JPH0817265B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0817265B2 JPH0817265B2 JP2718988A JP2718988A JPH0817265B2 JP H0817265 B2 JPH0817265 B2 JP H0817265B2 JP 2718988 A JP2718988 A JP 2718988A JP 2718988 A JP2718988 A JP 2718988A JP H0817265 B2 JPH0817265 B2 JP H0817265B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- shield
- film
- circuit conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はプリント配線板に関する。Description: TECHNICAL FIELD The present invention relates to a printed wiring board.
従来のプリント配線板は、所謂、銅張積層板の銅箔を
エッチングして基板１の上側に所要の回路導体２を形成
することにより構成される。A conventional printed wiring board is constructed by etching a copper foil of a so-called copper clad laminate to form a required circuit conductor 2 on an upper side of a substrate 1.
また、このプリント配線板３の回路導体２に対する外
部ノイズを遮断するため、当該プリント配線板３を器体
に装着するに先きだって、前記回路導体２の特に外部ノ
イズを受け易い箇所あるいは外部ノイズから遮断する必
要性のある要部等を局部的にシールドすべくシールド作
用を具備するシールドフィルム４を被着しつつ器体に装
着していた。Further, in order to block external noise from the circuit conductor 2 of the printed wiring board 3, prior to mounting the printed wiring board 3 on the body, a portion of the circuit conductor 2 which is particularly susceptible to external noise or external noise. Therefore, the shield film 4 having a shielding action is locally attached to the body while shielding the essential parts and the like that need to be blocked.
尚第３図中、５はオーバコートとしての絶縁層を示す
ものである。In FIG. 3, reference numeral 5 indicates an insulating layer as an overcoat.
さらに、第３図示のプリント配線板３におけるシール
ドフィルム４は、これを別体に形成した後、プリント配
線板３の器体に対する装着に先き立って局部的な形状に
対応したサイズを以て裁断加工するとともにこれを被着
する作業が要求されることから、出願人は、これを作業
的に、プリント配線板３の製造工程中に工業生産性を以
て実施し得るシールド層を具備するプリント配線板の開
発に努力したところであり、その結果、開発されたの
が、第４図示のプリント配線板である。Further, the shield film 4 in the printed wiring board 3 shown in FIG. 3 is formed separately and then cut into a size corresponding to a local shape prior to mounting the printed wiring board 3 on the body. In addition, the applicant is required to carry out the work of depositing the work, and therefore, the applicant of the present invention works on the work of the printed wiring board having a shield layer which can be implemented with industrial productivity during the manufacturing process of the printed wiring board 3. Efforts have been made to develop the product, and as a result, the printed wiring board shown in FIG. 4 was developed.
しかして、かかるプリント配線板６は、基板１の回路
導体２の形成後、絶縁層５を施するとともにこの絶縁層
５上側にシルク印刷等の手段にてシールド作用を有する
ペーストを印刷後、これを硬化してシールド塗膜７を形
成し、このシールド塗膜７上側に絶縁層８を設けること
により構成したものである。Thus, the printed wiring board 6 is provided with the insulating layer 5 after the circuit conductor 2 of the substrate 1 is formed, and after printing a paste having a shielding action on the upper side of the insulating layer 5 by means of silk printing or the like. Is cured to form a shield coating film 7, and an insulating layer 8 is provided on the upper side of the shield coating film 7.
前述したプリント配線板3,6の場合、回路導体２の上
側にシールドフィルム４あるいはシールド塗膜７を設け
ることにより構成したもので、外部ノイズの遮断作用を
有するも各回路導体２間におけるクロストークおよびノ
イズの影響を有するとともに回路導体２の作動中に生ず
る熱が、これを被覆する絶縁層5,8によって放熱が阻止
される結果、回路導体３の加熱による誤動作あるいは耐
久性が阻害される欠点を有するものであった。In the case of the above-mentioned printed wiring boards 3 and 6, the shield film 4 or the shield coating film 7 is provided on the upper side of the circuit conductor 2, and the crosstalk between the circuit conductors 2 has the effect of blocking external noise. In addition, the heat generated by the circuit conductor 2 during the operation of the circuit conductor 2 is prevented from being dissipated by the insulating layers 5 and 8 as a result of the influence of noise, and the malfunction or durability of the circuit conductor 3 due to heating is impaired. It was something that had.
