JPH067038U - Pressure detector - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a pressure detection device that facilitates welding work and can sufficiently meet the needs for improvement of assembly workability and miniaturization. A cylindrical housing 3 containing a semiconductor pressure conversion element 1 is provided, a cylindrical pressure introducing pipe 4 having a diameter smaller than the housing diameter is provided at the center of the lower end surface of the housing, and a pipe outer circumference circle of the lower end surface of the housing. A pressure sensor 2 in which an input / output terminal 5 of the semiconductor pressure conversion element 1 is projected on a side portion;
A pressure receiver 10 provided in the pressure introduction pipe 4 of the pressure sensor 2 for receiving pressure and electrically insulating, and a plurality of electronic components 13 for performing temperature compensation and input / output level adjustment of the semiconductor pressure conversion element 1. And a printed circuit board 23 formed of a semi-flexible material on which the pressure sensor 2 is directly attached to the printed circuit board 23.
The electronic circuit 3 and the input / output terminal 5 of the semiconductor pressure conversion element 1 are electrically connected directly to each other.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a pressure detection device having a pressure sensor having a semiconductor pressure conversion element built-in and a printed circuit board having a plurality of electronic components mounted thereon.

[0002]

[Prior art]

 An example of using the pressure detecting device as described above is a pressure detecting device for a refrigerator. In recent years, inverters, heat pumps and room air conditioners have become widespread.

Among them, the multi-room multi-air conditioner has a complicated refrigeration cycle and has a very wide range of capacity control. Even if the indoor units of different types and different capacities (cooling / heating capacity) are operated in combination, the required amount of refrigerant is always supplied appropriately, and optimal air conditioning can be performed to achieve comfortable air conditioning. Semiconductor pressure sensing devices for refrigerants play an important role especially in the frequency control of air conditioners.

The pressure data of the pressure detection device and the separately detected temperature data are fed back to the microcomputer, and the load condition of the air conditioner is judged to perform proper inverter speed control of the compressor without excess or deficiency. It is something to do.

According to the data of the pressure detecting device, for example, even when the operation of the indoor unit changes from one room to two rooms, or from two rooms to one room, the rotation speed of the compressor is immediately changed to perform cooling or The heating capacity can be adjusted.

By the way, FIG. 4 shows a pressure sensor 2 having a built-in semiconductor pressure converting element 1 and a printed circuit board 14 having a plurality of electronic components 13 mounted thereon in a conventional pressure detecting device having the above-described function. As described above, the flexible lead wire 15 is used for electrical connection.

The pressure sensor 2 has a cylindrical housing 3 having the semiconductor pressure conversion element 1 built-in, and a cylindrical pressure introduction pipe 4 having a diameter smaller than the diameter of the housing projects from the center of the lower end surface of the housing 3. The semiconductor pressure conversion element 1 has an input / output terminal 5 protruding from the outer peripheral edge of the pipe on the lower end surface of the housing as shown in FIG. A disk-shaped hard board 6 having an insertion hole 6a, a terminal fitting insertion hole 6b, and a lead wire connection terminal 6a is assembled, and the input / output terminal 5 of the semiconductor pressure conversion element 1 is soldered to the wiring terminal of the hard board 6. A flexible lead wire 15 is connected between the lead wire connection terminal 6a of the hard board 6 and the circuit terminal of the printed circuit board 14 as shown in FIG.

Further, the pressure introducing pipe 4 is provided with a pressure receiver 10 that receives pressure and electrically insulates, and the pressure receiver 10 is welded at a joint 12 to form a pressure chamber 7. It is composed of a body 8 and a lid body 9. A pressure introducing capillary tube 10a is joined to the receiving body 8, and the lid body 9 is sealed by a sealing glass 11 in order to ensure electrical insulation from the pressure sensor 2. Has been done.

[0009]

[Problems to be solved by the device]

 According to the conventional pressure detecting device, a flexible lead wire 15 for connecting the hard board 6 and the printed board 14 is required, and the lead wire 15 is not affected by heat due to welding of the receiving body 8 and the lid body 9. In order to avoid it, the pressure receiver 2 had to be connected after it was assembled to the pressure sensor 2, and automatic assembly was difficult because it was not a planar structure. Further, since the hard substrate 6 is assembled to the pressure sensor 2, it is difficult to set the receiving body 8 and the lid body 9 on the welding jig when welding. The present invention was devised to solve the above-mentioned problems, and the purpose thereof is to facilitate welding work and eliminate the need for flexible lead wires, thereby sufficiently addressing the needs of assembly workability improvement and miniaturization. An object of the present invention is to provide a pressure detecting device capable of performing the above.

