JPH0658982B2 - Method for manufacturing LD pumped solid-state laser device - Google Patents

Description

The present invention relates to an LD-pumped solid-state laser device used for electronic microfabrication / distance measurement, laser radar, etc., and particularly to manufacture of a solid-state laser device used for the same. Regarding the method.

<Prior Art> A conventional LD-pumped solid-state laser device has an LD as shown in FIG.
A (semiconductor laser) 1, a condenser lens 2, a solid-state laser rod (LD excitation solid-state laser element) 3, and an output mirror 4 are arranged so that the excitation light and the laser light are in the same direction. The solid-state laser element 3 is made by punching an ingot in the shape of a round bar, or cutting it into a square bar, and then rounding it, mirror-polishing its end surface, and then coating it.

<Problems to be Solved by the Invention> When mass production is performed by the above-described conventional method, it is necessary to process a large number of solid-state laser elements 3 at the same time with the same jig. However, when the solid-state laser element 3 is fixed to the jig, a deviation of about several minutes occurs, so this method cannot be used for a solid-state laser element that requires parallelism of 20 seconds or less. Therefore, a large number of jigs must be used to proceed with the polishing process individually.

Also, in coating, a large amount of jigs for fixing the solid-state laser element 3 are required, which is very expensive.

Therefore, an object of the present invention is to provide a method of manufacturing an LD-pumped solid-state laser device that can be mass-produced.

<Means for Solving the Problems> According to the present invention, the ingot for a solid-state laser device is cut, the cut surface is mirror-polished with an optically parallel plane to form a wafer, and the mirror-polished surface of the wafer is coated. A method for manufacturing an LD-pumped solid-state laser device is obtained, in which the LD-pumped solid-state laser device is obtained by subjecting the LD-pumped solid-state laser device to a vertical cut on a surface coated with a predetermined dimension to obtain an LD-pumped solid-state laser device.

<Example> Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic configuration diagram of an LD-pumped solid-state laser device incorporating a solid-state laser element 3 manufactured according to an embodiment of the present invention. The solid-state laser element 3 of this LD-pumped solid-state laser device has a rectangular rod shape. Normally, when a rod-type excitation lamp is focused on a solid-state laser element with a cylindrical elliptical concentrator,
A rod-type solid-state laser element is used because the excitation light is condensed into a cylindrical shape. In the LD pumped solid state laser device,
Since the elliptical excitation light is focused and made incident on the solid-state laser element and only the portion on the optical path is excited and laser oscillation occurs only at that portion, a solid-state laser element having a size larger than the cross-sectional area of the excitation light is used. The solid-state laser device may have any shape. Therefore, the same oscillation efficiency and mode as those of the round bar can be obtained by using the square bar solid laser element 3 shown in FIG.

A method of manufacturing the rectangular rod-shaped solid-state laser element 3 will be described with reference to FIGS. 2 to 5.

A 60φ mm solid laser diode ingot grown in the shape of a round bar is cut into a disk with a thickness of 4 mm as shown in Fig. 2, and its cross section is mirror-polished with a parallelism of 20 seconds or less and a flatness of λ / 10. To obtain the wafer 10. Cleaning this wafer 10,
As shown in FIG. 3, a non-reflective coating 11 for the wavelength of the LD-pumped solid-state laser light is applied to one surface of the vacuum vapor deposition apparatus, and 99.5 for the wavelength of the LD-pumped solid-state laser light is applied to the opposite surface.
A dichroic coating 12 having a high reflectance of at least%, which is a non-reflection coating for LD laser light, is applied. Next, with a diamond cutter, the vertical cutting line 1 is shown in Fig. 4.
As shown by 3 and a horizontal cutting line 14, a solid laser element 3 is obtained by cutting into a rectangular rod shape of 3 mm × 3 mm × 4 mm.

3 mm as shown in Fig. 5 from the wafer 10 of 60φmm
It is possible to take 100 or more solid-state laser elements 3 in the shape of a square bar. Here, the rectangular rod-shaped solid-state laser element 3 has a structure having a dichroic mirror film 5 and an antireflection coating film 6 on both end faces.

The polishing man-hour is almost the same as that of a 3φmm rod, so the polishing cost is 3
It is less than 1/100 of the φmm rod.

In the case of 3φ in vapor deposition, since only 20 wafers can be formed at the same time, the vapor deposition cost is 1/5 or less even if only one wafer is vapor-deposited.

Since the divergence angle of LD laser light is about 15 rad, it cannot be narrowed down. However, when the LD pumped laser is used, the resonator can be freely designed and the divergence angle can be set to several mrad, and the beam must be narrowed down. It is advantageous for electronic fine processing.

<Effects of the Invention> As described above, according to the present invention, it is possible to provide a method for inexpensively manufacturing an LD-pumped solid-state laser device that emits high-quality laser light.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of an LD-pumped solid-state laser device using a solid-state laser device obtained in one embodiment of the present invention. 2 to 5 show a method of manufacturing the solid-state laser device in FIG. 1, FIG. 2 is a perspective view, FIG. 3 is a side view, FIG. 4 is a plan view, and FIG. 5 is a perspective view. . FIG. 6 is a schematic configuration diagram of a conventional LD pumped solid-state laser device. 1 ... LD, 2 ... Condensing lens, 3 ... Solid-state laser element, 4 ... Output mirror, 5 ... Dichroic mirror film, 6 ... Non-reflective coating film, 10 ... Wafer.

Claims (1)

[Claims] 1. An ingot for a solid-state laser device is cut, and a cut surface is mirror-polished with an optically parallel plane to prepare a wafer,
An LD-pumped solid-state laser device is obtained by applying a coating on a mirror-polished surface of the wafer and then cutting the wafer in a direction perpendicular to the surface on which the coating is applied.
Method of manufacturing pumped solid-state laser device.