JPH0671128B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0671128B2 JPH0671128B2 JP62235762A JP23576287A JPH0671128B2 JP H0671128 B2 JPH0671128 B2 JP H0671128B2 JP 62235762 A JP62235762 A JP 62235762A JP 23576287 A JP23576287 A JP 23576287A JP H0671128 B2 JPH0671128 B2 JP H0671128B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- circuit conductor
- heat dissipation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プリント配線板に関するものである。TECHNICAL FIELD The present invention relates to a printed wiring board.
従来のプリント配線板は、所謂銅張積層板１の銅箔２を
エッチングすることにより所要の回路導体３を基板４上
側に形成することにより製造される。A conventional printed wiring board is manufactured by etching a copper foil 2 of a so-called copper clad laminate 1 to form a required circuit conductor 3 on an upper side of a substrate 4.
そして、かかるプリント配線板５の回路導体３上側には
絶縁被膜６によるオーバーコートが形成される。（第３
図参照） 〔発明が解決しようとする問題点〕 しかるに、前記構成から成る従来のプリント配線板５に
おいては、回路導体３の作動中に生ずる熱が、これを被
覆する絶縁ペースト被膜６によって放熱を阻止される結
果、回路導体３の加熱による誤動作あるいは耐久性が阻
害される欠点を有するものであった。An overcoat of the insulating coating 6 is formed on the upper side of the circuit conductor 3 of the printed wiring board 5. (Third
(See FIG.) [Problems to be Solved by the Invention] However, in the conventional printed wiring board 5 having the above-described configuration, heat generated during the operation of the circuit conductor 3 is radiated by the insulating paste film 6 covering the circuit conductor 3. As a result of the prevention, there is a drawback that malfunction or durability of the circuit conductor 3 is hindered.
因って、本発明はかかる従来のプリント配線板における
欠点に鑑みて開発されたもので、プリント配線板の回路
導体の加熱を防止し得るプリント配線板の提供を目的と
するものである。Therefore, the present invention was developed in view of the drawbacks of the conventional printed wiring board, and an object thereof is to provide a printed wiring board capable of preventing heating of a circuit conductor of the printed wiring board.
本発明のプリント配線板は、基板の片面または両面に回
路導体を形成するとともに前記回路導体を絶縁被膜にて
被覆して成るプリント配線板において、前記回路導体と
絶縁被膜間に前記回路導体の作動中に発生する熱を放熱
するための放熱被膜を設けて成るものである。The printed wiring board of the present invention is a printed wiring board in which a circuit conductor is formed on one surface or both surfaces of a substrate and the circuit conductor is covered with an insulating coating, and the circuit conductor operates between the circuit conductor and the insulating coating. The heat-dissipating film is provided to dissipate the heat generated therein.
本発明のプリント配線板は、回路導体に設けられた放熱
皮膜により、回路導体の作動中における加熱作用に対し
て、積極的な放熱作用が発揮される。In the printed wiring board of the present invention, the heat dissipation film provided on the circuit conductor exerts a positive heat dissipation action against the heating action of the circuit conductor during operation.
以下本発明プリント配線板の実施例を図面とともに説明
する。An embodiment of the printed wiring board of the present invention will be described below with reference to the drawings.
第１図は本発明のプリント配線板の要部拡大平面図、第
２図は同縦断面図である。FIG. 1 is an enlarged plan view of an essential part of a printed wiring board according to the present invention, and FIG. 2 is a longitudinal sectional view of the same.
図において、10は基板、11は基板10の片面に形成した回
路導体である。In the figure, 10 is a substrate, and 11 is a circuit conductor formed on one surface of the substrate 10.