[0010]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, a pressure detecting device of the present invention has a cylindrical housing 3 having a semiconductor pressure converting element 1 built-in, and a cylindrical shape having a diameter smaller than the housing diameter at the center of the lower end surface of the housing 3. And a pressure sensor 2 in which the input / output terminal 5 of the semiconductor pressure conversion element 1 is projected on the outer circumference of the pipe on the lower end surface of the housing, and the pressure introduction pipe of the pressure sensor 2. 4 is a semi-flexible material mounted with a pressure receiver 10 for receiving pressure and electrically insulating, and a plurality of electronic components 13 for performing temperature compensation and input / output level adjustment of the semiconductor pressure conversion element 1. A printed circuit board 23 to be formed, the pressure sensor 2 is directly assembled to the printed circuit board 23, and an electronic circuit of the printed circuit board 23 and an input / output terminal of the semiconductor pressure conversion element 1 are provided. Characterized in that the electrically directly connected and.

[0011]

[Action]

 In the pressure detecting device of the present invention, the printed circuit board 23 is formed of a semi-flexible material having an intermediate property between the flexible circuit board and the hard circuit board, and the pressure sensor 2 is directly attached to the printed circuit board 23. Since the electronic circuit and the input / output terminal 5 of the semiconductor pressure conversion element 1 are directly connected to each other by soldering or the like, the lead wire 15 and the hard board 6 unlike the conventional case are not required, and the pressure detecting device is simple.・ Since it is a compact type, assembly workability has been improved.

[0012]

【Example】

 An embodiment of the present invention will be described below with reference to FIGS.

The pressure detecting device of this embodiment includes a pressure sensor 2 having a built-in semiconductor pressure conversion element 1, a pressure receiver 10 for receiving pressure and electrically insulating, and temperature compensation of the semiconductor pressure conversion element 1. And a printed circuit board 23 on which a plurality of electronic components 13 (such as the hybrid IC 29 and the capacitors 30 and 30a shown in FIG. 3) for adjusting the input / output level are mounted.

The pressure sensor 2 has a cylindrical housing 3 having the semiconductor pressure conversion element 1 built-in, and a cylindrical pressure introduction pipe 4 having a diameter smaller than the housing diameter is projected from the central portion of the lower end surface of the housing 3. It has the same structure as the conventional pressure sensor shown in FIG. 5 in which the input / output terminals 5 of the semiconductor pressure converting element 1 are projected on the outer circumference of the pipe on the lower end surface of the housing.

The pressure receiver 10 includes a receiving body 8 and a lid body 9 which are welded together at a joint portion 12 to form a pressure chamber 7, and a capillary tube 10 a for introducing pressure is attached to the receiving body 8 by a roller. The lid 9 is fixed, and the lid 9 is sealed by a sealing glass 11 filled between the lid projection and the hollow pipe 22 in order to ensure electrical insulation from the pressure sensor 2.

The printed circuit board 23 is a semi-flexible material (preferably a plate of about 0.3 mm to 0.4 mm) having a plate thickness of 0.25 to 0.6 mm, which has an intermediate property between a flexible board and a hard board. A thick glass epoxy base material is easy to use), and electronic components 13 such as a hybrid IC 29 and capacitors 30 and 30a for performing temperature compensation and input / output level adjustment of the semiconductor pressure conversion element 1 are formed on the printed circuit board 23. Are implemented as shown in FIG. The printed circuit board 23 used in the present invention can maintain a predetermined shape without being deformed even when the weight of the plurality of electronic components 13 is applied.

The pressure sensor 2 is directly attached to the printed circuit board 23, and the electronic circuit of the printed circuit board 23 and the input / output terminal 5 of the semiconductor pressure conversion element 1 are directly electrically connected by soldering. However, the pressure introducing pipe 4 is inserted into the printed circuit board 23 so that the printed circuit board 23 is assembled after the pressure receiving device 10 including the receiving body 8 and the lid body 9 is assembled to the pressure sensor 2. The first slotted portion 24 and the slotted central round hole 25, the plurality of small holes 28 into which the input / output terminals 5 of the semiconductor pressure conversion element 1 are inserted, and the first slotted portion 24 parallel to the first slotted portion 24. A second slot portion 26 and an elastically deformable substrate tongue piece 27 formed between the first and second slot portions 24, 26 are provided, and the outer edge of the first slot portion 24 is provided. A chamfer 24a is provided at the end.

