JPH0661523A - Reflection type photocoupler and its manufacture - Google Patents

Abstract

PURPOSE:To eliminate the need for a masking process, etc., so as to simplify the manufacturing work of a reflection type photocoupler by mounting a light emitting element on a package formed in two colors of conductive resin bodies and insulating resin bodies and electrically connecting the light emitting element on the upper surface of the package to lower-surface terminals formed on the lower surface of the package. CONSTITUTION:A package 21 is formed by integrally molding four highly conductive resin bodies 31, 33, 32, and 34 and insulating resin bodies 35 put between each body 31, 33, 32, and 34 by means of metallic mold and elements 22 and 24 are mounted on the upper surface of the package 21, with the peripheries of the elements 22 and 24 being sealed with a light transmitting resin 27. Therefore, the manufacturing process of this photocoupler can be simplified and part of the process can be omitted, because the need of forming three-dimensional wiring on the surface of the through, etc., of the package 21 which has been formed in the conventional example in order to secure electric connection between the elements 22 and 24 and lower-surface terminals 37 and 41 on the lower surface of the package 21 is eliminated. In addition, since no through hole is required and the metallic mold can be simplified in shape, the molding can be performed easily and the cost of the metallic mold can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflection type optical coupling device and its manufacturing method.

[0002]

2. Description of the Related Art FIG. 4 is a perspective view of a conventional reflection type optical coupling device having a frameless structure, FIG. 5 is a plan view of a reflection type optical coupling device having a conventional frameless structure, and FIG. 6 is a plan view of a conventional frameless structure. FIG. 7 is a side view of the reflective optical coupling device, and FIG. 7 is a bottom view of the conventional reflective optical coupling device having a frameless structure.

A conventional reflection type optical coupling device is a package in which a light emitting side concave portion 2 for accommodating a light emitting element 1 and a light receiving side concave portion 4 for accommodating a light receiving element 3 are arranged side by side through an intermediate wall 5. The frameless structure having the resin case 6 and the metal plating wiring 7 provided on both the concave portions 2 and 4 by the metal plating technique or the vapor deposition technique is adopted.

The metal-plated wiring 7 is led out to the outside along the case 6, and is further routed to the back surface. The wiring (hereinafter referred to as the back surface terminal) 8 on the back surface of the case 6 is used as a soldering pad at the time of mounting on another substrate or the like.

Further, the light emitting element 1 and the light receiving element 3 are directly mounted on the metal plated wiring 7 of the light emitting side recessed portion 2 and the light receiving side recessed portion 4, respectively, and are resin-sealed with a translucent resin 9.

Here, in order to prevent the translucent resin 9 from adhering to the upper surface of the intermediate wall 5 or flowing out of the case 6, the upper surface of the case 6 including the upper surface of the intermediate wall 5,
An ink resist 11 for stopping resin flow is applied.

[0007]

In the conventional reflection type optical coupling device, the electrical connection between the light emitting element 1 or the light receiving element 3 and the rear surface terminal 8 is formed on the surface of the through hole of the case 6 or the like. It is done through the plated layer of the three-dimensional wiring. Here, in order to form a three-dimensional wiring by the plating method, after plating the entire surface, masking a necessary portion (pattern formation portion) with a resist, and further performing an etching step from the photolithography process to leave an unnecessary portion (insulation Method to remove plating on the line part) (conventional method 1),
It is general to adopt one of the methods (conventional method 2) in which only the pattern formation portion is coated with a catalyst or the like so that it can be plated. However, in any of the methods, in order to form a pattern three-dimensionally, masking also requires a three-dimensional method, which requires advanced technology.

In view of the above problems, it is an object of the present invention to provide a reflection type optical coupling device which can simplify the manufacturing process and a manufacturing method thereof.

