JPH0667630B2 - Thermal head - Google Patents

Thermal head

Info

Publication number
JPH0667630B2
JPH0667630B2 JP60233015A JP23301585A JPH0667630B2 JP H0667630 B2 JPH0667630 B2 JP H0667630B2 JP 60233015 A JP60233015 A JP 60233015A JP 23301585 A JP23301585 A JP 23301585A JP H0667630 B2 JPH0667630 B2 JP H0667630B2
Authority
JP
Japan
Prior art keywords
layer
thermal head
resistor
electrode
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60233015A
Other languages
Japanese (ja)
Other versions
JPS6292862A (en
Inventor
茂 間野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Priority to JP60233015A priority Critical patent/JPH0667630B2/en
Publication of JPS6292862A publication Critical patent/JPS6292862A/en
Publication of JPH0667630B2 publication Critical patent/JPH0667630B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Landscapes

  • Electronic Switches (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、感光紙やインクリボンを介して普通紙等に画
像等を記録するのに用いられるサーマルヘッドに関す
る。
The present invention relates to a thermal head used for recording an image or the like on plain paper or the like via a photosensitive paper or an ink ribbon.

〔発明の背景〕[Background of the Invention]

従来、第3図の要部断面図に示したようなサーマルヘツ
ドは知られている。このサーマルヘツドは、アルミナ等
のセラミックから成る基板1上にグレーズ層のような蓄
熱層2を設け、次に、蓄熱層2上から基板1上にかけて
窒化タンタルのような抵抗体3を設け、次に、抵抗体3
に電力を供給するように、抵抗体3上にアルミニウム等
の金属から成るリード用の信号電極4と共通電極5を設
け、最後に、抵抗体3や信号電極4及び共通電極5の酸
化や摩擦を防止するための二酸化珪素や五酸化タンタル
等から成る保護層6を抵抗体3や信号電極4及び共通電
極5等の上に設けることにより形成される。そして、こ
のサーマルンヘツドは、信号電極4と共通電極5の端面
が蓄熱層2上の抵抗体3の表面上で対向しているから、
この対向の間の保護層6の表面すなわち印字ドット部P
が信号電極4や共通電極5の厚さだけ窪むようになり、
そのために印字ドット部Pへの感光紙10(または、イン
クリボンを介しての普通紙)の接触が不十分となって、
熱効率が悪くなるから、印字の質が低下し、また、印字
ドット部Pの左右端において保護層6の表面が高くなっ
ている部分に感光紙10等が強く接触して、保護層6のそ
の部分が早く摩滅するようになると言う欠点を有する。
印字の質の低下を防ぐためには、抵抗体3の発熱を大き
くすることも行われるが、それでは抵抗体3等の寿命が
短くなり、また、保護層6が摩滅し易いと言う問題は解
消しない。
Conventionally, a thermal head as shown in the sectional view of the main part of FIG. 3 is known. In this thermal head, a heat storage layer 2 such as a glaze layer is provided on a substrate 1 made of ceramic such as alumina, then a resistor 3 such as tantalum nitride is provided from the heat storage layer 2 to the substrate 1, And resistor 3
In order to supply electric power to the resistor 3, a lead signal electrode 4 and a common electrode 5 made of a metal such as aluminum are provided on the resistor 3, and finally, oxidation and friction of the resistor 3, the signal electrode 4 and the common electrode 5 are performed. It is formed by providing a protective layer 6 made of silicon dioxide, tantalum pentoxide or the like on the resistor 3, the signal electrode 4 and the common electrode 5 for preventing the above. In this thermal head, the end faces of the signal electrode 4 and the common electrode 5 face each other on the surface of the resistor 3 on the heat storage layer 2,
The surface of the protective layer 6 between the facing portions, that is, the print dot portion P
Becomes depressed by the thickness of the signal electrode 4 and the common electrode 5,
Therefore, the contact of the photosensitive paper 10 (or the plain paper via the ink ribbon) with the print dot portion P becomes insufficient,
Since the thermal efficiency is deteriorated, the quality of the print is deteriorated, and the photosensitive paper 10 and the like are strongly contacted with the portions of the left and right ends of the print dot portion P where the surface of the protective layer 6 is high. It has the drawback that parts will wear out faster.
In order to prevent the print quality from deteriorating, the heat generation of the resistor 3 may be increased, but this does not solve the problem that the life of the resistor 3 or the like is shortened and the protective layer 6 is easily worn. .

