JPH0653607A - Cooling device for semiconductor light element array - Google Patents

Abstract

PURPOSE:To cool a semiconductor light element array accurately at a planned fixed temperature below its heating temperature. CONSTITUTION:The thickness of a combined semiconductor light element installation frame and heat introduction plate 2 and the interval M between a semiconductor light element array 1 and a temperature detecting element 5 are selected so that the element 5 is extended onto the point P fronting on the plate 2, of the isothermal being extended inside the plate 2 and in contact, under the array 1, with the face that a member 3 for heat diffusion contacts, viewed on the cross section passing the array 1 and the element 5 and besides being orthogonal to the direction of the extension of the array 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor optical element array cooling device for cooling a semiconductor optical element array so as to keep it at a predetermined constant temperature which is equal to or lower than the heat generation temperature even if it generates heat.

[0002]

2. Description of the Related Art Conventionally, a semiconductor optical element array cooling device described below with reference to FIG. 4 has been proposed.

That is, a semiconductor optical device array 1 having a structure in which a plurality of semiconductor optical devices extend in the same direction on a semiconductor substrate and are sequentially arranged in a direction intersecting the direction (in the figure, is simple Therefore, it is assumed that the plurality of semiconductor optical devices are four, as indicated by A, B, C, and D, and they are sequentially arranged along the paper surface in a state where they extend perpendicularly to the paper surface. (Shown as having the above structure) and introduces the heat generated in the semiconductor optical device array 1 by the semiconductor optical device array mounting / heat introducing plate 2. The semiconductor optical element array mounting / heat introducing plate 2 is provided between the semiconductor optical elements (A and D) on both sides in the arrangement direction of the plurality of semiconductor optical elements (A to D) in the semiconductor optical element array 1. The thickness D is smaller than the distance, that is, the array length L of the plurality of semiconductor optical elements. In this case, in practice, the semiconductor optical device array mounting / heat introducing plate 2 is made of a good thermal conductor such as diamond, and the semiconductor optical device is mounted on the upper surface of the semiconductor optical device array mounting / heat introducing plate 2. On the back side of the semiconductor substrate of array 1,
It is connected through the solder layer.

Further, the heat from the semiconductor optical device array 1 which is connected to the semiconductor optical device array mounting / heat introducing plate 2 and introduced from the semiconductor optical device array mounting / heat introducing plate 2 is introduced. , And a heat diffusion member 3 for internally diffusing it to a heat density sufficiently lower than that in the semiconductor optical element array mounting / heat introduction plate 2. In this case, in practice, the heat diffusion member 3 is made of a good heat conductor such as copper or aluminum, and has a sufficiently wide upper surface than the plate surface of the semiconductor optical element array mounting / heat introducing plate 2. It has a height sufficiently long as compared with the thickness of the element array mounting / heat introducing plate 2, and
The semiconductor optical element array mounting / heat introducing plate 2 is connected to the upper surface of the heat diffusion member 3 via a solder layer.

Further, the heat from the semiconductor optical element array mounting / heat introducing plate 2 which is connected to the heat diffusing member 3 and diffused into the heat diffusing member 3 is introduced and absorbed in a controllable manner. It has a heat absorbing device 4. In this case,
The heat absorbing device 4 is an electronic cooling device using the Peltier effect, and the heat diffusion member 3 is directly contacted and connected on the cooling plate.

Further, it has a temperature detecting element 5 for detecting the temperature of the semiconductor optical element array 1. The temperature detecting element 5 is installed on the semiconductor optical element array mounting / heat introducing plate 2 so as to detect the temperature of the semiconductor optical element array 1 by measuring the temperature thereof. In this case, in practice, the temperature measuring element 5
Is a thermistor.

Further, a control device 6 for controlling the heat absorbing device 4 based on the temperature detection output from the temperature detecting element 5 so as to keep the semiconductor optical element array 1 at a predetermined constant temperature lower than its heat generation temperature is provided. Have. In this case, in practice, the heat absorbing device 4 is the electronic cooling device as described above, and the control device 6 compares the temperature detection output from the temperature detection element 5 with the temperature setting output set inside, The comparison output controls the energizing circuit for the electronic cooling device to be turned on and off.

Reference numeral 7 indicates a temperature detection output line for supplying the temperature detection output from the temperature detection element 5 to the control device 6, and 8
Indicates a control line through which the control device 6 controls the heat absorbing device 4.