[0009]

As shown in FIGS. 1 and 2, the light emitting side mounting land portion 36 for mounting the light emitting element 22 on the upper surface of the package 21 is provided.
The light emitting side connection land portion 39 connected to the light emitting element 22 via the bonding wire 38, the light receiving side mounting land portion 42 on which the light receiving element 24 is mounted, and the light receiving element 24 are connected via the bonding wire 38. A light receiving side connection land portion 44 is formed, the light emitting element 22 is mounted on the light emitting side mounting land portion 36, the light emitting element 22 and the light emitting side connection land portion 39 are connected by a bonding wire 38, and the light receiving side is formed. The light receiving element 24 is mounted on the mounting land portion 42, the light receiving element 24 and the light receiving side connection land portion 44 are connected by the bonding wire 38, and the back surface terminals 37, 41, 43 for external connection are provided on the back surface of the package 21. , 45
In the reflection type optical coupling device in which the respective elements 22 and 24 are resin-sealed with the translucent resin 27, the package 21 has the light emitting side mounting land portion 36 on the upper surface and the first surface on the back surface. A highly conductive first conductive resin body 31 that is a back surface terminal 37, and a highly conductive second conductive resin body 32 that has a light emitting side connection land portion 39 on the top surface and a second back surface terminal 41 on the back surface. , A highly conductive third conductive resin body 33 whose upper surface is the light-receiving side mounting land portion 42 and whose rear surface is the third rear surface terminal 43, and whose upper surface is the light-receiving side connection land portion 44 and whose rear surface is the fourth rear surface. A highly conductive fourth conductive resin body 34 which is the terminal 45 and an insulating resin body 3 which is interposed to electrically insulate the conductive resin bodies 31, 32, 33 and 34 from each other.
5, the conductive resin bodies 31, 32, 33, 34 and the insulating resin body 35 are integrally formed (two-color molding) at the time of molding with a die.

In the second aspect, the upper surface of the package 21 is
The light-emitting side recess 23 for housing the light-emitting element 22 and the light-receiving element 2
4 and the light receiving side concave portion 25 for housing 4 are formed side by side via the intermediate wall 26, and the light emitting element 2 is formed in the light emitting side concave portion 23.
The light emitting side mounting land portion 36 for mounting 2 and the light emitting element 22
And a light emitting side connection land portion 39 connected to the light emitting side mounting land portion 36 by the bonding wire 38. The light emitting element 22 is mounted on the light emitting side mounting land portion 36, and the light emitting element 22 and the light emitting side connection land portion 39 are bonded to each other. A light receiving side mounting land portion 42 for mounting the light receiving element 24 in the light receiving side concave portion 25 and a light receiving side connecting land portion 44 connected to the light receiving element 24 via the bonding wire 38 are connected by the wire 38. The light receiving element 24 is formed on the light receiving side mounting land portion 42, and the light receiving element 24 and the light receiving side connection land portion 44 are connected by a bonding wire 38. Terminal 3
7, 41, 43, 45 are formed, and the recesses 23, 2 are formed.
In the reflection-type optical coupling device in which 5 is resin-sealed with a translucent resin 27, the package 21 has a high conductivity with an upper surface serving as a light emitting side mounting land portion 36 and a back surface serving as a first back surface terminal 37. Of the first conductive resin body 31, a second conductive resin body 32 of high conductivity having an upper surface serving as a light emitting side connection land portion 39 and a back surface serving as a second back surface terminal 41, and an upper surface having a light receiving side mounting land portion 42. And the back surface is the third back surface terminal 43, and the high conductivity third conductive resin body 33, and the top surface is the light receiving side connection land portion 44 and the back surface is the fourth back terminal 45. Fourth conductive resin body 34 and the conductive resin body 3
1, 32, 33, 34 and an insulating resin body 35 interposed to electrically insulate the conductive resin body 3 from each other.
1, 32, 33, 34 and the insulating resin body 35 are integrally formed (two-color molding) at the time of molding with a die.

In the third aspect, the mounting land portions 36 and 42, the connection land portions 39, and the mounting land portions 36 and 42 according to the first or second aspect.
A metal film 46 for connection is formed on 44 and each of the back surface terminals 37, 41, 43, 45.

