JPH0677662A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPH0677662A JPH0677662A JP22428492A JP22428492A JPH0677662A JP H0677662 A JPH0677662 A JP H0677662A JP 22428492 A JP22428492 A JP 22428492A JP 22428492 A JP22428492 A JP 22428492A JP H0677662 A JPH0677662 A JP H0677662A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- hole
- printed circuit
- blind hole
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】印刷回路板の構造に係り、特に、
外層となる導体層と内部の導体層とを電気的に接続する
ための行き止り穴を有する多層の印刷回路板に関する。[Industrial application] The structure of printed circuit boards, especially
The present invention relates to a multilayer printed circuit board having blind holes for electrically connecting an outer conductor layer and an inner conductor layer.
【0002】[0002]
【従来の技術】一般に、多層の印刷回路板は、その各層
の導体間を接続するために、貫通スルーホール、インタ
ーステシャルバイアホールと呼ばれるスルーホール等を
使用して構成されている。また、最近では、ブラインド
バイアホールと呼ばれる行き止り穴構造を持つものを採
用して構成される印刷回路板が使用されている。2. Description of the Related Art In general, a multilayer printed circuit board is constructed by using through-holes, through-holes called interstitial via holes, etc. for connecting conductors of the respective layers. Further, recently, a printed circuit board configured by adopting a blind via hole having a blind hole structure has been used.
【0003】図3は従来技術による印刷回路板の構造を
示す平面図、図4は従来技術による印刷回路板の断面図
である。図3、図4において、1は印刷回路板、2はラ
ンド、3は行き止り穴、4はライン、5は内層回路パタ
ーン、6は銅箔、7は銅めっき層である。FIG. 3 is a plan view showing the structure of a conventional printed circuit board, and FIG. 4 is a sectional view of the conventional printed circuit board. 3 and 4, 1 is a printed circuit board, 2 is a land, 3 is a blind hole, 4 is a line, 5 is an inner layer circuit pattern, 6 is a copper foil, and 7 is a copper plating layer.
【0004】通常、印刷回路板1は、貫通スルーホール
を用いて層間の接続を行うように構成されるが、図3、
図4に示す従来技術は、ブライドビアホールと呼ばれる
行き止り穴3を使用して構成されている。そして、この
印刷回路板1は、行き止り穴3により、印刷回路板1の
外層の回路パターンと、内層回路パターン5との接続を
行うために、外層の銅箔6の上に銅めっき層7を付与す
る共に、行き止り穴3の内面にもめっきを行い、その
後、印刷技術を応用した焼付エッチ技術等により、ラン
ド2、ライン4等の外層の回路パターンが形成されて構
成されている。行き止り穴3は、通常、ドリル等を使用
して形成されるため、図3に示すように、その断面形状
が円形とされている。Normally, the printed circuit board 1 is constructed so as to connect the layers by using through-holes.
The prior art shown in FIG. 4 is configured by using a dead end hole 3 called a bride via hole. The printed circuit board 1 has a blind hole 3 to connect the outer layer circuit pattern of the printed circuit board 1 and the inner layer circuit pattern 5 to each other. And the inner surface of the dead-end hole 3 is plated, and thereafter, the circuit pattern of the outer layer such as the land 2 and the line 4 is formed by the baking and etching technique to which the printing technique is applied. Since the dead-end hole 3 is usually formed by using a drill or the like, its cross-sectional shape is circular as shown in FIG.
【0005】このブライドビアホールと呼ばれる行き止
り穴3は、高密度印刷回路板を実現するために採用され
ることが多く、このため、行き止り穴3の形状は、でき
るだけその径が小さいことが必要である。しかし、ホー
ルの小径化に伴って穴明技術、ホール内へのめっき技術
が困難なものとなっている。The blind hole 3 called a bridging via hole is often adopted to realize a high-density printed circuit board. Therefore, the shape of the blind hole 3 is required to be as small as possible. Is. However, as the diameter of the holes becomes smaller, the drilling technology and the plating technology inside the holes become difficult.
