JPH0661694A - Method and machine for mounting component - Google Patents

Abstract

PURPOSE:To detect projection width for chip components sucked by a plurality of suction nozzles and to correct the component mounting position appropriately based on the detection result while enhancing work efficiency by providing a component mounting head unit with a plurality of suction nozzles. CONSTITUTION:A head unit 5 is provided with a plurality of suction nozzles and a laser unit 27 detects projection width while rotating a suction nozzles sucking chip components and then a correction amount of mounting position is operated based on detection results. Correction amount is determined by assigning a projection width detecting region for each suction nozzle through an assigning means 34 and then detecting the projection width for each projection width detection region.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and apparatus for accurately mounting a small chip component such as an electronic component such as an IC at a predetermined position on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, a component mounting head unit having a suction nozzle sucks a chip component from a component supply unit such as a tape feeder and transfers it onto a positioned printed circuit board to a predetermined position on the printed circuit board. A component mounting apparatus adapted to be mounted on a device is generally known. In this device, normally, the head unit is movable in the X-axis direction and the Y-axis direction, and the suction nozzle is movable and rotatable in the Z-axis direction to move and rotate in each direction. Drive mechanism is provided.
Further, in order to mount it accurately on a predetermined position on the printed circuit board, the position and the rotation angle of the chip component sucked by the suction nozzle are examined to obtain a correction amount corresponding to these errors, and the printed circuit board is accordingly It is also known in this type of device to adjust the position and the angle of rotation when mounting the.

As one of the methods for the above adjustment, a chip component is sucked by a suction nozzle of a head unit and is rotated around a suction point, while an optical detecting means is used to move the chip component from a certain direction to a laser or the like. There has been proposed a method in which parallel rays are emitted to detect the projection width thereof, and the correction amount is obtained based on the detected value.

[0004]

In the conventional apparatus of this type, it is general that the head unit is provided with one suction nozzle and the optical detection means is provided for the suction nozzle. However, there is a limit to improving the efficiency of component mounting work with only one suction nozzle.

Therefore, if a plurality of suction nozzles are provided in the head unit, and the chip components are respectively sucked by the nozzles and then the head unit is moved to the printed circuit board side for mounting, the efficiency is improved. be able to. However, in this case, how to detect the projection width by the optical detection means and calculate the component mounting position correction amount based on the detection width is performed for each of the chip components sucked by the plurality of suction heads. ,
Further, the problem of how to rationally perform the component suction and mounting work including the component mounting position correction processing has not been solved in the past.

In view of the above circumstances, the present invention improves work efficiency by providing a plurality of suction nozzles on a component mounting head unit, and particularly projects a chip component sucked by a plurality of suction nozzles. An object of the present invention is to provide a component mounting method and the same device, which can appropriately detect the width and correct the component mounting position based on the detection.

[0007]

In order to achieve the above object, the component mounting method of the present invention is such that a head unit having a suction nozzle sucks a chip component and mounts it at a predetermined position, and While rotating the suction nozzle after sucking the chip component, the optical detection means having a parallel light beam irradiation unit and a light receiving unit irradiates the chip component with the parallel light beam to detect its projection width, and based on the detected value. Is a component mounting method in which a head unit is provided with a plurality of suction nozzles, and a light-receiving portion of the optical detection means attracts each of the suction nozzles. The projection width detection areas are assigned to the respective projection width detection areas, and the projection width detection area is rotated while rotating the suction nozzle that sucks the chip component at a position corresponding to the optical detection means. It is obtained so as to obtain the correction amount by performing detection of projection width of the chip component corresponding to each region.