In claim 4, on the upper surface of the package 21,
A light emitting side mounting land portion 36 for mounting the light emitting element 22, a light emitting side connecting land portion 39 connected to the light emitting element 22 via a bonding wire 38, a light receiving side mounting land portion 42 for mounting the light receiving element 24, and light receiving Light receiving side connection land portion 4 connected to the element 24 via the bonding wire 38
4 is formed, the light emitting element 22 is mounted on the light emitting side mounting land portion 36, the light emitting element 22 and the light emitting side connecting land portion 39 are connected by a bonding wire 38, and the light receiving side mounting land portion 42 is formed. The light receiving element 24 is mounted, and the light receiving element 24 and the light receiving side connection land portion 44 are connected by a bonding wire 38, and on the back surface of the package 21,
In the reflection-type optical coupling device in which backside terminals 37, 41, 43, 45 for external connection are formed, and the respective elements 22, 24 are resin-sealed with a transparent resin 27, the package 2
1 is a highly conductive first resin body 31 having an upper surface serving as a light emitting side mounting land portion 36 and a back surface serving as a first back surface terminal 37.
And a second resin body 32 whose upper surface is the light emitting side connection land portion 39 and whose rear surface is the second rear surface terminal 41, and whose upper surface is the light receiving side mounting land portion 42 and whose rear surface is the third rear surface terminal 43.
A highly conductive third resin body 33, a fourth resin body 34 having an upper surface serving as a light receiving side connection land portion 44 and a back surface serving as a fourth back surface terminal 45, the conductive resin bodies 31, 32, Three
And an insulating resin body 35 interposed to electrically insulate the resin body from each other.
34 and 35 are integrally formed (two-color molding) at the time of mold molding, and the second resin body 32 and the fourth resin body 34 are connected to the bonding wires 38 by the metal members 51 and 5.
2 is exposed and embedded.

According to a fifth aspect of the present invention, a highly conductive first resin body 31 having an upper surface serving as a light emitting side mounting land portion 36 and a rear surface serving as a first back surface terminal 37, and an upper surface having a light emitting side connection land portion 39.
And a back surface serving as a second back surface terminal 41, and a highly conductive third resin body 33 having a top surface serving as a light-receiving side mounting land portion 42 and a back surface serving as a third back surface terminal 43.
To electrically insulate the fourth resin body 34 whose upper surface is the light-receiving side connection land portion 44 and whose rear surface is the fourth back surface terminal 45 and the conductive resin bodies 31, 32, 33, 34 from each other. The intervening insulating resin body 35 is integrally mold-molded to form the package 21, the light emitting element 22 is mounted on the light emitting side mounting land portion 36, and the light emitting element 22 and the light emitting side connection land portion 39. With the bonding wire 38, the light receiving element 24 is mounted on the light receiving side mounting land portion 42, and the light receiving element 24 and the light receiving side connecting land portion 44 are connected with the bonding wire 38, and each of the elements 22 , 24
Is sealed with a translucent resin 27.

[0014]

In the means for solving the problems according to the above-mentioned claims 1, 2, 3 and 5, four highly conductive resin bodies 31, 33, 3 are provided.
2, 34 and the insulating resin body 35 interposed therebetween are integrally mold-molded (two-color molding) to form the package 21.
On the upper surface of the package 21,
Is mounted, and the periphery thereof is resin-sealed with a translucent resin 27.

Then, each element 2 on the upper surface is formed as in the conventional case.
2, 24 and the back terminals 37, 41, 43, 45 on the back surface do not need to be provided with three-dimensional wiring on the surface of the through holes or the like of the package 21 in order to secure electrical connection, and the process is simplified and simplified. To be done.

In the fourth aspect, when the package 21 is molded, the metal members 51 and 52 are simply inserted and molded.
Each element 22, 24 on the upper surface and rear surface terminals 37, 41 on the rear surface
The metal members 51 and 52 can be electrically connected to the members 43 and 45. Then, even if the bonding lands 39 and 44 are not metal-plated, the bonding wires can be easily attached and the bondability is improved.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG. 1 is a view showing a reflection type optical coupling device according to a first embodiment of the present invention, in which FIG.
(B) is a sectional view taken along the line A-A of (A), and (C) is a line B- of (A).
FIG. 2 is a bottom view showing a reflection type optical coupling device of the first embodiment of the present invention.

The reflection type optical coupling device of this embodiment is shown in FIG.
As shown in FIGS. 2A to 2C and FIG. 2, on the upper surface of the resin substrate 21 as a package, a light emitting side recess 23 for housing the light emitting element 22 and a light receiving side recess 25 for housing the light receiving element 24 are provided as an intermediate wall. The light emitting element 22 is housed in the light emitting side recess 23, the light receiving element 24 is housed in the light receiving side recess 25, and the light emitting element 22 and the light receiving element 24 are protected and the external quantum efficiency is improved. For the purpose of
The recesses 23 and 25 are resin-sealed with a translucent resin 27.

