KR20200091765A - Socket for semiconductor device - Google Patents

Abstract

The present invention relates to a socket for a semiconductor device, which includes a socket body unit configured with an upper body portion provided with a first upper through hole accommodating an upper part of a contact pin, a second upper through hole accommodating an upper part of a signal pin, and an upper ground protrusion portion protruding to an upper direction around the first upper through hole, and a lower body portion provided with a first lower through hole accommodating a lower part of the ground pin, a second lower through hole accommodating a lower part of the signal pin, and a lower ground protrusion portion protruding in a lower direction around the first lower through hole. The socket body unit can be interposed between a printed circuit board and the semiconductor device so that electrical connection is possible.

Description

Socket for semiconductor devices {Socket for semiconductor device}

The present invention relates to a socket for a semiconductor device.

Generally, a semiconductor device may be an integrated circuit (IC) made by assembling a transistor or a diode or a circuit element such as a resistor or a capacitor on a single substrate with high density, and such a semiconductor device is detachably installed in a socket. It can form an electrical connection with a printed circuit board (PCB).

The socket is a component that ensures a stable electrical connection between a lead or pad as a contact point of a semiconductor device and a pad as a contact point of a printed circuit board.

The IC socket disclosed in Patent Literature 1 forms a plurality of contact insertion holes arranged at high density in the inner region of the socket body, and in this contact insertion hole, a contact that forms a conductive path between the lead of the semiconductor device and the pad of the printed circuit board is formed. Insert it. The IC socket can continuously maintain tension for vertical movement by the elastic force of the contact between the lead of the semiconductor device and the pad of the printed circuit board. Of course, the socket for a semiconductor device can insert and embed various types of conductive members such as pogo pins in place of the spring-type contact disclosed in Patent Document 1.

Especially. Various socket structures have been studied for the transmission of ultra-high-speed signals, and a socket employing a shielding method has been developed as one of them, and a more advanced structure in the shielding-type socket is used to transmit an ultra-high-speed signal with improved quality. Suggests.

In addition, when a differential signal is transmitted using a socket employing a conventional shielding method, the transmission quality of the signal is not satisfactory as a target, and a method for improving the signal transmission quality in the transmission of the differential signal through the socket of the shielding structure is described. Suggest.

Republic of Korea Registered Patent No. 10-0913761

The present invention was created to solve the above-mentioned problems, and an object of the present invention is to provide a socket capable of transmitting an ultra-high-speed signal with improved quality.

In addition, it is an object of the present invention to provide a socket capable of transmitting a differential signal with improved quality.

In order to achieve the above object, a first embodiment of the present invention relates to a socket for receiving a probe pin for electrically connecting a lead of a semiconductor device and a pad of a printed circuit board in a pin hole of a socket body, a ground pin An upper body part having a first upper through hole accommodating an upper portion of the first upper through hole accommodating an upper portion of the signal pin, and an upper ground protrusion protruding upwardly around the first upper through hole; A lower body portion having a first lower through hole accommodating a lower portion of the ground pin, a second lower through hole accommodating a lower portion of the signal pin, and a lower ground protrusion protruding downward around the first lower through hole; It may include a socket body portion made.

Here, the ground lead of the semiconductor device is in contact with the upper probe of the ground pin and the upper ground projection of the socket body, and the ground pad of the printed circuit board is in contact with the lower probe of the ground pin and the lower ground projection of the socket body. Is done.

Preferably, the upper body portion and the lower body portion may be made of a conductive material.

In an embodiment of the present invention, the upper ground protrusion may be formed in a truncated cone shape in which the first upper through-hole is disposed in the center, and the lower ground projection may be formed in a truncated cone shape in which the first lower through-hole is disposed in the center.

The present invention may be applied as a first insulating layer to the inner peripheral surface of the second upper through-hole of the upper body portion and the inner peripheral surface of the second lower through-hole of the lower body portion.

Additionally, the present invention can be applied to the outer peripheral surface of the signal pin as a second insulating layer.

The second embodiment of the present invention relates to a socket for accommodating a probe pin for electrically connecting a lead of a semiconductor device to a pad of a printed circuit board in a pin hole of a socket body part, the first receiving the upper part of the probe pin An upper body portion having an upper through hole and a second upper through hole accommodating an upper portion of the shielding module; A lower body portion having a first lower through hole accommodating a lower portion of the probe pin and a second lower through hole accommodating a lower portion of the shielding module; And a shielding module in which a ground pin is spaced apart from the pair of differential signal pins.

