JPH0674973B2 - Shape measuring device - Google Patents
Shape measuring deviceInfo
- Publication number
- JPH0674973B2 JPH0674973B2 JP2100969A JP10096990A JPH0674973B2 JP H0674973 B2 JPH0674973 B2 JP H0674973B2 JP 2100969 A JP2100969 A JP 2100969A JP 10096990 A JP10096990 A JP 10096990A JP H0674973 B2 JPH0674973 B2 JP H0674973B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- plate
- inspected
- light receiving
- shape measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Control Of Metal Rolling (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、圧延鋼板等のシート板の凹凸形状を測定す
る形状測定装置に関するものである。TECHNICAL FIELD The present invention relates to a shape measuring device for measuring the uneven shape of a sheet plate such as a rolled steel plate.
第５図は、例えば三菱電機技法Vol.60,No.5P.48〜52に
示された従来の形状測定装置を示し、図において、１は
被検査板、２は被検査板１に対向した複数の検出ヘッ
ド、３は処理装置である。また、検出ヘッド２は第６図
に示すように構成されており、４は光源、５は投光レン
ズ、６は受光レンズ、７は光電変換素子群からなる検出
デバイス、８は被検査板１の走行に応じたパルス列を発
生するパルス発生器である。FIG. 5 shows a conventional shape measuring device shown in, for example, Mitsubishi Electric Engineering Vol.60, No.5P.48 to 52, in which 1 is a plate to be inspected and 2 is a plate 1 to be inspected. The plurality of detection heads 3 are processing devices. Further, the detection head 2 is configured as shown in FIG. 6, 4 is a light source, 5 is a light projecting lens, 6 is a light receiving lens, 7 is a detection device composed of a photoelectric conversion element group, and 8 is the plate 1 to be inspected. Is a pulse generator that generates a pulse train according to the traveling of the vehicle.
次に動作について説明する。第５図に示すように、被検
査板１は矢印Ｖの方向に走行するが、この上方に設置さ
れた複数チャンネルCH1〜CHn分の角検出ヘッド２によ
り、各々距離を計測し、この計測結果に基づいて、処理
装置３が被検査板１の凹凸形状を演算し、その結果を出
力する。一方、検出ヘッド２では、光源４から放射され
た光束を投光レンズ５により集束し、光スポットとして
被検査板１に照射する。そして、この被検査板１で反射
された光スポットを、別の位置に設けた受光レンズ６に
より撮像し、検出デバイス７上に結像する。従って、被
検査板１の変位ｌに対応して、光スポットの検出デバイ
ス７上における結像位置が変化する。検出デバイス７は
光スポットの結像位置に比例した電気的出力を発生する
ので、これにより被検査板１の位置が測定できる。同様
の動作により、各チャンネルCH1〜CHnごとの検出ヘッド
２により被検査板１の各点の位置が計測でき、この結果
から被検査板１の幅方向の凹凸形状が判明する。また、
被検査板１が走行する毎にパルスを発生するパルス発生
器８の出力パルスと同期をとりながら、上記動作を繰り
返すことにより、２次元的な凹凸形状が測定できる。Next, the operation will be described. As shown in FIG. 5, the plate 1 to be inspected runs in the direction of arrow V, but the distance is measured by the angle detection heads 2 for the plurality of channels CH1 to CHn installed above this, and the measurement results are obtained. Based on the above, the processing device 3 calculates the uneven shape of the plate 1 to be inspected, and outputs the result. On the other hand, in the detection head 2, the light flux emitted from the light source 4 is focused by the light projecting lens 5 and is irradiated onto the inspection plate 1 as a light spot. Then, the light spot reflected by the plate 1 to be inspected is imaged by the light receiving lens 6 provided at another position, and imaged on the detection device 7. Therefore, the imaging position of the light spot on the detection device 7 changes corresponding to the displacement 1 of the inspection plate 1. Since the detection device 7 generates an electric output proportional to the image forming position of the light spot, the position of the inspection plate 1 can be measured by this. By the same operation, the position of each point on the plate 1 to be inspected can be measured by the detection head 2 for each channel CH1 to CHn, and from this result, the uneven shape in the width direction of the plate to be inspected 1 can be found. Also,
By synchronizing the output pulse of the pulse generator 8 that generates a pulse each time the plate 1 to be inspected travels, the two-dimensional uneven shape can be measured by repeating the above operation.
