JPH0648871Y2 - コールドプレート構造 - Google Patents

コールドプレート構造

Info

Publication number
JPH0648871Y2
JPH0648871Y2 JP1989147034U JP14703489U JPH0648871Y2 JP H0648871 Y2 JPH0648871 Y2 JP H0648871Y2 JP 1989147034 U JP1989147034 U JP 1989147034U JP 14703489 U JP14703489 U JP 14703489U JP H0648871 Y2 JPH0648871 Y2 JP H0648871Y2
Authority
JP
Japan
Prior art keywords
cooling
cold plate
flow path
cooling liquid
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989147034U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0385653U (enExample
Inventor
伸嘉 山岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989147034U priority Critical patent/JPH0648871Y2/ja
Publication of JPH0385653U publication Critical patent/JPH0385653U/ja
Application granted granted Critical
Publication of JPH0648871Y2 publication Critical patent/JPH0648871Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989147034U 1989-12-22 1989-12-22 コールドプレート構造 Expired - Lifetime JPH0648871Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989147034U JPH0648871Y2 (ja) 1989-12-22 1989-12-22 コールドプレート構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989147034U JPH0648871Y2 (ja) 1989-12-22 1989-12-22 コールドプレート構造

Publications (2)

Publication Number Publication Date
JPH0385653U JPH0385653U (enExample) 1991-08-29
JPH0648871Y2 true JPH0648871Y2 (ja) 1994-12-12

Family

ID=31693567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989147034U Expired - Lifetime JPH0648871Y2 (ja) 1989-12-22 1989-12-22 コールドプレート構造

Country Status (1)

Country Link
JP (1) JPH0648871Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635595B2 (ja) * 2004-12-16 2011-02-23 ダイキン工業株式会社 熱交換システム

Also Published As

Publication number Publication date
JPH0385653U (enExample) 1991-08-29

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