【0006】そして、小径の穴明は、近年、レーザー穴
明けの技術が開発されており、これにより、小径の行き
止りの穴をあけることが可能になっている。For the small-diameter hole drilling, a laser drilling technique has been developed in recent years, which makes it possible to make a small-diameter blind hole.
【0007】また、このようにして穴あけされたブライ
ドビアホールの内面には、配線層間を電気的に接続する
ためにめっきを施すことが必要である。Further, it is necessary to apply plating to the inner surface of the bridging via hole thus drilled in order to electrically connect the wiring layers.
【0008】一般に、印刷回路板のめっき処理は、湿式
(液体)で行われるため、小径化した行き止り穴の内面
にめっきを付与する場合に、穴内に残留した気泡を除去
する必要があり、この気泡の除去が不充分であると、穴
内にめっき前処理液、めっき液が侵入することができ
ず、めっきボイドを生じ完全なめっきを行うことができ
ないことになる。Generally, the plating process of the printed circuit board is performed by a wet method (liquid), and therefore, when the plating is applied to the inner surface of the dead end hole having a reduced diameter, it is necessary to remove the air bubbles remaining in the hole. If the removal of the air bubbles is insufficient, the plating pretreatment liquid and the plating liquid cannot penetrate into the holes, resulting in plating voids and incomplete plating.
【0009】このため、通常は、めっき前処理中、めっ
き処理中等に、加工する印刷回路板に振動、衝撃等を与
えて、ホール内の気泡を排出させるようにしている。For this reason, normally, during the plating pretreatment, the plating treatment, or the like, the printed circuit board to be processed is subjected to vibration, impact, or the like to expel air bubbles in the holes.
【0010】なお、この種の印刷回路板に関する従来技
術として、例えば、特公平4−3676号等に記載され
た技術が知られている。As a conventional technique relating to this type of printed circuit board, for example, the technique described in Japanese Patent Publication No. 4-3676 is known.
【0011】[0011]
【発明が解決しようとする課題】前述した従来技術によ
る印刷回路板は、小径化した断面が円形の行き止り穴を
持つため、めっき前処理中、めっき処理中等に印刷回路
板に振動、衝撃を与えも内部の気泡を脱泡させることが
困難であるという問題点を有し、このため、行き止り穴
の内壁に完全なめっきを施すことが困難であるという問
題点を有している。Since the printed circuit board according to the prior art described above has a blind hole having a circular cross section with a reduced diameter, vibration and impact are applied to the printed circuit board during pre-plating treatment and during plating treatment. There is also a problem that it is difficult to remove air bubbles inside, and thus it is difficult to completely plate the inner wall of the dead end hole.
【0012】本発明の目的は、前記従来技術の問題点を
解決し、小径化した行き止り穴を持ち、かつ、この小径
の穴内に、めっき前処理液、めっき液が侵入しやすく、
めっきボイドのない完全なめっきを施すことが可能な印
刷回路板を提供することにある。The object of the present invention is to solve the above-mentioned problems of the prior art, to have a blind hole having a reduced diameter, and to allow the pretreatment liquid for plating and the plating liquid to easily enter into the hole having the reduced diameter.
It is an object of the present invention to provide a printed circuit board that can be completely plated without plating voids.
【0013】[0013]
【課題を解決するための手段】本発明によれば前記目的
は、行き止り穴構造を有するブライドビアホールの断面
形状を長円形とすることにより達成される。According to the present invention, the above object is achieved by making a cross-sectional shape of a blind via hole having a blind hole structure an elliptical shape.
【0014】[0014]
【作用】一般に、行き止り穴構造のホールの内面にめっ
き処理を行う場合、内部に存在する気泡を容易に除去す
ることができるか否かは、行き止り穴の形状、すなわ
ち、その深さと穴径とに関係している。気泡の除去は、
行き止り穴の深さが小さく、また、穴径が大きいほど容
易である。In general, when the inner surface of a hole having a dead-end hole structure is plated, whether or not bubbles existing inside can be easily removed depends on the shape of the dead-end hole, that is, the depth and the hole. It is related to the diameter. The removal of bubbles
It is easier as the depth of the blind hole is smaller and the hole diameter is larger.
