JPH0648767Y2 - The jumper chip - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a jumper chip which is provided with a gear chip on a printed circuit board and short-circuits between a pair of opposing patterns.

[Conventional technology]

4 and 5 are explanatory views of a conventional jumper chip, FIG. 4 is a perspective view of the jumper chip, and FIG. 5 is a sectional view of the jumper chip soldered to a pattern on a printed circuit board.

In the drawing, 1 is an insulating base made of a heat-resistant rectangular resin having a thickness, 2 is an electrode plate composed of a top plate 3, a vertical leg 4 and a horizontal leg 5 for covering the upper, side and lower surfaces of the insulating base 1, and a jumper chip. The main body 6 is composed of an insulating base 1 and an electrode plate 2, and a solder plating layer 7 is formed over the entire surface of the electrode plate 2. Reference numeral 8 is a printed circuit board, 9 is a pattern in which a gap 10 is provided on the circuit board 8 and arranged to face each other.
The jumper chip body 6 has the horizontal legs 5 in a pattern 9
After mounting on top, the vertical leg 4 and the horizontal leg 5 and the pattern 9 are fixed with solder 11. Reference numeral 12 is another pattern provided orthogonal to the pattern 9 and passes through the lower surface of the insulating base 1.

[Problems to be solved by the device]

By the way, since the solder plating layer 7 is formed on the entire surface of the electrode plate 2 in the jumper chip body 6, the solder 11 rises up the vertical leg 4 and further rises to the central portion of the top plate 3 during soldering. However, there is a problem that this solder 11 drops from the upper surface plate 3 onto the printed circuit board 8 and the pattern 12 undesirably shorts, and the corner portion where the upper surface plate 3 of the electrode plate 2 and the vertical leg 4 intersect is Since it is not covered with a metal plate and there is no soldering at this part, the soldering strength is low and if the jumper chip 6 is displaced, the pattern 12 and the vertical leg 5 come close to each other and the pattern 12 The potential for unwanted shorts of the can be further increased.

The present invention is intended to solve the above problems,
An object of the present invention is to provide a jumper chip having a high soldering strength and capable of preventing an undesirable pattern of shortage.

[Means for Solving the Problems]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention forms an electrode plate composed of a metal plate to cover an upper surface, a side surface and a bottom surface of an insulating base, a vertical leg, and a horizontal leg to form an insulating base. In a jumper chip formed by forming a jumper chip main body with an electrode plate, placing the horizontal leg on a pair of patterns formed by providing a gear chip on a printed circuit board, and soldering the vertical leg and the horizontal leg to the pattern. A side electrode connecting the upper plate and the vertical leg is provided at a corner where the upper plate and the vertical leg of the electrode plate intersect, and soldering solder is provided on each surface of the vertical leg, the horizontal leg, the side electrode, and the end of the upper plate. Layers are provided.

[Action]

In the present invention, as described above, since the solder plating layer is formed only on the end portions of the upper surface plate of the electrode plate, the solder does not rise to the central portion of the upper surface plate during soldering. Therefore, since solder does not drip from the central portion of the top plate, undesired shorts of the pattern during soldering can be avoided.

Further, since soldering is performed not only on the vertical legs and the horizontal legs but also on the side electrodes, the soldering strength is reinforced as compared with the conventional one.

Therefore, there is no undesired short of the pattern due to the displacement of the jumper chip.

〔Example〕

 Embodiments of the present invention will be described below with reference to the accompanying drawings.

1 to 3 are explanatory views of an embodiment of the present invention. FIG. 1 is a perspective view of a jumper chip, and FIGS. 2 (a), (b),
(C) is an explanatory view showing an example of a manufacturing process of a jumper chip, and FIG. 3 is a sectional view showing a state in which the jumper chip is soldered to a printed board.

The same parts as those of the conventional example shown in FIGS. 4 and 5 are designated by the same reference numerals, and the duplicated description will be omitted.

The difference between the present invention and the conventional example is that a side electrode 13 for connecting the upper plate 3 and the vertical leg 4 is provided at a corner where the upper plate 3 and the vertical leg 4 of the electrode plate 2 intersect. Vertical leg 4,
The plating layer 7 is provided on each surface of the horizontal leg 5 and the side electrode 13 and on both ends of the top plate 3.

Below is a second example of the manufacturing process of the jumper chip body.
It will be described with reference to the drawings.

