JPH064814A - Production of magnetic head - Google Patents

Abstract

PURPOSE:To smoothly finish the sliding surface of the magnetic head and a recording medium by obviating the exposure of an adhesive layer of thick glass on this sliding surface. CONSTITUTION:Plural square bar-shaped sub-substrates 11 formed with metallic layers 14 on one surface are used and are combined in a grid shape with plural square bar-shaped mother substrates 15 with housing grooves 16 by aligning the metallic layers 14. The adjacent mother substrates 15 are pressed to the sub-substrates 11 in opposite directions, by which the mother substrates 15 are brought into tight contact with the metallic layers 14 of the sub-substrates at the time of glass molding. The respective mother substrates 15 are bisected laterally longitudinally to slide the joined sub-substrates and the mother substrates. The core block formed by joining and integrating the slicing surfaces of a pair of the cut-out core blocks 18a, 18b where the metallic layers 14 come into tight contact with the mother substrates 15 is sliced that the thick glass layers 17 are not exposed on the slicing surfaces, by which core chips 19 are produced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a magnetic head, and more particularly to a magnetic head used in a VTR device and having a metal layer in which a metal magnetic film having a high saturation magnetic flux density and an insulating thin film are alternately laminated. Manufacturing method.

[0002]

2. Description of the Related Art For example, a magnetic head used in a VTR device for high density recording is of a laminated type having a metal layer in which a metal magnetic film having a high saturation magnetic flux density and an insulating thin film are alternately laminated. is there.

As a method of manufacturing this type of magnetic head, the present applicant has previously proposed a new manufacturing method including the following steps [Japanese Patent Application No. 3-340692].

First, as shown in FIG. 7A, a rectangular rod-shaped child substrate (1) made of a non-magnetic material such as ceramic is prepared, and one of the child substrates (1) has a high saturation magnetic flux density. Metal magnetic film ( ₂ ) such as sendust and Al ₂ O ₃ or SiO ₂
A metal layer (4) in which insulating thin films (3) such as the above are alternately laminated is deposited by sputtering.

On the other hand, as shown in FIG. 7B, a flat mother board (5) made of a non-magnetic material such as ceramic is prepared, and a plurality of storage grooves (6) are formed in the mother board (5). Engrave in an aligned state. Then, as shown in FIG. 8A, the plurality of sub-boards (1) on which the metal layer (4) is formed are connected to the metal layer (4).
Are inserted in the respective storage grooves (6) of the mother substrate (5) so that they face a certain direction, glass (7) is filled in the gap between the mother substrate (5) and the daughter substrate (1), and the glass mold is used for adhesion. To do.

After that, although not shown, after polishing the surface of the mother substrate (5) having the storage groove (6), forming a welding groove, filling the welding groove with glass, and forming a winding window groove. The core block (8) is cut out by cutting the mother board (5) in a direction orthogonal to the extending direction of the child board (1) as shown by the chain line in the figure. Then, as shown in FIG. 8B, the surfaces (8a) and (8a) of the pair of cut core blocks (8) and (8) serve as gap spacers and are made of a non-magnetic thin film such as SiO ₂ [not shown]. ), And abut and integrate them.

Next, after forming the winding locking groove (not shown),
A pair of core blocks that are joined and integrated (8) (8)
By slicing each core chip (9) at a constant pitch along the lateral direction as shown by the chain line in the figure,
A laminated type magnetic head having a metal layer (4) is manufactured.

[0008]

By the way, in the above-mentioned conventional manufacturing method, the mother substrate (5) and the daughter substrate (1) are joined by pouring the glass (7) into the gap between them, This gap is enlarged to some extent to facilitate pouring. Therefore, the adhesive layer of the glass (7) becomes thicker and exposed on the top surface (9a) of the core chip (9), which deteriorates the sliding performance with respect to the magnetic recording medium. This is the top surface (9a) of the core chip (9) during the finishing process.
When polishing (1), the glass (7) has a smaller hardness than the non-magnetic material forming the child substrate (1) and the mother substrate (5), and therefore is abraded much and impairs the flatness.

The problem that the adhesive layer of the glass (7) becomes thick is that the warp of the child substrate (1) occurs because the metal layer (4) having a different coefficient of thermal expansion is formed on one surface of the child substrate (1). Will be even bigger. This is because if there is a warp, the adhesive layer will vary and an extremely thick portion will occur.

Therefore, the present invention has been proposed in view of the above problems, and an object thereof is to expose a thick glass adhesive layer on the top surface of a core block which is a sliding surface with respect to a magnetic recording medium. It is an object of the present invention to provide a method of manufacturing a magnetic head that does not cause the above problem.