In the component mounting apparatus for carrying out the above method, a head unit movable between the component supply side and the mounting side is provided with a plurality of suction nozzles and a drive means for rotating each suction nozzle. The suction unit for irradiating a parallel light beam from one side of each suction nozzle and the light receiving unit opposed thereto are provided with optical detection means for detecting the projection width of the chip component sucked by the suction nozzle, and to the head unit. Allocation means for allocating a projection width detection area of the light receiving section to each suction nozzle in accordance with an input indicating a size of a chip component sucked by each suction nozzle, and a projection for each projection width detection area. An arithmetic means for obtaining a correction amount according to the width detection signal is provided.

[0009]

According to the above construction, after the suction of the chip component by the suction nozzle of the head unit, the projection width is detected by the optical detecting means and the component mounting position correction amount is calculated based on the detection of the projection width. By allocating the projection width detection area to the light receiving portion of the optical detection means according to the component, the chip components attracted by the plurality of suction nozzles are distinguished, and the respective mounting positions are corrected.

[0010]

Embodiments of the present invention will be described with reference to the drawings.
1 and 2 show the overall structure of a component mounting apparatus according to an embodiment of the present invention. In these figures, the base 1
A conveyor 2 for transferring a printed circuit board is arranged on the upper side,
The printed board 3 is conveyed on the conveyor 2 and stopped at a fixed position of the mounting work station.

On the side of the conveyor 2, a parts supply section 4 is provided.
Are arranged. The component supply unit 4 includes a plurality of rows of supply tapes 4a, and each supply tape 4a has an I
Small chip-shaped chip parts 20 such as C, transistors and capacitors are housed and held at equal intervals and wound on a reel. A ratchet type feed mechanism is incorporated in the feeding end 4b of the supply tape 4a, and as the chip component 20 is picked up by the head unit 5 from the feeding end 4b, the supply tape 4a is intermittently fed out.
It is possible to repeat the above pick-up work.

A head unit 5 for mounting components is installed above the base 1, and the head unit 5 is mounted on the head unit 5.
Can move in the X-axis direction (direction of the conveyor 2) and in the Y-axis direction (direction orthogonal to the X-axis on the horizontal plane).

That is, the conveyor 2 is mounted on the base 1.
Two fixed rails 7 extending in the Y-axis direction across the same are arranged in parallel with each other at a predetermined interval, and as a Y-axis feed mechanism, one fixed rail 7 is provided near the one fixed rail 7.
Ball screw shaft 8 which is driven to rotate by a shaft servo motor 9
Are arranged. A support member 11 for supporting the head unit 5 is movably supported on the fixed rails 7, and a nut portion 12 at an end of the support member 11 is screwed onto the ball screw shaft 8. Ball screw shaft 8
The rotation of the support member 11 causes the support member 11 to move in the Y-axis direction. The Y-axis servomotor 9 is provided with Y-axis position detecting means 10 including an encoder.

The support member 11 is provided with a guide rail 13 extending in the X-axis direction, and a ball screw shaft 14 disposed near the guide rail 13 as a feed mechanism in the X-axis direction and the ball screw. An X-axis servomotor 15 that rotationally drives the shaft 14 is provided. The head unit 5 is movably supported by the guide rails 13, and the nut portion 17 provided on the head unit 5 is screwed onto the ball screw shaft 14, and the head unit 5 is rotated by the rotation of the ball screw shaft 14. 5 moves in the X-axis direction. The X-axis servomotor 15 is provided with X-axis position detecting means 16.

The head unit 5 includes a chip component 2
A plurality of suction nozzles 21 that suck 0 are provided, and three suction nozzles 21 are provided in the illustrated example. As shown in detail in FIGS. 3 and 4, the suction nozzles 21 can be moved in the Z-axis direction (vertical direction) and rotated about the R-axis (nozzle central axis).
The Z-axis servo motor 22 and the R-axis servo motor 24 are provided in the head unit 5. The servo motors 22 and 24 have position detecting means 23 and 2 respectively.
5 are provided. Further, an interference position detecting means 26 for detecting an interference position between the suction nozzle 21 and the component supply section 4 is attached to the head unit 5.

