface area of the waste gas discharging duct 2, treats waste gas at 2m/second or higher discharging flow rate, has good pressure loss efficiency since harmful components contained in the waste gas are made harmless by introducing washing water to flow in parallel, and thus can make the system compact. The parallel-flow wet-way harmful components removing apparatus 1 may be composed of static mixing apparatuses 3 or porous plates with venturi scrubbers with a plurality of holes and having a parallel-flow shower in the upper stream side. The waste gas discharging duct is divided in parallel into at least two ducts and the parallel-flow wet-way harmful components removing apparatus 1 may be put in each waste gas discharging duct 2 and the axis of the parallel-flow wet-way harmful components removing apparatus 1 is arranged in a straight line.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は,半導体製造装置から排
出される排気の除害を行う排気除害システムに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust gas abatement system for removing exhaust gas emitted from a semiconductor manufacturing apparatus.

【0002】半導体の製造では,酸類,アンモニア類の
薬品による湿式プロセスにより処理を行う半導体製造装
置,及び,洗浄装置を多数用いており,その排気には有
害なものが少なくない。
In the production of semiconductors, a large number of semiconductor production equipments and cleaning equipments that perform treatment by a wet process using chemicals such as acids and ammonia are used, and their exhausts are notably harmful.

【0003】そのため, これら半導体製造設備から排出
される排気は,大気中に放出する前に有害成分を除去す
る除害を行う必要がある。半導体工場では, 1ないし複
数の半導体製造設備等に対して,その直後で排気の除害
を行い, その後のダクトには処理後の安全な排気を流す
ことで, 工場内の安全性を高めることを望んでいる。
Therefore, it is necessary to remove the harmful components from the exhaust gas discharged from these semiconductor manufacturing facilities before releasing them into the atmosphere. In a semiconductor factory, the exhaust gas is immediately removed from one or more semiconductor manufacturing facilities, and the safe exhaust gas after processing is passed through the ducts after that to improve the safety inside the factory. Wants

【0004】しかし, 工場内に排気処理装置を置く場
合, メンテナンス上の安全性を確保するために, 連続操
業中は排気の通過する部分のメンテナンスフリー化を要
望されている。また, 将来的には, 処理後排気の循環再
利用も望まれている。
However, when an exhaust treatment device is installed in a factory, in order to ensure safety in maintenance, there is a demand for maintenance-free maintenance of the portion through which exhaust passes during continuous operation. In the future, it is also desired to recycle exhaust gas after treatment.

【0005】更に, 半導体製造装置等の稼働状況により
排気の風量及び,濃度が変化しても,除害機能の劣化を
できるだけ低減させることが望まれている。
Further, it is desired to reduce the deterioration of the abatement function as much as possible even if the air volume and concentration of the exhaust gas change depending on the operating conditions of the semiconductor manufacturing equipment.

【0006】[0006]

【従来の技術】図4は従来例の説明図である。図におい
て,17は洗浄塔, 18は排気ファン, 19は排気ダクト, 20
は廃液配管,21は廃液受槽, 22は廃液ポンプ, 23は屋内
洗浄塔である。
2. Description of the Related Art FIG. 4 is an explanatory view of a conventional example. In the figure, 17 is a washing tower, 18 is an exhaust fan, 19 is an exhaust duct, and 20
Is a waste liquid pipe, 21 is a waste liquid receiving tank, 22 is a waste liquid pump, and 23 is an indoor cleaning tower.

【0007】従来の排気除害システムでは, 図4に示す
ように,洗浄塔17を屋外に設置して, その直前に排気フ
ァン18を設け, 半導体製造設備からの排気ダクト19を系
統別に排気ファン18まで配管して, 負圧で引いていた。
In a conventional exhaust gas abatement system, as shown in FIG. 4, a cleaning tower 17 is installed outdoors, an exhaust fan 18 is installed immediately in front of it, and an exhaust duct 19 from a semiconductor manufacturing facility is exhaust fan by system. Piping up to 18 and drawing with negative pressure.

