JPH065749A - Heat dissipating device - Google Patents

Abstract

PURPOSE:To enhance a heat dissipating efficiency by using liquid having high heat conductivity as heat dissipating medium, sealing the medium in a vessel which is partitioned to two stages in contact with a main surface of an electronic component to be heat dissipated, and externally dissipating heat from the component by utilizing a convection. CONSTITUTION:Heat generated from an electronic component 1 is transferred to a vessel body 2 of an upper heat dissipating device through a package 5. A temperature of liquid of a part in contact with the package is raised, and a convection occurs in the vessel. That is, heat is raised in a direction as indicated by a black arrow 8 via a hole 4, liquid having a low temperature is moved down in a direction indicated by a white arrow 9, and it is moved to be circulated in a direction for averaging a temperature of the entire liquid. The heat raised upward is dissipated externally as indicated by an arrow 12 through heat dissipating fins 6. Thus, its heat exchanging efficiency is improved, a ventilation space may be reduced, the number of components to be placed is increased on the same board, and a space efficiency is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid cooling type heat dissipation device for effectively releasing heat from electronic parts.

[0002]

2. Description of the Related Art Regarding heat dissipation technology for electronic parts, see Nikkei Electronics, No. 1-21, 1991, p. 123-1
No. 41 (published by Nikkei BP) provides detailed information. Up to now, the heat dissipation device has been mainly applied to a general-purpose computer using a bipolar LSi or an electric equipment using a power device, and an air cooling method has been mainly adopted.
Currently, LSi, which consumes a large amount of power, is used in workstations, personal computers, etc., and the conventional air-cooled heat dissipation device is becoming insufficient. In addition, since the packaging density of components has increased due to the miniaturization of equipment and the space in which cooling air can flow has decreased, there is a limit in air cooling, and it is considered that liquid cooling will predominate in the future.

In a conventional air-cooling type heat dissipation device, it is necessary to attach a huge heat dissipation plate (fin) and a cooling fan in contact with electronic components. However, in these structures, the volume of the protruding portion on the printed wiring board becomes large, and the space between the boards for providing the air passage between the components is required, so that the mounted set itself becomes large. Could lead to. The present invention is intended to solve the above-mentioned problems, and it is an object of the present invention to provide a heat dissipation device capable of increasing the heat dissipation efficiency by liquid cooling and ensuring the miniaturization of the set.

[0004]

According to the present invention, a liquid having a high heat conductivity is used as a heat dissipation medium, and the container is divided into two stages and is attached in contact with one main surface of an electronic component in which heat is to be dissipated. The above-mentioned medium is sealed in and the heat from the electronic component is dissipated to the outside by utilizing the convection phenomenon. With such a structure, the heat generated from the electronic component can be conducted to the outside through the medium and released, and the structure does not have to be so large.

By installing a heat radiation fan in addition to the above device, it is possible to more efficiently dissipate the heat. Further, by connecting a plurality of heat dissipation devices with a connecting pipe, the entire device can be made compact.

[0006]

EXAMPLES The present invention will be described below with reference to some examples. FIG. 1 is a sectional perspective view of an embodiment in which a liquid cooling type heat dissipation device according to the present invention is mounted on a surface mount type electronic component. Reference numeral 1 is a semiconductor device (LSi) which is a main part of an electronic component, 5 is a resin package for encapsulating the semiconductor device, and 10 is a lead led out to the outside so that the tip can be surface-mounted. Two
Is a container of a heat radiating device, which is divided into two chambers, an upper chamber and a lower chamber, by a partition plate 3, into which a liquid having good thermal conductivity, such as water, is injected as a medium. Some holes 4 are made in the partition plate 3,
Liquid can freely move between the upper chamber and the lower chamber.

FIG. 2 is a front sectional view for explaining the convection phenomenon of liquid in the heat dissipation device of FIG. Electronic component 1
The generated heat is transmitted to the container body 2 of the upper heat dissipation device through the package 5. The temperature of the liquid (refrigerant) in the portion in contact with the package rises, and a convection phenomenon occurs in the container (main body). That is, heat rises through the holes 4 in the direction indicated by the black arrow 8 in the drawing, while liquid having a low temperature descends in the direction indicated by the white arrow 9 and circulates in a direction in which the temperature of the entire liquid is averaged. The heat rising upward is dissipated to the outside through the radiation fins 6 as indicated by an arrow 12.

In FIG. 3, a plurality of electronic components 5 are arranged on one common substrate 7, the heat radiator of the present invention is installed in each electronic component, and the heat radiators are connected by a connecting pipe 11 on the side of the container. In this state, a structure is shown in which a liquid, which is a refrigerant, is allowed to pass between the radiating pipes and heat is released to the outside. In this case, the liquid is forcibly moved by a pump or the like, which facilitates temperature control.

[0009]

Since the present invention is configured as described above, it has the following effects. Since it is a liquid cooling type, it has better heat exchange efficiency than simple forced air cooling, requires less ventilation space, and increases the number of parts mounted on the same board, improving space efficiency. In addition, the degree of freedom in circuit wiring is increased, and wiring can be easily changed during mounting.

[Brief description of drawings]

FIG. 1 is a cross-sectional perspective view of an electronic component equipped with a heat dissipation device according to the present invention.

2 is a front cross-sectional view of the heat dissipation device in FIG. 1 showing a heat transfer state.

FIG. 3 is a front cross-sectional view showing a connection form of a plurality of heat dissipation devices mounted on a plurality of electronic components in an application example of the present invention.

[Explanation of symbols]

 1 Electronic Component (Semiconductor Device) 2 Heat Dissipator Main Body (Liquid Container) 3 Partition Plate 4 Liquid Passing Hole 5 Package 6 Heat Sink (Fin) 7 Printed Wiring Board 8 Arrows indicating the direction of movement of heated liquid 9 Movement of low temperature liquid Arrow indicating direction 10 Lead of electronic component 11 Connection tube 12 Arrow indicating heat radiation direction

Claims (3)

[Claims] 1. A heat dissipation device for electronic parts, wherein a liquid having a high thermal conductivity is used as a heat dissipation medium in a container provided in contact with one main surface of the electronic part, and the liquid is contained in the container. A heat dissipation device characterized in that a partition plate is provided to move heat from an electronic component to the upper surface of the container by convection. 2. The heat dissipation device according to claim 1, wherein heat dissipation fins are provided on the surface of the container containing the upper liquid. 3. The heat dissipation device according to claim 1 or 2,
A heat dissipation device is attached to each of the plurality of electronic components, and each heat dissipation device is connected to each other by a connection pipe provided on the side surface of the container, and a common cooling liquid is passed between the plurality of heat dissipation devices through the connection pipe. .