JPH0720073U - Heat dissipation device for motor drive circuit - Google Patents

Abstract

(57) [Abstract] [Purpose] In the heat dissipation of the heating element of the motor drive circuit,
Provide a heat dissipation device that is inexpensive and has an excellent space factor. [Structure] The printed wiring board 2 and the mounting flange 6 are fixed so that the heating element 3 is pressed against the metal mounting flange 6 of the motor. According to the above configuration, it is possible to reduce the number of members such as a heat dissipation plate, to achieve automatic mounting on the printed wiring board, and to store the heating element in the space between the printed wiring board and the mounting flange, which leads to downsizing. It is possible to provide a heat dissipating device that is possible, has excellent economical efficiency, and has an excellent space factor.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heat dissipation device for a motor drive circuit.

[0002]

[Prior art]

 FIG. 2 shows a conventional heat dissipation device for a motor drive circuit. In the drawing, reference numeral 1 is a stator, which is electrically energized and fixed to the printed wiring board 2. Various electronic components for controlling power supply to the coil are mounted on the printed wiring board 2. Among the various electronic components, the heating element 3 is fixed to the heat dissipation plate 4 with the screw 5 to electrically connect to the printed wiring board 2. The heat dissipation of the heating element 3 is improved and the allowable loss amount is increased.

In FIG. 2, reference numeral 6 designates a mounting flange integrally provided with the bearing housing, and the printed wiring board 2 is mounted on the end surface of the mounting flange 6 by a mounting screw 7. Reference numeral 8 denotes a rotor frame having an inner peripheral surface fixed with a magnet 9, and the rotor frame 8 is rotated by energizing a coil wound around the stator 1 through electronic components mounted on the printed wiring board 2. .

[0004]

[Problems to be solved by the device]

 However, in the above-described conventional configuration, since the heat dissipation plate 4 is fixed to the heating element 3 and is mounted on the surface of the printed wiring board 2 opposite to the other mounted electronic components, it is difficult to realize automatic mounting by a machine. The mounting cost is high due to human-made mounting, the cost is low due to the need for heat sinks and screws, and the space for arranging the heat sinks is required. There was a problem that the space increased and it also hindered the market needs such as miniaturization.

In view of the above problems, it is an object of the present invention to provide a heat dissipation device which is excellent in economy and space factor.

[0006]

[Means for Solving the Problems]

 In order to achieve this object, the heat dissipation device of the motor drive circuit of the present invention is configured such that the printed wiring board and the mounting flange are fixed so that the heating element is pressed against the metal mounting flange of the motor.

[0007]

[Action]

 With this configuration, heat can be efficiently dissipated by bringing the heating element into contact with the mounting flange. Therefore, the heat dissipation plate can be eliminated, and the heating element can be mounted and stored directly below the mounting flange. The above space saving will be achieved.

[0008]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a heat dissipation device for a motor drive circuit according to an embodiment of the present invention. In the drawing, the heating element 3 is electrically energized and fixed to the printed wiring board 2, and the printed wiring board mounting screw 7 is used to press the mounting flange 6 and the printed wiring board so that the heating element 3 is pressed against the mounting flange 6 integrally formed with the bearing housing. The wiring board 2 is fixed.

According to this configuration, mounting of electronic components on the printed wiring board 2 does not require mounting of a heat dissipation plate or the like, and all the electronic components are arranged on the same surface of the printed wiring board 2 for mechanization. Further, the heating element 3 is housed and arranged in the space between the mounting flange 6 and the printed wiring board 2, and the space factor can be effectively utilized.

[0011]

[Effect of device]

 As described above, the present invention can be mounted automatically on a printed wiring board without attaching a member such as a radiator plate to the heating element of the motor drive circuit, and the heating element can be mounted on the printed wiring board and the mounting flange space. It is possible to provide a heat-dissipating device that is small in size, has excellent economical efficiency, and has an excellent space factor by being housed in a part.

[Brief description of drawings]

FIG. 1 is a diagram showing a heat dissipation device of a motor drive circuit according to an embodiment of the present invention.

FIG. 2 is a diagram showing a conventional heat dissipation device for a motor drive circuit.

[Explanation of symbols]

 1 Stator 2 Printed wiring board 3 Heating element 4 Heat sink 5 Screw 6 Mounting flange 7 Printed wiring board mounting screw 8 Rotor frame 9 Magnet

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroyuki Matsumoto 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Scope of utility model registration request] 1. A motor having a mounting flange made of a metal base, a bearing housing integrally formed with the mounting flange, a stator fixed and a rotor rotatably supported, for controlling power supply to the stator. A motor drive circuit comprising a printed wiring board on which an electronic component is mounted, wherein the heating element of the electronic component is fixed to the mounting flange so that the printed wiring board is pressed against the mounting flange. Heat dissipation device.