JP2002320313A - Control unit structure for vehicle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the efficiency of assembly work by facilitating the alignment of leads while securing heat radiative property, in case that a printed board for mounting and fixing a heat generating electronic part with its leads upward is stored in a control unit for a vehicle. SOLUTION: A resinous case body (case body 14) for storing a board (a printed board 62) is mounted on a metallic base (base 12) which functions as a heat sink, with the heating part ( power transistor 18) fixed. A recessed storage 70 capable of storing the heating part is made in the main body of the resinous case so as to store the heating part, also a lead passage hole 80 is bored in the wall face (power transistor contact face 76) of the recessed storage, and the lead 18 extended from the electronic part is passed. Moreover, a second lead passage hole 62a leading to the lead passage hole is bored in the board and the lead is passed therein.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a control unit structure for a vehicle.

[0002]

2. Description of the Related Art Recently, a vehicle control unit (hereinafter referred to as a "unit"), which has been arranged in a vehicle compartment, has been moved to an engine room or the like of a vehicle, thereby shortening a harness used and reducing costs. In addition to reducing the noise applied to other electrical components, it has been practiced.

Since the interior of the engine room has a higher temperature and humidity atmosphere than the interior of the vehicle, the units disposed therein must maintain high waterproofness, and heat-generating electronic components (heat-generating components) are contained therein. ) Needs to be quickly radiated. From that intention, for example,
As disclosed in Japanese Patent No. 1324992, a technique has been proposed in which an electronic component having leads is directly attached to an aluminum case or the like having a high heat dissipation property to dissipate heat.

[0004]

According to the prior art, when the leads of the electronic component on which the pudding and the substrate are mounted are accommodated in an aluminum case with the leads facing upward, the lead forming and mounting of the electronic component are performed. In order to solve the problem that the workability is deteriorated due to the variation of the angle and the mounting position, a large-diameter lead insertion hole is continuously provided to the lead connection hole on the printed circuit board.

However, in this prior art,
Since the large-diameter lead insertion hole is connected to the lead connection hole on the printed circuit board, not only the mounting density of the printed circuit board is reduced, but also solder falls off from the insertion hole when soldering, causing soldering failure There was fear. Also, if the amount of solder is increased to eliminate such soldering defects,
There is a possibility that the pitch between the insertion holes becomes small and short-circuit occurs between the insertion holes or between the leads.

Therefore, the present invention provides a control unit for a vehicle in which heat dissipation is ensured even when a printed circuit board in which leads of heat-generating electronic components are fixed and mounted upward is accommodated. It is an object of the present invention to provide a vehicle control unit structure that facilitates alignment of leads and improves workability of assembly.

[0007]

In order to solve the above-mentioned problems, according to the present invention, at least a metal base to which at least a heat-generating component is fixed, and a resin base bonded to the metal base are provided. In a vehicle control unit structure comprising a case body and a substrate housed inside the resin case body and connected to a lead extended from the heat-generating component and mounted in an engine room of the vehicle,
A concave accommodating portion is formed in the resin case body to accommodate the heat-generating component, and a lead insertion hole is formed in a wall surface forming the concave accommodating portion, and the lead is inserted into the lead insertion hole. It was configured as follows.

[0008] A concave housing portion capable of housing the heat-generating component is formed and housed in a case body bonded to a metal base to which the heat-generating component is fixed (functioning as a heat sink). A lead insertion hole is drilled in the wall surface forming the, more specifically, a lead insertion hole is drilled at a position where a lead extended from the electronic component is inserted when the electronic component is housed in the concave housing portion. As a result, even when the printed circuit board on which the leads of the heat-generating electronic components are fixed and mounted on the board is housed, it is easy to assemble the leads while ensuring heat dissipation. Performance can be improved. In addition, since the concave receiving portion is provided, there is no influence such as an increase in the height of the unit.

According to a second aspect of the present invention, a second lead insertion hole communicating with the lead insertion hole is formed in the substrate, and the lead is inserted through the second lead insertion hole. Configured.

