JPH065577A - Substrate cleaning device - Google Patents

Substrate cleaning device

Info

Publication number
JPH065577A
JPH065577A JP18186392A JP18186392A JPH065577A JP H065577 A JPH065577 A JP H065577A JP 18186392 A JP18186392 A JP 18186392A JP 18186392 A JP18186392 A JP 18186392A JP H065577 A JPH065577 A JP H065577A
Authority
JP
Japan
Prior art keywords
substrate
cleaning
overflow tank
brush
ultrasonic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18186392A
Other languages
Japanese (ja)
Other versions
JP2897537B2 (en
Inventor
Kazuo Saeki
和郎 佐伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP18186392A priority Critical patent/JP2897537B2/en
Publication of JPH065577A publication Critical patent/JPH065577A/en
Application granted granted Critical
Publication of JP2897537B2 publication Critical patent/JP2897537B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the deterioration with age due to the pollution of a brush itself by moving a substrate between the opening parts of an overflow tank with the substrate in a clearing solvent, applying an ultrasonic wave to the clearing solvent to clean the substrate in the clearing solvent by brushing. CONSTITUTION:A substrate 12 is moved in a right direction along a pass line by a transfer roller 4 and dipped into the liquid of an overflow tank 1 by way of a shutter part 3 and an opening part 2, and the surface of a substrate 12 is cleaned by scrubbing with a cleaning brush 6 of a rotary brush part 5. The rear surface of the substrate 12 and the cleaning brush 6 are cleaned with the effect of an ultrasonic wave from an ultrasonic wave oscillator 7. A cleaning solvent overflowed from an overflow tank 1 is collected into a storage tank 8. Thereby, the lowering of cleaning ability due to the pollution of the cleaning brush itself may be prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は基板洗浄装置に関し、特
に枚葉処理方式によるブラシ洗浄装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus, and more particularly to a single-wafer processing brush cleaning apparatus.

【0002】[0002]

【従来の技術】従来の基板洗浄装置は図2に示すよう
に、洗浄液11の受槽13の上開口部に被洗浄物である
基板12の両端を支持する搬送ローラ4が直線上に所定
のピッチで配列され、パスラインを構成している。
2. Description of the Related Art In a conventional substrate cleaning apparatus, as shown in FIG. 2, a conveying roller 4 for supporting both ends of a substrate 12, which is an object to be cleaned, is linearly arranged at a predetermined pitch in an upper opening of a tank 13 for cleaning liquid 11. Are arranged in a line and form a pass line.

【0003】このパスラインに直交して対向する1組の
回転ブラシ部5が受槽13のほぼ中央部に配設され、さ
らに、受槽13の下部には貯液タンク8を有し、両者
は、互いに配管接続されている。
A pair of rotating brushes 5 which are orthogonal to and intersect with the path line are arranged in the substantially central portion of the receiving tank 13, and a liquid storage tank 8 is provided under the receiving tank 13, both of which are Piped to each other.

【0004】また、洗浄ブラシ6の先端近傍に洗浄液1
1を供給するためのスプレーノズル14が回転ブラシ部
5と同様にパスラインに対向して配設されている。
Further, the cleaning liquid 1 is provided near the tip of the cleaning brush 6.
A spray nozzle 14 for supplying 1 is disposed so as to face the pass line similarly to the rotary brush unit 5.

【0005】なお、スプレーノズル14と貯液タンク8
とは、循環ポンプ9とフィルター10を中継して配管接
続されている。
The spray nozzle 14 and the liquid storage tank 8
And are connected by piping through the circulation pump 9 and the filter 10.

【0006】次に洗浄動作について説明する。図1に示
すように基板12は、搬送ローラ4によりパスラインに
沿って右方向に搬送されながら、回転ブラシ部5の先端
部に装着された洗浄ブラシ6によって基板12の表・裏
面が同時にスクラブ洗浄される。
Next, the cleaning operation will be described. As shown in FIG. 1, the substrate 12 is conveyed rightward along the path line by the conveying roller 4, while the cleaning brush 6 attached to the tip of the rotating brush unit 5 scrubs the front and back surfaces of the substrate 12 at the same time. To be washed.