【0008】即ち, 半導体工場の半導体製造設備から排
出される廃液や排気の処理は, 一般に1台,或いは複数
の半導体製造設備等に対して, 図4(a)に示すよう
に,有害排気は半導体工場の屋外の排気ファン18で, 排
気ダクト19内を常に負圧に保ちながら, 屋外, 或いは屋
上の洗浄塔17まで導き除外処理を行い, 廃液は半導体工
場地下の廃液受槽21より工場敷地内の廃液処理装置に送
って処理を行っていた。
That is, the treatment of the waste liquid and the exhaust gas discharged from the semiconductor manufacturing equipment of the semiconductor factory is generally carried out by treating one or a plurality of semiconductor manufacturing equipments with no harmful exhaust gas as shown in FIG. 4 (a). An outdoor exhaust fan 18 in a semiconductor factory keeps the exhaust duct 19 at a negative pressure, and guides it to the washing tower 17 outdoors or to the rooftop to remove the waste liquid. It was sent to the waste liquid treatment equipment of No. 1 for processing.

【0009】また, 特に高濃度の有害排気を排出する半
導体製造設備には, その直後に, 図4(b)に示すよう
に,半導体工場内に小型の屋内洗浄塔23を設けて洗浄処
理を行った後, 他の半導体製造装置等から屋外に排気す
る排気ダクト19の一部に,挿入的に設置されている場合
が多かった。
Immediately after that, as shown in FIG. 4 (b), a small indoor cleaning tower 23 is provided in a semiconductor factory for semiconductor manufacturing equipment that emits particularly high-concentration harmful exhaust gas to perform cleaning processing. After that, it was often installed by insertion in a part of the exhaust duct 19 that exhausts air from other semiconductor manufacturing equipment to the outside.

【0010】また, 半導体製造装置から排出される廃液
の廃液受槽21からも排気をとって,室内に有害排気が漏
れないようにしていた。上記のように, これらの方法で
は,排気ダクト19内に常に有害排気が流れており, 排気
ダクト19内が負圧でも, 排気ダクト19の曲がり部で発生
する渦流で漏れが無いように点検する必要があった。
Further, exhaust is also taken from the waste liquid receiving tank 21 of the waste liquid discharged from the semiconductor manufacturing apparatus so that harmful exhaust gas does not leak into the room. As described above, with these methods, harmful exhaust is constantly flowing in the exhaust duct 19, and even if the exhaust duct 19 has a negative pressure, check that there is no leakage due to the vortex flow generated at the bend of the exhaust duct 19. There was a need.

【0011】また, 排気ダクト19の配管を系統別に配管
するため, 排気ダクト19の本数が多くなり, メンテナン
ススペースも大きくなり, 改善が望まれていた。半導体
工場において,このような排気除害システムをコンパク
トに効率的に配置するためには,小型の並流湿式除害器
を屋内に設置して,処理後の排気を集約してコンパクト
な排気ダクトで排出することが必要となる。
Further, since the exhaust ducts 19 are arranged for each system, the number of the exhaust ducts 19 is increased, the maintenance space is also increased, and improvement is desired. In a semiconductor factory, in order to arrange such an exhaust gas abatement system compactly and efficiently, a small co-current wet abatement device is installed indoors, and the exhaust gas after processing is collected to create a compact exhaust duct. It is necessary to discharge it at.

【0012】また,排気除害システムの高さもメンテナ
ンスを含めて,1.8m以下にすれば,設置場所の確保
が容易になる。そこで,排気ダクト断面積の2倍以内の
断面積で,排気ダクトの途中にコンパクトに設置でき,
且つ,空間速度2m/秒以上で処理できる小型の横型並
流湿式除害システムが要求されている。
If the height of the exhaust gas abatement system including maintenance is set to 1.8 m or less, it becomes easy to secure the installation place. Therefore, with a cross-sectional area within twice the exhaust duct cross-sectional area, it can be installed compactly in the middle of the exhaust duct,
In addition, a compact horizontal co-current wet abatement system capable of processing at a space velocity of 2 m / sec or more is required.

【0013】また,半導体工場の地下ピットの効率活用
で廃液配管を削減することも,工場内のスペース有効活
用に貢献することから,地下ピット,若しくは,地下ピ
ット内にチャンバ兼用液槽を設けることが望まれてい
る。
Further, since the waste liquid piping can be reduced by efficiently utilizing the underground pit of the semiconductor factory, it contributes to the effective utilization of the space in the factory. Therefore, the underground pit or the liquid tank that also serves as a chamber is provided in the underground pit. Is desired.