The resin substrate 21 is collectively formed on a substrate having a multi-cavity shape, and a light emitting element 22 as described later is mounted on the substrate.
After sealing, it is divided into individual device units by using a scribe method or a dicing method, and each device has a bottom surface portion 28 that constitutes the bottom wall of the recessed portions 23 and 25 and a side wall of the recessed portions 23 and 25. It is composed of the peripheral part 29 and the peripheral part 29.

The bottom surface portion 28 includes a first conductive resin body 31, a second conductive resin body 32, a third conductive resin body 33 and a fourth conductive resin body 34 which are separated from each other, and the conductive resin bodies 31,
An insulating resin body 35, which is interposed to electrically insulate the parts 32, 33, and 34 from each other, is integrally formed (two-color molding) at the time of molding with a die.

The conductive resin bodies 31, 32, 33, 34
As the material, a material obtained by mixing a conductive material such as metal powder or carbon into a resin to make it conductive, or a material in which the resin material itself has conductivity such as polypyrrole resin or polyaniline is used. These conductive resin bodies 31, 32, 33, 34
When the drive current of the light emitting element 22 and the like are considered, the resistivity of
It is preferably 1 Ω · cm or less.

The upper surface of the first conductive resin body 31 has a first land portion (light emitting side mounting land portion) on which the light emitting element 22 is mounted.
36. The back surface of the first conductive resin body 31 serves as a first back surface terminal 37 for external connection.

The upper surface of the second conductive resin body 32 serves as a second land portion (light emitting side connection land portion) 39 connected to the light emitting element 22 via a bonding wire 38 such as Au. The back surface of the second conductive resin body 32 serves as a second back surface terminal 41 for external connection.

The upper surface of the third conductive resin body 33 has a third land portion for mounting the light receiving element 24 (light receiving side mounting land portion).
42. The back surface of the third conductive resin body 33 serves as a third back surface terminal 43 for external connection.

The upper surface of the fourth conductive resin body 34 serves as a fourth land portion (light receiving side connection land portion) 44 connected to the light receiving element 24 via a bonding wire 38 such as Au. The back surface of the fourth conductive resin body 34 serves as a fourth back surface terminal 45 for external connection.

The land portions 36, 39, 42, 44
Is the conductive resin body 3 after two-color molding with the insulating resin body 35.
It is exposed on the upper surface of 1, 32, 33, 34. In addition, each back surface terminal 37, 41, 43, 45 is exposed on the back surface of each conductive resin body 31, 32, 33, 34 after two-color molding with the insulating resin body 35. And each land part 36, 39, 4
Ni / Au plating 46 as a metal film is applied to the terminals 2, 44 and the rear terminals 37, 41, 43, 45.
The Ni / Au plating 46 is used as a connection pad for bonding or soldering to another mounting substrate.

The light emitting element 22 is fixedly mounted on the light emitting side mounting land portion 36 with Ag paste or the like, and the light emitting element 22 and the light emitting side connecting land portion 39 are connected by a bonding wire 38. In addition, the light receiving side mounting land portion 4
A light-receiving element 24 is fixedly mounted on the substrate 2 by Ag paste or the like, and the light-receiving element 24 and the light-receiving side connection land portion 44 are connected by a bonding wire 38.

As the insulating resin body 35, a functional polymer material (engineering plastic) having good workability and solder heat resistance, such as liquid crystal polymer and polyether sulfone, is used.

The peripheral portion 29 is formed of an insulating resin in a tubular shape having a square shape in plan view. The peripheral portion 29 is integrally formed with the bottom surface portion 28 at the time of molding by a two-color molding method. An ink resist 47 is applied to the upper surface of the peripheral portion 29 so that the translucent resin 27 does not flow out or adhere to the upper surface of the case, as in the conventional example.

As the translucent resin 27, for example, a transparent epoxy resin is used.

The reflection type optical coupling device having the above structure is manufactured as follows.