A second lead insertion hole communicating with the lead insertion hole is formed in the substrate, and the lead is inserted through the second lead insertion hole. More specifically, the electronic component is accommodated in the concave accommodating portion. When the unit is assembled, the lead insertion hole and the second lead insertion hole are formed so as to be drilled at the position where the lead is inserted. Therefore, when assembling the unit, the alignment of the lead can be further facilitated. The efficiency of the assembling work can be further improved.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a vehicle control unit according to one embodiment of the present invention will be described below with reference to the accompanying drawings. The vehicle control unit structure according to this embodiment is mounted in an engine room of a vehicle (not shown), more specifically, on a room wall surface or an intake pipe of an engine.

FIG. 1 is a top view for explaining the structure of a vehicle control unit (hereinafter referred to as "unit") 10 according to one embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II of FIG. It is.

The unit 10 includes a resin case main body, a metal collar molded into the resin case main body, and a metal base having a bolt insertion hole and on which a heat-generating component is arranged. The outer peripheral surface of the metal collar that comes into contact with the resin case body is formed in an uneven shape, and is formed so as to protrude from the resin case body in the bolt insertion direction.
Further, the resin case body is assembled to the metal base via an adhesive, and the metal collar and the metal base are fixed together by bolts together.

The unit 10 is generally made of a base material (metal base) 12 made of a metal material having a high heat dissipation property such as aluminum and functioning as a heat sink, and made of a resin material. 14a
Is mounted on the base 12 (resin case)
14 and a resin material, and its peripheral edge (described later)
Is provided with a cover 16 (not shown in FIG. 1) formed to be housed and bonded in a groove (described later) formed around the upper end 14b of the case body 14.

As shown in FIG. 2, the base 12 is formed in a substantially flat plate shape, and a heat-generating electronic component, specifically, a power transistor (heat generating component) 18 is in contact with a substantially trapezoidal heat generating portion in a side view. The component fixing part 20 is formed.

Four bolt holes 24 (only two are shown) are formed in the heat-generating component fixing portion 20 at positions corresponding to the power transistor fixing holes 22 formed in the power transistor 18. By inserting the power transistors 18 into the holes 24, a total of four power transistors 18 are attached.

A base-side bolt insertion hole 28 through which a bolt (described later) for fixing the unit 10 is inserted is formed below the collar, which will be described later. The rib-shaped protrusion 30 is formed over the entire circumference. The configuration of the protrusion 30 will be described later. In this specification, “upward” means an upward direction (that is, the cover 16 side) with respect to the case main body 14 in FIG. 2, and “downward” means a downward direction (that is, the base 12 side). To tell.

The case body 14 has a substantially hexagonal shape when viewed from the top, and its internal space has a substantially rectangular shape, and is molded from a resin material such as PBT (polybutylene terephthalate).

A collar 32 made of a substantially cylindrical metal material and having a collar-side bolt insertion hole 31 is provided outside the vicinity of the center of two substantially rectangular opposite sides of the case body 14.
Are molded integrally with the case body 14.
The bolt insertion holes 28 and 31 are formed at positions where bolts described later are aligned so that they can communicate with each other.

FIG. 3 is a side view of the collar 32. As well shown in the figure, the outer peripheral surface where the collar 32 contacts the case main body 14 is formed in an uneven shape. More specifically, on the outer peripheral surface where the collar 32 contacts the case main body 14, a retaining recess 34 is provided in advance in a lateral direction as shown in FIG. 3 at an appropriate position near the center in the vertical direction (bolt insertion direction). , Flat knurling is performed in the vertical direction (bolt insertion direction).

Since the retaining recess 34 is formed on the outer peripheral surface of the collar 32, the unit 1 is fastened with bolts.
Even when vibration is applied to 0, or when each member expands or contracts due to a temperature change in the surroundings,
The collar 32 does not fall out of the case body 14.
Further, since the flat knurl is applied to the outer peripheral surface of the collar 32, the collar 32 does not run idle inside the case body 14.

In this embodiment, the color 3
While the outer peripheral surface of 2 was subjected to flat knurling and the retaining recess 34 was formed, other than this, for example, if the outer peripheral surface of the collar 32 was subjected to twill knurling or the like, the retaining concave 34 was formed. Without the collar 32, it is possible to prevent the idling of the collar 32 in the case main body 14 and prevent the collar 32 from being displaced from the case main body 14 in the bolt insertion direction.