【0014】[0014]

【発明が解決しようとする課題】そのため, ダクトには
処理後の安全な排気を流すことで,工場内の安全性をよ
り高めることが必要であり, 工場内のダクトの曲がり部
分で発生する排気の渦流で, 排気がダクトから漏れが無
いかどうか点検する必要があった。
Therefore, it is necessary to increase the safety in the factory by flowing the safe exhaust gas after processing to the duct, and the exhaust gas generated in the bent part of the duct in the factory is required. It was necessary to check that the exhaust did not leak from the duct due to the swirling flow.

【0015】また, 排気ダクトの配管を系統別に配管す
るため, ダクト本数が多くなり, メンテナンススペース
も大きくなり, 改善が望まれている。そこで,本発明は
横型の並流湿式除害器を用いて, 排気漏れがない, ダク
トを効率的に配管するコンパクトな直後処理排気除害シ
ステムの提供を目的とする。
Further, since the exhaust ducts are arranged by system, the number of ducts increases, the maintenance space also increases, and improvements are desired. Therefore, it is an object of the present invention to provide a compact immediate-treatment exhaust gas abatement system that uses a horizontal co-current wet abatement device and that has no exhaust gas leakage and that efficiently ducts ducts.

【0016】[0016]

【課題を解決するための手段】図1〜図3は本発明の排
気除害システムの構成図である。図において,1は並流
湿式除害器,2は排気ダクト,3は静止型混合器,4は
多孔板,5は並流シャワー,6は複数孔ベンチュリスク
ラバ,7は出口配管,8はチャンバ兼用液槽,9はチャ
ンバ部,10は液槽部, 11はシーブトレイ, 12は排気ファ
ン,13はポンプ, 14は右捻りエレメント, 15は左捻りエ
レメント, 16は補給液注入管である。
1 to 3 are block diagrams of an exhaust gas abatement system according to the present invention. In the figure, 1 is a co-current wet detoxifier, 2 is an exhaust duct, 3 is a static mixer, 4 is a perforated plate, 5 is a co-current shower, 6 is a multi-hole venturi scrubber, 7 is outlet piping, 8 is a chamber A combined liquid tank, 9 is a chamber part, 10 is a liquid tank part, 11 is a sheave tray, 12 is an exhaust fan, 13 is a pump, 14 is a right twist element, 15 is a left twist element, and 16 is a replenisher injection pipe.

【0017】上記目的を達成するために,本発明の排気
除害システムは,図1(a)に示すように排気ダクト2
の2倍程度以内の断面積で処理可能な横型の並流湿式除
害器1を排気ダクト2の途中に取り付けることで, 高さ
を1.2m程度にコンパクト化でき,且つ,排気ファン
12を床置きにするばあいは,横型の並流湿式除害器1を
排気ファン12と同じレベルに設置して,点検を容易にす
る。
In order to achieve the above object, the exhaust gas abatement system of the present invention has an exhaust duct 2 as shown in FIG. 1 (a).
By installing a horizontal co-current wet-type abatement system 1 that can be treated with a cross-sectional area of about 2 times or less, the height can be reduced to about 1.2 m and the exhaust fan can be made compact.
If the 12 is placed on the floor, the horizontal co-current wet type abatement machine 1 is installed at the same level as the exhaust fan 12 to facilitate the inspection.