First, the resin substrate 21 is collectively formed on a multi-piece substrate.

At this time, first, the conductive resin bodies 31, 32, 33, and 34, which will be an electric circuit, are molded using a high conductive resin (primary molding).

Next, the insulating resin body 35 is molded with this portion as the insert side (secondary molding). At this time, the land portion 36 on the upper surface of each conductive resin body 31, 32, 33, 34,
39, 42, 44 and back surface terminals 37, 41, 4 on the back surface
3 and 45 are exposed on each surface.

After that, each land portion 36, 39, 42, 4
4 and each back terminal 37, 41, 43, 45, Ni /
Au plating 46 is applied.

Then, the elements 22 and 24 are fixed to the mounting land portions 36 and 42 with Ag paste, and are connected to the connection land portions 39 and 44 through the bonding wires 38, respectively.

Thereafter, the recesses 23 and 25 are resin-sealed with a translucent resin 27.

After that, the resin substrate 21 is divided into individual units by using a scribing method or a dicing method, and the reflection type optical coupling device is completed.

The reflection type optical coupling device produced in the above process is provided with the respective elements 22 and 24 and the back surface terminals 37, 41, 43 and 4.
5 is electrically connected to each conductive resin body 31, 32, 33,
Can be done via 34. Then, each land portion (plating land) for connecting each element 22 and the back surface terminal (plating terminal for electrode) as in the prior art
In order to secure the electrical connection with, it is not necessary to provide a three-dimensional wiring through a through hole or the like of the resin substrate (reflection case). Therefore, the manufacturing process is simplified and simplified.

Since no through hole is required, molding is easy and the shape of the mold can be simplified. Therefore, the die cost is reduced.

Further, since the wiring of the circuit wiring is unnecessary, the overall size becomes compact.

(Second Embodiment) In FIG. 3, reference numeral 21 is a resin substrate as a package, and a recess 23,
25 are formed.

The resin substrate 21 is composed of a bottom surface portion 28 which constitutes the bottom wall of the recesses 23 and 25, and a peripheral portion 29 which constitutes the side walls of the recesses 23 and 25.

The bottom portion 28 is similar to that of the first embodiment.
Four conductive resin bodies 31, 32, 3 from the first to the fourth
3, 34 and the insulating resin body 35 interposed between the conductive resin bodies 31, 32, 33, 34 are integrally formed (two-color molding) at the time of molding the die.

The peripheral portion 29 is made of an insulating resin. The peripheral portion 29 is integrally formed with the bottom surface portion 28 at the time of molding by a two-color molding method.

The second conductive resin body 32 and the fourth conductive resin body 34 are provided on the metal lead pin 5 at the time of die molding.
1, 52 (metal members) are embedded respectively, and serve as a bonding pad at the time of wire bonding.

Further, each back surface terminal 3 on the back surface of the resin substrate 21.
Ni / Au plating 46 for external connection is applied to 7, 41, 43, and 45.

The elements 22 and 24 are fixed on the mounting lands 36 and 42 by Ag paste, and the upper electrodes of the elements 22 and 24 and the metal lead pins 5 are attached.
A bonding wire 38 made of Au or the like is connected between the first and the second wirings 52.

The entire inside of the recesses 23 and 25 is
For the purpose of protecting each of the elements 22 and 24 and improving the external quantum efficiency, they are sealed with a transparent resin 27 such as a transparent epoxy resin.

When the reflection type optical coupling device is formed in this manner, the electrical continuity between the elements 22, 24 and the back terminals 41, 45 can be achieved by the metal lead pins 51, 52. Therefore, in this embodiment, the recess 2
It is not necessary to form a metal film on each of the land portions 36, 39, 42, 44 in 3, 25, and the manufacturing process can be shortened accordingly.

The present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.

For example, in the second embodiment, the metallic lead pins 51, 52 are embedded in the second resin bodies 32, 34 made of a highly conductive resin, but the electrical continuity is provided by the metallic lead pins 51, 52. As long as the second resin body 32,
Since the material of 34 does not necessarily require high conductivity, an insulating resin similar to the insulating resin body 35 may be used instead. In this case, the second back surface terminal 4
1, 45 and the metal lead pins 51, 52 may be brought into direct contact with each other and electrically connected.