[0011]

The technical means for achieving the above object of the present invention is a rectangular bar-shaped child substrate made of a non-magnetic material having a metal layer deposited on one surface, and a housing for the child substrate. Using a plurality of square bar-shaped mother substrates made of non-magnetic material in which grooves are engraved on one surface at a predetermined pitch,

[0012] With the metal layer of the child board aligned in one of the longitudinal directions of the mother board, the child board and the mother board are combined in a grid pattern, and bonding glass is poured and bonded to the bonding portion. When

Adjacent mother boards are pressed against the child boards in directions opposite to each other to bring every other mother board into close contact with the metal layer of the child boards,

The blocks formed by this joining are sliced at each mother substrate portion so as to be divided in the longitudinal direction, and core blocks (one on both sides of the sliced position of the mother substrate in close contact with the metal layer are paired). And)

The pair of core blocks are joined and integrated so that the sliced surface of the mother substrate, which is in close contact with the metal layer, is flush with each other,

The pair of jointly integrated core blocks are sliced in a cross section which is parallel to the metal layer and does not include a thick adhesive layer portion of glass, and the sliced surface of the mother substrate closely adhered to the metal layer is sliced, That is, the thick glass adhesive layer portion was removed, and the core chip was cut out so that the metal layer portion was sandwiched by the nonmagnetic substrate with a predetermined thickness.

[0017]

In the above method of the present invention, the mother substrate and the mother substrate are combined in a lattice pattern, and when the mother substrates are bonded by glass, the mother substrates are pressed against the mother substrates in the directions in which the adjacent mother substrates are opposite to each other. In the portion of the mother substrate that is pushed toward the metal layer, the mother substrate is bonded to the metal layer of the daughter substrate in a close contact state regardless of the warp of the daughter substrate.

After that, when each mother board is sliced into two parts in the longitudinal direction, the metal layers of the child boards exposed on both sliced surfaces of the divided core blocks are closely adhered to the mother board on one surface. They are joined together in a state, and joined on the other side through a thick glass layer.

If the core blocks adjacent to each other after slicing are paired so that the slice surfaces are flush with each other and the metal layers of each core block are joined and integrated so as to be continuous with each other, the slice planes are flush with each other. The cross section of each of the sub-boards shown in Figure 1 is such that the metal layer on one side is in close contact with the mother board portion and the other side is joined to the mother board portion with a thick glass adhesive layer.

Then, the pair of bonded core blocks are sliced in a direction parallel to the metal layer, and the thick glass adhesive layer portion is removed when viewed at the sliced surface where the metal layer and the mother substrate are in close contact with each other. If the core chip is cut out so as to include the above portion with a predetermined thickness, it is possible to prevent the adhesive layer made of thick glass from being exposed on the top surface (sliding surface with the magnetic recording medium) of the core chip.

[0021]

EXAMPLE An example of the method of the present invention will be described with reference to FIGS.

First, as shown in FIG. 1, square bar-shaped child substrates (11), (11), ... Made of non-magnetic material such as ceramics are prepared. A metal magnetic film ( ₁₂ ) having a high saturation magnetic flux density, such as Sendust, and A are provided on one surface of the child substrates (11), (11), ...
A metal layer (14) in which insulating thin films (13) such as 1 ₂ O ₃ and SiO ₂ are alternately laminated is formed by sputtering.

Further, as shown in the lower side of the figure, the rectangular rod-shaped mother substrates (15), (15), ... Made of non-magnetic material such as ceramics.
Is prepared, and a plurality of storage grooves (16) are engraved in an aligned state on each of the mother substrates (15), (15), ....

Then, as shown in FIG. 2, the mother substrate (1
Sub-boards (11), (1
By inserting 1), ..., a plurality of mother boards (15),
(15), ... And a plurality of child boards (11), (11) ,. At this time, the metal layer (14) of the child board is aligned with one of the longitudinal directions of the mother boards (15), (15), ....

In such a combined state, the mother substrate (1
When the bonding glass (17) is poured into the gaps between 5), (15), ... And the child boards (11), (11) ,. The mother substrates (15), (15), ... are pressed against the daughter substrates (11), (11), ... in the opposite directions (15), (15), ....

As a result, even-numbered mother boards (15), (15), ... Counted from the front side in the drawing are sub-boards (11), (11),
The metal layers (14) are pressed against each other, and the bonding of the metal layer portions is not influenced by the warp of the sub-boards (11), (11), ... The odd-numbered mother substrates (15), (15), ... Are joined to the metal layer (14) with thickened glass (17) for bonding.

When the mother boards (15), (15), ... And the child boards (11), (11) ,.
Lapping the surface of the surface (1), (11), ...

Next, the mother substrates (15), (15), ... Are sliced so as to be divided into two parts in the longitudinal direction at positions indicated by chain lines in the figure. As a result, as shown in FIG. 3A, a pair of two core blocks (18a) and (18b) are sequentially cut out. This pair is two core blocks obtained on both sides of the sliced position of the even-numbered mother substrates (15), (15), ... Which are in close contact with the metal layer (14).

Looking at the sliced surfaces on both sides of the pair of core blocks (18a) and (18b) shown in FIG. 3 (a), the metal layer (14) on one surface is closely bonded to the mother substrate. ,
The metal layer (14) on the other surface is joined to the mother substrate portion through the thickened glass (17) for adhesion.