FIG. 4 is a partially enlarged sectional view of the periphery of the collar 32 of FIG.

As shown in FIG. 1, the collar 32 is, for example, 0.2 mm from the lower end 14a and the upper end 14b of the case body 14.
The lower end 32 a of the collar 32 is in direct contact with the base 12, and the upper end 32 b is in direct contact with the bolt 98. Thereby, when assembling the unit 10, the unit 10 can be assembled with only metal members, and particularly, the thermal shock resistance and the assembling strength of the fastening portion in the engine room can be secured.

Around the lower end 14a of the case body 14, an outer wall portion 14c formed in a skirt shape is provided. This makes it difficult for oils, fats, water droplets, dust, and the like to come into contact with the adhesive 40 between the case body 14 and the base 12, thereby further improving the bonding reliability.

Further, in the unit 10, a concave portion is provided in one of the case body 14 and the base 12, and a convex portion to be inserted into the concave portion with a predetermined gap at a position corresponding to the concave portion on the other side. A part is formed. Hereinafter, those configurations will be specifically described with reference to FIG.

FIG. 5 is a partially enlarged sectional view showing a portion indicated by reference numeral A in FIG. 2 in an enlarged manner. As shown in the figure, a concave portion 36 is provided at an appropriate position (described later) on the lower end 14a of the case main body 14 so as to be annular in a bottom view. In addition, the base 12 is provided with a convex portion 30 formed substantially in a rib shape over the entire circumference so as to correspond thereto. The protrusion 30 has a length that the collar 32 protrudes from the lower end 14 a of the case body 14, that is, the length of the protrusion 32.
It is inserted into the concave portion 36 while having a gap 38 of about 2 to 0.5 mm.

The adhesive 40 applied (injected) into the concave portion 36 when the convex portion 30 is inserted into the concave portion 36 at the time of assembling the unit 10 is moved in the lower end 14a direction (lateral direction).
Extruded.

When assembling the unit 10, the case body 1
When a predetermined gap is provided between the base 4 and the base 12, the adhesive 40 is not sufficiently filled in the gap, and waterproofness (sealing properties) and adhesive strength may be impaired.

However, in this embodiment, when assembling the base 12 to the case main body 14, the projection 3
0 is inserted into the concave portion 36 on which the adhesive 40 is applied while having a predetermined gap 38, so that the adhesive 40 extruded from the concave portion 36 can be stretched into the gap 38 and sufficiently filled therein. Is done. Accordingly, waterproofness (sealing property) can be ensured, the bonding area can be increased, and bonding strength can be improved. An adhesive avoiding portion (described later) is provided so that the adhesive 40 does not reach a position where the base 12 and the collar 32 come into contact with each other.

The collar 32 and the base 12 are fastened together by bolts 98 through bolt insertion holes 28 and 31 formed so as to communicate with each other.
0 is fixed integrally.

FIG. 6 is a bottom view of the case body 14 as viewed from below. As shown in FIG. 6, the recess 36 is provided over the entire lower end 14a of the case body 14 as described above. Although not shown, the base 12 has
The projection 30 is provided over the entire circumference to correspond to the above.

In the unit 10, in order to further enhance the waterproofness, a connector connection port and a terminal are integrally formed in the case body 14, and the inside of the (resin) case body 12 is externally provided in the connector connection port. A ventilation hole for communication is formed. Hereinafter, the configurations thereof will be specifically described with reference to FIG.

FIG. 7 is a sectional view taken along the line VII-VII of FIG.
As shown in FIGS. 1, 6 and 7, a connector connection portion 50 is integrally molded with the case main body 14 by resin molding. One end of the connector connection portion 50 is opened to form a connector connection port 52, and a printed circuit board (described later) housed in the unit 10 and a connector (shown by imaginary lines)
Terminal 56 for connecting the connector 54
Is molded integrally with the case body 14 so as to protrude inward.

FIG. 8 is a side view of the unit 10 shown in FIG. 1 as viewed from the opening side of the connector connection port 52. As shown in FIGS. 7 and 8, the connector connection port 52 is provided between the inside and the outside of the case main body 14, that is, the housing section side and the connector connection port 5.
A ventilation hole 58 communicating the two sides is formed.