The above is the configuration of the conventionally proposed semiconductor optical element array cooling device.

According to the conventional semiconductor optical element array cooling device having such a structure, the semiconductor optical element array 1 is mounted on the semiconductor optical element array mounting / heat introducing plate 2 in the state. If the semiconductor optical device array 1 generates heat due to its operation, the heat is introduced by the semiconductor optical device array mounting / heat introducing plate 2, and the semiconductor optical device array mounting / heat introducing plate 2 is also introduced. The heat from the introduced semiconductor optical device array 1 is introduced by the heat diffusion member 3, and then the heat is internally diffused by the heat diffusion member 3 and further diffused to the heat diffusion member 3. Is absorbed by the heat absorbing device 4. At this time, the temperature detecting element 5 detects the temperature of the semiconductor optical element array 1 by measuring the temperature of the heat diffusion member 3, and the control device 6 detects the heat absorption based on the temperature detection output. The device 4 is controlled so that the semiconductor optical element array 1 maintains a predetermined constant temperature below its heat generation temperature.

Therefore, according to the conventional semiconductor optical element array cooling device shown in FIG. 4, even if the semiconductor optical element array 1 generates heat, the semiconductor optical element array 1 is cooled so as to be maintained at a predetermined constant temperature below the heat generation temperature. be able to.

Further, according to the conventional semiconductor optical element array cooling device shown in FIG. 4, the semiconductor optical element array mounting / heat introducing plate 2 is connected to the heat absorbing device 4 via the heat diffusion member 3, Then, the heat diffusion member 3 internally diffuses the heat introduced from the semiconductor optical element array mounting / heat introducing plate 2, so that the heat flux density in the heat diffusion member 3 is changed. Even if the heat flux density due to the heat introduced from the semiconductor optical element array 1 in the heat introducing plate 2 is relatively high, the heat absorbing device 4 acts to make the heat flux density relatively low, which is suitable for absorbing heat. That is, the semiconductor optical element array mounting / heat introducing plate 2 and the heat absorbing device 4 are
Since the function of matching the heat flux density is performed, the above-described cooling of the semiconductor optical device array 1 can be effectively performed.

Further, in the case of the conventional semiconductor optical element array cooling device shown in FIG. 4, the temperature measuring element 5 is mounted on the semiconductor optical element array mounting / heat introducing plate 2 and the semiconductor optical element array mounting / heat introducing. Since the temperature of the semiconductor optical device array 1 is detected by measuring the temperature of the plate 2,
Even if there is a difference between the actual temperature of the semiconductor optical element array 1 and the actual temperature measured by the temperature measuring element 5, the difference is that the thermal resistance between the semiconductor optical element array 1 and the temperature measuring element 5 is Since it is clear that the temperature measuring element 5 is much lower than the case where the temperature measuring element 5 is arranged in the heat diffusion member 3,
Compared with the case where the temperature measuring element 5 is arranged in the heat diffusion member 3, the temperature measuring element 5 is remarkably small. Therefore, the semiconductor optical element array 1 is kept at a predetermined constant temperature below the heat generation temperature thereof. As compared with the case where 5 is arranged in the heat diffusion member 3, the semiconductor optical device array 1 can be cooled so as to maintain the accuracy with high accuracy. Compared with the case where it is placed inside, it can be operated with the desired excellent characteristics.

[0014]

In the case of the conventional semiconductor optical element array cooling device shown in FIG. 4, the semiconductor optical element array 1 is used.
As shown in FIG. 4, when viewed in a cross-section passing through the temperature measuring element 5 and orthogonal to the extension direction of the semiconductor optical element array 1, as shown in FIG. A plurality of isotherms (indicated by isotherms of temperature 9.25 and temperature 9.00 in the figure) extending in contact with and extending from a plurality of surfaces under the semiconductor optical device array 1;
Inside the semiconductor optical element array mounting / heat introducing plate 2 and the heat diffusion member 3, a plurality of surfaces parallel to the surface where the semiconductor optical element array mounting / heat introducing plate 2 and the heat diffusion member 3 are in contact with each other. The surface has a temperature distribution in which a plurality of isotherms extending in contact with each other under the semiconductor optical device array 1 are drawn, but the semiconductor optical device array mounting / heat introducing plate 2 is a semiconductor device. A plurality of semiconductor optical devices (A to
Since the thickness D is smaller than the array length L of D), the semiconductor optical element array 1 is arranged so that the temperature measuring element 5 has a sufficiently small inner space M with the semiconductor optical element array 1.
Even if the temperature measuring element 5 is placed as close as possible to the surface of the semiconductor optical element array mounting / heat introducing plate 2, the temperature detecting element 5 is placed under the semiconductor optical element array 1 on the surface 9 in contact with the thermal diffusion member 3. On the semiconductor optical element array mounting / heat introducing plate 2, the isothermal line 10 extending in contact with the semiconductor optical element array mounting / heat introducing plate 2 is extended to a point P facing the semiconductor optical element array mounting / heat introducing plate 2. Can not be distributed to.