因って、本発明はかかる欠点に鑑みて開発されたもの
で、プリント配線板における回路導体のクロストーク及
びノイズを解消し得るとともに回路導体の加熱を防止し
得るプリント配線板の提供を目的とするものである。Therefore, the present invention was developed in view of such drawbacks, and an object of the present invention is to provide a printed wiring board capable of eliminating crosstalk and noise of the circuit conductors in the printed wiring board and preventing heating of the circuit conductors. To do.
本発明プリント配線板は基板の片面または両面に回路
導体を形成して成るプリント配線板において、前記各回
路導体の表側にシールド膜を被着するとともにシールド
膜の上側に放熱被膜を被着し、かつ前記回路導体上側に
絶縁被膜を設けるに当り、前記放熱被膜の長さ方向に沿
って長溝状の放熱窓を設けて絶縁被膜を設けて成るもの
である。The printed wiring board of the present invention is a printed wiring board formed by forming a circuit conductor on one side or both sides of a substrate, in which a shield film is applied to the front side of each circuit conductor and a heat dissipation film is applied to the upper side of the shield film. Further, when the insulating coating is provided on the upper side of the circuit conductor, a long groove-shaped radiation window is provided along the length direction of the radiation coating to provide the insulating coating.
本発明プリント配線板各回路導体の表側に設けたシー
ルド膜により各回路導体間のクロストーク及びノイズの
遮断作用が発揮される。The shield film provided on the front side of each circuit conductor of the printed wiring board of the present invention exerts a crosstalk between each circuit conductor and a noise blocking action.
また、これに加えてシールド膜に設けられた放熱被膜
により、回路導体の作動中における加熱作用に対して、
積極的な放熱作用が発揮されるとともに放熱被膜上側に
被覆される絶縁被膜による同作用の低下を放熱窓を介し
て阻止する作用を有する。Moreover, in addition to this, the heat dissipation film provided on the shield film prevents the heating effect of the circuit conductor during operation.
It has a positive heat-dissipating effect and also has an effect of preventing the same effect from being lowered by the insulating coating on the upper side of the heat-dissipating coating through the heat-dissipating window.
以下本発明プリント配線板の実施例を図面とともに説
明する。An embodiment of the printed wiring board of the present invention will be described below with reference to the drawings.
第１図および第２図は本発明プリント配線板の実施例
を示す要部の断面図および平面図である。1 and 2 are a sectional view and a plan view of a main part showing an embodiment of a printed wiring board according to the present invention.
図において、10は基板で、この基板10の上側には回路
導体11,12が形成されている。In the figure, 10 is a substrate, and circuit conductors 11 and 12 are formed on the upper side of the substrate 10.
13,14は回路導体11,12の表側に絶縁被膜15,16を設け
た後、この絶縁被膜15,16表側に被着したシールド膜で
ある。Numerals 13 and 14 are shield films which are formed by providing the insulating coatings 15 and 16 on the front sides of the circuit conductors 11 and 12, and then depositing on the insulating coatings 15 and 16 on the front sides.
また、各シールド膜13,14の上側には放熱被膜17,18を
被着してある。さらに19は回路導体11,12上側に被覆さ
れた絶縁被膜（オーバーコート）で、この絶縁被膜19を
設ける場合には、前記シールド膜13,14の表面に設けた
前記放熱被膜17,18の長さ方向に沿って長溝状の放熱窓2
0,21を設けることにより形成してある。Further, heat radiation coatings 17 and 18 are deposited on the upper sides of the shield films 13 and 14, respectively. Further, 19 is an insulating coating (overcoat) coated on the upper side of the circuit conductors 11 and 12. When the insulating coating 19 is provided, the length of the heat radiation coatings 17 and 18 provided on the surfaces of the shield films 13 and 14 is long. Longitudinal heat dissipation window 2 along the vertical direction
It is formed by providing 0 and 21.