このような従来のサーマルヘツドの問題を解消するもの
として、第4図の要部断面図に示したサーマルヘツドが
特開昭60-112459号公報によって知られており、また、
第5図や第6図の要部斜視図に示したサーマルヘツドが
特開昭60-137670号公報によって知られている。
As a means for solving such a problem of the conventional thermal head, the thermal head shown in the cross-sectional view of the principal part of FIG. 4 is known from Japanese Patent Application Laid-Open No. 60-112459, and
The thermal head shown in the perspective views of the essential parts of FIGS. 5 and 6 is known from Japanese Patent Application Laid-Open No. 60-137670.

第4図のサーマルヘツドが第3図のサーマルヘツドと異
なる点は、蓄熱層2上に、信号電極4と共通電極5が対
向している間の抵抗体3の表面を両電極の表面と同じ程
度の高さまで持ち上げるような、アルミニウムや銅等か
ら成る台形状の金属層7を設け、その金属層7や蓄熱層
2等の表面を覆うように二酸化珪素等から成る絶縁層8
を設けて、その上に、第3図のサーマルヘツドにおける
と同様に、抵抗体3や信号電極4及び共通電極5を設け
るようにした点、また、絶縁層6を二酸化珪素等の酸化
防止層6aと五酸化タンタル等の耐摩耗層6bの二層構成と
した点である。すなわち、第4図のサーマルヘツドは、
蓄熱層2上に設けた台形状の金属層7によって信号電極
4と共通電極5の間の抵抗体3の表面を両電極の表面と
同じ高さにまでもたらし、印字ドット部Pに窪みができ
ないようにして、第3図のサーマルヘツドの欠点を解消
したものである。しかし、このサーマルヘツドは、金属
層7と絶縁層8を設ける工程だけ、第3図のサーマルヘ
ツドの製造工程よりも工程数が増加する。しかも、金属
層7を設ける工程は、金属層7が蓄熱層2や絶縁層8と
違って熱伝導性であるから、抵抗体3毎に独立していな
ければならず、したがって、蒸着やスパッタによって薄
膜に形成した後、フォトエッチングによってパターニン
グすることを必要とする面倒な工程である。
The thermal head of FIG. 4 is different from the thermal head of FIG. 3 in that the surface of the resistor 3 on the heat storage layer 2 while the signal electrode 4 and the common electrode 5 face each other is the same as the surface of both electrodes. A trapezoidal metal layer 7 made of aluminum, copper or the like is provided so as to be lifted up to a certain height, and an insulating layer 8 made of silicon dioxide or the like is provided so as to cover the surfaces of the metal layer 7 and the heat storage layer 2.
And the resistor 3, the signal electrode 4, and the common electrode 5 are provided on the insulating layer 6 as in the thermal head shown in FIG. 3, and the insulating layer 6 is an antioxidant layer such as silicon dioxide. This is a two-layer structure of 6a and a wear resistant layer 6b such as tantalum pentoxide. That is, the thermal head of FIG.
The trapezoidal metal layer 7 provided on the heat storage layer 2 brings the surface of the resistor 3 between the signal electrode 4 and the common electrode 5 to the same height as the surfaces of both electrodes, and the print dot portion P is not dented. Thus, the drawbacks of the thermal head shown in FIG. 3 are eliminated. However, in the thermal head, the number of steps is increased compared to the step of manufacturing the thermal head shown in FIG. 3 only by the step of providing the metal layer 7 and the insulating layer 8. Moreover, in the step of providing the metal layer 7, since the metal layer 7 has thermal conductivity unlike the heat storage layer 2 and the insulating layer 8, it is necessary to be independent for each resistor 3, and therefore, by the vapor deposition or the sputtering. This is a troublesome process that requires patterning by photoetching after forming a thin film.