Therefore, the difference between the actual temperature of the semiconductor optical element array 1 and the actual temperature measured by the temperature measuring element 5 is relatively large, and the temperature of the semiconductor optical element array 1 measured by the temperature measuring element 5 is relatively large. Cannot be performed without being affected by the temperature gradient in the heat diffusion member 3, and the temperature measuring element 5
The trackability of the actual detected temperature of 1 to the actual temperature of the semiconductor optical element array 1 is relatively poor.

Therefore, even if the control device 6 is configured to control the heat absorbing device 4 in consideration of a large temperature difference between the actual temperature of the semiconductor optical element array 1 and the actual temperature detected by the temperature detecting element 5. , The semiconductor optical element array 1 has a certain limit for cooling it so as to keep it at a predetermined constant temperature equal to or lower than the heat generation temperature with high accuracy, and therefore, the semiconductor optical element array 1 has excellent desired characteristics. It has a drawback that it has a certain limit to operate at.

Therefore, the present invention proposes a novel semiconductor optical element array cooling device which does not have the above-mentioned drawbacks.

[0018]

A semiconductor optical element array cooling device according to the present invention mounts (i) a semiconductor optical element array as in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. A semiconductor optical device array mounting / heat introducing plate for introducing heat generated by the semiconductor optical device array; and (ii) the semiconductor optical device array mounting / heat introducing plate connected to the semiconductor optical device array mounting / heat introducing plate. The heat from the semiconductor optical device array introduced into the element array mounting / heat introducing plate is introduced, and the heat is internally transferred to a sufficiently lower heat flux density than that in the semiconductor optical device array mounting / heat introducing plate. A heat diffusion member to be diffused, and (iii) a heat absorption which is connected to the heat diffusion member and which introduces the heat from the heat diffusion member diffused from the heat diffusion member and absorbs it in a controllable manner. Device and ( v) a temperature detecting element for detecting the temperature of the semiconductor optical element array, and (v) the heat absorbing device, based on the temperature output output from the temperature detecting element, so that the semiconductor optical element array has a temperature equal to or lower than its heat generation temperature. A controller for controlling to maintain a predetermined constant temperature, and (v
i) The temperature detecting element is juxtaposed with the semiconductor optical element array so as to detect the temperature of the semiconductor optical element array by mounting the temperature detecting element on the semiconductor optical element array mounting / heat introducing plate. It is provided.

However, the semiconductor optical element array cooling device according to the present invention is the same as the semiconductor optical element array cooling device having the above-described structure, in which (vii) (a) the thickness of the semiconductor optical element array mounting / heat introducing plate And the inner spacing between the semiconductor optical element array and the temperature measuring element is
(B) The temperature measuring element is located in the semiconductor optical element array mounting / heat introducing plate as viewed on a cross section passing through the semiconductor optical element array and the temperature measuring element and orthogonal to the extension direction of the semiconductor optical element array. , On the surface for contacting and extending the surface where the semiconductor optical element array and the heat diffusion member are in contact with each other under the semiconductor optical element array, on the semiconductor optical element array mounting / heat introducing plate. (C) It is chosen so that it extends above the point where it faces.

In this case, it is possible that the semiconductor optical element array mounting / heat introducing plate has a thickness of ½ or more of the array length of the plurality of semiconductor optical elements in the semiconductor optical element array. .