従来の形状測定装置は以上のように構成されているの
で、被検査板１の凹凸形状を細かく測定する場合には、
検出ヘッド２の数が増加して、装置が大形化するほか、
コストが高くなるなどの課題があった。Since the conventional shape measuring apparatus is configured as described above, when finely measuring the uneven shape of the plate 1 to be inspected,
The number of detection heads 2 increases and the device becomes larger,
There was a problem such as high cost.
この発明は上記のような課題を解消するためになされた
もので、検出ヘッドの個数を減らすことができ、これに
よって装置の小形化並びにローコスト化を図ることがで
きる形状測定装置を得ることを目的とする。The present invention has been made to solve the above problems, and an object of the present invention is to obtain a shape measuring apparatus capable of reducing the number of detection heads, thereby achieving downsizing and cost reduction of the apparatus. And
この発明に係る形状測定装置は、投光手段から被検査板
に投光した光束を、第１の半透明鏡により２分割し、上
記被検査板にて反射させた２つの光束を、第２の半透明
鏡を通して受光手段により受光し、この受光手段からの
出力に基づき、処理装置が被検査板の形状を演算するよ
にしたものである。In the shape measuring apparatus according to the present invention, the light beam projected from the light projecting unit onto the plate to be inspected is divided into two by the first semitransparent mirror, and the two light beams reflected by the plate to be inspected are divided into the second beam. The light receiving means receives the light through the semi-transparent mirror, and the processing device calculates the shape of the plate to be inspected based on the output from the light receiving means.
この発明における形状測定装置は、光源からの投光ビー
ムを第１の半透明鏡により２分割して被検査板の２箇所
に照射し、受光光路にも第２の半透明鏡を挿入すること
により、２箇所からの光スポットを１個の検出デバイス
で受光できるようにし、さらに被検査板上の測定点数Ｎ
を（Ｎ＋１）/2組の検出ヘッド数で測定できるようにす
る。In the shape measuring apparatus according to the present invention, a projection beam from a light source is divided into two by a first semi-transparent mirror and is applied to two positions of a plate to be inspected, and a second semi-transparent mirror is also inserted in a light receiving optical path. By this, the light spots from two locations can be received by one detection device, and the number of measurement points N
Can be measured with (N + 1) / 2 sets of detection heads.
以下、この発明の一実施例を図について説明する。第１
図において101〜10mはそれぞれ第２図に示すような光源
４と投光レンズ５からなる投光手段、111〜11mは同様に
受光レンズ６と検出デバイス７からなる受光手段、121
〜12nは透過率と反射率が1:1の比率を有する半透明鏡
で、投光側のものを第１の半透明鏡とし、受光側のもの
を第２の半透明鏡とする。An embodiment of the present invention will be described below with reference to the drawings. First
In the figure, 10 1 to 10 m are light projecting means each comprising a light source 4 and a light projecting lens 5 as shown in FIG. 2, 11 1 to 11 m are light receiving means similarly comprising a light receiving lens 6 and a detection device 7, 12 1
Denoted at 12n are semitransparent mirrors having a transmissivity and a reflectivity of 1: 1. The light projecting side is the first semitransparent mirror and the light receiving side is the second semitransparent mirror.
次に動作について説明する。この発明は従来と同様に、
光源４から発せられた光束を投光レンズ５により集束し
て、光スポットを被検査板１へ投光するが、特に、投光
路中に第１の半透明鏡121,123,…12nを設置して投光ビ
ームを２分割し、被検査板１上の２つずつの測定点M0,M
1、M2,M3、…Mn-1,Mnに投光する。これにより投光手段1
01〜10nは必要測定数の半数に低減できる。同様に、受
光レンズ６と検出デバイス７から構成される受光手段11
においても、受光光路中にそれぞれ第２の半透明鏡122,
124,…12n+1を設置し、被検査板１上の２箇所で反射さ
れた投光スポットを受光する。この構成によって、受光
手段111〜11nの個数も必要測定数の半数に低減できる。
全体としては、必要測定数をＮとすると、投・受光手段
の数ｍは、 ｍ＝（Ｎ＋１）/2 となる。Next, the operation will be described. This invention, like the conventional one,
The light beam emitted from the light source 4 is focused by the light projecting lens 5 to project the light spot onto the plate 1 to be inspected. In particular, the first semi-transparent mirror 12 1 , 12 3 , ... Is installed to divide the projected beam into two, and two measurement points M 0 , M on the plate 1 to be inspected
The light is projected onto 1 , M 2 , M 3 , ... Mn -1 , Mn. With this, the light projecting means 1
0 1 to 10 n can be reduced to half of the required number of measurements. Similarly, the light receiving means 11 including the light receiving lens 6 and the detection device 7
Also in the light receiving optical path, the second semi-transparent mirror 12 2 ,
12 4 , ... 12n +1 are installed to receive the light projection spots reflected at two locations on the plate 1 to be inspected. This configuration can reduce the light receiving means 11 1 ~11n number necessary measurement number half.