More specifically, the ventilation hole 58 has a case-side opening 58 a formed below the portion of the case body 14 where the terminal 56 is integrally molded with the resin, and the deepest portion of the connector connection port 52. The connector side opening 58b is formed in the wall surface position of, and is formed by communicating them.

More specifically, when the air inside the unit 10 expands, the air inside the unit 10 flows into the connector connecting portion 50 through the ventilation hole 58, and is further connected to a harness (not shown) connected to the connector 54. ) It is possible to escape to a relatively environmentally friendly place such as inside a vehicle compartment (not shown) through the inside. Also, when the air inside the unit 10 contracts, the air in the vehicle interior or the like flows into the unit 10 following the reverse path of the expansion. Therefore, even if the unit 10 has a structure with a high sealing property under an environment where the temperature change is remarkable, the unit 10 is not affected. When the cover 16 is attached to the case body 14 via a thermosetting adhesive, the inside and the outside of the unit 10 can be ventilated by communicating with each other.

A protrusion 60 (shown in FIGS. 1, 6, and 8) for locking the connector 54 is provided at an appropriate position on the wall surface of the connector connecting portion 50, and is provided on the connector 54 side. The connector 54 is detachably connected to the connector connection portion 50 by an appropriate locking mechanism (not shown).

Further, as shown in FIG.
The upper end 14b of the lower end 14b is formed substantially flat.
A power transistor accommodating portion (described later) capable of accommodating the power transistor 18 is formed inside the a side.

A printed circuit board 62 on which various electronic components are mounted is accommodated in the unit 10. The printed circuit board 62 has leads 18 of the power transistor 18 mounted thereon.
b is connected. The connector 5 is connected to the printed circuit board 62.
A harness (not shown) is locked via 4 to exchange signals with the external configuration. Since those connections are not related to the gist of the present invention, the description is omitted.

Hereinafter, referring to FIG.
Will be described. FIG. 9 is a perspective view partially illustrating the unit 10 shown in FIG. 1 for explaining a partial process of accommodating the power transistor 18 in the case main body 14.

First, the power transistor 18 is housed in the case body 14.

In the case body 14, four power transistor housings (concave housings) 70 of substantially the same size are formed at positions where the power transistors 18 are mounted (only one is shown).

The power transistor accommodating portion 70 is formed substantially in a bathtub shape toward the lower side of the case body 14.
The power transistor contact surface 76, which is a part of the wall surface of the power transistor accommodating portion 70, includes a semicircular cutout and a rectangular cutout, and includes a communication portion 78 that communicates the upper and lower sides of the case body 14, and the power transistor 18 Is used to pass bolts 26 and a tool (not shown) (not shown) when bolted to the base 12.

A part of the power transistor contact surface 76 is formed in a stepped shape, and three lead insertion holes 80 into which the leads 18b of the power transistor 18 can be inserted are formed in each power transistor accommodating portion. Case body 14
Is a board fixing portion 14d on which the printed board 62 can be placed.
(Shown in FIGS. 2, 7, and 9).

The main body 18a of the power transistor 18 is connected to the lead insertion hole 80 by the power transistor accommodating portion 70.
When it is accommodated in the power transistor 18, a lead 18b extending from the power transistor 18 is provided at a position where the lead 18b is inserted.

Next, the relative positions of the base 12, the case body 14, the power transistor 18, and the printed board 62 will be described.

In the unit 10, at least a base 12 (made of metal) to which a power transistor (heat-generating component) 18 is fixed, a case body 14 bonded to the base 12 (made of resin), and an inside of the case body 14 And a lead 18 extended from the power transistor 18
and a printed circuit board (substrate) 62 to which the power transistor 18b is connected. The power transistor accommodating portion 70 is formed in the case main body 14, the power transistor 18 is accommodated therein, and the wall surface (power transistor A lead insertion hole 80 is formed in the contact surface 76, and the lead 18b is inserted into the lead insertion hole 80.

That is, in the unit 10, the base 1
2. The case body 14 and the printed circuit board 62 are arranged in three layers. More specifically, the printed circuit board 62 is disposed above the case body 14 and the power transistor 18 is fixed therebelow.
2 are arranged and assembled in three layers. Since the power transistor accommodating portion 70 is formed in a concave shape, there is no influence such as an increase in the height of the unit 10.