【0007】このとき、洗浄液11は循環ポンプ9の圧
力によりスプレーノズル14の口より洗浄ブラシ6の先
端近傍に供給される。
At this time, the cleaning liquid 11 is supplied from the mouth of the spray nozzle 14 to the vicinity of the tip of the cleaning brush 6 by the pressure of the circulation pump 9.

【0008】[0008]

【発明が解決しようとする課題】この従来の基板洗浄装
置では、洗浄処理時間の経過に伴って、基板の表面から
除去した粒子等の不純物がブラシの内部に入り込み、徐
々にブラシ自身が汚染されるという現象が発生する。
In this conventional substrate cleaning apparatus, impurities such as particles removed from the surface of the substrate enter the inside of the brush as the cleaning time elapses, and the brush itself is gradually contaminated. Phenomenon occurs.

【0009】そのために基板の表面が汚染されたブラシ
により擦られる結果となり、洗浄能力が著しく低下する
という品質面での問題点があった。
As a result, the surface of the substrate is rubbed by a contaminated brush, resulting in a significant decrease in cleaning ability, which is a problem in terms of quality.

【0010】さらに、頻繁にブラシを交換するための多
大な工数が発生するという問題点があった。
Further, there has been a problem that a large number of man-hours are required to replace the brush frequently.

【0011】本発明の目的は、ブラシ自身の汚染による
経時劣化を防止した基板洗浄装置を提供することにあ
る。
An object of the present invention is to provide a substrate cleaning apparatus which prevents deterioration with time due to contamination of the brush itself.

【0012】[0012]

【課題を解決するための手段】前記目的を達成するた
め、本発明に係る基板洗浄装置は、オーバーフロー槽
と、シャッター部と、搬送部と、超音波発振部と、回転
ブラシ部とを有する基板洗浄装置であって、オーバーフ
ロー槽は、洗浄液を収容し、対向する側面の上縁付近に
基板の搬出入を行うためのスリット形状の開口部を有す
るものであり、シャッター部は、前記開口部に設けら
れ、基板の搬出入により開閉するものであり、搬送部
は、オーバーフロー槽の開口部間に基板を洗浄液に浸漬
して搬送するものであり、超音波発振部は、オーバーフ
ロー槽の洗浄液に超音波を作用するものであり、回転ブ
ラシ部は、前記オーバーフロー槽の洗浄液中で基板を洗
浄ブラシにより洗浄するものである。
In order to achieve the above object, a substrate cleaning apparatus according to the present invention is a substrate having an overflow tank, a shutter section, a transfer section, an ultrasonic wave oscillating section, and a rotating brush section. In the cleaning device, the overflow tank contains a cleaning liquid and has a slit-shaped opening near the upper edge of the opposite side surface for loading and unloading the substrate, and the shutter part is provided in the opening. It is provided for opening and closing by loading and unloading the substrate, the transfer section is for immersing and transferring the substrate between the openings of the overflow tank, and the ultrasonic wave oscillating section is for the cleaning solution in the overflow tank. The rotating brush part is for cleaning the substrate with the cleaning brush in the cleaning liquid in the overflow tank.

【0013】[0013]

【作用】洗浄ブラシを常時洗浄液中に浸漬させ、洗浄ブ
ラシを超音波洗浄することによりブラシ自身による汚染
を防止する。
Function: The cleaning brush is constantly immersed in the cleaning liquid, and the cleaning brush is ultrasonically cleaned to prevent contamination by the brush itself.

【0014】[0014]

【実施例】次に本発明について図面を参照して説明す
る。図1は本発明の一実施例を示す断面図である。
The present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of the present invention.