As a whole, assuming that the required number of measurements is N, the number m of light emitting / receiving means is m = (N + 1) / 2.
このような構成においての測定動作を第２図により説明
する。第２図は２箇所の測定を行う受光手段11を中心に
示してある。まず、被検査板１が位置1aの場合には、２
箇所の測定点M1A,M2Aの位置に投光された光スポット
は、受光レンズ６により検出デバイス７のＰで示す位置
に結像される。また、被検査板１が位置1bに変位した場
合には、光スポット位置Q,Rの２点に結像される。ここ
で、投光手段10は時間的に交互に切替えられ投光光束を
発生するので、従来装置の場合と同様の原理により、各
測定点M1A,M2A,M1B,M2Bまでの距離が測定できる。そし
て、処理装置３により全ての測定点までの距離から被検
査板１の形状を算出することができる。The measurement operation in such a configuration will be described with reference to FIG. FIG. 2 mainly shows the light receiving means 11 for measuring at two points. First, when the plate 1 to be inspected is at the position 1a, 2
The light spots projected at the positions of the measurement points M 1A and M 2A at the points are imaged by the light receiving lens 6 at the position indicated by P of the detection device 7. When the plate 1 to be inspected is displaced to the position 1b, the light spots Q and R are imaged at two points. Here, since the light projecting means 10 is alternately switched in time to generate a light projecting light beam, the distance to each measurement point M 1A , M 2A , M 1B , M 2B is determined by the same principle as in the conventional device. Can be measured. Then, the processing device 3 can calculate the shape of the inspection plate 1 from the distances to all the measurement points.
なお、上記実施例では２つの投光手段10を時間的に交互
に切替えて、２箇所の測定点を別々に計測できるものを
示したが、第３図に示すように、光源４の発光波長をλ
1,λ２と変え、受光手段11にて波長選別フィルタ13と、
第1,第２の検出デバイス7a,7bを用い、光源４からの光
束を選択受光するようにしてもよい。In the above embodiment, the two light projecting means 10 are alternately switched over time to measure two measurement points separately. However, as shown in FIG. Λ
1 and λ 2 are changed, and a wavelength selection filter 13 is provided by the light receiving means 11,
The light flux from the light source 4 may be selectively received by using the first and second detection devices 7a and 7b.
また、第４図に示すように、投光手段10を平面的に配置
せず、進行方向にｘだけ少しずらし、これに対応するよ
うに第1,第２の検出デバイス7a,7bを置くようにしても
よい。Further, as shown in FIG. 4, the light projecting means 10 is not arranged in a plane, but is slightly shifted in the traveling direction by x, and the first and second detection devices 7a and 7b are placed correspondingly. You may
さらに、上記実施例では被検査板１を走行するものとし
て説明したが、逆に被検査板１を固定し、投光手段10,
受光手段11を移動させてもよく、上記実施例と同様の効
果を奏する。Further, in the above-described embodiment, the plate 1 to be inspected is described as traveling, but conversely, the plate 1 to be inspected is fixed and the light projecting means 10,
The light receiving means 11 may be moved, and the same effect as that of the above embodiment can be obtained.
以上のように、この発明によれば、投光手段から被検査
板に投光した光束を、第１の半透明鏡により２分割し、
上記被検査板にて反射させた２つの光束を、第２の半透
明鏡12を通して受光手段により受光し、この受光手段か
らの出力に基づき処理装置が被検査板の形状を演算する
ように構成したので、所定の測定精度を得るために使用
する検出ヘッドの数を、これまでの半分にすることがで
きるので、装置全体の小形化とローコスト化を共に図れ
るものが得られる効果がある。As described above, according to the present invention, the light flux projected from the light projecting unit onto the inspection plate is divided into two by the first semitransparent mirror,
The two light fluxes reflected by the plate to be inspected are received by the light receiving means through the second semitransparent mirror 12, and the processing device calculates the shape of the plate to be inspected based on the output from the light receiving means. As a result, the number of detection heads used to obtain a predetermined measurement accuracy can be halved to the half, which is advantageous in that the size of the entire apparatus and the cost can be reduced.