First, the power transistor 18 is housed in the case main body 14, and then the adhesive 40 is applied (injected) to an appropriate position of the lower end 14 a of the case main body 14, specifically, the entire circumference in the concave portion 36 of the case main body 14. You. Note that a silicon-based adhesive capable of absorbing expansion and contraction is used as the adhesive 40.

Next, the case body 14 is placed on the base 12.
(Lower end 14a) is assembled. Specifically, the protrusion 30 provided on the base 12 is fitted so as to be inserted into the recess 36 formed on the case body 14.

As described above, the adhesive 40 applied (injected) into the concave portion 36 is pushed out in the internal and external directions of the case body 14 when the convex portion 30 is inserted, that is, in the horizontal direction in FIG. And the gap 38 is filled. More specifically, the thickness of the adhesive 40 required to secure the bonding strength between the case body 14 and the base 12, that is, the collar 32 protrudes from the lower part of the case body 14 by an appropriate length to obtain a gap 38. Mold.
Therefore, the gap 38 is filled with the adhesive 40, and the adhesive strength is improved.

As shown in FIG. 4, the periphery of the lower end of the molded portion of the collar 32 molded in the case body 14 is formed in a stepped shape, and an adhesive avoiding portion 84 is provided. The adhesive avoiding portion 84 effectively prevents the adhesive 40 from reaching the position of the lower end 32 a of the collar 32.

Further, when the base 12 is assembled to the case body 14, there is a possibility that the base 12 partially moves up and down with the collar 32 projecting from two places as a fulcrum, so that it cannot be assembled with high accuracy. Therefore, as shown in FIG. 6, four base mounting portions 86 are formed at appropriate positions on the lower end 14a of the case main body 12.

The base mounting portion 86 includes a projecting portion 86a and a groove 86b. The projecting portion 86a has a lower end 32a of the collar 32 at a height (specifically, a length in the insertion direction of the bolt insertion holes 28 and 31). It is formed so as to protrude from the lower end 14a of the case body 14 by the same amount as the protruding amount (0.2 to 0.5 mm). The groove 86b is provided with the collar 32.
Is formed in a shape similar to that of the adhesive avoiding portion 84 provided around the lower end of the protrusion 40, and similarly, prevents the adhesive 40 from reaching below the protruding portion 86a.

As shown in FIG. 6, the groove 86b is not formed up to the outer wall 14c. This is the groove 86
If b is designed to be in contact with the outer wall portion 14c, a relatively large thin portion will be formed, and it will be easy for defects (so-called shorts) to occur when performing resin molding.

Next, bolts (not shown) for temporarily fixing the unit 10 are inserted into the collars 32 and the bolt insertion holes 28 and 31 of the base 12, and the collar 32 (that is, the case) is attached using a nut (not shown). The main body 14) and the base 12 are fastened together.

In this state, when the adhesive 40 is cured, the bonding between the base 12 and the case body 14 is completed.

Next, the bolt 26 is inserted into the power transistor fixing hole 22 or the bolt hole 24 (not shown in FIG. 8) through the communication portion 78, and the power transistor 18 is bolted to the base 12.

After the base 12 is fixed (bolted) to the case body 14, the printed circuit board 62 is
Is inserted from an opening formed on the upper end 14b side of the. The inserted printed circuit board 62 is attached to the inner wall 82 of the case body 14.
1 and 2 are lowered along a plurality of substrate guide ribs 88 provided at appropriate places on the side, and are pressed and pressed from above to fix the substrate formed in a hook shape in a side view. Means 90 (FIGS. 1 and 2)
(Shown in FIG. 2) is pushed down until it comes into contact with the substrate fixing portion 14d of the case body 14. Printed circuit board 6
2 contacts the substrate fixing part 14d, the substrate fixing means 90
Returns to its original shape, so that the printed circuit board 62 is fixed.

In the unit 10, a second lead insertion hole 62 a (FIG. 9) communicating with the lead insertion hole 80 is formed in the printed board 62, and the second lead insertion hole 6 is formed.
The lead 18b was inserted through 2a.