[0021]

In the semiconductor optical element array cooling device according to the present invention, (a) the thickness of the semiconductor optical element array mounting / heat introducing plate, and the inner side between the semiconductor optical element array and the temperature detecting element. (B) The temperature measuring element is for mounting the semiconductor optical element array and for introducing heat when viewed on a cross section passing through the semiconductor optical element array and the temperature measuring element and orthogonal to the extension direction of the semiconductor optical element array. In the plate, for mounting the semiconductor optical element array and also for heat introduction of an isotherm extending in contact with the surface where the semiconductor optical element array and the heat diffusion member are in contact with each other under the semiconductor optical element array. It has the same configuration as the conventional semiconductor optical element array cooling device described above with reference to FIG. 4, except that (c) is selected so that it extends to the point facing the plate.

Therefore, although a detailed description is omitted, as in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. It can be cooled so as to keep it at a constant temperature.

As in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. 4, the semiconductor optical element array mounting / heat introducing plate is connected to the heat absorbing device via the heat diffusion member. Therefore, although detailed description is omitted, as in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG.
The semiconductor optical device array can be cooled effectively.

Further, as in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. 4, the temperature measuring element detects the temperature on the semiconductor optical element array mounting / heat introducing plate, so that the semiconductor Since the temperature of the optical element array is detected, detailed description thereof will be omitted. However, as in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. Compared to the case where the temperature measuring element is placed in the heat diffusion member, the temperature can be cooled to a predetermined constant temperature below the temperature so as to maintain it with high accuracy. Compared with the case where the element is arranged in the heat diffusion member, the element can be operated with excellent characteristics.

However, in the case of the semiconductor optical element array cooling device according to the present invention, (a) the thickness of the semiconductor optical element array mounting / heat introducing plate and the inner space between the semiconductor optical element array and the temperature measuring element are (B) When viewed in a cross section that passes through the semiconductor optical element array and the temperature measuring element and is orthogonal to the extension direction of the semiconductor optical element array, the temperature measuring element is located in the semiconductor optical element array mounting / heat introducing plate. The isothermal line extending in contact with the surface where the array and the heat diffusion member are in contact with each other under the semiconductor optical element array extends to a point facing the semiconductor optical element array mounting / heat introducing plate. like,
(C) Since it is selected, the difference between the actual temperature of the semiconductor optical element array and the actual temperature of the temperature detecting element is smaller than that of the conventional semiconductor optical element array cooling device described in FIG. In addition, the temperature of the semiconductor optical element array can be detected by the temperature measuring element without being affected by the temperature gradient in the thermal diffusion member, and the semiconductor temperature of the actual temperature of the temperature measuring element can be measured. The ability of the element array to follow the actual temperature can be made higher than in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG.

Therefore, the semiconductor optical element array can be cooled to a constant temperature equal to or lower than the heat generation temperature thereof so as to maintain it with higher accuracy than in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. Therefore, it is possible to operate the semiconductor optical element array with desired characteristics as compared with the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. This is all the more true when the semiconductor optical element array mounting / heat introducing plate has a thickness of ½ or more of the array length of the semiconductor optical element array.

[0027]

First Embodiment Next, a first embodiment of the semiconductor optical element array cooling device according to the present invention will be described with reference to FIG.

In FIG. 1, parts corresponding to those in FIG. 4 are designated by the same reference numerals, and detailed description thereof will be omitted.

The semiconductor optical element array cooling device according to the present invention shown in FIG. 1 has the same structure as that of the conventional semiconductor optical element array cooling device described above with reference to FIG. 4, except for the following matters.

That is, (a) the thickness D of the semiconductor optical element array mounting / heat introducing plate 2 and the inner space M between the semiconductor optical element array 1 and the temperature detecting element 5 are (b) the semiconductor optical element. As shown in FIG. 2, when viewed in a cross section passing through the array 1 and the temperature measuring element 5 and orthogonal to the extension direction of the semiconductor optical element array 1, the temperature measuring element 5 is inside the semiconductor optical element array mounting / heat introducing plate 2. The point where the isotherm 10 extending in contact with and extending under the semiconductor optical device array 1 on the surface 9 where it and the heat diffusion member 3 contact each other faces the semiconductor optical device array mounting / heat introducing plate 2. (C) Chosen so that it extends above P.

In this case, the thickness D of the semiconductor optical device array mounting / heat introducing plate 2 is 1/2 or more of the array length L of the plurality of semiconductor optical devices (A to D) in the semiconductor optical device array 1. It is acceptable to have a thickness.