【0018】即ち,本発明の目的は,図1(a)に示す
ように,排気に含まれる有害成分を除去する排気除害シ
ステムであって, 排気に含まれる有害成分を除去する排
気除害システム10であって, 排気ダクト2の断面積の2
倍以下の断面積を有し,且つ, 排気速度を2m/秒以上
で処理でき,排気に含まれる有害成分を洗浄水が並流し
て除害するため圧損効率が良く,小型化に適した横型の
並流湿式除害器1を,該排気ダクト2の途中に有するこ
とにより,また,前記並流湿式除害器1は,図1(b)
に示すように,静止型混合器3,或いは,図2(d)に
示すように,多孔板4とその上流に並流シャワー5とを
有する複数孔ベンチュリスクラバ6にて構成されてなる
ことにより,また,図3(f)に示すように,前記排気
ダクト2を少なくとも2か所以上に分割し,前記並流湿
式除害器1をそれぞれの排気ダクト2に有し,且つ,前
記並流湿式除害器1の軸が一直線上に並ぶように配置さ
れてなることにより,また, 図1(b)に示すように,
前記並流湿式除害器1の出口配管7を通過風速0.2m
/秒以下に減速するチャンバ兼用液槽8に接続してなる
ことにより,更に,図3(g),或いは図3(h)に示
すように,前記チャンバ兼用液槽8のチャンバ部9と液
槽部10との間に, シーブトレイ11を有することにより達
成される。
That is, an object of the present invention is, as shown in FIG. 1 (a), an exhaust gas removal system for removing harmful components contained in exhaust gas, which is an exhaust gas removal system for removing harmful components contained in exhaust gas. The system 10 has a sectional area of the exhaust duct 2 of 2
It has a cross-sectional area of less than twice, and can process at an exhaust speed of 2 m / sec or more, and because the washing water flows in parallel to remove harmful components contained in the exhaust, the pressure loss efficiency is good, and the horizontal type is suitable for downsizing. By having the parallel flow wet type abatement device 1 in the middle of the exhaust duct 2, the parallel flow wet type abatement device 1 is shown in FIG.
As shown in FIG. 2, the static mixer 3 or the multi-hole venturi scrubber 6 having a perforated plate 4 and a co-current shower 5 upstream thereof as shown in FIG. As shown in FIG. 3 (f), the exhaust duct 2 is divided into at least two locations, and the co-current wet abatement device 1 is provided in each exhaust duct 2 and By arranging the axes of the wet type abatement machine 1 so as to be aligned on a straight line, as shown in FIG. 1 (b),
Wind velocity of 0.2 m passing through the outlet pipe 7 of the co-current wet type abatement system 1.
Since it is connected to the chamber / liquid tank 8 that decelerates to less than 1 / second, as shown in FIG. 3 (g) or FIG. This is achieved by having a sieve tray 11 between the tank section 10 and the tank section 10.

【0019】[0019]

【作用】本発明においては,ダクトの2倍以内の断面積
で,且つ排気速度が2m/秒以上の処理が可能な横型の
並流湿式除害器を排気ダクトの途中に取り付けることで
高さをコンパクト化することができる。
In the present invention, a horizontal co-current wet type abatement device having a cross-sectional area of less than twice that of the duct and capable of processing at an exhaust velocity of 2 m / sec or more is mounted in the middle of the exhaust duct. Can be made compact.

【0020】また,並流湿式除害器を,静止型混合器,
或いは,複数孔ベンチュリスクラバで構成すると,並流
する洗浄液によって排気が常に洗浄され,専用の目詰ま
り防止スプレーを設けなくても, スクラバ等の目詰まり
が生じなくなり, 排気除害システムの連続稼働が可能と
なる。
Further, the co-current wet abatement device is a static mixer,
Alternatively, if a multi-hole venturi scrubber is used, the exhaust gas is always washed by the cleaning liquid flowing in parallel, and the scrubber etc. will not be clogged even if a dedicated anti-clogging spray is not installed, and the exhaust gas abatement system can be operated continuously. It will be possible.

【0021】また, 静止型混合器,或いは,複数孔ベン
チュリスクラバは空間速度を2m/秒以上で稼働するこ
とが可能であり,駆動部分がないため連続稼働に有効で
ある。
The static mixer or the multi-hole venturi scrubber can operate at a space velocity of 2 m / sec or more, and is effective for continuous operation because it has no driving part.

【0022】更に,排気ダクトを集約することで無害排
気はコンパクトに排出でき,チャンバ兼用液槽を設ける
ことで,ミスト除去と排気ダクト集約を一度に行え,回
収ミストをそのまま循環液として利用できる利点があ
る。
Further, by collecting exhaust ducts, harmless exhaust can be discharged compactly, and by providing a chamber / liquid tank, mist can be removed and exhaust ducts can be collected at one time, and recovered mist can be used as a circulating liquid as it is. There is.