Here, the socket body portion is disposed so that the upper probe of the pair of differential signal pins and ground pins disposed on the shielding module is exposed through the second upper through hole, and the lower probe of the pair of differential signal pins and ground pins is penetrated through the second lower part. It is characterized by being arranged to be exposed through the hole.

Specifically, the shielding module includes a pair of differential signal pins; Ground pin; An insert composed of an upper insert having a pair of upper receiving holes for receiving an upper portion of the pair of differential signal pins, and a lower insert having a pair of lower receiving holes for receiving a lower portion of the pair of differential signal pins; And an upper block having a first upper coupling hole accommodating the upper portion of the insert and a second upper coupling hole accommodating the upper portion of the ground pin, and a first lower coupling hole accommodating the lower portion of the insert and a lower portion of the ground pin. 2 A metal block consisting of a lower block with a lower coupling hole; may be made of.

Preferably, the upper body portion and the lower body portion are made of an insulating material, the upper insert and the lower insert are made of an insulating material, and the upper block and the lower block may be made of a conductive material.

In addition, the pair of differential signal pins may consist of a + signal pin and a-signal pin.

Features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, the terms or words used in the specification and claims should not be interpreted in a conventional and lexical sense, and the inventor can appropriately define the concept of terms in order to best describe his or her invention. It should be interpreted as meaning and concept consistent with the technical idea of the present invention based on the principle of being there.

According to the socket of the present invention, by providing a more robust grounding path for the socket body 11 using the ground protrusion 112, the shielding of the socket to the signal pin is performed more robustly, and thus the ultra-high-speed signal can be seen. There is an effect that can be transmitted with improved quality.

In addition, according to the socket of the present invention, shielding is performed with a metal block 25 on two pairs of differential signal pins, but a differential structure is provided between only two pairs of differential signal pins by interposing an insulating material (ie, an insert). There is an effect that can further improve the transmission quality of the signal.

1 is a schematic diagram illustrating a socket for a semiconductor device according to a first embodiment of the present invention.
FIG. 2 is a longitudinal sectional view schematically showing a main part of the socket shown in FIG. 1.
3 is a longitudinal sectional view showing another example of a socket for a semiconductor device according to a first embodiment of the present invention.
4 is a schematic diagram illustrating a socket for a semiconductor device according to a second embodiment of the present invention.
5 is a longitudinal sectional view schematically showing a main part of the socket shown in FIG. 4.
FIG. 6 is a partial cutaway view schematically showing a main part of the socket illustrated in FIG. 4.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and examples which are associated with the accompanying drawings. In addition, it should be noted that, in addition to reference numerals to the components of each drawing in the present specification, the same components have the same numbers as possible, even if they are displayed on different drawings. In addition, in the description of the present invention, when it is determined that detailed descriptions of related known technologies may unnecessarily obscure the subject matter of the present invention, detailed descriptions thereof will be omitted. In this specification, terms such as first and second are used to distinguish one component from another component, and the component is not limited by the terms. In the accompanying drawings, some components are exaggerated, omitted, or schematically illustrated, and the size of each component does not entirely reflect the actual size.

The present invention relates to a socket for a semiconductor device that can be used for testing, connecting, or mounting various semiconductor devices including a central processing unit (CPU), graphics processing unit (GPU), chipset, and the like.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view and a partially enlarged view schematically showing a socket 1 for a semiconductor device according to a first embodiment of the present invention. FIG. 2 is a longitudinal sectional view schematically showing a main part of the socket shown in FIG. 1.

The socket 1 for a semiconductor device according to the first embodiment of the present invention is interposed between the semiconductor device 3 and the printed circuit board 4, for example, a printed circuit for a socket 1 having a socket body 11 It is fixed on the substrate 4 (the illustration and description of the mechanism for fixing, etc. are omitted), and the semiconductor device 3 can be detachably disposed on the socket 1.

The socket 1 according to the present invention is a lead 31 formed on the bottom surface of the semiconductor device 3 with the upper probe of the probe pin 13 having its own elasticity disposed in the socket body 11 (where'lead' is 'Pad','Bump','Ball', and the like.), and the lower probe thereof may contact the pad 41 of the printed circuit board 4 and the like.