【0015】これは、気泡の大きさ、加工する印刷回路
板の穴内の表面と気泡とのつき易さ、回路板表面の液の
動き等に影響されるためと考えられる。また、気泡は、
液中で表面張力のバランスにより、球形の形状で安定し
ている。そして、球形の気泡は、さまざまの寸法で分布
するので、穴形状にあった気泡形状も生じることにな
り、円形の行き止りの穴内に気泡の大部分が納まる場合
が生じ、この場合、気泡の除去が困難になることが推定
できる。特に、気泡が穴の内壁の円周と、行き止り穴の
底部に接触すると気泡が穴内に半固定され除去しにくく
なる。It is considered that this is influenced by the size of the bubbles, the easiness of the bubbles to come into contact with the surface inside the hole of the printed circuit board to be processed, the movement of the liquid on the surface of the circuit board, and the like. Also, the bubbles are
It is stable in a spherical shape due to the balance of surface tension in the liquid. And since spherical bubbles are distributed in various sizes, bubble shapes that match the hole shape will also occur, and in some cases most of the bubbles will fit inside the circular dead-end holes. It can be estimated that removal will be difficult. In particular, when the bubbles contact the circumference of the inner wall of the hole and the bottom of the dead-end hole, the bubbles are semi-fixed in the hole and are difficult to remove.
【0016】本発明は、行き止り穴の断面形状を長円形
としているので、気泡と穴内面との接触箇所を少なく
し、接触面積を低減することができ、このため、穴内に
球形の気泡が残留しても、気泡と穴の壁面との間に隙間
ができ、そこにめっき処理液が侵入することができるの
で、めっき処理時に行う印刷回路板に対する振動、衝
撃、揺動によって、気泡を容易に除去することができ
る。According to the present invention, since the cross-sectional shape of the dead end hole is oval, it is possible to reduce the contact area between the air bubble and the inner surface of the hole and reduce the contact area. Therefore, the spherical air bubble is formed in the hole. Even if it remains, a gap is created between the bubble and the wall surface of the hole, and the plating solution can enter there, so the bubble can be easily generated by the vibration, shock, and rocking of the printed circuit board during the plating process. Can be removed.
【0017】[0017]
【実施例】以下、本発明による印刷回路板の一実施例を
図面により詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a printed circuit board according to the present invention will be described in detail below with reference to the drawings.
【0018】図1は本発明の一実施例による印刷回路板
構成を示す平面図、図2は本発明の一実施例による印刷
回路板構成を示す断面図であり、図の符号は図3、図4
の場合と同一である。FIG. 1 is a plan view showing the structure of a printed circuit board according to an embodiment of the present invention, FIG. 2 is a sectional view showing the structure of a printed circuit board according to the embodiment of the present invention, and the reference numerals in FIG. Figure 4
Is the same as
【0019】本発明の一実施例は、図1に示すように、
行き止り穴3の形状を、その断面形状が長円形となるよ
うにした点で、図3、図4により説明した従来技術と相
違する。One embodiment of the present invention, as shown in FIG.
The blind hole 3 is different from the prior art described with reference to FIGS. 3 and 4 in that the cross-sectional shape of the blind hole 3 is an ellipse.
【0020】そして、本発明の一実施例における長円形
の行き止り穴3は、レーザー穴あけ法により形成するこ
とができるので、短手と長手との寸法を、印刷回路板1
のパターン寸法、穴径等を考慮し、また、製造時の行き
止り穴3内の気泡の除去程度等を考慮して、最適な値に
決めるようにすればよい。Since the oblong blind hole 3 according to the embodiment of the present invention can be formed by the laser drilling method, the short side and the long side have the same dimensions.
The optimum value may be determined in consideration of the pattern size, the hole diameter, etc., and the removal degree of bubbles in the dead-end hole 3 at the time of manufacturing.
【0021】また、通常、行き止り穴は、ランド2の位
置に設けるが、図1に示すように、ライン4上に設ける
ようにすることもできる。Further, the dead end hole is usually provided at the position of the land 2, but it may be provided on the line 4 as shown in FIG.