The above is the configuration of the embodiment of the semiconductor optical element array cooling device according to the present invention.

The semiconductor optical element array cooling device according to the present invention having such a configuration has the same configuration as that of the conventional semiconductor optical element array cooling device described above with reference to FIG. 4, except for the matters described above. Therefore, although detailed description is omitted, the semiconductor optical element array mounting / heat introducing plate 2, the heat diffusion member 3, and the heat absorbing device 4 are the same as in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. Works, and
At this time, the temperature detecting element 5 detects the temperature of the semiconductor optical element array 1 by detecting the temperature of the semiconductor optical element array mounting / heat introducing plate 2, and controls the temperature based on the temperature output. The device 6 controls the heat absorbing device 4 so that the semiconductor optical element array 1 maintains a predetermined constant temperature below the heat generation temperature thereof.

Therefore, as in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. 4, even if the semiconductor optical element array 1 generates heat, the semiconductor optical element array 1 is maintained at a predetermined constant temperature below the heat generation temperature. Can be cooled.

Also, in the case of the semiconductor optical element array cooling device according to the present invention shown in FIG. 1, the semiconductor optical element array mounting and heat introduction is carried out similarly to the case of the conventional semiconductor optical element array cooling device described in FIG. Since the working plate 2 is connected to the heat absorbing device 4 via the heat diffusing member 3, a detailed description thereof will be omitted, but similar to the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. The above-described cooling of the optical element array 1 can be effectively performed.

Further, also in the case of the semiconductor optical element array cooling device according to the present invention shown in FIG. 1, as in the case of the conventional semiconductor optical element array cooling device described in FIG.
Is provided on the semiconductor optical element array mounting / heat introducing plate 2 so as to detect the temperature of the semiconductor optical element array 1 by detecting the temperature thereof, so detailed description will be omitted. As in the case of the conventional semiconductor optical element array cooling device described above in 4, the semiconductor optical element array 1 is placed in the thermal diffusion member 3 at a predetermined constant temperature below the heat generation temperature thereof. In comparison with the case where the temperature measuring element 5 is arranged in the thermal diffusion member 3, the semiconductor optical element array 1 can be cooled so as to maintain the temperature with high accuracy. , Can be operated with the desired excellent characteristics.

However, in the case of the semiconductor optical element array cooling device according to the present invention shown in FIG. 1, (a) the thickness D of the semiconductor optical element array mounting / heat introducing plate 2, and the semiconductor optical element array 1 and the temperature measuring element. 5, the inner space M between the semiconductor optical device array 1 and the temperature measuring device 5 is perpendicular to the extension direction of the semiconductor optical device array 1 and the temperature measuring device 5 is a semiconductor optical device array. An isotherm 1 extending in the mounting / heat introducing plate 2 in contact with a surface 9 of the plate 2 for contacting the heat diffusing member 3 under the semiconductor optical device array 1.
0 is extended so as to extend on the point P facing the semiconductor optical element array mounting / heat introducing plate 2, so that the actual temperature and the temperature measuring element of the semiconductor optical element array 1 are selected. The difference between the actual temperature of the semiconductor optical element array 1 and the actual temperature of the semiconductor optical element array 1 can be made smaller than in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. It can be performed without being affected by the temperature gradient in the thermal diffusion member 3, and the followability of the actual temperature of the temperature measuring element 5 to the actual temperature of the semiconductor optical element array 1 is shown in FIG. As shown in FIG. 4, it can be higher than in the case of the conventional semiconductor optical element array cooling device described in FIG.

Therefore, the semiconductor optical element array 1 can be cooled to a constant temperature equal to or lower than its exothermic temperature so as to maintain it with higher accuracy than in the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. For this reason, the semiconductor optical element array 1 can be operated with desired characteristics as compared with the case of the conventional semiconductor optical element array cooling device described above with reference to FIG. This means that the semiconductor optical element array mounting / heat introducing plate 2 has an arrangement length L of 1 of the semiconductor optical element array 1.
This is even more the case with a thickness of / 2 or more.