Therefore, when the pressure introducing pipe 4 of the pressure sensor 2 is slid from the chamfered portion 24 a and assembled, the substrate tongue 27 between the first slotted portion 24 and the second slotted portion 27 is removed. It can be elastically deformed and easily assembled. In this assembled state, the pressure introducing pipe 4 is fixed in the central round hole 25 of the first slot 24, and the input / output terminal 5 of the semiconductor pressure converting element 1 is inserted into the small hole 28 of the printed board 23. Therefore, by soldering the input / output terminal 5 and the electronic circuit of the printed circuit board 23 on the opposite side, the electric connection between the pressure sensor 2 and the printed circuit board 23 can be made easily and surely.

[0019]

[Effect of device]

 Since the pressure detecting device of the present invention has the above-described structure, it facilitates the welding work of the pressure receiver 10 and eliminates the flexible lead wire, which is sufficient for the needs of the improvement of the assembling workability and the miniaturization. It is possible to deal with it (it is possible to reduce the process and downsize by deleting the relay lead wire).

In particular, when the printed circuit board 23 is provided with the slotted portions 24 and 26 and the slotted central round hole 25, and the board tongue piece 27 and the small hole 28 as specified in claims 2 and 3, Using the flexibility of the printed circuit board 23 and the slot portions 24 and 26, the pressure sensor 2 can be attached to the printed circuit board 23 afterwards (it is easy to set it on the welding jig). Due to the appropriate hardness of the printed circuit board 23, it is possible to withstand the mounting weight of the electronic component 13 and maintain a predetermined shape.

[Brief description of drawings]

FIG. 1 is a plan view of a pressure detecting device according to an embodiment of the present invention.

FIG. 2 is an external front view of a part of the pressure detection device in section.

FIG. 3 is an external perspective view showing a printed circuit board on which electronic components of the pressure detection device are mounted.

4A and 4B are explanatory views showing a conventional pressure detecting device, in which FIG. 4A is a plan view and FIG.

FIG. 5 is an exploded perspective view of a pressure sensor and a hard substrate according to the conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor pressure conversion element, 2 ... Pressure sensor, 3 ... Housing, 4 ... Pressure introduction pipe, 5 ... Input / output terminal, 7 ... Pressure chamber, 8 ... Receptor, 9 ... Lid, 10 ... Pressure receiver, 10a ... Capillary tube, 23 ... Printed circuit board, 24 ... First slotted portion, 25 ... Slotted central round hole, 26 ... Second slotted portion, 27 ... Substrate tongue piece, 28 ... Small hole, 13 (29,
30, 30a) ... Electronic components.

Claims (3)

[Scope of utility model registration request] 1. A cylindrical pressure-introducing pipe having a diameter smaller than the housing diameter is provided at the center of the lower end surface of the housing having a cylindrical housing containing a semiconductor pressure conversion element, and a pipe outer circumference of the lower end surface of the housing. A pressure sensor having an input / output terminal of the semiconductor pressure converting element projecting from a portion, a pressure receiver provided in a pressure introducing pipe of the pressure sensor for receiving pressure and electrically insulating, and the semiconductor pressure converter. In a pressure detection device comprising a printed circuit board mounted with a plurality of electronic components for temperature compensation of elements and input / output level adjustment, the printed circuit board is formed of a semi-flexible material, and the pressure sensor is mounted on the printed circuit board. A pressure detecting device characterized by being directly assembled and electrically connecting the electronic circuit of the printed circuit board and the input / output terminal of the semiconductor pressure converting element directly. . 2. The printed board is provided with a first slotted portion into which a pressure introduction pipe is inserted and a central slotted hole, and a plurality of small holes into which input / output terminals of a semiconductor pressure conversion element are inserted. The pressure detecting device according to claim 1, wherein 3. A second slotted portion parallel to the first slotted portion is provided on the printed board, and an elastically deformable substrate tongue is formed between the first and second slotted portions. The pressure detecting device according to claim 2, wherein