A laser unit 27, which constitutes an optical detecting means, is attached to the lower end of the head unit 5. This laser unit 27 has a suction nozzle 2
Chip component 2 in the chip component adsorption state by 1
A laser beam that is a parallel light beam is radiated to 0, and the projection width thereof is detected. A laser generation unit (parallel light beam irradiation unit) 27a and a detector (light receiving unit) 27b that face each other across the suction nozzle 21 are provided. However, the detector 27b is a CCD
It consists of

Each suction nozzle 21 of the head unit 5
The laser unit 27 and the laser unit 27 are arranged so as to avoid overlapping of the suction nozzles 21 in the laser beam irradiation direction. That is, in the example shown in FIGS. 1 to 4,
As schematically shown in FIGS. 5A and 5B, the laser unit 27 is arranged so that the laser beam irradiation direction (broken line arrow) is in the X-axis direction, while the suction nozzles 21 are arranged relative to the X-axis. The arrangement is diagonally offset. Alternatively, as shown in FIGS. 6A and 6B, the suction nozzles 21 may be aligned in the X-axis direction, while the laser unit 27 may be arranged such that the laser beam irradiation direction is inclined with respect to the X-axis. With the arrangement as shown in FIG. 5 or 6, the projection image of the chip component 20 sucked by each suction nozzle 21 is formed in a different region of the detector 27b of the laser unit 27.

Note that, as shown in FIG. 7 (a), the chip components 20 are usually adsorbed by the respective suction nozzles 21, but when the chip component 20 is large, one chip component 20 is provided as shown in FIG. 7 (b). According to the size of the chip component 20 and the like, the chip component 20 is sucked by using only the suction nozzle (center nozzle) or the two suction nozzles 21 are used as shown in FIG. 7C. You can also select and change.
Further, as shown in FIG. 8, two types (or three types) of chip components 20 having different sizes may be adsorbed.

FIG. 9 shows an embodiment of a control system. In this figure, the Y-axis, X-axis, Z-axis for each nozzle, and R-axis servo motors 9, 15, 22, 24 are provided respectively. The position detecting means 10, 16, 23 and 25 are the main controller 30.
It is electrically connected to the axis controller (driver) 31 of. The laser unit 27 is electrically connected to a laser unit arithmetic unit 28, and the laser unit arithmetic unit 28 is connected to a main arithmetic unit (arithmetic unit) 33 via an input / output unit 32 of a main controller 30. Further, the interference position detecting means 26 is connected to the input / output means 32.

Further, the main controller 30 has a projection width detection area (hereinafter referred to as a window) on the detector 27b for each suction nozzle 21 depending on the size of the chip part 20 and the type of the suction nozzle 21. Window allocating means 34 for allocating is provided. The chip component 20
And the type of the suction nozzle 21 are input at a stage such as initial setting of the mounting work. Then, the window allocating means 34 determines how many chip components 20 are adsorbed based on the input information, for example, depending on the size of the chip components 20 (see FIGS. 7A, 7B and 7C). ) Is determined, and if the size of each chip component 20 to be sucked is different (see FIG. 8), appropriate allocation is performed such that windows are allocated to match each size.

Further, in the present embodiment, the processing for obtaining the mounting position correction amount of the chip component 20 is performed for the chip components 20 sucked by the suction nozzles 21 in a switching manner in sequence so that the suction nozzles 21 for the R-axis are used. Position detecting means 2
5 is connected to the laser unit computing section 28 via the signal switching means 35. The signal switching means 35 switches the signal from the R-axis position detecting means 25 according to the switching operation control signal from the main controller 30 and sends it to the laser unit computing section 28.

Specific examples of the method and procedure for sucking and mounting components by the apparatus of this embodiment are shown in the flow charts of FIGS. In the example shown in the flow chart,
The present invention can be applied not only to the case where there are three suction nozzles but also to the case where a plurality of suction nozzles are provided.