Further, in each of the above embodiments, each land portion 3
6, 39, 42, 44 and back terminals 37, 41, 43, 4
Although Ni / Au was used as the material of the metal film 46 applied to No. 5, for example, Al, Cu, Ag or the like may be used.

Further, in the first embodiment, for example, after forming the conductive resin bodies 31, 32, 33, 34, the insulating resin body 35 is formed.
Was integrally formed by a two-color molding method.
After forming, the first conductive resin bodies 31 and 33 and the second conductive resin bodies 32 and 34 may be integrally formed by a two-color molding method.

Furthermore, in each of the above embodiments, the package 21 is provided with the recesses 23 and 25. However, if a means such as a light shielding wall for preventing crosstalk between light reception and emission is provided, it is not always necessary. It is not necessary to form the recesses 23 and 25, and therefore a flat plate-shaped package may be used as the package 21.

[0056]

As is apparent from the above description, according to claims 1, 2, 3 and 5 of the present invention, the light emitting element is mounted on the package in which the conductive resin body and the insulating resin body are two-color molded, and the top surface is mounted. Since the light emitting element and the back surface terminal on the back surface are electrically conducted by the conductive resin body, it is not necessary to provide a three-dimensional wiring such as a through hole as in the conventional example. Therefore, the manufacturing process can be simplified by omitting the work process such as the masking process.

Since no through hole is required, molding is easy and the shape of the mold can be simplified. Therefore, the die cost is reduced.

Furthermore, since the circuit wiring is not required, the overall size becomes compact.

According to the fourth aspect of the present invention, the conductive resin body electrically conducts the light emitting element on the upper surface and the rear surface terminal on the back surface with the metal member. Therefore, the electrode inside the recess is not required, and the process is further simplified. Is possible.

[Brief description of drawings]

1A and 1B are views showing a reflection-type optical coupling device of a first embodiment of the present invention, FIG. 1A being a plan view and FIG. 1B being AA of FIG.
Sectional view, (C) is a sectional view taken along line BB of (A)

FIG. 2 is a bottom view showing the reflective optical coupling device according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a reflective optical coupling device according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing a conventional reflection type optical coupling device.

FIG. 5 is a plan view showing a conventional reflection type optical coupling device.

FIG. 6 is a side view showing a conventional reflective optical coupling device.

FIG. 7 is a bottom view showing a conventional reflection type optical coupling device.

[Explanation of symbols]

 21 package 22 light emitting element 23 light emitting side recess 24 light receiving element 25 light receiving side recess 26 intermediate wall 27 translucent resin 31 to 34 conductive resin body 35 insulating resin body 36 light emitting side mounting land portion 37, 41, 43, 45 back surface terminal 38 Bonding wire 39 Light emitting side connection land section 42 Light receiving side mounting land section 44 Light receiving side connection land section 46 Metal film 51, 52 Metal member

Claims (5)

