JPH0665472U - Racking structure for plating - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a racking structure for plating that can obtain a uniform plating thickness regardless of the mounting position of a printed wiring board on a rack. In a racking structure for plating having a rack 4 on which a plate 2 to be plated is mounted and a current supply section 7 for supplying a current for plating to the rack 4, the rack 4 is circular and the plate 2 to be plated 2 is a rack 4. The corresponding positions from the center of the rack 4 are arranged along the circumferential direction of the above so as to be equal among the plurality of plated plates 4, and the current supply unit 7 is arranged at the central position.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a plating racking structure, and more particularly to a plating racking structure used in an electrolytic plating process of a printed wiring board.

[0002]

[Prior art]

 The racking structure used in the conventional plating process of a printed wiring board is shown in FIG. The rectangular plating rack is provided with a plurality of openings for mounting the printed wiring board, and the printed wiring board 2 is attached to the openings using the fixing claws 3 mounted on the rack 1. Has become. In this way, the plurality of printed wiring boards 2 are inserted into the plating layer while being attached to the rack 1, and a negative voltage is applied to the rack 1 to perform electrolytic plating on the surface of the printed wiring board 2. Be seen.

[0003]

[Problems to be solved by the device]

 However, in the above-mentioned conventional racking structure, the position of the printed wiring board 2 in the plating layer does not change during the electrolytic plating. Therefore, the distance from the electrode, which is provided facing the plating rack 1 and to which the positive voltage is applied, differs for each printed wiring board 2. Further, when the electrolytic plating solution is circulated, the circulation of the plating solution varies depending on the position where the printed wiring board 2 is attached. Therefore, there is a problem that a difference occurs in the plating thickness of the printed wiring board 2 in the same rack, and it is difficult to make the plating thickness uniform.

The present invention has been made to solve the above-described problems, and provides a racking structure for plating that can obtain a uniform plating thickness regardless of the mounting position of the printed wiring board on the rack. With the goal.

[0005]

According to the present invention, in a plating racking structure having a rack on which a plate to be plated is mounted and a current supply unit for supplying a plating current to the rack, the rack is circular, The plated plates are arranged along the circumferential direction of the rack so that the corresponding positions from the center of the rack are equal among the plated plates, and the current supply unit is arranged at the central position. Is.

[0006]

[Action]

 In the present invention, the plating rack is circular, and the plates to be plated are arranged along the circumferential direction. Then, after immersing this rack in the plating layer, it is rotated around the center position. Therefore, the relative position of each plate to be plated with respect to the positive voltage supply electrode is substantially uniform. Further, even when the plating liquid is circulated, each plate to be plated receives the circulation liquid under the relatively same condition. As a result, a uniform plating thickness can be obtained.

[0007]

【Example】

 FIG. 1 shows a racking structure for plating according to an embodiment of the present invention. FIG. 1 (a) is a plan view thereof, and FIG. 1 (b) is a perspective view showing a rotating mechanism. In the present invention, the rack for the microphone is constructed as the rotary rack 4.

The rotary rack 4 has a circular shape and is provided with an opening along the circumferential direction for mounting the printed wiring board 2, and the printed wiring board 2 is fixed to the opening by using fixing claws 3. To do. Therefore, the relative positions of the printed wiring boards 2 from the center position 7 are arranged so as to be equal to each other. Then, a rack fixing bar 6 as shown in FIG. 1 (b) is inserted into the center position 7 and rotatably attached.

Since the rack fixing bar 6 is connected to a cathode of a plating power source (not shown), the plating voltage is supplied to the rotary rack 4 from its center position 7. In this way, the rotating rack 4 is inserted into the plating bath with the printed wiring board 2 to be plated attached, and the belt 5 provided around the rack 4 moves the rack 4 around the center position 7 in the plating bath. To rotate. At this time, the belt needs to be made of a conductive material so that the plating does not adhere during the plating process. The rotation speed of the rack 4 must be determined in advance by experiments or the like so that the plating thickness on the printed wiring board 2 will be uniform.

[0010]

[Effect of device]

 As described in detail based on the above embodiments, in the present invention, the racking structure of the electroplating process uses a circular rotary rack, and the positions from the center to the periphery of the rack are the same between the plated plates. Since the arrangement is made so that the electric current is supplied from the central position, it is possible to reduce the difference in the plating thickness depending on the position from the plating electrode provided facing the rack.

Further, during the plating process, the rack rotates 360 degrees, so that the degree of dependence on the circulation of the plating solution in the plating tank is reduced. For this reason, it is possible to make the plating thickness of the plated board such as the printed wiring board uniform in the same rack. Furthermore, it is easy to control the plating thickness, which can contribute to the improvement of manufacturing yield.

[Brief description of drawings]

FIG. 1 is a plan view and a perspective view showing a plating racking structure according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an example of a conventional plating racking structure.

[Explanation of symbols]

 2 Printed wiring board 3 Fixing claw 4 Rotating rack 5 Belt 6 Rack fixing bar

Claims (1)

[Scope of utility model registration request] 1. A racking structure for plating having a rack on which a plate to be plated is mounted and a current supply unit for supplying a current for plating to the rack, wherein the rack is circular and the plate to be plated is a circle of the rack. A racking structure for plating, characterized in that corresponding positions from the center of the rack are arranged along the circumferential direction to be equal among the plurality of plates to be plated, and the current supply unit is arranged at the center position.