FIG. 10 is a main routine and shows an overall procedure of the work of sucking and mounting the parts. When this work is started, first, in step S1, the external dimensions of each chip component x to be sucked by each suction nozzle and the suction nozzle number H [x] are used for x = 1, 2 ,. A recognition window W [x] on the detector 27b is allocated. Further, the number A of nozzles for suction and attachment is set. Further, in step S2, a variable L for indicating the suction nozzle number for which the suction operation has been performed and a variable M for indicating the suction nozzle number for which the recognition operation, which is an operation for obtaining the component mounting position correction amount, has been performed. , The variable N for indicating the suction nozzle number for which the mounting operation on the printed circuit board is performed is initialized to "1", respectively, and the variable P for indicating to what stage the recognition operation is progressing. And a variable Q indicating to what stage the mounting operation has progressed to "0".

Subsequently, in step S3, a negative pressure is supplied from a negative pressure generating means (not shown) to all the suction nozzles 21, and in step S4, a predetermined servomotor is driven to move X, Y. , Θ axis movement starts. In step S5, the window is set to W [1] and the nozzle rotation position signal is set to the nozzle of H [1]. That is, the rotational position signals for the first window and the first nozzle of the allocated windows are selected.

Next, in step S6, it is determined whether or not L≤A. If this determination is YES, it means that the number of sucked nozzles has not reached the required number (the number of nozzles to be sucked and attached) A. At this time, in step S7,
A routine for performing the suction operation of the suction nozzle having the nozzle number H [L] is executed, and when it is determined in step S8 that the suction operation of the suction nozzle having the H [L] is completed,
By incrementing the value of L in step S9, the number H [L] of the nozzle that performs the suction operation is sequentially changed. Then, the process proceeds to step S10. Note that step S
When the determination of 6 is NO (all of the suction nozzles of A above have been sucked), or when the determination of step S8 is NO (during suction operation), the process directly proceeds to step S10.

In step S10, it is determined whether M <L and M ≦ A. If this determination is YES, it means that the number of recognized nozzles is less than the number of sucked nozzles and the required number A has not been reached. At this time, in step S11, a routine for recognizing the suction nozzle with the nozzle number H [M] is executed, and in step S12 it is determined that the recognition operation of the suction nozzle with the H [M] is completed. Then, the value of M is incremented in step S13, and the number H [M] of the nozzle that performs the recognition operation is sequentially changed. Further in step S14,
As the window is switched to W [M], the nozzle rotation position signal can be switched to that of H [M], that is, the window and nozzle rotation position signal are sequentially changed corresponding to the increment of the value of M.

Then, the process proceeds to step S15. When the determination in step S10 is NO (the recognized nozzles and the suctioned nozzles are the same, or all of the above A nozzles are recognized), or when the determination in step S12 is NO (the recognition operation is in progress). The process directly moves to step S15.

In step S15, it is determined whether N <M and N ≦ A and L> A. If this determination is YES, the number of mounted nozzles is less than the number of recognized nozzles, and the number of mounted nozzles has not reached the required number A, but the number of sucked nozzles has reached the required number A. Means that. At this time, in step S16, a routine for performing the mounting operation of the nozzle having the nozzle number H [N] is executed, and it is further determined in step S17 that the mounting operation of the suction nozzle of H [N] is completed. And step S18
The number H [N] of the nozzle that performs the mounting operation is sequentially changed by incrementing the value of N at. Then, the process proceeds to step S19. When the determination in step S15 is NO (the mounted nozzles and the recognized nozzles are the same, or the above A nozzles are all mounted or the nozzles that have not been adsorbed exist), the determination in step S17 is N.
When it is O (during mounting operation), the process directly proceeds to step S19.

In step S19, it is determined whether or not N> A. If the determination is NO, the process returns to step S6 and Y
When it becomes ES, it ends.