【0015】図1において、洗浄液11のオーバーフロ
ー槽1は、対向する側面の上部に基板12を搬出入する
ためのスリット形状の開口部2と、開口部2に隣接して
基板12の通過に同期して自重にて上下するロール形状
のシャッター部3と、槽1の底部に配置した超音波発振
器7とを有している。
In FIG. 1, the overflow tank 1 of the cleaning liquid 11 has a slit-shaped opening 2 for loading and unloading the substrate 12 at the upper part of the opposite side surface, and is adjacent to the opening 2 and is synchronized with the passage of the substrate 12. Further, it has a roll-shaped shutter portion 3 which moves up and down by its own weight, and an ultrasonic oscillator 7 arranged at the bottom of the tank 1.

【0016】基板12の搬送部としては、オーバーフロ
ー槽1の対向する開口部2を結ぶ直線上に基板12の両
端を支持する搬送ローラ4を所定のピッチで配列して、
基板12のパスラインを構成する。
As a transfer section for the substrate 12, transfer rollers 4 for supporting both ends of the substrate 12 are arranged at a predetermined pitch on a straight line connecting the opposite openings 2 of the overflow tank 1.
The pass line of the substrate 12 is formed.

【0017】回転ブラシ部5は、先端部に装着した洗浄
ブラシ6を下にして基板12のパスラインに直交してオ
ーバーフロー槽1のほぼ中央部に配設する。
The rotating brush portion 5 is disposed in a substantially central portion of the overflow tank 1 with the cleaning brush 6 attached to the tip end facing downward and orthogonal to the pass line of the substrate 12.

【0018】オーバーフロー槽1の下部には貯液タンク
8を配置し、オーバーフロー槽1と貯液タンク8とは、
洗浄液11の回収系の配管系及び循環ポンプ9やフィル
ター10等を有する供給系の配管にて連結され循環シス
テムを構成している。
A liquid storage tank 8 is arranged below the overflow tank 1, and the overflow tank 1 and the liquid storage tank 8 are
A piping system of a recovery system of the cleaning liquid 11 and a piping of a supply system including the circulation pump 9 and the filter 10 are connected to form a circulation system.

【0019】次に洗浄動作について説明すると、基板1
2は、搬送ローラ4によりパスラインに沿って右方向に
搬送され、シャッター部3及び開口部2を経由してオー
バーフロー槽1の液中に搬送されて回転ブラシ部5の洗
浄ブラシ6によって基板12の表面がスクラブ洗浄され
る。
Next, the cleaning operation will be described. The substrate 1
2 is conveyed rightward along the path line by the conveying roller 4, is conveyed into the liquid of the overflow tank 1 via the shutter portion 3 and the opening portion 2, and is washed by the cleaning brush 6 of the rotating brush portion 5 to the substrate 12 Surface is scrubbed.

【0020】また基板12の裏面及び洗浄ブラシ6は、
超音波発振器7による超音波作用(即ち、発振周波数が
20〜40KHZ帯の場合にはキャビテーション作用,
1MHZ帯近傍では振動加速度作用)によって洗浄され
る。
The back surface of the substrate 12 and the cleaning brush 6 are
Ultrasonic action by the ultrasonic oscillator 7 (that is, cavitation action when the oscillation frequency is in the 20-40 KHZ band,
It is washed by the action of vibration acceleration in the vicinity of the 1 MHZ band.

【0021】尚、オーバーフロー槽1からオーバーフロ
ーした洗浄液は、貯液タンク8内に回収される。貯液タ
ンク8内の洗浄液は、循環ポンプ9にて供給され、フィ
ルター10を通過して濾過されオーバーフロー槽1内に
補給される。
The cleaning liquid overflowing from the overflow tank 1 is collected in the liquid storage tank 8. The cleaning liquid in the liquid storage tank 8 is supplied by the circulation pump 9, passes through the filter 10, is filtered, and is supplied to the overflow tank 1.

