JPH0653662A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To enable loading of circuit structuring parts on both sides of a wiring board to realize reduction in size of a hybrid integrated circuit device while achieving heat radiating property of a wiring board with one side thereof connected to a case. CONSTITUTION:The opposed surface just under the position for loading a heat generating circuit structure part 8 is defined as a part loading inhibit area and the region for bonding to a case and a wiring substrate 2 loading a non-heat generating circuit structure part 1 to both surfaces of the other region is bonded to a case 3a having a stepped portion 9a for housing circuit structure parts loaded on the bonding surface of the wiring substrate, the case is filled with gel-form resin 5 for the protection thereof and a cover 6 is fixed on the case.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device using a case to protect each electric component.

[0002]

2. Description of the Related Art In a conventional hybrid integrated circuit device, as shown in FIG. 3, a wiring board 2 having a heat-generating circuit component 8 and a non-heat-generating circuit component 1 mounted on one surface thereof is attached to a case 3C using an adhesive 4. The gel-like resin 5 is filled inside the case for protection from external stress, and the lid 6 is fixed to the upper part of the case with an adhesive 7. In order to enhance the heat dissipation effect of the heat generated by the mounted components, the wiring board is fixed to the case with the entire one surface as an adhesive area, and it is impossible to mount the components on both surfaces of the wiring board.

As a hybrid integrated circuit device having components mounted on both sides thereof, there is a structure in which a wiring board having components mounted on both sides is molded with an exterior resin 11 as shown in FIG. It does not have the same level of environmental resistance and heat dissipation as the hybrid integrated circuit device.

[0004]

In this conventional hybrid integrated circuit device, in order to dissipate the heat generated by the mounted components, the entire one surface of the wiring board is fixed to the case as an adhesive area, and the other surface of the wiring board is fixed. Parts can only be mounted. As a result, the size of the wiring board cannot be effectively used, and there is a problem that it hinders the overall size reduction.

[0005]

SUMMARY OF THE INVENTION The hybrid integrated circuit device of the present invention requires an area required to dissipate heat from a heat-generating circuit component mounted on a wiring board and a wiring board to be fixed to a case. The area where the components are prohibited from mounting and the adhesion area to the case, the wiring board with other non-heat-generating circuit components mounted on both sides of the other area, and the circuit configuration mounted on the adhesion surface of the wiring board to the case And a case having a stepped portion for housing the component.

[0006]

The present invention will be described below with reference to the drawings. 1A is a plan view showing a first embodiment of the present invention, and FIG. 1B is a sectional view taken along the line AA. In this embodiment, the heat-generating circuit component 8 and the non-heat-generating circuit component 1 are mounted on both surfaces of the wiring board 2. However, the wiring board 2
3mm wide on the side opposite to the side where the heat-generating circuit components are mounted
A peripheral portion and a region immediately below the heat-generating circuit component mounting position are set as a component mounting prohibited region, and this region is fixed to the case 3a with an adhesive 4 as a bonding region.

The case 3a has a stepped portion 9a having a depth of about 7 mm, and has a structure for accommodating the circuit components mounted on the side of the wiring board 2 that is adhered to the case. As a result, components can be mounted on a part of the case bonding surface of the wiring board, which can contribute to downsizing of the entire hybrid integrated circuit device. Further, since the gel-like resin 5 is filled in the upper part of the wiring board 2 and the lid 6 is fixed to the upper part of the case with the adhesive 7, the environment resistance equivalent to the conventional one is maintained.

FIG. 2 is a sectional view showing a second embodiment of the present invention. In the present embodiment, the heat-generating circuit component 8 is mounted on the central portion of the wiring board 2 and the opposite surface immediately below is bonded to the case 3b as an adhesive region, and a metal portion is provided on the peripheral portion of the wiring board which is not in contact with the case. The clip terminal 10 is attached.
This has the advantage of facilitating electrical connection between the front and back of the wiring board and between the wiring board and the external terminals.

Further, in this embodiment, since the gel-like resin 5 is also filled in the lower portion of the wiring board, the reliability can be improved in terms of the temperature cycle test. If there are no circuit components that require heat dissipation using the case,
It is sufficient that the adhesion region of the substrate does not have to have a sufficient area for fixing the substrate.

If the heat is instantaneously generated in the order of several hundreds of mS, the heat is transmitted only to a limited area. Therefore, even if there is a heat dissipation area larger than that, the effect does not appear.
The same heat dissipation effect can be obtained without using the entire surface of the wiring board as the area required for heat dissipation.

[0011]

As described above, according to the present invention, only the area required for heat dissipation and adhesion to the case on the adhesion surface of the wiring board to the case is the component mounting prohibited area,
Since the case for adhering the wiring board has a structure having a step for accommodating the components mounted on the adhering surface of the wiring board,
While maintaining the heat dissipation from the heat-generating circuit components,
The circuit components can be mounted on both surfaces of the wiring board, and the size of the wiring board can be reduced to 70 to 80%, and the hybrid integrated circuit device can be downsized.

[Brief description of drawings]

1A and 1B are a plan view and a cross-sectional view taken along the line AA of the first embodiment of the present invention.

FIG. 2 is a sectional view of a second embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a conventional example.

FIG. 4 is a cross-sectional view showing another conventional example.

[Explanation of reference numerals] 1 non-heat-generating circuit component 2 wiring board 3a, 3b, 3c case 4,7 adhesive 5 gel resin 6 lid 8 heat-generating circuit component 9a, 9b stepped portion 10 metal clip terminal 11 exterior resin

Claims (1)

[Claims] 1. A hybrid integrated circuit device having a wiring board on which semiconductor components and other electronic components are mounted on both sides, and a case for protecting the wiring board from external mechanical stress. The component mounting prohibited area is set only in the area of the adhesive surface of the wiring board that needs to be in contact with the case, and the case has a step for accommodating the mounted component on the side of the adhesive surface of the wiring board to the case. Hybrid integrated circuit device.