More specifically, a lead insertion hole (a second lead insertion hole) 62a formed in the substrate 62 has a structure in which the main body 18a of the power transistor 18 is accommodated in the power transistor accommodating portion 70 and the printed circuit board 62 is Board fixing part 14
d, the lead 18b is inserted into the lead insertion hole 6
2a and the position for inserting the lead insertion hole 80 (1 in FIG. 9).
(Indicated by a dashed line B).

In other words, the lead 18 b protruding from the case main body 14 is guided so as to pass through the lead insertion hole 62 a formed in the printed circuit board 62. Therefore, the alignment between the lead 18b and the lead insertion hole 62a is facilitated.

Conventionally, when assembling to a case (unit) for accommodating a board on which electronic components having leads are mounted, a jig is used to adjust the position when connecting the lead to the board. It was necessary to make adjustments, and the work efficiency was reduced.

In this embodiment, the case body 1
Reference numeral 4 denotes a power transistor accommodating portion 70 having a shape following the shape of the power transistor 18, and the lead 18 b is inserted into the lead insertion hole 80 when the power transistor main body 18 a is accommodated therein. Thus, the positioning of the lead 18b is completed only by housing the power transistor 18 in the power transistor housing 70, so that the work efficiency when assembling the unit 10 can be improved.

Next, the leads 18b and the printed circuit board 62
Are connected by a process such as soldering, and a cover 16 (shown in FIGS. 2 and 6) is attached from above. The peripheral edge 16a of the end of the cover 16 is formed to hang down as shown in FIG.
Is accommodated in a cover accommodating groove 94 formed over the entire periphery of the upper end 14b.

Next, a silicone adhesive 96 is applied (injected) to the accommodated end peripheral edge 16a and the remaining portion (gap) of the cover accommodating groove 94, and the cover 16 is pressed from above with a weight (not shown) or the like. Then, by heating the periphery, the adhesive 96 is cured.

The assembled unit 10 has the bolts and nuts for temporary assembly removed, and can be directly or properly attached to an appropriate place in the engine room of the vehicle, for example, the room wall surface or the intake pipe of the engine, through the fixing bolt 98. Via a stay, it is integrally fixed to the unit mounting portion 100 (shown in FIG. 4) made of a metal member, and the connector 54
Is connected. In the above steps, the power transistor 18 is bolted to the base 12 in advance,
May be adhered to the case body 14.

According to the embodiment of the present invention, as described above, power supply transistor 18 is fixed to base 12.
A concave power transistor accommodating portion 70 capable of accommodating the power transistor 18 is provided in the case body 14 bonded thereon.
Is formed, and a lead insertion hole 80 is formed in the power transistor contact surface 76 forming the power transistor accommodating portion 70, and the lead 18 b extended from the power transistor 18 is inserted into the lead insertion hole 80. More specifically, the power transistor housing 70
When the power transistor 18 is accommodated in the
Since the lead insertion hole 80 is formed at a position where the lead 8b is inserted, the lead 1 of the power transistor 18 is formed.
Even in the case where the printed circuit board 62 on which the mounting 8b is fixed upward is accommodated, the alignment of the leads 18b can be facilitated, and the assembling workability can be improved.

Further, a second lead insertion hole 62a communicating with the lead insertion hole 80 is formed in the printed board 62, and the lead 18b is inserted therethrough. When the transistor 18 is housed, the lead insertion hole 80 and the second lead insertion hole 62a are formed at positions where the leads 18b are inserted.
Can be easily adjusted, and the efficiency of the assembling work can be further improved. Since the power transistor accommodating portion 70 is formed in a concave shape, the unit 1
There is no influence such as an increase in the height of 0.

As described above, in the embodiment of the present invention, at least a heat-generating component (power transistor 1
8) a metal base (base 12) that is fixed and functions as a heat sink; a resin case body (case body 14) adhered on the metal base; Board (printed board 62) to which lead 18b extended from the heat-generating component is connected
In the structure of the vehicle control unit (unit 10) configured to be mounted in the engine room of the vehicle, the heat generating component is formed by forming a concave receiving portion (power transistor receiving portion 70) in the resin case body. And a lead insertion hole 80 is formed in a wall surface (the power transistor contact surface 76) forming the concave accommodation portion, and the lead is inserted through the lead insertion hole.