【0022】[0022]

【発明の効果】以上説明したように本発明は、洗浄ブラ
シを常時オーバーフローしている洗浄液の中に浸漬した
状態で超音波発振器の超音波作用により洗浄する構成と
したので、洗浄処理時間の経過に伴う洗浄ブラシ自身の
汚染による洗浄能力の低下を防止することができ、従来
に比べて品質面での向上を図ることができる。
As described above, according to the present invention, the cleaning brush is immersed in the overflowing cleaning liquid and is cleaned by the ultrasonic action of the ultrasonic oscillator. As a result, it is possible to prevent the cleaning ability from being deteriorated due to the contamination of the cleaning brush itself, and it is possible to improve the quality in comparison with the related art.

【0023】さらに、洗浄ブラシの交換頻度が少なくな
り、工数の削減を図ることができるという効果を有す
る。
Further, there is an effect that the frequency of replacement of the cleaning brush is reduced and the number of steps can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.

【図2】従来の基板洗浄装置を示す断面図である。FIG. 2 is a sectional view showing a conventional substrate cleaning apparatus.

【符号の説明】[Explanation of symbols]

1 オーバーフロー槽 2 開口部 3 シャッター部 4 搬送ローラ 5 回転ブラシ部 6 洗浄ブラシ 7 超音波発振器 8 貯液タンク 9 循環ポンプ 10 フィルター 11 洗浄液 12 基板 13 受槽 14 スプレーノズル 1 Overflow tank 2 Opening part 3 Shutter part 4 Conveying roller 5 Rotating brush part 6 Cleaning brush 7 Ultrasonic oscillator 8 Liquid storage tank 9 Circulation pump 10 Filter 11 Cleaning liquid 12 Substrate 13 Receiving tank 14 Spray nozzle

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 オーバーフロー槽と、シャッター部と、
搬送部と、超音波発振部と、回転ブラシ部とを有する基
板洗浄装置であって、 オーバーフロー槽は、洗浄液を収容し、対向する側面の
上縁付近に基板の搬出入を行うためのスリット形状の開
口部を有するものであり、 シャッター部は、前記開口部に設けられ、基板の搬出入
により開閉するものであり、 搬送部は、オーバーフロー槽の開口部間に基板を洗浄液
に浸漬して搬送するものであり、 超音波発振部は、オーバーフロー槽の洗浄液に超音波を
作用するものであり、 回転ブラシ部は、前記オーバーフロー槽の洗浄液中で基
板を洗浄ブラシにより洗浄するものであることを特徴と
する基板洗浄装置。
1. An overflow tank and a shutter section,
A substrate cleaning device having a transfer part, an ultrasonic wave oscillating part, and a rotating brush part, wherein the overflow tank contains a cleaning liquid and has a slit shape for carrying in / out the substrate near the upper edge of the opposite side surface. The shutter is provided in the opening and is opened / closed by loading / unloading the substrate. The transfer unit is immersed in the cleaning liquid between the openings of the overflow tank to transfer the substrate. The ultrasonic wave oscillating unit applies ultrasonic waves to the cleaning liquid in the overflow tank, and the rotating brush unit cleans the substrate with the cleaning brush in the cleaning liquid in the overflow tank. Substrate cleaning equipment.
JP18186392A 1992-06-16 1992-06-16 Substrate cleaning device Expired - Lifetime JP2897537B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18186392A JP2897537B2 (en) 1992-06-16 1992-06-16 Substrate cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18186392A JP2897537B2 (en) 1992-06-16 1992-06-16 Substrate cleaning device

Publications (2)

Publication Number Publication Date
JPH065577A true JPH065577A (en) 1994-01-14
JP2897537B2 JP2897537B2 (en) 1999-05-31