FIG. 11 shows a suction operation routine executed in step S7. In this routine, it is checked in step S7a whether the center coordinates (X, Y, θ) of the suction nozzle 21 have reached the target position range for suction. If it does not reach the target position range, the process directly proceeds to step S8 of the main routine (FIG. 10), but if it reaches the target position range, the suction nozzle 21 descends (step S7).
b), the chip component is sucked from the supply tape 4a of the component supply unit 4 (step S7c), and then the suction nozzle 2
1 starts rising (step S7d). Then, after the adsorption completion flag is set (step S7
e) The procedure moves to step S8 of the main routine.

FIG. 12 shows a routine of the recognition operation executed in the above step S11. Regarding this routine,
Description will be made with reference to FIGS. 14 and 15.

In this routine, first, step S11a
The value of the variable P is checked with. Here, it will be explained which stage in the recognition operation the value of the variable P indicates when the value is “0”, the stage immediately after the suction, and when the value is “1”, the suction nozzle 21 indicates the component supply unit. 4, the stage where it rises to a position where it escapes from the interference area with 4, the stage where it rises to the recognition height of the suction nozzle when “2”, and the stage where the preliminary rotation described below is completed
When it is "3", it means the stage when the predetermined forward rotation of the suction nozzle is completed.

When P is determined to be "0" in step S11a, it is determined in step S11b whether or not the suction nozzle 21 has risen to a position where the suction nozzle 21 escapes from the interference area with the component supply section 4, and this determination is made. If NO, it is as it is, and if this determination is YES, P is changed to "1" (step S11c), and then step S1 of the main routine.
Move to 2.

When P is determined to be "1" in step S11a, a predetermined negative angle θ _{S in} step S11d.
Rotation of the θ axis (indicated by an alternate long and short dash line arrow in FIG. 14) is started, and movement of the X and Y axes to the suction position of the next suction nozzle (all the A nozzles finish the suction operation). If so, the movement to the mounting position) is started. The rotation in the negative direction is for ensuring the detection of the minimum projection width value by the next rotation in the positive direction. And step S11e
Then, it is determined whether or not the suction nozzle 21 has risen to a height that can be recognized by the laser unit 27, and the preliminary rotation up to the predetermined angle θ _{S in the} negative direction has ended. If this determination is NO. If it is as it is, this judgment is YES
If so, after P is changed to "2" (step S11
f) The process moves to step S12 of the main routine.

If P is determined to be "2" in step S11a, the projection width W _S of the chip component, its center position C _S, and rotation angle θ _{S at} that time are detected in step S11g, and then step S11g. In S11h, the suction nozzle 21 is rotated in the forward direction (shown by a solid arrow in FIG. 14), and the detection operation for obtaining the minimum value of the component projection width is performed. This rotation in the positive direction is performed by a constant rotation angle θ _e . And
Whether or not this rotation has ended is determined in step S11i, and if this determination is NO, it remains as it is, and if this determination is YES, P is changed to "3" (step S11j), and then the main routine. Moves to step S12.

When P is determined to be "3" in step S11a, the minimum projection width value Wmin is determined in step S11k.
The center position C _m and the rotation angle θ _m at the minimum projection width are read. Subsequently, it is determined based on the detection data whether or not the component suction is normal (step S11l). If not normal, the chip component is discarded (step S11m). If normal, X, based on the detection data, The mounting position correction amounts X _C , Y _C , and θ _{C in the} Y and θ directions are calculated (step S11n). Then, after P is reset to "0" and the flag indicating the recognition completion is set (step S11o), step S1 of the main routine is performed.
Move to 2.

The calculation of the correction amount in step S11n is performed as follows. That is, as is apparent from FIG. 15, assuming that the chip component 20 is mounted with the long side in the X-axis direction, the component mounting position correction amounts X _C , Y
Of _C and θ _C , the correction amount in the Y and θ directions is Y _C and θ _C

[0038]

## EQU1 ## Y _C = C _m −C _N θ _C = θ _m . C _N is the center position (suction point) of the suction nozzle 21 and is a known value.