第5図のサーマルヘツドが第3図のサーマルヘツドと異
なる点は、信号電極4と共通電極5を設けた後に、両電
極間の抵抗体3上に、印字ドット部Pの窪みを無くすた
めの、炭化珪素や酸化アルミニウム等から成る電気絶縁
性の熱伝導部材9を設け、最後の絶縁層6を表面が熱伝
導部材の表面と一致する層厚に設けるようにした点であ
る。このサーマルヘツドにおいては、印字ドット部Pの
窪みは無くなるが、両電極間の抵抗体3の表面と印字ド
ット部Pの表面との距離が両電極表面と印字ドット部P
の表面の距離よりも両電極の厚さだけ大であることは変
わらず、従って、第4図のサーマルヘツドの絶縁層6に
熱伝導部材9と同様の材料を用いた場合に比較すると、
この距離が大なる分だけ熱伝達率が小となって熱効率が
悪くなるから、それに対して抵抗体の発熱量を大きくす
ることが要求されるようになる。また、このサーマルヘ
ツドの製造工程は、見掛上、第3図のサーマルヘツドの
製造工程よりも熱伝導部材9を設ける一工程だけが増し
て、第4図のサーマルヘツドの製造工程よりも一工程簡
略化しているように思われるが、実際上、炭化珪素や炭
化アルミニウム等の熱伝導部材9を細かいパターンで抵
抗体3上に設けることは第4図のサーマルヘツドの金属
層7を設けることよりも遥に面倒であり、さらに、保護
層6を熱伝導部材9の表面に付着させないように設ける
ことも極めて困難であるから、保護層6を設けた後に熱
伝導部材9の表面に付着した保護層6を除くための表面
研磨工程を必要としたりして、反つて第4図のサーマル
ヘツドの製造工程よりも面倒である。
The thermal head shown in FIG. 5 is different from the thermal head shown in FIG. 3 in that after the signal electrode 4 and the common electrode 5 are provided, it is necessary to eliminate the depression of the print dot portion P on the resistor 3 between the electrodes. The point is that an electrically insulating heat conducting member 9 made of silicon carbide, aluminum oxide or the like is provided, and the last insulating layer 6 is provided with a layer thickness whose surface matches the surface of the heat conducting member. In this thermal head, the depression of the print dot portion P is eliminated, but the distance between the surface of the resistor 3 and the surface of the print dot portion P between both electrodes is the same as the surface of both electrodes and the print dot portion P.
The thickness of both electrodes is larger than the distance of the surface of the electrode, and therefore, when compared with the case where the same material as the heat conducting member 9 is used for the insulating layer 6 of the thermal head of FIG.
As the distance becomes larger, the heat transfer coefficient becomes smaller and the thermal efficiency becomes worse. Therefore, it becomes necessary to increase the heat generation amount of the resistor. In addition, the manufacturing process of the thermal head is apparently one more process than the manufacturing process of the thermal head shown in FIG. Although it seems that the process is simplified, in practice, providing the heat conducting member 9 such as silicon carbide or aluminum carbide on the resistor 3 in a fine pattern is to provide the metal layer 7 of the thermal head shown in FIG. It is much more troublesome than that, and it is also extremely difficult to provide the protective layer 6 so as not to adhere to the surface of the heat conducting member 9. Therefore, after the protective layer 6 is provided, it adheres to the surface of the heat conducting member 9. On the contrary, it requires a surface polishing step for removing the protective layer 6, which is more troublesome than the manufacturing step of the thermal head shown in FIG.