First, as shown in (a), the protrusions 15 are provided on the upper and lower sides of the strip-shaped stainless steel plate 14, and the solder plating layer 7 is formed on the left and right points. Next, it is bent at a right angle along the dotted line 16 and bent and drawn at the dotted line 17. (B) As shown in the figure, side electrodes 13 for connecting the upper plate 3 and the vertical legs 4 are formed at the corners where the vertical legs 4 and the upper plate 3 intersect. Next, as shown in (b), after covering this electrode plate 2 on the insulating base 1, the tip of the vertical leg 4 is placed inside along the bottom surface 17 of the insulating base 1 as shown in (c). Bend in one direction. At that time,
Both ends of the top plate 3, vertical legs 4, horizontal legs 5, side electrodes 13
The solder plating layer 7 is exposed on each surface of the.

In order to solder the jumper chip body 6 assembled in this way to the pattern 9 of the printed circuit board 8, the horizontal leg 5 is placed on the pattern 9, and the pattern 9 and the horizontal leg 5 are
The vertical leg 4 and the side electrode 13 are fixed to the pattern 9 with solder 11.

According to the above embodiment of the present invention, when soldering, the solder 11
Part of the climbs the vertical leg 4 to the end of the top plate 3,
Since the solder plating layer 7 is not formed in the central portion of the upper surface plate 3 and the stainless steel plate 14 is exposed, the solder 11 does not rise to the central portion, so that the solder 11 is applied from both sides of the central portion. It is not dropped on the printed circuit board 8. Therefore, there are no other undesired shorts of pattern 12 that intersect pattern 9.

In addition to the conventional vertical leg 4 and horizontal leg 5, the electrode plate 2 is soldered to the pattern 9 on the side electrode 13 as well, so that the soldering strength is greater than in the conventional case, and the position of the jumper chip body 6 is displaced. In this respect, without causing
There are no unwanted shorts of pattern 12.

The upper plate 3 of the electrode plate 2 has a circuit check function, and a test pin may be set on the upper plate 3, but the surface of the upper plate 3 may be satin-finished or may be marked in a diagonal line. If a rough surface is formed by using this method, slippage of the test pin can be prevented and circuit check can be performed easily.

[Effect of device]

As described above, since the solder does not adhere to the upper surface plate of the electrode plate, the solder is not properly applied from this portion, and an undesired short of the pattern can be avoided. Further, since the soldering with the pattern on the printed circuit board is carried out at three places of the vertical leg, the horizontal leg, and the side electrode, the soldering strength is large, and there is no displacement of the jumper chip. The desired short circuit can be avoided.

[Brief description of drawings]

1 to 3 are explanatory views of an embodiment of the present invention. FIG. 1 is a perspective view of a jumper chip, and FIGS. 2 (a), (b),
(C) is an explanatory view showing an example of a manufacturing process of a jumper chip, FIG. 3 is a sectional view of a condition in which the jumper chip is soldered to a pattern on a printed circuit board, and FIGS. 4 and 5 are explanatory views of a conventional example. FIG. 4 is a perspective view of the jumper chip, and FIG. 5 is a cross-sectional view of the jumper chip soldered to a pattern on a printed circuit board. 1 ... Insulating base, 2 ... Electrode plate, 3 ... Top plate, 4 ...
Vertical leg, 5 ... Horizontal leg, 6 ... Jeanper chip body,
7 ... Solder plating layer, 8 ... Printed circuit board, 9, 12 ... Pattern, 10 ... Gear cup, 13 ... Side electrode, 14 ... Stainless plate (metal plate).

Claims (1)

[Scope of utility model registration request] 1. An electrode plate comprising a top plate, a side plate and a bottom plate for covering an insulating base, a vertical leg and a horizontal leg is formed from a single metal plate, and a jumper chip body is formed by the insulating base and the electrode plate. In the jumper chip, which is configured by placing the horizontal leg on a pair of patterns formed by providing gears on a printed circuit board and soldering the vertical leg and the horizontal leg to the pattern, a top plate of the electrode plate Side electrodes that connect the upper plate and the vertical plate are provided at the corners where the vertical legs intersect with the vertical legs, and solder plating layers are provided on the surfaces of the vertical legs, the horizontal legs, the side electrodes, and the end portions of the upper plate. The jumper chip.