JPH0662791U - Power supply - Google Patents

Abstract

(57) [Summary] [Purpose] The amount of resin to be injected and filled can be reduced to reduce cost and weight, and a simple structure can be used even when using electronic parts that require a structure to prevent sealing. (EN) Provided is a power supply device capable of cost reduction. [Structure] A power supply case 1 is partitioned into a plurality of regions by a partition 1a, and a resin 4 is injected into one region 1b partitioned by the partition 1a. At least a part of the electronic components 5a and 5b mounted on the substrate 3 that require heat radiation is embedded in the injection resin 4, and the other region 1c is a non-injection region of the resin, and the electronic component 5c that relatively does not require heat radiation is arranged. did.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a power supply device such as an AC-DC converter or a DC-DC converter, and more specifically, a substrate on which electronic parts are mounted is housed in a resin case and sealed with an electronic device. The present invention relates to a structure in which parts are fixed.

[0002]

[Problems to be solved by conventional techniques and devices]

 A power supply device in which electronic components such as semiconductors, transformers, capacitors, and resistors are mounted on a board, and the board is housed in a resin case is conventionally used to efficiently dissipate the heat generated by each electronic component. -A structure in which a resin such as soft epoxy, silicon, or urethane, which has better thermal conductivity than air, is injected into the case and the heat generated from the electronic parts is radiated from the outer peripheral surface of the case using the resin as a medium. It is taken.

However, in the conventional power supply device, since the resin is injected into almost the entire inside of the case, a large amount of resin is injected, which results in a high cost and an increase in weight. was there. When using electronic parts that must not be sealed, such as an electrolytic capacitor with an explosion-proof valve (since the valve will not work properly if sealed with resin), for example, store the electrolytic capacitor in a separate case. There is also a problem that a structure that prevents sealing, such as a double structure, is required, the number of parts increases, and the structure becomes complicated, resulting in high cost.

In view of the above circumstances, the present invention can reduce the amount of resin to be injected and filled to reduce cost and weight, and also has a simple structure when using electronic components that should not be sealed. It is an object of the present invention to provide a power supply device that can be manufactured at a reduced cost.

[0005]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention partitions a case of a power source into a plurality of areas by partitions, injects resin into one area partitioned by the partitions, and mounts the injected resin on a substrate. Another feature is that at least a part of the electronic component that requires heat radiation is buried, and the other region is a non-injection region of resin, and an electronic component that does not require relatively heat radiation is arranged in the non-injection region.

[0006]

[Action]

 In the power supply device of the present invention, the heat of the electronic component that requires heat radiation is radiated from the injected resin to the case. Since the injected resin is injected into the case only for electronic components that require heat dissipation, the amount of injected resin is small.

[0007]

【Example】

 1 is an exploded perspective view of an embodiment of a power supply device according to the present invention, FIG. 2 (A) is a side sectional view of the embodiment, and FIG. 2 (B) is an EE sectional view of FIG. 2 (A). In FIG. 1, 1 is a resin case whose inside is divided into two regions by a partition 1a, 2 is a resin lid, and 3 is a substrate on which electronic components 5a to 5c are mounted. A resin 4 such as soft epoxy, silicon, or urethane is poured into one of the divided regions 1b of 1 and the other region 1c is a region where the resin is not injected.

As shown in FIGS. 1 and 2A, semiconductor components such as transistors and diodes, or electronic components 5 a and 5 b that require heat radiation such as transformers are regions where the resin 4 is poured. Electronic components 5d, 5e such as capacitors, fuses, inductors, etc. that do not require comparative heat radiation and electrolytic capacitors 5c with explosion-proof valves, etc. must not be sealed. The component is mounted on the substrate 3 so as to enter the region 1c where the resin 4 is not injected. The substrate 3 on which the electronic components 5a to 5e are mounted in this manner is mounted on the convex portion 1i formed on the inner wall of the case 1 and assembled. Further, the lid 2 is attached to the case 1 by inserting the external connection terminals 3a of the substrate 3 into the holes 2a formed in the lid 2 and the holes 2b formed at the four corners of the lid 2 in the case. It is carried out by fitting the projections 1d at the four corners of No. 1 and the claws 2c of the lid 2 into the holes 1e formed on the side surface of the case 1 elastically. A protrusion 2d formed by projecting outward on the outer peripheral portion of the lid 2 is fitted into a recess 1f formed in the opening of the case 1 to prevent rattling between the lid 2 and the case 1. In addition to the prevention, the formation positions of the concave portions 1f and the convex portions 2d are set to be asymmetrical positions to prevent mistakes in the assembling direction of the lid 2.