第6図のサーマルヘツドは、第5図のサーマルヘツドの
熱伝導部材9を形成が容易な金属から成る熱伝導部材
9′とするために、信号電極4と共通電極5を設けた後
に、両電極及び抵抗体3等の表面を被覆する二酸化珪素
等の絶縁層8を設けて、その上に第5図のサーマルヘツ
ドの熱伝導部材9と同様に金属の熱伝導部材9′と、さ
らに保護層6を設けるようにしたものである。このサー
マルヘツドも、第5図のサーマルヘツドと同様、両電極
間の抵抗体3の表面と印字ドット部Pの表面との間隙が
両電極の厚さだけ大で、熱効率が悪くなるし、保護層6
を設けた後に熱伝導部材9′の表面に付着した保護層6
を除くための表面研磨を必要として、製造工程がその分
第4図のサーマルヘツドの製造工程よりも面倒である。
The thermal head shown in FIG. 6 is provided with the signal electrode 4 and the common electrode 5 after the signal electrode 4 and the common electrode 5 are provided so that the thermal conductive member 9 of the thermal head shown in FIG. An insulating layer 8 made of silicon dioxide or the like for covering the surfaces of the electrodes and the resistor 3 is provided, on which a metal heat conducting member 9'is further protected, like the heat conducting member 9 of the thermal head shown in FIG. The layer 6 is provided. As with the thermal head shown in FIG. 5, this thermal head has a large gap between the surface of the resistor 3 and the surface of the print dot portion P between both electrodes by the thickness of both electrodes, which deteriorates the thermal efficiency and protects it. Layer 6
After the provision of the protective layer 6 attached to the surface of the heat conducting member 9 '
However, the manufacturing process is more complicated than that of the thermal head manufacturing process shown in FIG.

さらに、第3図乃至第6図のサーマルヘツドは、ラフペ
ーパーに対しても容易に鮮明な印字を行い得るエッジタ
イプに構成することが困難なものである。すなわち、第
3図乃至第6図のサーマルヘツドは、共通電極5の全部
を繋ぐ部分を図よりもさらに左側に設けるようなもので
あり、そのために、印字ドット部Pの位置すなわち、両
電極4,5間の抵抗体3の位置か基板1のエッジから内側
に離れるようになる。このようなサーマルヘツドで、表
面粗さの粗い、平滑度が5〜10秒と言った、欧米では記
録紙に好ましいとされているラフペーパーに記録しよう
とすると、通常の条件では印字が極めて不鮮明になるの
で、通常の条件よりも強く記録紙を印字ドット部Pに押
圧させなければならない。これに対して、印字ドット部
Pの位置を基板1のエッジに近く設けたエッジタイプの
サーマルヘツドにあっては、記録紙をサーマルヘツドに
対して斜めに当接させるようになるので、印字ドット部
Pと記録紙の圧接が良好となり、ラフペーパーに対して
も通常の条件で鮮明な印字を行うことができる。
Further, it is difficult to form the thermal heads shown in FIGS. 3 to 6 into an edge type which can easily and clearly print on rough paper. That is, the thermal head shown in FIGS. 3 to 6 is such that a portion connecting all of the common electrodes 5 is provided on the further left side of the drawing. Therefore, the position of the print dot portion P, that is, both electrodes 4 are provided. The distance between the resistor 5 and the resistor 3 is inward from the edge of the substrate 1. With such a thermal head, if you try to record on rough paper, which is said to have rough surface roughness and smoothness of 5 to 10 seconds, which is said to be preferable for recording paper in Europe and America, the printing is extremely unclear under normal conditions. Therefore, it is necessary to press the recording paper against the print dot portion P more strongly than under normal conditions. On the other hand, in the case of the edge type thermal head in which the position of the print dot portion P is provided close to the edge of the substrate 1, the recording paper is contacted obliquely with respect to the thermal head. The pressure contact between the portion P and the recording paper is good, and clear printing can be performed even on rough paper under normal conditions.

〔発明の目的〕[Object of the Invention]

本発明は、上記の背景に基いてなされたものであり、印
字ドット部の表面と抵抗体の表面との距離を短縮して印
字ドット部に窪みを生ぜしめず、しかも製造工程が簡単
なサーマルヘツドの提供を第1の目的とし、エッジタイ
プのサーマルヘツドの提供を第2の目的としてなされた
ものである。
The present invention has been made based on the background described above, the distance between the surface of the printing dot portion and the surface of the resistor is shortened, and the printing dot portion is not dented, and the thermal process is simple. The first purpose is to provide the head, and the second purpose is to provide the edge type thermal head.