Next, as shown in FIG. 3B, a pair of core blocks (18a) and (18b) are arranged such that the metal layers of the core blocks (18a) and (18b) are continuous so that the sliced surfaces in the above-mentioned close contact state are flush with each other. The core blocks (18a) and (18b) are butted and joined together. Note that this junction is SiO that serves as a gap spacer.
It is performed through a non-magnetic thin film (not shown) such as ₂ .

Then, as shown by the chain line in FIG. 4, the pair of bonded core blocks (18a, 18b) is sliced in a direction parallel to the metal layer (14), and the sliced surface in the above-mentioned close contact state is seen. Then, the thick glass layer (17) for adhesion is removed, and the core chip (19) is cut out so as to include the metal layer (14) with a predetermined thickness.

Core chip (19) cut out by this
As shown in FIG. 5, the adhesive layer made of thick glass (17) is not exposed on the top surface (sliding surface with the magnetic recording medium) (19a).

After this, although not shown, surface polishing is performed to form a medium sliding surface on the top surface (19a). However, since the thick glass layer is not exposed on the top surface (19a), the top surface is uneven. Can be finished to an ideal smooth surface.

The bottom side (19) of this core chip (19)
In b), the metal layer (14) and the mother substrates (15), (15), ... Are adhered by the thick glass (17), but this surface is not used as the sliding surface, so there is no problem. Does not occur.

The above description has been given with reference to a simplified drawing in order to explain only the step related to the object of the present invention, namely, not forming the joint portion made of the thick glass (17) on the sliding surface with the magnetic recording medium. . Core chips actually formed (20)
Is as shown in FIG.

In FIG. 6, (21) and (21) are glasses for joining a pair of core blocks (18a) and (18b), and (22)
(23) and (24) are winding grooves. These are formed in the process before cutting out the core chip (20).

[0037]

According to the present invention, when a combined sub-substrate and mother substrate are bonded with glass and sliced to manufacture a core chip, regardless of the warp of the sub-substrate, a metal layer of the sub-substrate is formed. Form a sliced surface where the mother substrate is in close contact,
This sliced surface can be used as a sliding surface for the magnetic recording medium, and a thick glass adhesive layer can be prevented from appearing on this sliding surface. It is possible to prevent the sliding performance from being deteriorated due to unevenness and to achieve high performance of the core chip.

[Brief description of drawings]

FIG. 1 is a perspective view showing a sub-substrate on which a metal layer is used and a mother substrate on which a storage groove is formed, which are used in the first step of the method of the present invention,

FIG. 2 is a combination of a child board and a mother board shown in FIG.
A perspective view showing a state in which every other mother board is alternately pushed in different directions during glass molding.

3A is a perspective view showing a pair of core blocks cut out from the glass-molded child substrate and mother substrate shown in FIG. 2, and FIG. 3B is a perspective view showing the joined core blocks.

FIG. 4 is a perspective view showing a cutout position of one core chip of the core block shown in FIG.

5 is a perspective view showing a core chip cut out from the core block of FIG.

FIG. 6 is a perspective view showing a core chip actually manufactured by the method of the present invention.

7A and 7B are views for explaining a conventional manufacturing method, in which FIG. 7A is a perspective view with a partially enlarged view showing a child substrate having a metal layer formed on one side thereof, and FIG. 7B is a mother having a storage groove formed therein. Perspective view showing the substrate

FIG. 8A is a perspective view showing a mother substrate which is glass-molded and then lapped, and FIG. 8B is a perspective view showing a state where a pair of core blocks are joined and integrated.

[Explanation of symbols]

 11 Sub-board 14 Metal layer 15 Mother-board 16 Storage groove 17 Adhesive glass 18, 18a, 18b Core block 19, 20 Core chip

Claims (1)

[Claims] 1. A rectangular rod-shaped mother substrate made of a non-magnetic material having a metal layer deposited on one surface thereof, and a rectangular rod-shaped mother substrate made of a non-magnetic material in which the storage grooves of the daughter substrate are engraved on one surface at a predetermined pitch. A plurality of substrates are used, and in a state where the metal layer of the daughter substrate is aligned in one of the longitudinal directions of the mother substrate, the daughter substrate and the mother substrate are combined in a grid pattern and bonded to the bonding portion. When glass is poured and bonded together, adjacent mother boards are pressed against child boards in directions opposite to each other, and every other mother board is brought into close contact with the metal layer of the child boards to join them, and this is formed The divided blocks are sliced in each mother board portion so as to be divided into left and right in the longitudinal direction, and each pair of core blocks is arranged so that the sliced surface of the mother board in close contact with the metal layer is flush with each other. Joined and integrated, this joined and integrated Characterized by slicing a pair of core blocks in a cross section parallel to the metal layer and not including a thick glass adhesive layer portion, and cutting out a core chip such that the metal layer portion is sandwiched by a nonmagnetic substrate with a predetermined thickness. Magnetic head manufacturing method.