JPH0660988U - Electronic component connector and connector board - Google Patents

Abstract

(57) [Summary] [Object] To provide an electronic component connector capable of ensuring a reliable connection between the outer periphery of a socket and a conductive layer of a connector substrate. The electronic component connector 10 includes a plurality of sockets 11 for receiving lead pins of electronic components, and a plurality of first through holes 21a for receiving and holding the sockets 11.
On the upper surface and the lower surface of the insulator plate 21 in which the socket 1 is formed, the socket 1 is centered around the opening of the first through hole 21a.
Circular space 22a having an inner diameter larger than the outer diameter of 1
And a connector substrate 12 having conductive layers 22 and 23 formed thereon. The socket 11 and the conductive layer 22 are formed in an annular shape so as to be attached around the upper or lower periphery of the socket 11 and cover the circular space 22a when attached to the socket 11 held by the connector substrate 12. 23 and conductive washers 13 and 14 capable of soldering.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic component connector which is mounted on a printed circuit board and holds lead pins of the electronic component to connect the printed circuit board and the electronic component, and a connector circuit board used for the electronic component connector.

[0002]

[Prior art]

 A printed circuit board to which electronic components such as LSI are attached has a wiring pattern that matches the electronic components, and lead pins of the electronic components may be directly soldered to each position of the wiring pattern. However, such a method of mounting electronic components on a printed board has a disadvantage in that a printed circuit board having a different wiring pattern must be prepared for each type of electronic component.

Therefore, conventionally, a connector for electronic components as shown in FIG. 6 has been used. This electronic component connector has a plurality of sockets 61, 61 for receiving lead pins (not shown) of the electronic component, and an upper surface of an insulator plate 621 formed with a plurality of through holes 621 a for receiving and holding these sockets 61. And a connector substrate 62 having thin conductive layers 622 and 623 formed on the lower surface. The conductive layers 622 and 623 are formed with circular spaces 622a and 623a having an inner diameter larger than the outer diameter of the socket 61 centering on the opening of the through hole 621a.

In such an electronic component connector 60, the outer periphery of the socket that receives the power supply lead pin of the electronic component and is connected to the power supply wiring pattern of the printed circuit board is soldered to the conductive layer 622 on the upper surface side. . Also, it receives the grounding lead pin of the electronic component, is connected to the grounding wiring pattern of the printed board, and solders the outer periphery of the socket and the conductive layer 623 on the lower surface side. Each socket is held on the connector board 62 in accordance with the arrangement of lead pins and the wiring pattern of the printed board.

Therefore, even if the type of electronic component is different, it is not necessary to change the holding position of the socket connected to the wiring pattern by only changing the holding position of each socket on the connector substrate 62. There is no need to prepare printed circuit boards with different wiring patterns for different types of parts.

By the way, the above-mentioned connector board is designed to stabilize the power supply current supplied to the electronic components mounted on the connector board, and to exchange noise between circuit phases in the electronic component. To prevent such problems, a decoupling capacitor is installed between the conductive layer on the power supply connection side and the conductive layer on the ground side. This decoupling capacitor is configured by connecting a chip capacitor to each conductive layer and is arranged on the upper surface of the insulator plate or the like.

[0007]

[Problems to be solved by the device]

 However, in the electronic component connector described above, a part of the circular space remains between the outer periphery of the socket received and held in the through hole and the conductive layer as a gap, and this gap is filled up for soldering. There is a problem that it is difficult. That is, if the amount of solder is too small, the connection will be poor.

Further, since the decoupling capacitor is arranged on the upper surface of the insulator plate or the like, the vertical dimension (thickness) of the entire connector substrate increases, which causes a problem that compaction is hindered. .

The present invention has been made in view of the above problems, and a connector for electronic parts and a decoupling for ensuring a reliable connection between the outer periphery of a socket and a conductive layer. It is an object of the present invention to provide a connector substrate that can be made compact while providing a capacitor.

[0010]

[Means for Solving the Problems]

 In order to achieve the above object, the connector for electronic parts of the present invention is formed with a plurality of sockets for receiving lead pins of electronic parts and a plurality of first through holes for receiving and holding these sockets. The connector board has a conductive layer formed on the upper surface and the lower surface of the insulator plate, leaving a circular space having an inner diameter larger than the outer diameter of the socket centering on the opening of the first through hole. When the socket is formed into an annular shape so as to be attached around the outer periphery of the upper or lower portion of the socket and is inserted into and held in the first through hole, it covers the circular space and the conductive layer of the socket. It is also configured with a conductive washer capable of soldering.