【0023】[0023]

【実施例】図1〜図3は本発明の排気除害システムの構
成図である。本発明による排気除害システムは,図1
(a)に示すように,ダクトの2倍程度以内の断面積で
処理可能な横型の並流湿式除害器1を備えており,排気
ダクト2の途中に取り付けることで,高さを1.2m程
度にコンパクト化でき,且つ,排気ファン12を室内に設
ける場合には,排気ファン12を横型の並流湿式除害器1
と同じレベルに設置して,点検を容易にするようにし
た。
1 to 3 are block diagrams of an exhaust gas abatement system according to the present invention. The exhaust gas abatement system according to the present invention is shown in FIG.
As shown in (a), the horizontal parallel-flow wet abatement device 1 capable of processing with a cross-sectional area within about twice as large as the duct is provided, and by installing it in the middle of the exhaust duct 2, the height becomes 1. When the exhaust fan 12 can be made compact to about 2 m and the exhaust fan 12 is installed indoors, the exhaust fan 12 is a horizontal co-current wet detoxifier 1
It was installed at the same level as above to facilitate inspection.

【0024】また, 図1(b)に示すように,静止型混
合器3は, 上流側入口以外の中間部にも洗浄液噴射口を
設けた方が, 効率が良くなる。図2(c)に静止型混合
器3の内部構造を示す。
Further, as shown in FIG. 1 (b), in the static mixer 3, it is more efficient to provide the cleaning liquid injection port at the intermediate portion other than the upstream side inlet. The internal structure of the static mixer 3 is shown in FIG.

【0025】図2(d)に示す複数孔ベンチュリスクラ
バ6は上流に並流シャワー5を有する多孔板4から構成
される。図2(e)に複数孔ベンチュリスクラバ6の多
孔板4の内部構造を示す。
The multi-hole venturi scrubber 6 shown in FIG. 2D is composed of a perforated plate 4 having a co-current shower 5 upstream. FIG. 2E shows the internal structure of the perforated plate 4 of the multi-hole venturi scrubber 6.

【0026】静止型混合器3,及び,複数孔ベンチュリ
スクラバ6は横型で使用する場合,重力により並流シャ
ワー5の流れが不均一となるのを防ぐために, 500mm □
程度以下のサイズで使用するのが望ましい。
When the static mixer 3 and the multi-hole venturi scrubber 6 are used horizontally, in order to prevent the flow of the co-current shower 5 from becoming non-uniform due to gravity, 500 mm square
It is desirable to use it with a size less than that.

【0027】また,図3(f)に示すように, 排気ダク
ト2を複数に分割して, 各々の排気ダクト1の途中に複
数の横型の並流湿式除害器1を設ける場合,メンテナン
スし易いように並流湿式除外器の軸を一直線上に配置す
ることで,コンパクト性を維持することが可能となる。
Further, as shown in FIG. 3 (f), when the exhaust duct 2 is divided into a plurality of parts and a plurality of horizontal co-current wet abatement devices 1 are provided in the middle of each exhaust duct 1, maintenance is required. Compactness can be maintained by arranging the axes of the parallel-flow wet-type remover on a straight line for the sake of simplicity.

【0028】横型の並流湿式除外器1で処理後の無害排
気は,排気ダクト2を集約することでコンパクトに排出
できる。また,ミストを除去する場合は,通過風速を
0.2m/秒以下に落して,方向を変更すると効果があ
る。しかし,ダクトの途中に設けることは,設置スペー
スの確保が困難である。
The harmless exhaust gas that has been treated by the horizontal parallel flow wet type excluding device 1 can be exhausted compactly by consolidating the exhaust ducts 2. Further, when removing mist, it is effective to reduce the passing wind speed to 0.2 m / sec or less and change the direction. However, if it is installed in the middle of the duct, it is difficult to secure the installation space.

【0029】そこで,半導体工場では,図1(b)に示
すように,一般的な地下ピットを利用して,チャンバ兼
用槽8を設けて, ミストの除去と排気ダクト2の集約を
一度に行うこと, 及び, 回収ミストをそのままポンプ13
を用いて循環液として使用できるメリットを提供でき
る。
Therefore, in a semiconductor factory, as shown in FIG. 1 (b), a common underground pit is used to provide a chamber / tank 8 for removing mist and consolidating exhaust ducts 2 at once. Pump the collected mist as it is 13
It is possible to provide the advantage that it can be used as a circulating fluid.