FIG. 3 shows the trackability of the actual temperature measured by the temperature measuring element 5 to the actual temperature of the semiconductor optical element array 1 by measuring the thickness D of the semiconductor optical element array mounting / heat introducing plate 2. The semiconductor optical device array 1 and the temperature measuring device 5 are used as parameters.
From the state in which only one semiconductor optical device (for example, A) of the plurality of semiconductor optical devices (A to D) in the semiconductor optical device array 1 is operated with respect to the inner space M (mm) between 4 shows the temperature change (° C.) of the first semiconductor optical device (A) when the semiconductor optical device array 1 is heated by changing the semiconductor optical devices (A to D) of FIG. It is a figure shown in comparison with the case of the conventional semiconductor optical element array cooling device shown in FIG.

In the above description, only one embodiment of the present invention is shown, and various modifications and changes can be made without departing from the spirit of the present invention.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an embodiment of a semiconductor optical element array cooling device according to the present invention.

FIG. 2 is a temperature distribution diagram in the semiconductor optical element array mounting / heat introducing plate and the heat diffusion member, which is used for explaining the semiconductor optical element array cooling device according to the present invention shown in FIG.

FIG. 3 is a graph showing an actual temperature measured by the temperature measuring element, which is used for explaining the semiconductor optical element array cooling device according to the present invention shown in FIG.
Using the thickness D of the semiconductor optical element array mounting / heat introducing plate as a parameter, the inner space M between the semiconductor optical element array and the temperature measuring element is measured so that the semiconductor optical element array can follow the actual temperature. (Mm) changes the heat generated in the semiconductor optical element array by operating all the semiconductor optical elements from the state in which only one semiconductor optical element in the plurality of semiconductor optical elements in the semiconductor optical element array is operating. Is the temperature change (° C) of the first semiconductor optical device when given
It is a figure shown in contrast with the case of the conventional semiconductor optical element array cooling device shown in FIG.

FIG. 4 is a schematic diagram showing a conventional semiconductor optical element array cooling device.

5 is a temperature distribution diagram in the semiconductor optical element array mounting / heat introducing plate and the heat diffusion member, which is used for explaining the conventional semiconductor optical element array cooling device shown in FIG.

[Explanation of symbols]

 1 semiconductor optical element array 2 semiconductor optical element array mounting and heat introduction plate 3 heat diffusion member 4 heat absorbing device 5 temperature measuring element 6 control device 7 temperature measuring output line 8 control line 9 surface 10 isotherm

Claims (2)

[Claims] 1. A semiconductor optical element array having a structure in which a plurality of semiconductor optical elements extend in the same direction and are sequentially arranged in a direction intersecting with the direction, and the semiconductor optical element array. From the semiconductor optical device array mounting / heat introducing plate, which is connected to the semiconductor optical device array mounting / heat introducing plate for introducing the heat generated by A heat diffusion member for introducing heat from the semiconductor optical device array introduced thereinto, and internally diffusing it into a heat flux density sufficiently lower than that in the semiconductor optical device array mounting / heat introducing plate; A heat absorbing device connected to the diffusion member and introducing heat from the heat diffusion member diffused from the heat diffusion member to absorb the heat in a controllable manner, and the temperature of the semiconductor optical element array is measured. Temperature measurement An element, and the heat absorbing device, based on the temperature output output from the temperature detecting element, a control device for controlling the semiconductor optical element array so as to maintain a predetermined constant temperature below the heat generation temperature thereof. The temperature detecting element is provided in parallel with the semiconductor optical element array so as to detect the temperature of the semiconductor optical element array by detecting the temperature on the semiconductor optical element array mounting / heat introducing plate. In the semiconductor optical element array cooling device, the thickness of the semiconductor optical element array mounting / heat introducing plate and the inner space between the semiconductor optical element array and the temperature detecting element are the semiconductor optical element array. And the temperature measuring element in the semiconductor optical element array mounting / heat introducing plate and the heat diffusing portion as viewed on a cross section passing through the temperature measuring element and orthogonal to the extension direction of the semiconductor optical element array. The isothermal line extending in contact with the surface under contact with the material under the semiconductor optical device array, as extending to the point facing the semiconductor optical device array mounting and heat introduction plate, A semiconductor optical element array cooling device characterized by being selected. 2. The semiconductor optical element array cooling device according to claim 1, wherein the semiconductor optical element array mounting / heat introducing plate has an array length of 1 of the plurality of semiconductor optical elements in the semiconductor optical element array. A semiconductor optical element array cooling device having a thickness of / 2 or more.