The electronic component connector includes a socket for receiving a power supply lead pin of an electronic component among a plurality of sockets received and held in the first through hole and one of the upper and lower conductive surfaces of the insulator plate. The conductive washer is soldered to the layer, and the conductive washer is soldered to the socket that receives the grounding lead pin of the electronic component and the other conductive layer on the upper surface side and the lower surface side. It is preferably used with the source connected and the other conductive layer grounded.

Also, the connector substrate according to the present invention has an insulator plate having a plurality of first through holes for receiving and holding a plurality of sockets for receiving lead pins of an electronic component, and has electrodes at both ends thereof. A second through hole for receiving and holding the capacitor is formed. A conductive layer is formed on the upper and lower surfaces of the insulator plate. Then, in the second through hole, capacitors are inserted so that the electrodes are located above and below, and between the upper electrode and the conductive layer formed on the upper surface of the insulator plate and the lower electrode. Solder connection is made with the conductive layer formed on the lower surface of the insulator plate.

[0013]

In the electronic component connector as described above, the conductive washer is attached to the upper or lower portion of the socket with the socket inserted and held in the first through hole formed in the insulator plate. , The circular space left as a gap between the outer periphery of this socket and the conductive layer is covered. Therefore, by connecting at least the outer circumference of the socket and the inner circumference of the conductive washer and the outer circumference of the conductive washer and the conductive layer with a small amount of solder, electrical connection between the outer circumference of the socket and the conductive layer is secured.

It should be noted that the socket for receiving the power supply lead pin of the electronic component is electrically connected to one of the conductive layers via a conductive washer, and the power is connected to the one conductive layer (for example, the power wiring of the printed board). The power supply socket held on the connector board according to the pattern is electrically connected to one conductive layer via the conductive washer, and this power supply socket is connected to the power supply wiring pattern.) By connecting the socket and the other conductive layer through the conductive washer and grounding the other conductive layer, a power supply current can be supplied to the power supply lead pin to operate the electronic component.

Also, a second through hole may be formed in the insulator plate having the plurality of first through holes, and a capacitor may be inserted into the second through hole to solder-connect the electrodes to the upper and lower conductive layers. As a result, it is possible to configure the connector substrate with the decoupling capacitor built in the insulator plate. As a result, the connector board can be made compact.

[0016]

【Example】

 Hereinafter, a preferred embodiment of the present invention will be described. First, FIG. 1 shows an electronic component connector according to the present invention. The connector 10 includes a plurality of sockets 11, 11, ... For receiving the lead pins 41a, 41b, 41c extending downward from the lower surface of the electronic component 40, and a connector board for holding these sockets (refer to claim 3). “Connector board”) 12.

As shown in FIG. 2, the socket 11 includes a main body portion 11a formed in a cylindrical shape, and a head portion formed on an upper portion of the main body portion 11a so as to have an outer diameter larger than that of the main body portion 11a. 11b and a leg portion 11c formed in a pin shape at the bottom of the main body portion 11a. As shown in FIG. 4, a receiving hole 11d for receiving the lead pin (41a or the like) is formed from the upper surface of the head portion 11b to the lower portion of the main body portion 11a, and the receiving hole 11d is inserted into the receiving hole 11d. A holding spring 11e for holding the lead pin 41 is attached. A locking projection 11f is formed on the outer surface of the main body 11a.

As shown in FIG. 3A, the connector substrate 12 is formed into a substantially square shape in a plan view, and a large number of first through holes 21a, 21a, ... There is. Further, to be described in detail with reference to FIG. 2, the connector substrate 12 is configured with the insulator plate 21 as a base. Between the upper surface and the lower surface of the insulator plate 21, the aforementioned first through holes 21a, 21a, ... Having an inner diameter slightly larger than the outer diameter of the main body 11a of the socket 11 are formed. A conductive layer made of a conductive metal such as copper is formed on the upper surface and the lower surface of the insulator plate 21 (hereinafter, the upper surface side is referred to as an upper conductive layer 22 and the lower surface side is referred to as a lower conductive layer 23). .) Is thinly formed. However, in the upper conductive layer 22, there is formed a circular space 22a that extends around the upper end opening of each first through hole 21a and has an inner diameter larger than the outer diameter of the head portion 11b of the socket 11. Further, the lower conductive layer 23 is formed with a circular space 23a having a larger inner diameter than the outer diameter of the main body portion 11a of the socket 11 and extending around the lower end opening of each first through hole 21a.

In the connector substrate 12 thus configured, the socket 11 is located on the leg 11c side in the first through hole 21a selected according to the position of the lead pin (41a etc.) of the electronic component 40. Is inserted through the upper end opening of the first through hole 21a. Then, as the insertion proceeds, the main body portion 11a of the socket 11 is press-fitted into the first through hole 21a due to the presence of the locking protrusion 11f, and the lower end portion of the head portion 11b of the socket 11 is caught on the upper surface of the insulator plate 21. . As a result, the socket 11 is held by the connector board 12 with the lower ends of the leg 11c and the main body 11a protruding from the lower end opening of the first through hole 21a. The locking protrusion 11f prevents the socket 11 from returning upward from the first through hole 21a.