In FIG. 15, O is the suction nozzle center point, b and B are the chip component center points in the initial state and the minimum projection width state, and ΔaOb≡ΔAOB.

[0040] L _AB: the line segment AB a length L _ab: length of the segment ab L _AO: line segment AO length L _aO: the segment aO length Y _ab: line segment ab onto the Y-axis Projection length of Y _aO : If the projection length of the line segment aO on the Y axis is

[0041]

## EQU2 ## C _N -C _S = Y _aO + Y _ab

[0042]

[ _Formula 3] Y _aO = L _aO · sin (θ _m + θ _S )

[0043]

## EQU4 ## Y _ab = L _ab .cos (θ _m + θ _S ). Then, L _aO = L _AO = X _C , L _ab = L _AB = C _N
Since −C _m , X _C is derived from the above equations as in the following equation.

[0044]

X _C = {(C _N −C _S ) − (C _N −C _m ) · cos (θ _m + θ _S )} / sin (θ _m + θ _S ). FIG. 13 is executed in step S16. The routine of mounting operation is shown. In this routine, first, step S16
The value of the variable Q is examined at a. Here, it will be explained which stage in the mounting operation the value of the variable Q indicates, when this value is “0”, it is within the stage immediately after recognition completion, and when it is “1”, within the mounting target position range. The reached stage, when "2", means the stage where the Z-axis is lowered to the target position.

When Q is determined to be "0" in step S16a, movement of the X, Y, and θ axes to the corrected component mounting position is started in step S16b. Then, in step S16c, it is determined whether or not the mounting target position range on the printed circuit board 3 has been reached. If this determination is NO, it remains as it is, and if this determination is YES, Q is set to "1". After the change (step S16d), the process proceeds to step S17 of the main routine.

When Q is determined to be "1" in step S16a, the suction nozzle 21 is lowered (step S16e). Then, in step S16f, it is determined whether or not the Z-axis is lowered to the target position, and if the determination is NO, then it is left unchanged, and if the determination is YES, then Q is changed to "2" (step S16g), and then proceeds to step S17 of the main routine.

When Q is determined to be "2" in step S16a, the negative pressure is cut (step S16h), so that the chip component 20 is mounted on the printed circuit board 3 and then the suction nozzle 21 is raised. (Step S1
6i). Then, after Q is reset to "0" and a flag indicating completion of recognition is set (step S16g), the process proceeds to step S17 of the main routine.

According to the method of the present embodiment as described above, the suction of the chip components 20 is sequentially performed by the plurality of suction nozzles 21 provided in the head unit 5, and at the same time,
With respect to the nozzle 21 that has completed the suction, the mounting position correction amount is obtained by the recognition operation. By allocating the recognition windows, the windows are distinguished for each nozzle, and the correction amount for each is obtained.

Further, even while the chip components 20 are sequentially picked up by the processing of the routine of FIG. 11, the recognition operation is performed from the already picked-up ones by the processing of the routine of FIG. 12, and the suction is completed. The suction operation for the nozzles that have not been sucked and the recognition operation for the nozzles that have already sucked are simultaneously performed. Further, when all the A nozzles have been sucked, the head unit 5 is moved to the mounting side and the recognition operation is completed, and then the mounting operation is performed by the processing of the routine of FIG. 13 and the recognition is completed. If there is a nozzle that has not been performed, the recognition operation of the nozzle and the movement of the head unit 5 to the mounting side and the mounting operation of the recognized nozzle are simultaneously performed. In this way, the operations of suction, recognition and mounting are performed in parallel as much as possible, and the work efficiency is improved.

FIG. 16 and FIG. 17 show another embodiment of the control system and the suction mounting method. In this embodiment, a plurality of chip components can be simultaneously picked up and recognized simultaneously.