〔発明の構成〕[Structure of Invention]

本発明は、支持部材上に設けられた補助電極層と、少な
くとも前記支持部材の端部における補助電極層の一部を
残して、前記補助電極層上に設けられた絶縁層と、前記
絶縁層上に設けられ、さらに、前記支持部材の端部にお
いて前記絶縁層が設けられていない前記補助電極層の一
部の上にも設けられた抵抗体層と、前記支持部材の端部
側において、前記絶縁層と重なることなく、かつその端
部が前記抵抗体層を介して前記絶縁層の端部と対向する
よう、前記抵抗体層上に設けられ、さらに前記補助電極
層上にも設けられた第2電極と、前記抵抗体層上に前記
第2電極と直接接しないように設けられた第1電極と、
を有することを特徴とするサーマルヘッドにあり、この
構成によって上記目的を達成する。
The present invention provides an auxiliary electrode layer provided on a supporting member, an insulating layer provided on the auxiliary electrode layer leaving at least a part of the auxiliary electrode layer at an end portion of the supporting member, and the insulating layer. A resistor layer provided on the support member, which is also provided on a part of the auxiliary electrode layer on which the insulating layer is not provided at the end of the support member, and at the end of the support member, It is provided on the resistor layer so as not to overlap with the insulating layer and so that the end portion faces the end portion of the insulating layer through the resistor layer, and is also provided on the auxiliary electrode layer. A second electrode, and a first electrode provided on the resistor layer so as not to be in direct contact with the second electrode,
The thermal head is characterized by having:

〔実施例〕〔Example〕

以下、本発明を第1図及び第2図に示した実施例によっ
て説明する。
The present invention will be described below with reference to the embodiments shown in FIGS. 1 and 2.

第1図は本発明のサーマルヘツドの例を示す要部断面
図、第2図は第1図のサーマルヘツドの保護層を除いた
部分平面図である。
FIG. 1 is a sectional view of an essential part showing an example of the thermal head of the present invention, and FIG. 2 is a partial plan view of the thermal head of FIG. 1 excluding a protective layer.

第1図と第2図に示した本発明のサーマルヘツドは、基
板1上にグレーズ層の蓄熱層2を基板1のエッジに沿っ
て設けるようにし、次に蓄熱層2と基板1の表面を覆う
ように信号電極や共通電極と同じ金属層から成る補助電
極層5′を形成し、あとは絶縁層8を基板1の端部にお
ける補助電極層5′の一部を残して補助電極層5′上に
形成する。次に抵抗体層3を絶縁層8上と、さらに基板
1の端部において絶縁層が設けられていない補助電極層
5′の一部の上にも形成する。ついで抵抗体層3上には
第1電極である信号電極4を設け、基板1の端部側にお
いて絶縁層8と重なることなく、かつその端部が抵抗体
層3を介して絶縁層8の端部と対向するよう抵抗体層3
上に第2電極である共通電極5が設けられる。この共通
電極5は一部において第2図に示されるように部分的に
直接補助電極層5′と接続し、抵抗体層面より低くなっ
た基板1端部に設けられて、抵抗体層3とほぼ連続した
同じ高さに形成される。このようにして信号電極4と共
通電極5とは抵抗体層3を介して対向する。そして最後
に、全体の上面を覆う保護層6を設けることによって製
造される。
In the thermal head of the present invention shown in FIGS. 1 and 2, the heat storage layer 2 of the glaze layer is provided on the substrate 1 along the edge of the substrate 1, and then the heat storage layer 2 and the surface of the substrate 1 are provided. An auxiliary electrode layer 5'made of the same metal layer as the signal electrode and the common electrode is formed so as to cover the insulating electrode 8 and the insulating layer 8 is left at a part of the auxiliary electrode layer 5'at the end of the substrate 1 to leave the auxiliary electrode layer 5 '. ′ On top. Next, the resistor layer 3 is formed on the insulating layer 8 and also on a part of the auxiliary electrode layer 5 ′ where the insulating layer is not provided at the end portion of the substrate 1. Then, the signal electrode 4 as the first electrode is provided on the resistor layer 3 so that the end portion of the substrate 1 does not overlap with the insulating layer 8 and the end portion of the insulating layer 8 is interposed via the resistor layer 3. Resistor layer 3 facing the end
The common electrode 5, which is the second electrode, is provided on the top. Part of this common electrode 5 is partially directly connected to the auxiliary electrode layer 5 ′ as shown in FIG. 2 and is provided at the end of the substrate 1 which is lower than the surface of the resistor layer to form the resistor layer 3. They are formed almost continuously at the same height. In this way, the signal electrode 4 and the common electrode 5 face each other via the resistor layer 3. And finally, it is manufactured by providing a protective layer 6 covering the entire upper surface.