かかる構成から成るプリント配線板22によれば基板10
に設けられる各回路導体11,12の表側はシールド膜13,14
によって個別的にシールドされているため、各回路間の
クロストークおよびノイズを防止することができるとと
もに各シールド膜13,14のシールド作用により、外部ノ
イズの影響をも遮断し得るものである。According to the printed wiring board 22 having such a configuration, the substrate 10
The front side of each circuit conductor 11, 12 provided on the
Since they are individually shielded by, the crosstalk between each circuit and noise can be prevented, and the shield effect of each shield film 13 and 14 can also shield the influence of external noise.
また、回路導体11,12の上側に絶縁被膜19が形成され
ても、その作動中の熱は、シールド膜13,14の上側に形
成された放熱被膜17,18によって積極的に放熱すること
ができ、回路導体11,12の作動中における、加熱による
誤動作を防止することができるとともに回路導体11,12
の耐熱性を放熱被膜17,18によって向上し得るものであ
る。Further, even if the insulating coating 19 is formed on the upper side of the circuit conductors 11 and 12, the heat during operation can be positively radiated by the heat radiating coatings 17 and 18 formed on the upper sides of the shield films 13 and 14. The circuit conductors 11 and 12 can be prevented from malfunctioning due to heating during operation of the circuit conductors 11 and 12.
The heat resistance of can be improved by the heat radiation coatings 17, 18.
前記シールド膜13,14については、公知のシールド作
用を有するペーストをシルク印刷等の手段にて印刷塗布
した後、これを硬化することにより形成することができ
るものである。The shield films 13 and 14 can be formed by printing and applying a paste having a known shield effect by means such as silk printing and then curing the paste.
そして、前記放熱被膜17,18は銅，ニッケル等の金属
あるいはAl2O3等のセラミックス等の無機質を主成分と
する放熱ペーストを当該プリント配線板22の製造工程中
においてシルク印刷等の塗布手段を介して塗布後、これ
を硬化することにより形成するものである。The heat dissipation coatings 17 and 18 are applied by silk printing or the like during the manufacturing process of the printed wiring board 22 with a heat dissipation paste containing a metal such as copper or nickel or an inorganic material such as ceramics such as Al 2 O 3 as a main component. It is formed by applying the solution via the and then curing it.
さらに、図示の実施例の場合には、基板10の片面にの
み回路導体11,12を形成した場合について示していた
が、これを両面に形成したプリント配線板あるいは多層
プリント配線板（図示せず）についても適用し得ること
は言うまでもない。Further, in the illustrated embodiment, the case where the circuit conductors 11 and 12 are formed only on one surface of the substrate 10 is shown, but a printed wiring board or a multilayer printed wiring board (not shown) in which the circuit conductors 11 and 12 are formed on both surfaces is shown. Needless to say, it is also applicable to ().
加えて、図示の放熱被膜17,18は回路導体11,12の表面
の中央部に回路導体11,12の幅より狭い幅の放熱被膜17,
18を形成した場合について示したが、回路導体11,12の
幅と同一幅の放熱被膜17,18を形成したりあるいはプリ
ント配線板22のシールド膜13,14のうちの必要なシール
ド膜13,14の全長ではなく、必要な箇所に一箇所あるい
は複数箇所に必要に応じて形成することにより実施する
ことが可能である。In addition, the illustrated heat dissipation coatings 17, 18 are formed on the central portions of the surfaces of the circuit conductors 11, 12 so as to have a width narrower than that of the circuit conductors 11, 12.