第１図はこの発明の一実施例による形状測定装置を示す
概念図、第２図は第１図の詳細を示す構成図、第３図お
よび第４図はこの発明の他の実施例による形状測定装置
を示す構成図、第５図は従来の形状測定装置を示す斜視
図、第６図は第５図の一部の詳細を示す構成図である。 １は被検査板、３は処理装置、10は投光手段、11は受光
手段、121,123,…12nは第１の半透明鏡、122,124,…12n
+1は第２の半透明鏡。 なお、図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a conceptual diagram showing a shape measuring apparatus according to an embodiment of the present invention, FIG. 2 is a configuration diagram showing details of FIG. 1, and FIGS. 3 and 4 are shapes according to other embodiments of the present invention. FIG. 5 is a configuration diagram showing a measuring device, FIG. 5 is a perspective view showing a conventional shape measuring device, and FIG. 6 is a configuration diagram showing details of a part of FIG. 1 inspected plate, 3 processor, the light emitting means 10, 11 receiving unit, 12 1, 12 3, ... 12n are first semitransparent mirror, 12 2, 12 4, ... 12n
+1 is the second semi-transparent mirror. In the drawings, the same reference numerals indicate the same or corresponding parts.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 植木 勝也 兵庫県神戸市兵庫区和田崎町１丁目１番２ 号 三菱電機株式会社制御製作所内 (72)発明者 ▲高▼嶋 和夫 兵庫県尼崎市塚口本町８丁目１番１号 三 菱電機株式会社産業システム研究所内 (56)参考文献 特開 昭62−245912（ＪＰ，Ａ) 特開 昭63−78013（ＪＰ，Ａ) 実開 昭63−120112（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Katsuya Ueki 1-2-2 Wadazaki-cho, Hyogo-ku, Kobe-shi, Hyogo Mitsubishi Electric Corporation Control Works (72) Inventor ▲ Kazuo Shima Amagasaki-shi, Hyogo 8-1, 1-1 Tsukaguchi Honcho Sanryo Electric Co., Ltd. Industrial Systems Research Laboratory (56) Reference JP 62-245912 (JP, A) JP 63-78013 (JP, A) Actual 63-120112 (JP, U)
Claims (1)
対して光束を投光する投光手段と、この投光手段により
投光されたそれぞれの光束を２分割する第１の半透明鏡
と、上記被検査板にて反射された、隣接する投光手段が
投光し２分割されたそれぞれの一方の光束を第２の半透
明鏡を通して受光する受光手段と、この受光手段からの
出力を受けて上記被検査板の形状を演算する処理装置と
を備えた形状測定装置。1. A plurality of light-projecting means arranged on a plate to be inspected and projecting a light beam onto the plate to be inspected, and a first beam-splitting part of each light beam projected by the light-projecting means. A semitransparent mirror, a light receiving means for receiving one of the two light beams reflected by the plate to be inspected and emitted by an adjacent light projecting means and divided into two through a second semitransparent mirror, and this light receiving means. And a processing device for calculating the shape of the plate to be inspected by receiving the output from the shape measuring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2100969A JPH0674973B2 (en) | 1990-04-16 | 1990-04-16 | Shape measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2100969A JPH0674973B2 (en) | 1990-04-16 | 1990-04-16 | Shape measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03296608A JPH03296608A (en) | 1991-12-27 |
| JPH0674973B2 true JPH0674973B2 (en) | 1994-09-21 |
Family
ID=14288181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2100969A Expired - Fee Related JPH0674973B2 (en) | 1990-04-16 | 1990-04-16 | Shape measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0674973B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5394144B2 (en) * | 2009-06-25 | 2014-01-22 | 株式会社ブリヂストン | Method and apparatus for detecting shape of belt-shaped member |
-
1990
- 1990-04-16 JP JP2100969A patent/JPH0674973B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03296608A (en) | 1991-12-27 |
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