In the control system shown in the block of FIG. 16, the R-axis position detecting means 25 and the laser unit computing section 28 are directly connected, but the other parts are the same as those of the first embodiment shown in FIG. It is the same.

In the flowchart of FIG. 17, first, in step S21, the outer dimensions of the chip part x and the allocation of the recognition window W [x] by the suction nozzle number H [x], and the setting of the number A of nozzles for suction / mounting are set. Is performed, and the number of nozzles S [x] that are simultaneously adsorbed is set. Further, in step S22, the L and N registers are initialized to "1" and the flag F [x] is initialized to "0". Flag F above
[x] indicates the work progress status of each nozzle. When the value is "1", it means that the suction operation is completed, when it is "2", the recognition operation is completed, and when it is "3", the mounting operation is completed. .

Next, in step S23, a negative pressure is supplied to all the suction nozzles 21 from a negative pressure generating means (not shown), and in step S24, movement of the X, Y, and θ axes is started. Further, in step S25, the window allocation data W [1] to W [A] for each nozzle is transmitted to the calculation unit.

Next, in step S26, the suction operation as shown in FIG. 11 is simultaneously performed on the suction nozzles 21 included in the nozzle set S [L]. further,
When it is determined in step S27 that the suction operation of the suction nozzle set is completed, in step S28, the flags F [x] are set to “1” for the suction nozzles 21 included in the nozzle set. At the same time, in step S29, the value of L is incremented to sequentially change the number S [L] of the nozzle set that performs the suction operation. Then, the process proceeds to step S30. If the determination in step S27 is NO, then step S3 is performed as it is.
Move to 0.

Steps S30 to S36 are processing relating to the recognition operation, and x = 1 is set first (step S3).
0). Then, until x = A, the value of x is sequentially changed (steps S35 and S36), and it is checked whether or not adsorption has been completed for each by determining whether or not F [x] = 1 (step S31). Corresponding number H [x] if absorbed
The routine for performing the recognition operation of the suction nozzle 21 (see FIG. 12) is executed (step S32), and when it is determined that the recognition operation of the suction nozzle is completed, the corresponding flag F [x] is set to "2". (Steps S33, S3
4) The above process is repeated until x = A. As a result, the recognition operation is performed from the suctioned ones, and the recognition operation is performed simultaneously for the plurality of suction nozzles that are suctioned at the same time.

Next, in step S37, it is judged whether or not all the flags of F [1] to F [A] corresponding to the A nozzles are all 1 or more, so that all of these nozzles are at least sucked. Whether it is completed or not is checked, and if the result of the judgment is NO, the process returns to step S26. Step S3
If the determination result in step 7 is YES, it is determined in step S38 whether or not F [N] = 2, that is, whether or not the Nth nozzle has been recognized. If it is recognized, in step S39,
Routine for performing the mounting operation of the H [N] nozzle (Fig. 1
3) is executed. Further, in step S40, H [N]
When it is determined that the suction nozzle mounting operation is completed, in step S41, F [N] = 3, and
By incrementing the value of N, the nozzle number H [N] for the mounting operation is sequentially changed. Then, the process proceeds to step S42. The determination in step S38 is NO.
If or if the determination in step S40 is NO, the process directly proceeds to step S42.

In step S42, it is determined whether or not all the flags F [1] to F [A] are "3". If the determination is NO, the process returns to step S30, and if YES, the process ends. To do.

According to the method of this embodiment, the chip components are simultaneously sucked by the plurality of nozzles, and the recognition operation for obtaining the mounting position correction amount is simultaneously performed for the simultaneously sucked chips. Efficiency is further enhanced. And, since the windows for recognition are allocated, the windows are distinguished for each nozzle and the correction amounts are obtained respectively, as in the case of the first embodiment.