このサーマルヘツドは少なくとも第3図のサーマルヘツ
ドの欠点を解消し、しかも、補助電極5′を設けたこと
でエッジ側の共通電極5の幅を非常に狭いものとするこ
とができるから、それによりエッジタイプのサーマルヘ
ツドとして、ラフペーパーに対しても容易に鮮明な印字
を行うことができる。このサーマルヘツドの製造工程
は、金属層の補助電極5′を設ける工程が一工程増え
て、見掛上、第4図のサーマルヘツドと同じ工程数とな
るが、全体で一つの補助電極5′を設けることは第4図
のサーマルヘツドの抵抗体3毎に独立の細かいパターン
の金属層7を設けなければならない製造工程よりもずと
簡単である。従って、第5図や第6図のサーマルヘツド
の製造工程よりも著しく簡単である。
This thermal head eliminates at least the drawbacks of the thermal head shown in FIG. 3, and since the auxiliary electrode 5'is provided, the width of the common electrode 5 on the edge side can be made extremely narrow. As an edge type thermal head, clear printing can be easily performed even on rough paper. In the manufacturing process of this thermal head, the process of providing the auxiliary electrode 5'of the metal layer is increased by one process, and the number of processes is apparently the same as that of the thermal head of FIG. It is much simpler than the manufacturing process of FIG. 4 in which the metal layer 7 having an independent fine pattern is provided for each resistor 3 of the thermal head. Therefore, it is significantly simpler than the manufacturing process of the thermal head shown in FIGS.

なお、第1図に示した本発明のサーマルヘツドは、抵抗
体3を第2図に示したように、信号電極4と共通電極5
の中間に、両電極と接続している部分の一様幅よりも回
路幅が狭い、長さlのミヤンダ回路部を有する平面形状
にして、この発熱が大きくなるミヤンダ回路部が感熱紙
10やインクリボンに密接する印字ドット部Pの位置に来
るようにしている。このようにしたことで、輪郭までも
鮮明なドット印字を行うことができる。
In the thermal head of the present invention shown in FIG. 1, the resistor 3 has the signal electrode 4 and the common electrode 5 as shown in FIG.
In the middle of, a plane shape having a length 1 linder circuit portion whose circuit width is narrower than the uniform width of the portion connected to both electrodes is used.
10 and the position of the print dot portion P which is in close contact with the ink ribbon. By doing so, it is possible to perform clear dot printing even on the contour.

本発明は、以上述べた例に限らず、信号電極と共通電極
の位置が入れ換わっていても、抵抗体がミヤンダ回路部
を有しないものでもよい。
The present invention is not limited to the examples described above, and the positions of the signal electrode and the common electrode may be interchanged, and the resistor may not have the Myanmar circuit part.