[Claims] 1. A light emitting side mounting land portion for mounting a light emitting element, a light emitting side connecting land portion connected to the light emitting element via a bonding wire, and a light receiving side mounting land portion for mounting a light receiving element on the upper surface of the package. And a light-receiving side connection land portion connected to the light-receiving element via a bonding wire, a light-emitting element is mounted on the light-emitting side mounting land portion, and the light-emitting element and the light-emitting side connection land portion are bonded wires. A light receiving element is mounted on the light receiving side mounting land portion, the light receiving element and the light receiving side wiring land portion are connected by a bonding wire, and a back surface terminal for external connection is formed on the back surface of the package, In a reflective optical coupling device in which each of the elements is resin-sealed with a translucent resin, the package has a top surface serving as a light emitting side mounting land portion and a back surface serving as a first back surface. Highly conductive first conductive resin body that is used as a terminal, high conductive second conductive resin body that has a top surface as a light emitting side connection land portion and a back surface as a second back surface terminal, and the top surface is mounted on the light receiving side A highly conductive third conductive resin body having a land portion and a back surface serving as a third back surface terminal, and a highly conductive fourth conductive terminal having an upper surface serving as a light-receiving side connection land portion and a back surface serving as a fourth back surface terminal. A conductive resin body and an insulating resin body interposed to electrically insulate the conductive resin body from each other, wherein the conductive resin body and the insulating resin body are integrally formed during die molding. Reflective optical coupling device. 2. A light emitting side concave portion for accommodating a light emitting element and a light receiving side concave portion for accommodating a light receiving element are provided on an upper surface of the package.
Formed side by side via an intermediate wall, in the light emitting side concave portion, a light emitting side mounting land portion for mounting the light emitting element, and a light emitting side connection land portion connected to the light emitting element via a bonding wire is formed, A light emitting element is mounted on the light emitting side mounting land section, and the light emitting element and the light emitting side connection land section are connected by a bonding wire, and a light receiving side mounting land section for mounting the light receiving element in the light receiving side concave section and a light receiving section. A light receiving side connection land portion connected to the element via a bonding wire is formed, a light receiving element is mounted on the light receiving side mounting land portion, and the light receiving element and the light receiving side connection land portion are connected by a bonding wire. In the reflective optical coupling device, a back surface terminal for external connection is formed on the back surface of the package, and the recesses are resin-sealed with a translucent resin. , A highly conductive first conductive resin body having a top surface as a light emitting side mounting land portion and a back surface as a first back surface terminal, and a top surface as a light emitting side connection land portion and a back surface as a second back surface terminal A highly conductive second conductive resin body, a highly conductive third conductive resin body having an upper surface serving as a light-receiving side mounting land portion and a rear surface serving as a third back surface terminal, and an upper surface serving as a light-receiving side connection land portion. And a high-conductivity fourth conductive resin body having a back surface serving as a fourth back surface terminal, and an insulating resin body interposed to electrically insulate the conductive resin body from each other. The reflection type optical coupling device is characterized in that the resin body is integrally formed at the time of molding the die. 3. A reflection-type optical coupling device, wherein a metal film for connection is formed on each mounting land portion, each connection land portion, and each back surface terminal according to claim 1 or 2. 4. A light emitting side mounting land portion for mounting a light emitting element, a light emitting side connecting land portion connected to the light emitting element via a bonding wire, and a light receiving side mounting land portion for mounting a light receiving element on the upper surface of the package. And a light-receiving side connection land portion connected to the light-receiving element via a bonding wire, a light-emitting element is mounted on the light-emitting side mounting land portion, and the light-emitting element and the light-emitting side connection land portion are bonded wires. A light receiving element is mounted on the light receiving side mounting land portion, the light receiving element and the light receiving side wiring land portion are connected by a bonding wire, and a back surface terminal for external connection is formed on the back surface of the package, In a reflective optical coupling device in which each of the elements is resin-sealed with a translucent resin, the package has a top surface serving as a light emitting side mounting land portion and a back surface serving as a first back surface. Highly conductive first resin body used as terminals, second resin body whose top surface is the light emitting side connection land portion and whose back surface is the second back surface terminal, and whose top surface is the light receiving side mounting land portion and back surface Is a third backside terminal having high conductivity, a fourth resin body having a light receiving side connection land portion on the upper surface and a fourth backside terminal on the backside, and the conductive resin body are electrically connected to each other. And an insulating resin body interposed to electrically insulate the resin body, the resin body being integrally formed at the time of mold molding, and the second resin body and the fourth resin body being a metal member for connecting to a bonding wire. A reflection type optical coupling device characterized in that the part is exposed and embedded. 5. A highly conductive first resin body having an upper surface serving as a light emitting side mounting land portion and a back surface serving as a first back surface terminal, and an upper surface serving as a light emitting side connection land portion and a back surface serving as a second back surface terminal. A second resin body having a high conductivity, a top surface serving as a light receiving side mounting land portion, and a back surface serving as a third back surface terminal, and a top surface serving as a light receiving side connection land portion and a back surface A fourth resin body serving as a fourth back surface terminal and an insulating resin body interposed to electrically insulate the conductive resin body from each other are integrally mold-molded to form a package. The light emitting element is mounted on the side mounting land portion, the light emitting element and the light emitting side connecting land portion are connected by a bonding wire, and the light receiving element is mounted on the light receiving side mounting land portion. The parts are connected by a bonding wire, Method of manufacturing a reflection type optical coupling device, characterized in that the resin sealing in the translucent resin.