[0059]

As described above, according to the present invention, the head unit is provided with a plurality of suction nozzles, and the light receiving portion of the optical detecting means for detecting the projection width for correcting the mounting position is provided for each suction nozzle. Since the projection width detection area is allocated and the suction nozzle that sucks the chip component is rotated, the projection width of the corresponding chip component is detected for each projection width detection area to obtain the correction amount. The head unit can adsorb and mount a plurality of chip components, distinguish each adsorbed chip component, obtain a correction amount based on the detection of each projection width, and perform appropriate correction. Therefore, the suction of chip components by a plurality of nozzles, the calculation of the mounting position correction amount, and the mounting work can be performed efficiently and accurately.

[Brief description of drawings]

FIG. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of the same device.

FIG. 3 is an enlarged front view of a mounting head unit.

FIG. 4 is an enlarged plan view of the head unit.

FIG. 5A is an explanatory diagram showing an example of arrangement of a suction nozzle and a laser unit. (B) is an explanatory view of a laser beam irradiation state by this arrangement.

FIG. 6A is an explanatory diagram showing another example of the arrangement of the suction nozzle and the laser unit. (B) is an explanatory view of a laser beam irradiation state by this arrangement.

7 (a), (b), and (c) are explanatory views showing several examples of how to use a suction nozzle according to the dimensions of a chip component and the like.

FIG. 8 is an explanatory diagram of a laser beam irradiation state when chip components of different sizes are adsorbed.

FIG. 9 is a block diagram showing a control system.

FIG. 10 is a flowchart showing a specific procedure of a component mounting method.

FIG. 11 is a flowchart showing a suction operation routine.

FIG. 12 is a flowchart showing a routine of a recognition operation.

FIG. 13 is a flowchart showing a mounting operation routine.

FIG. 14 is an explanatory diagram showing a rotation operation of a chip component during a recognition operation.

FIG. 15 is a diagram for explaining how to obtain a mounting position correction amount.

FIG. 16 is a block diagram showing another example of a control system.

FIG. 17 is a flowchart showing a specific procedure of a component mounting method according to another example.

[Explanation of symbols]

 3 Printed Circuit Board 4 Component Supply Section 5 Head Unit 20 Chip Component 21 Adsorption Nozzle 9, 15, 22, 24 Servo Motor 10, 16, 23, 25 Position Detection Means 27 Laser Unit (Optical Detection Means) 27a Laser Generation Section (Irradiation) Part) 27b detector (light receiving part) 30, main controller 33 main calculation part 34 window allocating means

Claims (2)

[Claims] 1. A head unit having a suction nozzle sucks a chip component and mounts the chip component at a predetermined position, and while the suction nozzle is rotated after the chip component is sucked, a parallel light beam irradiation unit and a light receiving unit are provided. A component mounting method for irradiating the above chip component with parallel light rays to detect the projection width of the chip component, and determining a component mounting position correction amount based on the detected value. Is equipped with a plurality of suction nozzles, the projection width detection area for each of the suction nozzles is assigned to the light receiving portion of the optical detection means in accordance with the size of the chip component sucked by each suction nozzle, and the suction suctioning the chip component is performed. While rotating the nozzle at a position corresponding to the optical detection means, the projection width of the corresponding chip component is detected for each projection width detection area to obtain the correction amount. A component mounting method characterized by the above. 2. A head unit, which is movable between a component supply side and a mounting side, is provided with a plurality of suction nozzles and drive means for rotating each suction nozzle, while irradiating parallel rays from one side of each suction nozzle. The irradiation unit and the light receiving unit opposed thereto are provided with an optical detection unit for detecting the projection width of the chip component adsorbed by the adsorption nozzle, and the control unit for the head unit is adsorbed by each adsorption nozzle. Allocation means for allocating the projection width detection area of the light receiving portion to each suction nozzle in accordance with an input indicating the dimension of the chip component, and the correction amount is obtained according to the projection width detection signal for each projection width detection area. A component mounting apparatus, characterized in that it is provided with a computing means.