【0022】前述した本発明の一実施例によれば、印刷
回路板1の行き止り穴3の形状を、その断面形状が長円
形としているので、めっき処理時に、穴内に残留した気
泡が穴の内面に接触する面積を小さくすることができ、
気泡をを容易に除去することができる。このため、行き
止り穴の内面に対するめっきを、めっきボイドをなくし
て完全に行うことができ、製造時の歩留まりの向上を図
ることができる。According to the above-described embodiment of the present invention, since the dead-end hole 3 of the printed circuit board 1 has an oval cross-section, bubbles remaining in the hole during the plating process become holes. The area in contact with the inner surface can be reduced,
Bubbles can be easily removed. Therefore, it is possible to completely perform plating on the inner surface of the blind hole without the plating void, and it is possible to improve the yield at the time of manufacturing.
【0023】また、本発明の一実施例によれば、従来の
円形断面の行き止り穴に比較して、深さが大きく、径が
小さいものまで、確実に気泡の除去を行うことができ
る。Further, according to one embodiment of the present invention, it is possible to surely remove bubbles even if the depth is large and the diameter is small as compared with a conventional blind hole having a circular cross section.
【0024】[0024]
【発明の効果】以上説明したように本発明によれば、行
き止り穴内に残留した気泡を容易に除去し、小径化した
行き止り穴内に、めっき前処理液、めっき液を侵入しや
すくすることができ、これにより、行き止り穴の内面に
完全なめっきを施すことをができる。As described above, according to the present invention, it is possible to easily remove the air bubbles remaining in the dead-end holes and make it easier for the pretreatment liquid for plating and the plating liquid to enter the dead-end holes with a reduced diameter. This allows for complete plating of the inner surface of the dead end hole.
【図1】本発明の一実施例による印刷回路板構成を示す
平面図である。FIG. 1 is a plan view showing a printed circuit board structure according to an embodiment of the present invention.
【図2】本発明の一実施例による印刷回路板構成を示す
断面図である。FIG. 2 is a cross-sectional view showing a printed circuit board structure according to an embodiment of the present invention.
【図3】従来技術による印刷回路板の構造を示す平面図
である。FIG. 3 is a plan view showing a structure of a printed circuit board according to the related art.
【図4】従来技術による印刷回路板の断面図である。FIG. 4 is a cross-sectional view of a printed circuit board according to the related art.
1 印刷回路板 2 ランド 3 行き止り穴 4 ライン 5 内層回路パターン 6 銅箔 7 銅めっき層 1 Printed circuit board 2 Land 3 Dead end hole 4 Line 5 Inner layer circuit pattern 6 Copper foil 7 Copper plating layer
Claims (1)
電気的に接続するために設けられる行き止り穴を有する
印刷回路板において、前記行き止り穴の断面形状を長円
形としたことを特徴とする印刷回路板。1. A printed circuit board having a blind hole provided for electrically connecting an outermost conductor layer and an inner conductor layer, wherein the blind hole has an oval cross section. Printed circuit board characterized by.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22428492A JPH0677662A (en) | 1992-08-24 | 1992-08-24 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22428492A JPH0677662A (en) | 1992-08-24 | 1992-08-24 | Printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0677662A true JPH0677662A (en) | 1994-03-18 |
Family
ID=16811364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22428492A Pending JPH0677662A (en) | 1992-08-24 | 1992-08-24 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0677662A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000004753A3 (en) * | 1998-07-20 | 2002-09-19 | Intel Corp | Alignment of vias in circuit boards or similar structures |
EP1259102A1 (en) * | 2001-05-14 | 2002-11-20 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
US6492007B1 (en) | 2000-03-14 | 2002-12-10 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
-
1992
- 1992-08-24 JP JP22428492A patent/JPH0677662A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000004753A3 (en) * | 1998-07-20 | 2002-09-19 | Intel Corp | Alignment of vias in circuit boards or similar structures |
CN100384306C (en) * | 1998-07-20 | 2008-04-23 | 英特尔公司 | Alignment of vias in circuit boards or similar structures |
US6492007B1 (en) | 2000-03-14 | 2002-12-10 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
EP1259102A1 (en) * | 2001-05-14 | 2002-11-20 | Oki Printed Circuits Co., Ltd. | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
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