Further, a second lead insertion hole 62a communicating with the lead insertion hole is formed in the substrate, and the lead is inserted through the second lead insertion hole.

In the above-described embodiment, the number of the heat-generating components housed in the unit 10, that is, the number of the power transistors 18 and the number of the power transistor housing portions 70 are each four, but the number is not limited thereto.
Other appropriate numbers may be used.

Although the base 12 is made of a metal material made of aluminum, another metal material may be selected as long as it has high heat dissipation.

Further, the case body 14 is provided with a concave portion in the lateral direction on the outer peripheral surface in contact with the collar 32 and is configured to perform a flat knurling process. Any shape may be used as long as it does not fall off from the case main body 14 and does not slip inside the case main body 14.

The projection 30 is located on the base 12 side,
Although 6 is formed on the case body 14 side, it may be configured such that the convex portion 30 is formed on the case body 14 side and the concave portion 36 is formed on the base 12 side.

Further, when assembling the unit 10, the adhesive is applied to the case body 14 after the power transistor 18 is accommodated, but the adhesive may be applied first.

[0078]

According to the first aspect of the present invention, a concave accommodating portion capable of accommodating a heat-generating component is formed in a case body bonded to a metal base to which the heat-generating component is fixed (functions as a heat sink). Along with this, a lead insertion hole is formed in a wall surface forming the concave receiving portion. More specifically, when the electronic component is received in the concave receiving portion, a lead extended from the electronic component is formed. Since the lead insertion hole is configured to be drilled at the insertion position, it is possible to secure heat radiation even when accommodating a printed board on which the leads of the heat-generating electronic components are fixed upward and mounted. In addition, the positioning of the leads can be facilitated, and the assembling workability can be improved. In addition, since the concave receiving portion is provided, there is no influence such as an increase in the height of the unit.

In a second aspect of the present invention, a second lead insertion hole communicating with the lead insertion hole is formed in the substrate, and the lead is inserted through the second lead insertion hole. When the electronic component is accommodated in the concave accommodating portion, the lead insertion hole and the second lead insertion hole are formed at positions where the leads are inserted. Therefore, when assembling the unit, alignment of the leads is performed. Can be further facilitated, and the efficiency of the assembling operation can be further improved.

[Brief description of the drawings]

FIG. 1 is a top view for explaining a structure of a vehicle control unit according to one embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is an enlarged side view of the collar 32 shown in FIG.

FIG. 4 is a partially enlarged cross-sectional view around a collar 32 shown in FIG. 2;

5 is a partially enlarged cross-sectional view showing a portion indicated by reference numeral A in FIG. 2 in an enlarged manner.

FIG. 6 is a bottom view of the case main body 14 shown in FIG.

FIG. 7 is a sectional view taken along line VII-VII of FIG. 1;

FIG. 8 shows a unit 10 shown in FIG.
It is the side view seen from the (opening) side.

9 is a perspective view partially showing the unit 10 shown in FIG. 1 for explaining a partial process in which the power transistor 18 is housed in the case main body 14. FIG.

[Explanation of symbols]

 Reference Signs List 10 vehicle control unit (unit) 12 metal base (base) 14 resin case body (case body) 16 cover 18 power transistor (heating component) 18b lead 62 printed circuit board (board) 62a second lead insertion hole 70 power Transistor housing part 76 Power transistor contact surface 80 Lead insertion hole 100 Unit mounting part

Claims (2)

[Claims] 1. A metal base to which at least a heat generating component is fixed, a resin case main body adhered on the metal base, and a lead housed inside the resin case main body and extending from the heat generating component. In the vehicle control unit structure, which is configured from a substrate to be connected and is mounted in an engine room of a vehicle, a concave housing portion is formed in the resin case body to house the heat-generating component,
A control unit structure for a vehicle, wherein a lead insertion hole is formed in a wall surface forming the concave accommodating portion, and the lead is inserted through the lead insertion hole. 2. The semiconductor device according to claim 1, wherein a second lead insertion hole communicating with said lead insertion hole is formed in said substrate, and said lead is inserted through said second lead insertion hole. The vehicle control unit structure according to claim 1.