【0030】また, 処理済排気と高濃度循環液を接触さ
せると, 蒸気圧のバランスで再蒸発する恐れがあるが,
この場合は, 図3(g)に示すように,多孔板のシーブ
トレイ11を用いて, 処理済排気と高濃度循環液を仕切
り,補給液を補給液注入管16からシーブトレイ11上に供
給することで改善した。
Further, if the treated exhaust and the high-concentration circulating liquid are brought into contact with each other, there is a risk of re-evaporation due to the balance of vapor pressure,
In this case, as shown in FIG. 3 (g), the treated exhaust gas and the high-concentration circulating liquid are separated using the sieve tray 11 of a perforated plate, and the replenishing liquid is supplied from the replenishing liquid injection pipe 16 onto the sieve tray 11. Improved.

【0031】この方式では,その上,チャンバ兼用液槽
8が低濃度廃液受槽とも兼用可能となるので,工場全体
のシステムをコンパクト化することができる。更に,処
理済排気を補給液で二次処理すると, 更に除去効率を向
上できる。その場合は, 液体/気体の比率が小さい多孔
板洗浄方式が適当である。
In addition to this, in this system, the chamber-use liquid tank 8 can also be used as a low-concentration waste liquid receiving tank, so that the system of the entire factory can be made compact. Furthermore, if the treated exhaust gas is secondarily treated with a replenisher, the removal efficiency can be further improved. In that case, a perforated plate cleaning method with a small liquid / gas ratio is appropriate.

【0032】そこで,図3(h)に示すように,多孔板
のシーブトレイ11と液槽部10の液面の間に,横型の並流
湿式除害器1で処理後の排気出口を接続して,二次処理
を行うとミスト除去が可能となる。ミスト除去の方法と
しては, 衝突式ミスト除去部,及びサイクロンを加える
と,更に除去効果が上がる。
Therefore, as shown in FIG. 3 (h), an exhaust outlet after the treatment is connected between the sieve tray 11 made of a perforated plate and the liquid surface of the liquid tank section 10 by the horizontal co-current wet abatement device 1. Then, the mist can be removed by performing the secondary treatment. As a method for removing mist, a collision type mist removing section and a cyclone are added to further improve the removing effect.

【0033】[0033]

【発明の効果】以上説明したように,本発明によれば,
横型のコンパクトな並流湿式除害器を, 排気ダクトの途
中にに取り付けることで,高さをコンパクト化でき,並
流湿式除害器を,静止型混合器,或いは,複数孔ベンチ
ュリスクラバで構成することにより,排気が並流する洗
浄液によって常に洗浄され,目詰まりが生じなくなる。
As described above, according to the present invention,
By installing a horizontal compact co-current wet abatement device in the middle of the exhaust duct, the height can be made compact, and the co-current wet abatement device is composed of a static mixer or a multi-hole venturi scrubber. By doing so, the exhaust gas is always washed by the washing liquid flowing in parallel, and clogging does not occur.

【0034】これにより,本発明は排気除害システムの
コンパクト化,並びに高効率化に寄与するところが大き
い。
As a result, the present invention greatly contributes to the compactness and high efficiency of the exhaust gas abatement system.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の排気除害システムの構成図(その
1)
FIG. 1 is a configuration diagram of an exhaust gas abatement system of the present invention (No. 1)

【図2】 本発明の排気除害システムの構成図(その
2)
FIG. 2 is a configuration diagram of an exhaust gas abatement system of the present invention (part 2)

【図3】 本発明の排気除害システムの構成図(その
3)
FIG. 3 is a configuration diagram of an exhaust gas abatement system of the present invention (part 3)

【図4】 従来例の説明図FIG. 4 is an explanatory diagram of a conventional example.