そして、12は回路導体11の表面に被着した放熱皮膜で、
この放熱皮膜12は銅，ニッケル等の金属あるいはAl2O3
等のセラミックス等の無機質を主成分とする放熱ペース
トを当該プリント配線板13の製造工程中においてシルク
印刷等の塗布手段を介して塗布後、これを硬化すること
により形成するものである。And 12 is a heat dissipation film deposited on the surface of the circuit conductor 11,
This heat dissipation film 12 is made of metal such as copper or nickel or Al 2 O 3
A heat-dissipating paste containing an inorganic substance such as ceramics as a main component is applied through an applying means such as silk printing in the manufacturing process of the printed wiring board 13 and then cured.
また、図示の構成には、前記したプリント配線板13に要
求されるその他の構成、例えば第３図に示される絶縁被
膜６等については図示していないが、それ等の必要な構
成を施しつつ実施するものである。Further, in the illustrated configuration, although other configurations required for the printed wiring board 13 described above, for example, the insulating coating 6 shown in FIG. 3 are not shown, while providing those required configurations, It is to be implemented.
さらに、図示の実施例の場合には、基板10の片面にのみ
回路導体11を形成した場合について示したが、これを両
面に形成したプリント配線板あるいは多層プリント配線
板（図示せず）についても適用し得ることは言うまでも
ない。Further, in the illustrated embodiment, the case where the circuit conductor 11 is formed only on one surface of the substrate 10 is shown, but a printed wiring board or a multilayer printed wiring board (not shown) formed on both surfaces of the circuit conductor 11 is also shown. It goes without saying that it can be applied.
加えて、図示の加熱皮膜12は回路導体11の表面の中央部
に回路導体11の幅より狭い幅の放熱皮膜12を形成した場
合について示したが、回路導体11の幅と同一幅の放熱皮
膜12を形成したりあるいはプリント配線板13の回路導体
11のうちの必要な回路導体11の全長ではなく、必要な箇
所に一箇所あるいは複数箇所に必要に応じて形成するこ
とにより実施することが可能である。In addition, the illustrated heating film 12 shows the case where the heat dissipation film 12 having a width narrower than the width of the circuit conductor 11 is formed in the central portion of the surface of the circuit conductor 11, but the heat dissipation film having the same width as the width of the circuit conductor 11 is shown. 12 forming or circuit conductor of printed wiring board 13
It is possible to implement by forming not only the total length of the necessary circuit conductor 11 among 11 but at one place or a plurality of places where necessary, as needed.
以上の構成から成るプリント配線板13によれば、回路導
体11の上側に絶縁被膜が形成されて被覆されても、その
作動中の熱は、回路導体11の上側に形成された放熱皮膜
12によって積極的に放熱することができ、回路導体11の
作動中における、加熱による誤動作を防止することがで
きるとともに回路導体11の耐熱製を放熱皮膜12によって
向上し得るものである。According to the printed wiring board 13 having the above-described configuration, even if the insulating coating is formed on the upper side of the circuit conductor 11, the heat during the operation is the heat dissipation coating formed on the upper side of the circuit conductor 11.
Heat can be positively radiated by 12 and malfunctions due to heating can be prevented while the circuit conductor 11 is operating, and heat resistance of the circuit conductor 11 can be improved by the heat dissipation film 12.
本発明によればプリント配線板の回路導体の作動中にお
ける放熱作用が発揮でき、加熱による誤動作を防止し得
るとともに回路導体の耐熱性を向上し、プリント配線板
の精度並びに耐久性を向上し得る効果を有する。ADVANTAGE OF THE INVENTION According to this invention, the heat dissipation effect during operation of the circuit conductor of a printed wiring board can be exhibited, the malfunction by heating can be prevented, the heat resistance of a circuit conductor can be improved, and the precision and durability of a printed wiring board can be improved. Have an effect.
第１図は本発明プリント配線板の要部拡大平面図、第２
図は同縦断面図、第３図は従来のプリント配線板の部分
拡大断面図である。 10……基板 11……回路導体 12……放熱皮膜 13……プリント配線板FIG. 1 is an enlarged plan view of an essential part of a printed wiring board according to the present invention.