Family

ID=16108161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18186392A Expired - Lifetime JP2897537B2 (en) 1992-06-16 1992-06-16 Substrate cleaning device

Country Status (1)

Country Link
JP (1) JP2897537B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001008200A1 (en) * 1999-07-21 2001-02-01 Steag Microtech Gmbh Device for treating substrates
US6247198B1 (en) 1997-12-09 2001-06-19 Tdk Corporation Cleaning apparatus
KR100414540B1 (en) * 1999-12-17 2004-01-07 샤프 가부시키가이샤 Ultrasonic processing device and electronic parts fabrication method using the same
WO2004030838A1 (en) * 2002-10-07 2004-04-15 Star Cluster Co., Ltd. Ultrsonic washing equipment and ultrasonic washing method
US6810548B2 (en) 2000-03-08 2004-11-02 Sharp Kabushiki Kaisha Cleaning apparatus
JP2009070932A (en) * 2007-09-12 2009-04-02 Sumitomo Metal Mining Co Ltd Wafer-cleaning apparatus and wafer-cleaning method
JP2011072918A (en) * 2009-09-30 2011-04-14 Nec Personal Products Co Ltd Medium washing apparatus
JP2013101790A (en) * 2011-11-08 2013-05-23 Nippon Electric Glass Co Ltd Manufacturing method of a substrate with a transparent conductive oxide film
CN104971921A (en) * 2014-04-08 2015-10-14 麒麟电子(深圳)有限公司 Glass substrate cleaning device
CN105032835A (en) * 2015-08-19 2015-11-11 京东方科技集团股份有限公司 Ultrasonic cleaning device
JP2017000317A (en) * 2015-06-08 2017-01-05 サマンサジャパン株式会社 Tile carpet cleaning apparatus
JP6892176B1 (en) * 2020-11-19 2021-06-23 不二越機械工業株式会社 Work cleaning device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6247198B1 (en) 1997-12-09 2001-06-19 Tdk Corporation Cleaning apparatus
US6254688B1 (en) 1997-12-09 2001-07-03 Tdk Corporation Cleaning method
WO2001008200A1 (en) * 1999-07-21 2001-02-01 Steag Microtech Gmbh Device for treating substrates
JP2003505881A (en) * 1999-07-21 2003-02-12 ステアーグ ミクロテヒ ゲゼルシャフト ミット ベシュレンクテル ハフツング Equipment for processing substrates
JP4651252B2 (en) * 1999-07-21 2011-03-16 アイメック Equipment for processing substrates
KR100414540B1 (en) * 1999-12-17 2004-01-07 샤프 가부시키가이샤 Ultrasonic processing device and electronic parts fabrication method using the same
US6810548B2 (en) 2000-03-08 2004-11-02 Sharp Kabushiki Kaisha Cleaning apparatus
WO2004030838A1 (en) * 2002-10-07 2004-04-15 Star Cluster Co., Ltd. Ultrsonic washing equipment and ultrasonic washing method
JP2009070932A (en) * 2007-09-12 2009-04-02 Sumitomo Metal Mining Co Ltd Wafer-cleaning apparatus and wafer-cleaning method
JP2011072918A (en) * 2009-09-30 2011-04-14 Nec Personal Products Co Ltd Medium washing apparatus
JP2013101790A (en) * 2011-11-08 2013-05-23 Nippon Electric Glass Co Ltd Manufacturing method of a substrate with a transparent conductive oxide film
CN104971921A (en) * 2014-04-08 2015-10-14 麒麟电子(深圳)有限公司 Glass substrate cleaning device
JP2017000317A (en) * 2015-06-08 2017-01-05 サマンサジャパン株式会社 Tile carpet cleaning apparatus
CN105032835A (en) * 2015-08-19 2015-11-11 京东方科技集团股份有限公司 Ultrasonic cleaning device
JP6892176B1 (en) * 2020-11-19 2021-06-23 不二越機械工業株式会社 Work cleaning device

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