【符号の説明】[Explanation of symbols]

1は並流湿式除害器 2は排気ダクト 3は静止型混合器 4は多孔板 5は並流シャワー 6は複数孔ベンチュリスクラバ 7は出口配管 8はチャンバ兼用液槽 9はチャンバ部 10は液槽部 11はシーブトレイ 12は排気ファン 13はポンプ 14は右捻りエレメント 15は左捻りエレメント 16は補給液注入管 1 is a co-current wet detoxifier 2 is an exhaust duct 3 is a static mixer 4 is a perforated plate 5 is a co-current shower 6 is a multi-hole venturi scrubber 7 is an outlet pipe 8 is a chamber / liquid tank 9 is a chamber 10 Tank part 11 is sieve tray 12 is exhaust fan 13 is pump 14 is right twist element 15 is left twist element 16 is replenisher injection pipe

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 排気に含まれる有害成分を除去する排気
除害システム(10)であって, 排気ダクト(2) の断面積の
2倍以下の断面積を有し,且つ, 排気速度を2m/秒以
上で処理でき,排気に含まれる有害成分を洗浄水が並流
して除害するため圧損効率が良く,小型化に適した横型
の並流湿式除害器(1) を, 該排気ダクト(2) の途中に有
することを特徴とする排気除害システム。
1. An exhaust gas abatement system (10) for removing harmful components contained in exhaust gas, which has a cross-sectional area less than twice the cross-sectional area of an exhaust duct (2) and an exhaust speed of 2 m. The horizontal co-current wet detoxifier (1) is suitable for downsizing because it can be processed at a speed of at least 1 second / sec. An exhaust gas abatement system characterized by being provided in the middle of (2).
【請求項2】 前記並流・湿式除害器(1) は,静止型混
合器(3), 或いは多孔板(4) と, その上流に並流シャワ
ー(5) とを有する複数孔ベンチュリスクラバ(6) にて構
成されてなることを特徴とする請求項1記載の排気除害
システム。
2. A multi-hole venturi scrubber comprising a static mixer (3) or a perforated plate (4) and a co-current shower (5) upstream thereof. The exhaust gas abatement system according to claim 1, wherein the exhaust gas abatement system is composed of (6).
【請求項3】 前記排気ダクト(2) を少なくとも2か所
以上に並列に分割し,前記並流湿式除害器(1) をそれぞ
れの前記排気ダクト(2) に有し,且つ,前記並流湿式除
害器(1) の軸が一直線上に並ぶように配置されてなるこ
とを特徴とする請求項1〜2記載の排気除害システム。
3. The exhaust duct (2) is divided into at least two or more locations in parallel, and the co-current wet abatement device (1) is provided in each of the exhaust ducts (2), and The exhaust gas abatement system according to claim 1 or 2, wherein the flow-wet abatement device (1) is arranged such that the axes thereof are aligned.
【請求項4】 前記並流湿式除害器(1) の出口配管(7)
を通過風速0.2m/秒以下に減速するチャンバ兼用液
槽(8) に接続してなることを特徴とする請求項1〜3記
載の排気除害システム。
4. The outlet pipe (7) of the co-current wet type abatement device (1).
4. The exhaust gas abatement system according to claim 1, wherein the exhaust gas abatement system is connected to a chamber / liquid tank (8) that reduces the passing air velocity to 0.2 m / sec or less.
【請求項5】 前記チャンバ兼用液槽(8) のチャンバ部
(9) と液槽部(10)との間に, シーブトレイ(11)を有する
ことを特徴とする請求項1〜4記載の排気除害システ
ム。
5. The chamber section of the chamber-use liquid tank (8)
The exhaust gas abatement system according to any one of claims 1 to 4, further comprising a sieve tray (11) between the liquid tank portion (10) and the liquid tank portion (10).
JP23751692A 1992-09-07 1992-09-07 System for making waste gas harmless Pending JPH0679121A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23751692A JPH0679121A (en) 1992-09-07 1992-09-07 System for making waste gas harmless

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23751692A JPH0679121A (en) 1992-09-07 1992-09-07 System for making waste gas harmless

Publications (1)

Publication Number Publication Date
JPH0679121A true JPH0679121A (en) 1994-03-22

Family

ID=17016486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23751692A Pending JPH0679121A (en) 1992-09-07 1992-09-07 System for making waste gas harmless

Country Status (1)

Country Link
JP (1) JPH0679121A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100412579B1 (en) * 2001-10-11 2003-12-31 한국 파이오닉스 주식회사 Gas Scrubber Apparatus
KR20180132021A (en) * 2015-11-02 2018-12-11 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100412579B1 (en) * 2001-10-11 2003-12-31 한국 파이오닉스 주식회사 Gas Scrubber Apparatus
KR20180132021A (en) * 2015-11-02 2018-12-11 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus

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