Although the case where 18 is formed is shown, a heat dissipation film 17, 18 having the same width as the width of the circuit conductors 11, 12 is formed, or a necessary shield film 13, 14 of the shield films 13, 14 of the printed wiring board 22 is formed. It is possible to implement by forming not at the entire length of 14 but at one place or a plurality of places as needed, as needed.
本発明プリント配線板によれば、各回路導体間におけ
るクロストークおよびノイズを防止し得る効果を有し、
かつ外部ノイズの影響をも効果的に回避し得るととも
に、プリント配線板の回路導体の作動中における放熱作
用が発揮でき、加熱による誤動作を防止し得るとともに
回路導体の耐熱性を向上し、プリント配線板の精度並び
に耐久性を向上し得る効果を有する。According to the printed wiring board of the present invention, there is an effect of preventing crosstalk and noise between circuit conductors,
In addition, the effect of external noise can be effectively avoided, the heat dissipation effect can be exerted during the operation of the circuit conductor of the printed wiring board, the malfunction due to heating can be prevented, and the heat resistance of the circuit conductor can be improved. It has the effect of improving the precision and durability of the plate.
第１図および第２図は本発明プリント配線板の実施例を
示す要部の断面図および平面図、第３図および第４図は
従来のプリント配線板を示す断面図である。 10……基板 11,12……回路導体 13,14……シールド膜 15,16,19……絶縁被膜 17,18……放熱被膜 20,21……放熱窓 22……プリント配線板1 and 2 are a sectional view and a plan view of an essential part showing an embodiment of a printed wiring board according to the present invention, and FIGS. 3 and 4 are sectional views showing a conventional printed wiring board. 10 …… Board 11,12 …… Circuit conductor 13,14 …… Shield film 15,16,19 …… Insulation film 17,18 …… Heat dissipation film 20,21 …… Heat dissipation window 22 …… Printed wiring board
フロントページの続き (72)発明者 二階堂 勝友 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (72)発明者 向井 規人 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (56)参考文献 特開 平１−77987（ＪＰ，Ａ) 特開 昭55−130193（ＪＰ，Ａ) 実開 昭61−38967（ＪＰ，Ｕ) 実開 昭61−83098（ＪＰ，Ｕ)Front Page Continuation (72) Inventor Katsutomo Nikaido 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Prefecture, Japan MK Corporation (72) Inventor, Norito Mukai 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Prefecture 56) References JP-A-1-77987 (JP, A) JP-A-55-130193 (JP, A) Actually open 61-38967 (JP, U) Actually open 61-83098 (JP, U)
Claims (1)
て成るプリント配線板において、 前記各回路導体の表側にシールド膜を被着するとともに
シールド膜の上側に放熱皮膜を被着し、かつ前記回路導
体上側に絶縁皮膜を設けるに当たり、前記放熱皮膜の長
さ方向間に沿って長溝状の放熱窓を設けて絶縁被膜を設
けて成るプリント配線板。1. A printed wiring board comprising a circuit conductor formed on one or both sides of a substrate, wherein a shield film is deposited on the front side of each of the circuit conductors, and a heat dissipation film is deposited on the upper side of the shield film. A printed wiring board, comprising: providing an insulating film on the upper side of the circuit conductor, by providing long groove-shaped heat dissipation windows along the lengthwise direction of the heat dissipation film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2718988A JPH0817265B2 (en) | 1988-02-08 | 1988-02-08 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2718988A JPH0817265B2 (en) | 1988-02-08 | 1988-02-08 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01202894A JPH01202894A (en) | 1989-08-15 |
| JPH0817265B2 true JPH0817265B2 (en) | 1996-02-21 |
Family
ID=12214132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2718988A Expired - Lifetime JPH0817265B2 (en) | 1988-02-08 | 1988-02-08 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0817265B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130075168A (en) * | 2011-12-27 | 2013-07-05 | 삼성전기주식회사 | A printed circuit board and a manufacturing method thereof |
-
1988
- 1988-02-08 JP JP2718988A patent/JPH0817265B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01202894A (en) | 1989-08-15 |
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