Further, as shown in FIG. 2B, in the electronic component 5a (or 5b) that requires heat dissipation, at least a heat generating portion such as the electrode plate 6 is completely covered with the resin 4 in order to improve heat dissipation efficiency. It is desirable to be embedded in the casing and to be arranged as close as possible to the outer peripheral side surface portion of the case 1. Further, in the above embodiment, the partition 1a is constituted by the rib integrated with the case 1, but a separate partition plate may be attached to the case 1 by fitting or adhering. Good.

In this way, the case 1 is partitioned by the partition 1a, and the resin 4 is injected only into the regions where the electronic components 5a and 5b that require heat radiation are arranged. Therefore, the amount of injected resin is reduced. Therefore, cost reduction and weight reduction can be achieved. Also, by disposing the electrolytic capacitor 5c with the explosion-proof valve 7 in the region 1c where the resin 4 is not injected, it is possible to cope with the structure without complicating it and without increasing the number of parts, and it is possible to reduce the cost. be able to. Further, by forming the partition 1a, the rigidity of the case 1 is improved, and the deformation of the case 1 can be prevented.

3A to 3C are plan views showing a case of another embodiment of the power supply device according to the present invention, and FIG. 3D is a sectional view taken along line FF of FIG. 3B. In the example of FIG. 3 (A), the partition 1a is formed in a curved shape, and in the examples of FIGS. 3 (B) and 3 (C), the partition 1a is formed in a quadrangular shape or a circular cylindrical shape, respectively. Is. These partitions 1a are selected according to the type and quantity of electronic components mounted on the board 3 and their layout. For example, as shown in FIG. 3 (D), when a round rectifying bridge 8 is used, a case is used in which the partition 1a is formed into a circular tubular shape in accordance with the shape of the rectifying bridge 8. The electrode plate 6 of the rectifying bridge 8 is embedded in the resin 4 toward the bottom surface 1h of the case.

By thus forming the shape of the partition 1a according to the electronic component to be used, the region 1b into which the resin 4 is injected is optimized and the injection amount of the resin 4 is minimized. As a result, cost reduction and weight reduction can be achieved.

[0013]

[Effect of device]

 According to the present invention, a resin is injected into one area of a case divided into a plurality of partitions, and an electronic component that requires heat dissipation is embedded in the injected resin, while the other resin is not injected. Since the electronic components that do not require heat dissipation are placed, the resin injected into the case only needs to be in the area where the electronic components that require heat dissipation are placed, and the amount of resin injected can be reduced. Down and weight reduction can be achieved.

Further, in the case of using a component that should not be sealed, such as an electrolytic capacitor with an explosion-proof valve, by disposing the electrolytic capacitor in a region where resin is not injected, the structure is not complicated and the component is Since it can be handled without increasing the number of points, it is possible to reduce costs.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an embodiment of a power supply device according to the present invention.

2A is a side sectional view of the embodiment, and FIG. 2B is a sectional view taken along line EE of FIG.

3A to 3C are plan views showing another example of the case according to the present invention, and FIG. 3D is a sectional view taken along line FF of FIG. 3B.

[Explanation of symbols]

 1 case 1a Partition 1b Resin injection area 1c Resin non-injection area 2 Lid 3 Substrate 4 Resin 5a-5e Electronic parts 6 Electrode plate 7 Explosion-proof valve 8 Rectification bridge

Claims (1)

[Scope of utility model registration request] 1. A power supply case is partitioned into a plurality of regions by partitions, and a resin is injected into one of the regions partitioned by the partitions so that the injected resin requires heat radiation mounted on a substrate. A power supply device, wherein at least a part of an electronic component is embedded, and the other region is a non-injection region of resin, and an electronic component which does not require heat radiation relatively is arranged in the non-injection region.