Further, the connector 10 is provided with two types of conductive washers 13, 14. As shown in FIG. 2, each of the conductive washers 13 and 14 is formed of a conductive metal such as copper in a ring shape, and the surface thereof is solder-plated. However, the inner diameter of the inner peripheral portion 13a of one conductive washer (hereinafter referred to as the upper washer) 13 is equal to the outer diameter of the head portion 11b of the socket 11, and the outer diameter of the upper washer 13 is equal to that of the upper conductive layer 22. It is larger than the inner diameter of the circular space 22a. The inner diameter of the inner peripheral portion 14a of the other conductive washer (hereinafter referred to as the lower washer) 14 is equal to the outer diameter of the main body portion 11a of the socket 11, and the outer diameter of the lower washer 14 is the lower conductive washer. It is larger than the inner diameter of the circular space 23a of the layer 23.

As shown in the figure, the upper washer 13 is provided around the outer periphery of the head portion 11b of the socket 11 that receives and holds the power supply lead pin 41a (see FIG. 1) of the electronic component 40 in the socket 11 that is received and held by the connector substrate 12. Attached to. As a result, the inner peripheral portion 13a of the upper washer 13 contacts the head portion 11b, and the vicinity of the outer periphery of the lower surface of the upper washer 13 contacts the upper conductive layer 22 around the circular space 22a while covering the circular space 22a. On the other hand, the lower washer 14 is attached around the outer periphery of the lower end projecting portion of the main body portion 11a of the socket 11 that receives and holds the grounding lead pin 42b of the electronic component 40 among the sockets 11 that are received and held by the connector substrate 12. As a result, the inner peripheral portion 14a of the lower washer 14 contacts the main body portion 11a, and the vicinity of the outer periphery of the upper surface of the lower washer 14 contacts the lower conductive layer 23 around the circular space 23a while covering the circular space 23a.

The conductive washers 13 and 14 thus attached to the socket 11 are solder-bonded to the socket 11 and the conductive layers 22 and 23 (see FIGS. 4A and 4B). In the figure, H indicates solder.). Specifically, ring-shaped solder is placed near the inner circumference and the outer circumference of each conductive washer 13 and 14 to reflow it. As a result, electrical continuity between the socket 11 and the conductive layers 22 and 23 is ensured via the conductive washers 13 and 14. Here, the amount of solder H used for joining the conductive washers 13 and 14 is smaller than that when the socket 11 and the conductive layers 22 and 23 are directly soldered without using the conductive washers 13 and 14. . For this reason, it is possible to reliably prevent the solder H during reflow from flowing toward the adjacent socket 11 and adhering thereto, and forming a solder bridge.

However, the socket 11 that receives the signal lead pin 41 c (see FIG. 1) of the electronic component 40 is held by the connector base plate 12 without being soldered to any of the conductive layers 22 and 23. .

A power supply is connected to the upper conductive layer 22 of the connector 10 thus assembled. For example, as shown in FIG. 1, the electronic component 40 is inserted into the first through hole 21a in alignment with the position of the power supply wiring pattern 51 on the printed circuit board 50 separately from the socket 11 for receiving the power supply lead pin 41a. The upper washer 13 is soldered to the power supply socket 11 ′ and the upper conductive layer 22, and the leg portion 11 c ′ of the power supply socket 11 ′ is soldered to the power supply wiring pattern 51. When the wiring pattern is different from this example, the legs of the socket that receives the power supply lead pin of the electronic component may be directly soldered to the power supply wiring pattern.

Further, the lower conductive layer 23 is grounded. For example, as shown in FIG. 1, the leg 11c ″ of the grounding socket 11 ″ that receives the grounding lead pin 41b of the electronic component 40 is soldered to the grounding wiring pattern 52 on the printed circuit board 50. If the wiring pattern is different from that of this embodiment, a grounding socket may be provided separately from the socket for receiving the grounding lead pin like the power supply socket 11 '.

Further, the socket 11 that receives the signal lead pin 41 c of the electronic component 40 is soldered to the signal wiring pattern 53 of the printed board 50. In this way, the wiring patterns 51, 52, 53 on the printed board 50 can be connected to the electronic component 40, and the electronic component 40 can be operated.