Schematically, a socket 1 for a semiconductor device according to a first embodiment of the present invention includes a socket body 11 having a plurality of pin holes 111; 111', 111" arranged in an array, and a plurality of pins. It consists of probe pins 13 accommodated in holes 111; 111', 111".

The socket body 11 has a plurality of pin holes 111; 111', 111" in the same pattern arrangement as the leads of the semiconductor device 3 contacting the upper probe and the pads of the printed circuit board 4 contacting the lower probe. It is preferred to form.

In addition, the present invention may include a frame (not shown) for supporting the socket 1, a mechanism for fixing the socket body 11, a mechanism for pressing the semiconductor device 3, etc. (not shown). .

The probe pin 13 is accommodated in each pin hole 111;111',111" to be inserted into the socket body 11 through its own elasticity, and the probe pin is a pogo pin as shown. It may be, but is not limited to, various types of conductive members may be employed, as is well known to those skilled in the art, the socket 1 is a power pin (not shown), a conductive ground pin 13G for grounding. , Probe pins 13 composed of signal pins 13S for signal transmission, etc. are respectively inserted into the pin holes, where the ground pins 13G are leads for grounding on the printed circuit board and/or semiconductor device. And a pad.

Referring to FIG. 2, a socket for a semiconductor device according to a first embodiment of the present invention includes a plurality of pin holes 111; 111', 111 including one or more ground pins 13G and one or more signal pins 13S. ") is densely arranged in the inner region of the socket body part 11. For reference, the positions of the ground pin 13G and the signal pin 13S shown in FIGS. 2 to 3 are exemplary only and are limited to this. For example, the ground pin 13G may be distributed in the corner of the socket body 11 or may be disposed in the vicinity of the signal pin 13S where shielding is particularly required.

Specifically, the socket 1 for a semiconductor device according to the first embodiment of the present invention is designed to implement a reliable grounding state through the geometry of the socket body 11. In the embodiment of the present invention, there is a special structure to provide a path for electrically connecting the ground (GND) of the printed circuit board and/or the semiconductor device to the socket body 11, and specific details will be described later.

The socket body portion 11 forms an upper body portion 11a having one or more upper through holes 111a' and 111a" in the thickness direction, and one or more lower through holes 111b' and 111b" in the thickness direction. It is manufactured in a state separated by one lower body portion 11b, and the ground pin 13G is a grounding pin hole 111' limited to the first upper through hole 111a' and the first lower through hole 111b'. And insert the signal pin 13S into the signal pin hole 111", which is defined by the second upper through hole 111a" and the second lower through hole 111b", and then engages the upper body portion 11a. ) And the lower body portion 11b may be integrally combined through various coupling methods such as bolting, etc. Preferably, the upper body portion 11a and the lower body portion 11b are made of metal, that is, It is made of conductive material.

The upper body portion 11a includes a first upper through hole 111a' receiving the upper portion of the ground pin 13G, a second upper through hole 111a" receiving the upper portion of the signal pin 13S, and 1 It is provided with an upper ground projection 112a protruding upwardly around the upper through-hole 111a' As shown, the upper ground projection 112a is in an outer direction (upward) from the upper surface of the upper body portion 11a. Is projected to contact the ground lead of the semiconductor device 3. The upper ground projection 112a is also provided with the upper portion of the ground pin 13G into its interior through the first upper through hole 111a' disposed in the center. Allows the probe to be inserted and allows it to move up and down.

Correspondingly, the lower body portion 11b includes a first lower through hole 111b' receiving the lower portion of the ground pin 13G and a second lower through hole 111b" receiving the lower portion of the signal pin 13S" ), and a lower ground protrusion 112b protruding downward around the first lower through hole 111b' As shown, the lower ground protrusion 112b is external to the lower body portion 11b. It protrudes in the direction (downward) to come into contact with, for example, the ground pad of the printed circuit board 4. The lower ground protrusion 112b is also ground pin into its interior through the first lower through hole 111b' disposed in the center. Allows the lower probe of (13G) to be inserted and allows its up and down movement.

The upper probe of the ground pin 13G is disposed to be exposed above the inlet of the first upper through hole 111a', while the lower probe of the ground pin 13G is disposed to be exposed below the inlet of the first lower through hole 111b'. . Under the pressure release state, the total length of the ground pin, that is, the length between the upper probe and the lower probe of the ground pin is greater than the length between the upper ground protrusion 112a and the lower ground protrusion 112b of the socket body portion 11.

When the socket 1 for a semiconductor device according to the first embodiment of the present invention is coupled to the semiconductor device 3 and/or the printed circuit board 4, the ground lead of the semiconductor device and/or the ground pad of the printed circuit board It is preferentially contacted with the upper ground projection 112a and/or the lower ground projection 112b of the socket to ensure a more reliable grounding path between the semiconductor device and the printed circuit board while providing a more robust ground to the socket body. .

Compared to grounding the socket body 11 by relying only on the contact between the ground pin 13G and the socket body 11, the socket body 11 can be more reliably grounded, and the ground pin 13G Compared to providing a path between the semiconductor device and the printed circuit board, the impedance of the path can be significantly reduced.

The upper ground protrusion 112a and the lower ground protrusion 112b have a truncated pyramid shape, a frustum shape having a flat contact surface to ensure direct contact with a lead or pad, such as a truncated pyramid shape, as shown. It may be formed of.

As the processing speed of semiconductor devices increases, the frequency of signals used in semiconductor devices is increasing, and accordingly, the demand for high-quality transmission of high-speed signals is increasing. The signal pin 13S that transmits a high frequency signal has a very sensitive characteristic to external electromagnetic waves or cross-talk in a high frequency band, but it shields electromagnetic waves due to a socket body made of a conductive material to reduce noise and noise during high frequency operation. Cross-talk can be effectively suppressed.

Therefore, as described above, the socket body portion 11 is formed by surrounding the signal pin 13S by means of the upper body portion 11a made of metal and the lower body portion 11b made of metal, and thus a signal pin that is a signal path. Since the outer portion of (13S) is configured to surround the socket body portion of a conductive material, electromagnetic waves can be effectively shielded through the socket body portion. In particular, in the present invention, this function is small?? Electrical grounding for the body portion is performed more robustly.

The signal pin 13S is intended for signal transmission, and is preferably placed in the signal pin hole 111" so as not to contact the socket body 11 made of a conductive material, but the configuration for this is omitted in FIG. 2 And was shown.

3 is a longitudinal sectional view schematically showing a socket for a semiconductor device according to a first embodiment of the present invention. The socket for a semiconductor device illustrated in FIG. 3 is another modification of the socket for a semiconductor device illustrated in FIG. 2, and has a very similar structure except for the arrangement of the insulating layer, so as to help a clear understanding of the present invention Descriptions of similar or identical configurations will be excluded.

The socket for a semiconductor device according to a modified example of the present invention is provided with a ground pin 13G in a ground pin hole 111' formed in the socket body 11, and a signal pin 13S in the signal pin hole 111". As described above, the signal pin 13S has a second upper through-hole of the upper body portion 11a so as not to contact the upper body portion 11a of the conductive material and the lower body portion 11b of the conductive material. (111a") A first insulating layer 14 is applied to the inner peripheral surface and the inner peripheral surface of the second lower through hole 111b" of the lower body portion 11b. The first insulating layer 14 is around the entrance of the second upper through hole In addition, it is additionally applied to the circumference of the second lower through-hole to prevent contact opportunities between the socket body and the signal pin 13S.

Further, in the socket for a semiconductor device of the present invention, the second insulating layer 15 is applied to the outer peripheral surface of the signal pin 13S. Thus, the signal pin 13S may be insulated from the signal pin hole 111", that is, the socket body 11 by the first insulating layer 14 and/or the second insulating layer 15. .

4 is a perspective view and a partially enlarged view schematically showing a socket 2 for a semiconductor device according to a second embodiment of the present invention.

The socket 2 for a semiconductor device according to the second embodiment of the present invention is interposed between the semiconductor device 3 and the printed circuit board 4, for example, a printed circuit for a socket 2 having a socket body 21. The semiconductor device 3 may be fixedly mounted on the substrate 4 and detachably disposed in the socket 2. The socket 2 according to the present invention contacts the upper probe of the probe pin 23 having its own elasticity disposed in the socket body portion 21 with a lead formed on the bottom surface of the semiconductor device 3, and prints the lower probe thereof The circuit board 4 contacts the pad.

The socket 2 for a semiconductor device according to the second embodiment of the present invention includes a socket body portion 21 having a plurality of pin holes 211 and one or more shielding module holes 212 arranged in an array, and one or more It comprises one or more shielding modules 22 individually received in the shielding module holes 212, and probe pins 23 accommodated in the plurality of pinholes 211.

As shown, the present invention may include a plurality of probe pins 23; 23D, 23G in the shielding module 22.

The socket body portion 21 has a plurality of pin holes 211 and one or more shielding modules in the same pattern arrangement as the leads of the semiconductor device 3 contacting the upper probe and the pads of the printed circuit board 4 contacting the lower probe. It is desirable to form the holes 212.

The probe pin 23 is disposed in each of the pin holes 211 as well as the receiving holes 24': 24a', 24b' of the shielding module 22 so as to be inserted into the socket body 21 through its own elasticity. , The probe pin may be a pogo pin as illustrated, and is not limited thereto, and various types of conductive members may be employed. As is well known to those skilled in the art, the socket 2 inserts probe pins 23 composed of power pins, ground pins, signal pins, and the like into pin holes 211, respectively. In addition, the socket inserts and embeds a shield module 22 including a pair of differential signal pins 23D and probe pins such as a ground pin 23G into the socket body 21.

The grounding pin 23G of the shielding module 22 is arranged to contact a grounded lead (or pad) on a printed circuit board and/or a semiconductor device and thus a shielding block 25: 25a contacting the grounding pin 23G, 25b) is used to ground the pair of differential signal pins 23D to ground the pair of differential signal pins 23D. The differential signal pin 23D is a signal path member capable of transmitting and receiving data signals to and from a printed circuit board and/or semiconductor device, thereby minimizing interference or noise effects generated between the pair of differential signal pins 23D and its surroundings. .

5 to 6, a socket for a semiconductor device according to a second embodiment of the present invention includes a plurality of pin holes 211 accommodating each probe pin 23 inside the socket body 21 It is arranged in high density in the area. For reference, the positions of the probe pins shown in FIGS. 5 to 6 are exemplary and are not limited thereto.

In particular, the socket 2 for a semiconductor device according to the second embodiment of the present invention can embed one or more shielding modules 22 in a socket body portion to enable more reliable and good quality signal transmission. The shielding module 22 includes a pair of differential signal pins 23D and a ground pin 23G, as shown, and may include a single or multiple signal pins that transmit general signals, but not differential signals. have. The shielding module 22 has a pair of differential signal pins 23D having two complementary signals, the pair of differential signal pins 23D being + signal pins,-signal pins as is well known to those skilled in the art. And adjacently spaced.

In the second embodiment of the present invention, the insert 24 and the metal block 25 are arranged in a double overlap around the periphery of the pair of differential signal pins 23D, and the signal transmission efficiency of the socket 2 for a semiconductor device is improved. I can do it.

The socket body 21 includes an upper body portion 21a in which one or more first upper through holes 211a and one or more second upper through holes 212a are formed in a thickness direction, and one or more first lower through holes ( 211b) and one or more second lower through-holes 212b are formed in a separated state by forming the lower body portion 21b formed in the thickness direction, and the one or more probe pins 23 and the first upper through-holes 211a Inserted into the pin hole 211 defined by the first lower through hole 211b and the shield module hole 212 defined by the at least one shield module 22 as the second upper through hole 212a and the second lower through hole 212b. ) And then combine. The combination of the upper body portion 21a and the lower body portion 21b may be integrally combined through various coupling methods such as bolting. Preferably, the upper body portion 21a and the lower body portion 21b are made of an insulating material such as plastic or silicone.

Specifically, the upper body portion (21a) is a size that can accommodate the first upper through-hole (211a) having a size and shape to accommodate the upper portion of the probe pin 23, and the upper portion of the shielding module 22 And a second upper through hole 212a having a shape. Correspondingly, the lower body portion 21b is capable of accommodating the first lower through-hole 211b having a size and shape capable of accommodating the lower portion of the probe pin 23 and the lower portion of the shielding module 22. A second lower through hole 212b having a size and shape is provided.

The shielding module 22 is inserted into the interior space defined by the second upper through-hole 212a of the upper body portion 21a and the second lower through-hole 212b of the lower body portion 21b, a pair spaced apart from each other The upper probes of the differential signal pin 23D and the ground pin 23G are disposed to be exposed above the inlet of the second upper through hole 212a, while the lower probes of the pair of differential signal pin 23D and the ground pin 23G are The second lower through hole 212b is disposed to be exposed below the entrance.

Specifically, the shielding module 22 may be composed of an insert 24 accommodating a pair of differential signal pins 23D and a metal block 25 accommodating the insert 24 and ground pins 23G together. .

The insert 24 includes a pair of upper inserts 24a having a pair of upper receiving holes 24a' spaced apart from each other while accommodating the upper portion of the pair of differential signal pins 23D and allowing the upper probe to move up and down. It has a lower insert (24b) with a pair of lower receiving holes (24b') spaced apart from each other while accommodating the lower portion of the differential signal pin (23D) and allowing the lower probe to move up and down. Preferably, the upper insert 24a and the lower insert 24b are made of a plastic material, that is, an insulating material.

The insert 24 is made of an insulating material and is composed of an integral single body for a pair of differential signal pins, and is not separately configured for two differential signal pins constituting a pair of differential signal pins. Further, the insert 24 does not place a conductive material between the pair of differential signal pins 23D spaced apart from each other.

The metal block 25 has a size and shape capable of accommodating the upper portion of the insert 24, and the first upper coupling hole 25a' and the ground pin (which allow the vertical movement of the upper probe of the differential signal pin 23D) ( 23G) the upper block 25a with a second upper coupling hole 25a" having a size and shape capable of receiving the upper portion, and a differential signal having a size and shape capable of receiving the lower portion of the insert 24 The first lower coupling hole 25b' that allows the lower probe of the lower probe of the pin 23D and the second lower coupling hole 25b" having a size and shape to accommodate the lower portion of the ground pin 23G are provided. It consists of a lower block (25b) equipped. Preferably, the upper block 25a and the lower block 25b are made of a metal material.

As described above, the upper block 25a made of a conductive material arranges the upper probe of the differential signal pin 23D in the first upper coupling hole 25a' penetrating in the thickness direction of the upper block and is made of conductive material The lower block 25b arranges the lower probe of the differential signal pin 23D in the first lower coupling hole 25b' penetrating in the thickness direction of the lower block.

The metal block 25 is formed of a metal material as described above, and can shield electromagnetic waves transmitted from the outside or to the outside, and is configured therein and interferes between pins (signal pins, differential pins) that transmit signals. Reduce the phenomenon. As the processing speed of the semiconductor device increases, the frequency of the signal used in the semiconductor device is increasing. Accordingly, a demand for a signal pin (not shown) or a differential signal pin 23D capable of transmitting as a high-speed signal is increasing. The differential signal pin 23D transmitting a high frequency signal has a very sensitive characteristic to external electromagnetic waves in a high frequency band, but it can effectively suppress noise and interference during high frequency operation by shielding electromagnetic waves due to a metal block.

According to the socket of the present invention, shielding is performed by using a metal block 25 on two pairs of differential signal pins, but a structure in which only an insulating material (i.e., insert) is interposed between the two pairs of differential signal pins. There is an effect that can further improve the transmission quality.

At first glance, it would be easy to think of a structure in which each differential signal pin is individually shielded by inserts and metal blocks wrapped in each differential signal pin constituting the differential signal pin pair, but in the present invention, a pair of differential signal pins is used. It is assumed that the metal block 25 is wrapped all at once.

The socket 2 for a semiconductor device according to the second embodiment of the present invention is a pair of differential signal pins 23D with an insert forming a pair of upper receiving holes 24a' and a pair of lower receiving holes 24b'. Accept. In addition, although not shown, the socket 2 for a semiconductor device accommodates each signal pin with an insert forming a pair of upper receiving holes 24a' and a pair of lower receiving holes 24b'.

To be selectable, a socket body portion in which a shielding module 22 is buried is limitedly applied to a portion of the socket body portion 21, such as a socket for a semiconductor device according to a second embodiment of the present invention. Of course, the shielding module arranged in FIG. 4 may be changed according to the lead or pad arrangement pattern of the semiconductor device.

As described above, the present invention has been described in detail through examples, but this is for specifically describing the present invention, and the socket for a semiconductor device according to the present invention is not limited thereto, and common knowledge in the art within the technical spirit of the present invention It will be apparent that the modification or improvement is possible by the person who possesses. All simple modifications or changes of the present invention belong to the scope of the present invention, and the specific protection scope of the present invention will be clarified by the appended claims.

1 ----- socket,
11 ----- socket body, 13 ----- probe pin,
13G ----- ground pin, 13S ----- signal pin,
2 ---- socket,
21 ----- Socket body, 23 ----- Probe pin,
23D ----- differential signal pin, 23G ----- ground pin,
3 ----- semiconductor device,
4 ----- Printed circuit board.

Claims (10)

In the socket for receiving the probe pin (13; 13G, 13S) for electrically connecting between the lead of the semiconductor device (3) and the pad of the printed circuit board (4) in the pin hole of the socket body (11),
The socket body portion 11,
The first upper through-hole 111a' receiving the upper portion of the ground pin 13G, the second upper through-hole 111a" receiving the upper portion of the signal pin 13S, and the first upper through-hole 111a ') The upper body portion (11a) having an upper ground projection (112a) protruding upward from the circumference;
The first lower through hole 111b' receiving the lower portion of the ground pin 13G, the second lower through hole 111b" receiving the lower portion of the signal pin 13S, and the first lower through hole It comprises a; (111b') lower body portion (11b) having a lower ground protrusion (112b) protruding downward from the circumference;
The ground lead of the semiconductor device is in mutual contact with the upper probe of the ground pin 13G and the upper ground protrusion 112a of the socket body 11,
A socket for a semiconductor device, characterized in that the ground pad of the printed circuit board is in contact with the lower probe of the ground pin (13G) and the lower ground protrusion (112b) of the socket body portion (11).
The method according to claim 1,
The upper body portion (11a) is made of a conductive material,
The lower body portion (11b) is a socket for a semiconductor device, characterized in that made of a conductive material.
The method according to claim 1,
The upper ground protrusion 112a is formed in a truncated cone shape in which the first upper through hole 111a' is disposed at the center.
The lower ground protrusion 112b is a socket for a semiconductor device, characterized in that it is formed in a truncated cone shape in which the first lower through hole 111b' is disposed in the center.
The method according to claim 1,
The inner peripheral surface of the second upper through hole 111a" of the upper body portion 11a and the inner peripheral surface of the second lower through hole 111b" of the lower body portion 11b are coated with a first insulating layer 14 Socket for semiconductor devices.
The method according to claim 1,
The signal pin (13S) is a socket for a semiconductor device, characterized in that the outer peripheral surface of the signal pin is coated with a second insulating layer (15).
In the socket for receiving the probe pin 23 for electrically connecting the lead of the semiconductor device 3 and the pad of the printed circuit board 4 in the pin hole of the socket body portion 21,
The socket body portion 21,
An upper body portion 21a having a first upper through hole 211a accommodating an upper portion of the probe pin 23 and a second upper through hole 212a accommodating an upper portion of the shielding module 22;
A lower body portion 21b having a first lower through hole 211b accommodating a lower portion of the probe pin 23 and a second lower through hole 212b accommodating a lower portion of the shielding module 22; And
A socket for a semiconductor device, characterized in that it is configured to include; shielding module 22 spaced apart from one or more signal pins and a ground pin (23G).
The method according to claim 6,
The one or more signal pins include a pair of differential signal pins 23D,
The socket body portion 21,
The pair of differential signal pins 23D and the upper probes of the ground pin 23G disposed on the shield module 22 are disposed to be exposed through the second upper through hole 212a, and the pair of differential signals A socket for a semiconductor device, characterized in that the lower probe of the pin 23D and the ground pin 23G is disposed to be exposed through the second lower through hole 212b.
The method according to claim 7,
The shielding module 22,
The pair of differential signal pins 23D;
The ground pin 23G;
An upper insert 24a having a pair of upper receiving holes 24a' for receiving an upper portion of the pair of differential signal pins 23D, and a lower portion of the pair receiving lower portions of the pair of differential signal pins 23D. An insert 24 comprising a lower insert 24b having a receiving hole 24b'; And
An upper block (25a) having a first upper coupling hole (25a') for receiving the upper portion of the insert 24 and a second upper coupling hole (25a") for receiving the upper portion of the ground pin (23G), And a lower block 25b having a first lower engaging hole 25b' receiving the lower portion of the insert 24 and a second lower engaging hole 25b" receiving a lower portion of the ground pin 23G. It comprises; a metal block 25; socket for a semiconductor device comprising a.
The method according to claim 8,
The upper body portion 21a and the lower body portion 21b are made of an insulating material,
The upper insert 24a and the lower insert 24b are made of an insulating material,
The upper block (25a) and the lower block (25b) is a socket for a semiconductor device, characterized in that made of a metal material.
The method according to claim 8,
Shielding is performed with the upper block 25a and the lower block 25b with respect to the pair of differential signal pins 23D, but only the insert is interposed between the pair of differential signal pins 23D. Socket for semiconductor devices.

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