〔発明の効果〕〔The invention's effect〕

以上述べたように、本発明の端部に印字ドット部を有し
たエッジタイプのサーマルヘツドは、補助電極を設けた
ことによってエッジ側の共通電極の幅を非常に狭くする
ことでき、印字ドット部はエッジ部に近接して設けられ
るので、ラフペーパーに対しても容易に鮮明な印字を行
うことができる。また抵抗体層と第2電極とはほぼ同一
面をなすよう形成されているので、印字ドット部に窪み
を生ぜしめず、印字ドット部と抵抗体層の表面距離を小
さくできて熱効率に優れた特徴をも有している。また製
造工程も従来の印字ドット部に窪みを生ぜしめないサー
マルヘツドに比較すると遥に簡単な製造工程で作られる
と言う多くの効果を奏する。
As described above, the edge-type thermal head having the print dot portion at the end of the present invention can make the width of the common electrode on the edge side extremely narrow by providing the auxiliary electrode, Since it is provided close to the edge portion, clear printing can be easily performed even on rough paper. Further, since the resistor layer and the second electrode are formed so as to be substantially flush with each other, no recess is formed in the print dot portion, and the surface distance between the print dot portion and the resistor layer can be reduced, resulting in excellent thermal efficiency. It also has features. Further, the manufacturing process has many effects that it can be manufactured by a much simpler manufacturing process as compared with the conventional thermal head which does not cause a depression in the printed dot portion.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明のサーマルヘツドの例を示す要部断面
図、第2図は第1図のサーマルヘツドの保護層を除いた
部分平面図、第3図,第4図及び第5図,第6図はそれ
ぞれ従来のサーマルヘツドの要部断面図及び要部斜視図
である。 1……基板、2……蓄熱層、 3……抵抗体(層)、4……信号電極(層)、 5……共通電極(層)、5′……補助電極(層)、 6……保護層、8……絶縁層、 P……印字ドット部。
FIG. 1 is a cross-sectional view of an essential part showing an example of a thermal head of the present invention, FIG. 2 is a partial plan view of the thermal head of FIG. 1 excluding a protective layer, FIGS. 3, 4, and 5, FIG. 6 is a cross-sectional view and a perspective view of a main part of a conventional thermal head. 1 ... Substrate, 2 ... Heat storage layer, 3 ... Resistor (layer), 4 ... Signal electrode (layer), 5 ... Common electrode (layer), 5 '... Auxiliary electrode (layer), 6 ... ... Protective layer, 8 ... Insulating layer, P ... Print dot part.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】支持部材上に設けられた補助電極層と、 少なくとも前記支持部材の端部における補助電極層の一
部を残して、前記補助電極層上に設けられた絶縁層と、 前記絶縁層上に設けられ、さらに、前記支持部材の端部
において前記前縁層が設けられていない前記補助電極層
の一部の上にも設けられた抵抗体層と、 前記支持部材の端部側において、前記絶縁層と重なるこ
となく、かつその端部が前記抵抗体層を介して前記絶縁
層の端部と対向するよう、前記抵抗体層上に設けられ、
さらに前記補助電極層上にも設けられた第2電極と、 前記抵抗体層上に前記第2電極と直接接しないように設
けられた第1電極と、を有することを特徴とするサーマ
ルヘッド。
1. An auxiliary electrode layer provided on a support member; an insulating layer provided on the auxiliary electrode layer, leaving at least a part of the auxiliary electrode layer at an end portion of the support member; A resistor layer that is provided on a layer and that is also provided on a part of the auxiliary electrode layer where the leading edge layer is not provided at the end of the support member, and the end side of the support member. In, without overlapping with the insulating layer, and so that the end portion thereof faces the end portion of the insulating layer via the resistor layer, it is provided on the resistor layer,
The thermal head further comprises a second electrode also provided on the auxiliary electrode layer, and a first electrode provided on the resistor layer so as not to be in direct contact with the second electrode.
JP60233015A 1985-10-18 1985-10-18 Thermal head Expired - Fee Related JPH0667630B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60233015A JPH0667630B2 (en) 1985-10-18 1985-10-18 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60233015A JPH0667630B2 (en) 1985-10-18 1985-10-18 Thermal head

Publications (2)

Publication Number Publication Date
JPS6292862A JPS6292862A (en) 1987-04-28
JPH0667630B2 true JPH0667630B2 (en) 1994-08-31

Family

ID=16948473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60233015A Expired - Fee Related JPH0667630B2 (en) 1985-10-18 1985-10-18 Thermal head

Country Status (1)

Country Link
JP (1) JPH0667630B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3114790B2 (en) * 1995-12-28 2000-12-04 ローム株式会社 Thermal head
JP2793541B2 (en) * 1995-12-28 1998-09-03 ローム株式会社 Thermal head

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58181550U (en) * 1982-05-31 1983-12-03 日本電気株式会社 head for thermal printer
JPS6072752A (en) * 1983-09-29 1985-04-24 Fujitsu Ltd Thermal head
JPS60106738U (en) * 1983-12-26 1985-07-20 ロ−ム株式会社 thermal printing head

Also Published As

Publication number Publication date
JPS6292862A (en) 1987-04-28

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