FIG. 3 is a vertical sectional view of the same, and FIG. 3 is a partially enlarged sectional view of a conventional printed wiring board. 10 …… Board 11 …… Circuit conductor 12 …… Heat dissipation film 13 …… Printed wiring board
───────────────────────────────────────────────────── フロントページの続き (72)発明者 二階堂 勝友 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (72)発明者 向井 規人 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (56)参考文献 特開 昭62−50167（ＪＰ，Ａ) 特開 昭62−50166（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsutomo Nikaido 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Japan CMK Co., Ltd. In-house (56) References JP 62-50167 (JP, A) JP 62-50166 (JP, A)
Claims (1)
るとともに前記回路導体を絶縁被膜にて被覆して成るプ
リント配線板において、 前記回路導体と絶縁被膜間に前記回路導体の作動中に発
生する熱を放熱するための放熱被膜を設けて成るプリン
ト配線板。1. A printed wiring board in which a circuit conductor is formed on one surface or both surfaces of a substrate and the circuit conductor is covered with an insulating film, which occurs during operation of the circuit conductor between the circuit conductor and the insulating film. A printed wiring board provided with a heat radiation coating for radiating the heat generated by the printed wiring board.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62235762A JPH0671128B2 (en) | 1987-09-19 | 1987-09-19 | Printed wiring board |
| US07/194,841 US4859805A (en) | 1987-09-19 | 1988-03-29 | Printed wiring board |
| EP88105342A EP0308576B1 (en) | 1987-09-19 | 1988-04-02 | A printed wiring board |
| DE3850626T DE3850626D1 (en) | 1987-09-19 | 1988-04-02 | Circuit board. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62235762A JPH0671128B2 (en) | 1987-09-19 | 1987-09-19 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6477986A JPS6477986A (en) | 1989-03-23 |
| JPH0671128B2 true JPH0671128B2 (en) | 1994-09-07 |
Family
ID=16990859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62235762A Expired - Fee Related JPH0671128B2 (en) | 1987-09-19 | 1987-09-19 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0671128B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6250166A (en) * | 1985-08-29 | 1987-03-04 | Mitsubishi Electric Corp | Thermal head |
| JPS6250167A (en) * | 1985-08-29 | 1987-03-04 | Mitsubishi Electric Corp | Thermal head |
-
1987
- 1987-09-19 JP JP62235762A patent/JPH0671128B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6477986A (en) | 1989-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5747877A (en) | Semiconductor chip package with enhanced thermal conductivity | |
| US5459639A (en) | Printed circuit board assembly having high heat radiation property | |
| JPH07135376A (en) | Composite printed-circuit board and its manufacture | |
| EP0308576B1 (en) | A printed wiring board | |
| US4900602A (en) | Printed wiring board | |
| EP0433093B1 (en) | Thermal head for thermal recording machine | |
| JPH08316002A (en) | Electronic component and composite electronic part | |
| JPH0671128B2 (en) | Printed wiring board | |
| JPH021915Y2 (en) | ||
| JPH065994A (en) | Multilayer printed wiring board | |
| JPH0517716B2 (en) | ||
| JP2547861B2 (en) | Method of manufacturing thermal head | |
| JP2684893B2 (en) | Hybrid integrated circuit device | |
| JPH0758239A (en) | Chip carrier | |
| JP3360011B2 (en) | Circuit board structure | |
| JPH0517717B2 (en) | ||
| JPH0366101A (en) | Electric circuit component | |
| KR950001266B1 (en) | Method of manufacturing aluminum circuit board | |
| JPH0817265B2 (en) | Printed wiring board | |
| JPS63219196A (en) | Hybrid integrated circuit device | |
| JPH0817266B2 (en) | Printed wiring board | |
| JPS5934156Y2 (en) | printed wiring board | |
| JP2572731Y2 (en) | Thermal head | |
| JPH01202893A (en) | Printed circuit board | |
| JPH06210884A (en) | Thermal head |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |