JPH0660282U - Heat dissipation structure for motor electronic components - Google Patents

Abstract

(57) [Abstract] [Purpose] To improve the heat dissipation effect of electronic components that generate heat even if the circuit board is reduced to the minimum required area. A motor in which a stator core set 21 is disposed on a circuit board 20 and an electronic component 24 that requires heat dissipation is mounted, and the electronic component 24 is mounted at a position where it abuts a rib 22a formed on the stator core set. , Electronic components 24
The heat generated by the above is radiated to the rib 22a. [Effect] The required area of the circuit board can be reduced to the necessary minimum, and the heat generated by the electronic components can be radiated well to the stator core. Therefore, an inexpensive board can be used as the circuit board. The motor cost can be reduced.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heat dissipation structure for a motor electronic component having an electronic component such as a motor drive IC for rotating a motor such as a brushless motor.

[0002]

[Prior art]

 As shown in FIGS. 7 and 8, a conventional brushless motor has a circuit board 1 as a base board, a stator core set 2 arranged thereon, and an electronic device such as a motor drive IC for rotationally driving the motor. The component 3 is mounted.

As the circuit board 1, an iron board having a printed wiring pattern of copper foil formed on the surface of an iron plate via an insulating layer is generally adopted, and various kinds of circuits including a motor drive IC for rotationally driving the motor are used. The electronic component 3 is mounted. The electronic component 3 composed of the motor drive IC generates heat when a predetermined drive current is applied, and therefore radiates heat to the circuit board 1. On the other hand, in the stator core set 2 arranged on the circuit board 1, the winding 5 is wound around each of a plurality of ribs 4 formed so as to project outward from the central portion. Each winding 5 is connected to the electronic component 3 such as the motor drive IC to control energization. Reference numeral 11 in the drawing denotes a terminal portion for electrically connecting to an external circuit.

The central portion of the stator core set 2 is attached to a holder 6 fixed to the circuit board 1. A bearing 7 is held in the inner hole of the holder 6, and a rotating shaft 8 fixed to the center of a rotor 9 is rotatably supported by the bearing 7. Further, the drive magnet 10 is fixed to the inner peripheral surface of the rotor 9 and is rotationally biased by being opposed to the outer peripheral surface of the stator core set 2.

[0005]

[Problems to be solved by the device]

 In the conventional motor described above, since the electronic components that generate heat are mounted on the circuit board made of the iron board at different positions on the same plane as the stator core assembly, the required area of the circuit board becomes large. Electronic components radiate heat through the iron substrate, but the iron substrate has a higher unit price than general phenol substrates, and the cost is inevitably high if a large-area iron substrate is used as the circuit substrate. There's a problem. Further, although the iron substrate has a predetermined heat conductivity, there is a problem that a desired heat radiation effect cannot be obtained when the electronic component is mounted.

The present invention has been made in order to solve such a problem, and makes it possible to improve the heat radiation effect of electronic components that generate heat even if the circuit board is reduced to the minimum required area. An object of the present invention is to provide a heat dissipation structure for a motor electronic component that can be used.

[0007]

[Means for Solving the Problems]

 The present invention is a motor in which a stator core set is disposed on a circuit board and electronic components that require heat dissipation are mounted, and the electronic components are mounted at positions where they abut on ribs formed on the stator core set. The feature is that the heat generated by the electronic component is radiated to the rib.

[0008]

[Action]

 When an electronic component that requires heat dissipation is mounted at the position of the circuit board that abuts the rib formed on the stator core set and the heat generated by the electronic component is dissipated to the rib, the electronic component is placed between the circuit board and the stator core. The required area of the circuit board can be minimized. Further, since the heat generated by the electronic components can be radiated favorably to the stator core, it is possible to use an inexpensive phenol substrate instead of the iron substrate as the circuit substrate, and reduce the motor cost.

[0009]

【Example】

 An embodiment of a heat dissipation structure for a motor electronic component according to the present invention will be described below with reference to the drawings. The same reference numerals as those in FIG. 7 indicate the same parts, and detailed description thereof will be omitted. The embodiment shown in FIG. 1 shows a brushless motor of a three-phase type similar to that shown in FIG. 7, in which a stator core set 21 disposed on the circuit board 20 is formed so as to project outward from the central portion. Ribs 22 that form individual salient poles are formed.

A winding wire 23 belonging to each phase is wound around each of the nine ribs 22, which is a multiple of the number of phases, of the ribs 22. The central rib 22a of the remaining three ribs, which are not wound, is formed wider than the other ribs 22 and functions as a rib for heat radiation described later. Moreover, at least the ribs 22a for heat dissipation are not coated with an insulating coating, and a metal surface such as a silicon steel plate as a core material is exposed. Each rib 22 provided with another winding wire 23 is formed with a film having an electrically insulating property by an insulating coating.

A motor drive IC 24 for rotationally driving the motor, which is an electronic component, is mounted on the circuit board 20 so as to be positioned directly below the heat dissipation rib 22a configured as described above. There is. Each terminal of the drive IC 24 is soldered to a wiring pattern (not shown) of the circuit board 20. Further, the winding 23 and other electronic components (not shown) are wired and mounted on the wiring pattern of the circuit board 20.

Then, as shown in FIG. 2, the back surface of the drive IC 24 is brought into close contact with the rib 22a. Therefore, it is desirable to set the mounting height of the stator core set 21 to the circuit board 20 so that the distance between the rib 22a and the circuit board 10 matches the height of the drive IC 24 in the mounted state. However, when a gap is formed between the back surface of the drive IC 24 and the rib 22a, an appropriate member such as a solid or plastic material having good thermal conductivity may be interposed in this gap. .

As described above, as a result of bringing the drive IC 24 into contact with the heat dissipation rib 22 a, the heat generated from the drive IC 24 is transferred to the heat dissipation rib 12 a, and the heat is removed from the rib 12 a and the stator core assembly 21. It is radiated to the other side. Therefore, as the circuit board 20, a relatively inexpensive phenol board having low thermal conductivity can be used. That is, since the rib 22a radiates heat to the driving IC 24 that generates heat, it is not always necessary to radiate heat toward the circuit board 20. However, if the circuit board 20 is an iron board as in the conventional case, the heat radiation effect can be improved by several steps. Also, the area of the circuit board 20 may be the minimum necessary size because the drive IC 24 is mounted right under the rib 22a, which reduces the circuit board cost and the necessary area of the circuit board 20. As a result, the motor can be downsized.

As shown in FIG. 1, the width of the heat radiation rib 22a does not necessarily have to be the same as the width of the drive IC 24, and can be set arbitrarily. Incidentally, the width of the rib 22a may be the same as that of the rib 22 provided with the other winding wire 23, or as shown in FIG. 3, a connecting rib 25 may be formed by integrally connecting ribs for three poles. Good. In this case, the drive IC 24 is positioned below the connecting rib 25 as shown by the dotted line, and the back surface is brought into contact with the connecting rib 25 so as to be in close contact therewith.

FIG. 4 shows another embodiment of the present invention, which is an example in which a power transistor 26 as a heat-generating electronic component is brought into contact with a rib to radiate heat. That is, as shown in FIG. 5, the back surfaces of the three power transistors 26 that are driven by energizing the three-phase windings 23 are closely contacted with the heat radiation ribs 22a having the same structure as in FIG. I am letting you. As a result, the heat generated from the power transistor 26 is transferred to the heat radiating rib 22a, and is eventually radiated outward from the rib 22a and the stator core set 21.

Also in this example, it is desirable to set the mounting height of the stator core set 21 to the circuit board 20 so that the power transistor 26 and the rib 22a are closely attached. Further, when a gap is formed, an appropriate member having good thermal conductivity may be interposed in this gap. Furthermore, the width of the rib 22a for heat dissipation may be set arbitrarily, and three power transistors 26 are provided at predetermined intervals on the connecting rib integrally connecting the ribs for three poles as shown in FIG. Alternatively, they may be mounted side by side on the circuit board 20.

FIG. 6 shows still another embodiment of the present invention, in which the stator core assembly 30 has six ribs 31 for winding, and one heat dissipation rib 31a is formed. This is applied to a three-phase motor in which a drive magnet 32 having 10 magnetic poles on its surface is rotatably opposed to each other. That is, the ribs 31 of the stator core assembly 30 and the ribs 31a for heat dissipation are formed at equal angular intervals of 48 °, and the ribs 31a for heat dissipation are formed so that the opposing angles of the other ribs 31 and the drive magnet 32 are substantially the same. The inner part is formed wide. Then, just below the ribs 31a for heat dissipation, the back surface of the driving IC 24 is brought into contact with the ribs 31a so as to be in close contact therewith, and the heat generated by the driving ICs 24 is transferred to the ribs 31a so that the stator core assembly is The heat is radiated outward from 30 as in the above-described example.

It should be noted that the above-described embodiment is merely an example, and if the motor has circuit components that require heat dissipation such as a two-phase or five-phase type instead of the above-described three-phase formation, the The number of poles or the shape of the motor can be variously changed without departing from the scope of the present invention.

[0019]

[Effect of device]

 As is clear from the above description, the heat dissipation structure of the motor electronic component of the present invention is configured such that the electronic component that requires heat radiation is brought into contact with the rib formed on the stator core assembly and the heat is radiated to the rib. Can be arranged between the circuit board and the stator core, so that the required area of the circuit board can be minimized. Furthermore, since the heat generated by electronic components can be radiated to the stator core satisfactorily, it is possible to use an inexpensive board as the circuit board, and in addition to the fact that a small area is required, the motor cost is reduced. There is an advantage that can be done.

[0020]

[Submission date] December 24, 1993

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0005

[Correction method] Change

[Correction content]

[0005]

[Problems to be solved by the device]

In the conventional motor described above, since the electronic components that generate heat are mounted on the circuit board made of the iron board at different positions on the same plane as the stator core assembly, the required area of the circuit board becomes large. Electronic components radiate heat through the iron substrate, but the iron substrate has a higher unit price than general phenol substrates, and the cost is inevitably high if a large-area iron substrate is used as the circuit substrate. There's a problem. Further, although the iron substrate has a predetermined heat conductivity, there is a problem that a desired heat radiation effect cannot be sufficiently obtained in a state where electronic components are mounted.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction content]

[0007]

[Means for Solving the Problems]

The present invention is a motor in which a stator core set is disposed on a circuit board and electronic components that require heat dissipation are mounted. The electronic component is mounted at a position where it abuts a core portion of the stator core set. It is characterized in that the heat generated by is radiated to the core portion .

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction content]

[0008]

[Action]

When an electronic component that requires heat dissipation is mounted on the position of the circuit board that abuts the core part of the stator core group and the heat generated by the electronic component is dissipated to the core part , the electronic component is placed between the circuit board and the status core . The required area of the circuit board can be minimized. Furthermore, since the heat generated by the electronic components can be radiated favorably to the stator core, an inexpensive phenol substrate can be used as the circuit substrate instead of the iron substrate, and the cost of the motor can be reduced.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction content]

As described above, as a result of bringing the drive IC 24 into contact with the heat dissipation rib 22 a, heat generated from the drive IC 24 is transferred to the heat dissipation rib 22 a, and the rib 22 a and the stator core assembly 21 are also transferred. Heat is radiated outward from. Therefore, as the circuit board 20, a relatively inexpensive phenol board having low thermal conductivity can be used. That is, since the rib 22a radiates heat to the driving IC 24 that generates heat, it is not always necessary to radiate heat toward the circuit board 20. However, if the circuit board 20 is an iron board as in the conventional case, the heat radiation effect can be improved by several steps. Also, the area of the circuit board 2 0, drive IC24 well minimum necessary size in order to be mounted beneath the ribs 22a, thereby reducing the circuit board cost and decline need area of the circuit board 20 As a result, the motor can be downsized.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction content]

FIG. 6 shows still another embodiment of the present invention, in which the stator core set 30 has six ribs 31 for winding, and one heat dissipation core 31a is formed. This is applied to a three-phase motor in which a drive magnet 32 having 10 magnetic poles on its surface is rotatably opposed to each other. That is, the core 31a of the ribs 31 and the heat radiation of the stator core assembly 30 are each formed in a 48 ° spacing and 60 ° intervals, the core 31a for heat dissipation than other ribs 31, the inner portion is formed wider There is. Then, just below the heat dissipation core 31a, the back surface of the drive IC 24 is brought into contact with the core 31a so as to be in close contact therewith, and the heat generated by the drive IC 24 is transferred to the core 31a, so that the stator core The heat is radiated outward from the group 30 as in the above-described example.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a heat dissipation structure for a motor electronic component according to the present invention.

FIG. 2 is a sectional view of an essential part of the embodiment.

FIG. 3 is a plan view of an essential part showing a modified example of the above embodiment.

FIG. 4 is a plan view showing another embodiment of the present invention.

FIG. 5 is a sectional view of an essential part of the same embodiment.

FIG. 6 is a plan view showing another embodiment of the present invention.

FIG. 7 is a plan view showing the configuration of a conventional general motor.

FIG. 8 is a sectional view of an essential part of the same motor.

[Explanation of symbols]

 20 Circuit Board 21 Stator Core Set 22 Rib 22a Heat Dissipation Rib 23 Winding 24 Motor Drive IC (Circuit Part) 26 Power Transistor (Circuit Part)

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] December 24, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 1

[Correction method] Change

[Correction content]

1. A motor in which a stator core set is disposed on a circuit board and electronic components that require heat dissipation are mounted, wherein the electronic components are mounted at a position in contact with a core portion of the stator core set. A heat-dissipating structure for motor electronic components, which dissipates heat generated by components to the core portion .

[Procedure amendment]

[Submission date] December 24, 1993

[Procedure Amendment 7]

[Document name to be amended] Statement

[Name of item to be corrected] Brief description of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a heat dissipation structure for a motor electronic component according to the present invention.

FIG. 2 is a sectional view of an essential part of the embodiment.

FIG. 3 is a plan view of an essential part showing a modified example of the above embodiment.

FIG. 4 is a plan view showing another embodiment of the present invention.

FIG. 5 is a sectional view of an essential part of the above embodiment.

FIG. 6 is a plan view showing another embodiment of the present invention.

FIG. 7 is a plan view showing the configuration of a conventional general motor.

FIG. 8 is a sectional view of an essential part of the same motor.

[Explanation of Codes] 20 Circuit Board 21 Stator Core Set 22 Rib 22a Heat Dissipation Rib 23 Winding 24 Motor Drive IC (Circuit Part) 26 Power Transistor (Circuit Part)

[Procedure Amendment 8]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 6

[Correction method] Change

[Correction content]

[Figure 6]

Claims (1)

[Scope of utility model registration request] 1. A motor in which a stator core set is disposed on a circuit board and electronic components that require heat radiation are mounted, the electronic components being mounted at positions where they abut on ribs formed on the stator core set. A heat dissipation structure for a motor electronic part, wherein heat generated by the electronic part is radiated to the rib.