By the way, as shown in FIG. 3A, a plurality of decoupling capacitors 30, 30, ... Are aligned in the central portion of the connector substrate 12. As shown in FIG. 5, each decoupling capacitor 30 is composed of a chip capacitor 31 inserted and held in a second through hole 21b formed in the insulator plate 21. The chip capacitor 31 is formed in a substantially rectangular parallelepiped shape, and electrodes (a positive electrode 31a and a negative electrode 31b) are provided on both ends in the longitudinal direction of the chip capacitor 31. The chip capacitor 31 is inserted into the second through hole 21b so that the positive electrode 31a is located above and the negative electrode 31b is located below.

The positive electrode 31 a of the chip capacitor 31 is connected to the upper conductive layer 22 by a solder fillet H ′. The negative electrode 31b is also connected to the lower conductive layer 23 by a solder fillet H '. The decoupling capacitor 30 thus configured stabilizes the power supply current supplied to the electronic component 40 via the upper conductive layer 22, and also prevents the transfer of noise between circuits in the electronic component 40. To do. By configuring the decoupling capacitor 30 in such a manner that it is built in the insulator plate 21, the chip capacitor 31 is shown in FIG. Thus, the increase in the thickness T of the connector substrate 12 can be suppressed, and the connector substrate 12 can be made compact.

[0029]

[Effect of device]

 As described above, in the connector for electronic parts of the present invention, the conductive washer is attached to the outer periphery of the socket so as to cover the circular space formed in the conductive layer, and the conductive washer is attached to the outer periphery of the socket and the conductive layer. It is designed to be soldered to and. Therefore, as compared with the conventional solder joining method which does not use the conductive washer, the conduction between the socket and the conductive layer can be secured with a smaller amount of solder. Therefore, by using the connector for the electronic component of the present invention, it is possible to prevent the excessive solder from flowing to the adjacent socket and forming a so-called solder bridge as in the conventional case.

A socket that receives a power supply lead pin of an electronic component is electrically connected to one conductive layer through a conductive washer, and a power supply is connected to the one conductive layer and a socket that receives a ground lead pin is connected. It is possible to operate the electronic component by causing the other conductive layer to pass through through the conductive washer and grounding the other conductive layer.

In the connector substrate of the present invention, the decoupling capacitor is built in the insulator plate. Therefore, the thickness of the connector substrate can be reduced as compared with the conventional case where the decoupling capacitor is formed on the upper surface of the insulator plate or the like. Therefore, according to the present invention, it is possible to make the connector substrate compact.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component connector according to the present invention.

FIG. 2 is a perspective view of a part of the electronic component connector (FIG. 3).
It is an enlarged perspective view of the II part in (A).

FIG. 3A is a plan view showing a connector substrate according to the present invention, and FIG. 3B is a side view of the connector substrate.

FIG. 4A and FIG. 4B are partial cross-sectional views of the electronic component connector.

5 is an enlarged perspective view of a V portion in FIG.

FIG. 6 is a partial cross-sectional view of a conventional connector for electronic components.

[Explanation of symbols]

 10 Electronic Component Connector 11 Socket 12 Connector Substrate 21 Insulator Plate 21a First Through Hole 22,23 Conductive Layer 22a, 23a Circular Space 13,14 Conductive Washer 30 Decoupling Capacitor 31 Chip Capacitor 40 Electronic Component 41a, 41b, 41c Lead Pin 50 printed circuit boards

Claims (3)

[Scope of utility model registration request] 1. An opening of the first through hole in an upper surface and a lower surface of an insulator plate having a plurality of sockets for receiving lead pins of an electronic component and a plurality of first through holes for receiving and holding these sockets. A substrate for a connector in which a conductive layer is formed leaving a circular space having an inner diameter larger than the outer diameter of the socket centering on a portion, and formed in an annular shape so as to be attached around the outer periphery of the upper or lower portion of the socket, A conductive washer capable of being soldered to the outer periphery of the socket and the conductive layer to cover the circular space when attached to the socket inserted and held in the first through hole. Characteristic connector for electronic parts. 2. A socket for receiving a power supply lead pin of the electronic component among the plurality of sockets received and held in the first through hole, and the conductive layer on one of an upper surface side and a lower surface side of the insulator plate. Solder joints through the conductive washers, respectively, and a socket for receiving the grounding lead pin of the electronic component and the upper surface side.
The other conductive layer on the lower surface side is soldered to each other via the conductive washer, the one conductive layer is connected to a power source, and the other conductive layer is grounded. The described electronic component connector. 3. A connector substrate having conductive layers formed on an upper surface and a lower surface of an insulator plate having a plurality of first through holes for receiving and holding a plurality of sockets for receiving lead pins of an electronic component, The insulator plate is formed with a second through hole for receiving and holding a capacitor having electrodes at both ends, and the capacitor is inserted into the second through hole so that the electrodes are vertically arranged. A board for a connector, wherein the upper electrode and the conductive layer on the upper surface are connected by solder, and the electrode on the lower side and the conductive layer on the lower surface are connected by solder.