JPH06150224A - Magnetic head and its manufacture - Google Patents

Magnetic head and its manufacture

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Publication number
JPH06150224A
JPH06150224A JP29272192A JP29272192A JPH06150224A JP H06150224 A JPH06150224 A JP H06150224A JP 29272192 A JP29272192 A JP 29272192A JP 29272192 A JP29272192 A JP 29272192A JP H06150224 A JPH06150224 A JP H06150224A
Authority
JP
Japan
Prior art keywords
substrates
mother
magnetic
child
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP29272192A
Other languages
Japanese (ja)
Inventor
Kikuo Oura
紀久男 大浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP29272192A priority Critical patent/JPH06150224A/en
Publication of JPH06150224A publication Critical patent/JPH06150224A/en
Withdrawn legal-status Critical Current

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  • Magnetic Heads (AREA)

Abstract

PURPOSE:To provide a magnetic head and its manufacture making the bonding strength of core blocks strong and reducing the inductance. CONSTITUTION:A plurality of square rod-like child substrates 31 of non-magnetic bodies and a plurality of square rod-like mother substrates 32 formed with non-magnetic bodies and having storing grooves 33 for storing the child substrates 31 formed every constant pitch at one end faces are used. A magnetic film 22, and a glass film 35 are sequentially applied and laminated on the side faces of the mother substrates 32, and the child substrates 31 are fitted into the storing grooves 33 of the mother substrates 32, thereby, to combine the child and mother substrates 31, 32 in matrix. Then, the child substrates 31 are fused by means of a glass with the mother substrates 32, so that the mother substrates 32 are coupled and bonded each other via the child substrates 31 into one body. Subsequently, the mother substrates 32 are sliced at a predetermined pitch in the longitudinal direction. As a result, core blocks 41, 41' in which the sliced child substrates 31 are partially fitted at corners of one side of the sliced faces of the mother substrates 32 in the longitudinal direction are obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、VTR装置等に使用さ
れる磁気ヘッドとその製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head used in a VTR device or the like and a method for manufacturing the same.

【0002】[0002]

【従来の技術】従来、VTR装置等に使用される磁気ヘ
ッドを構成するコアチップ(1)は、図6に示すよう
に、磁性材料からなるメタル層(2)を非磁性基板
(3)(3)で挟み込んでなる一対のコア(4)
(4’)を、上記メタル層(2)を対向させて接合一体
化し、その媒体摺接面(5)に磁気ギャップを形成した
もので、図7乃至図9に示す要領で製造される。
2. Description of the Related Art Conventionally, as shown in FIG. 6, a core chip (1) constituting a magnetic head used in a VTR device or the like has a metal layer (2) made of a magnetic material and a non-magnetic substrate (3) (3). ) A pair of cores (4)
(4 ') is joined and integrated by facing the metal layer (2), and a magnetic gap is formed on the medium sliding contact surface (5), which is manufactured in the manner shown in FIGS. 7 to 9.

【0003】すなわち、図7に示すように、一側面に磁
性膜(2’)とガラス膜(11)をスパッタにより順次
被着形成したセラミック等の非磁性体からなる複数個の
角棒状の基板(12)を、例えば、治具(13)上に整
列保持して、押圧部材(14)により整列方向に加圧
し、かつ、適宜の加熱手段により加熱溶融したガラス膜
(11)によって、隣接する基板(12)を接合し、図
8に示すように、各基板(12)間にメタル層(2)を
形成する。次に、図8中の一点鎖線で示す位置で、接合
した各基板(12)を長手方向に定ピッチにスライスし
てコアブロック(15)を切出す。そして、図9に示す
ように、この切出された一対のコアブロック(15)
(15)の面(16)(16)をギャップスペーサとな
るSiO2等の非磁性体薄膜(図示せず)を介して突き
合せて接合一体化する。
That is, as shown in FIG. 7, a plurality of rectangular rod-shaped substrates made of a non-magnetic material such as ceramics having a magnetic film (2 ') and a glass film (11) sequentially deposited on one side by sputtering. (12) are aligned and held on a jig (13), pressed in the alignment direction by a pressing member (14), and are adjacent to each other by a glass film (11) that is heated and melted by an appropriate heating means. The substrates (12) are joined together to form a metal layer (2) between the substrates (12) as shown in FIG. Next, at the position shown by the alternate long and short dash line in FIG. 8, each bonded substrate (12) is sliced at a constant pitch in the longitudinal direction to cut out the core block (15). Then, as shown in FIG. 9, the pair of cut out core blocks (15).
The surfaces (16) and (16) of (15) are abutted and integrated with each other through a non-magnetic thin film (not shown) such as SiO 2 serving as a gap spacer.

【0004】次に、巻線窓(A)係止溝の形成後、この
一体化された一対のコアブロック(15)(15)を、
図9中の2点鎖線で示すようにその短手方向に沿って定
ピッチで、かつ、メタル層(2)と平行な方向でスライ
スして、メタル層(2)の部分を所定の厚さで含むよう
に、コアチップ(1)を切出す。
Next, after the winding window (A) locking groove is formed, the pair of integrated core blocks (15) (15) are
As indicated by the chain double-dashed line in FIG. 9, the metal layer (2) is sliced at a constant pitch along the widthwise direction thereof and in a direction parallel to the metal layer (2) so that the metal layer (2) has a predetermined thickness. The core chip (1) is cut out so as to be included in.

【0005】[0005]

【発明が解決しようとする課題】従来の技術によれば、
非磁性体である基板(12)は角棒状であるため変形し
難い。このため基板(12)に反り等があると、複数の
基板(12)を整列させた際、基板(12)間に隙間が
発生すると共に、上記治具(13)により複数の基板
(12)を整列方向に加圧しても、この基板(12)間
の隙間を閉塞することができない。したがって、基板
(12)を均一に接着することができず、接着強度が弱
く、メタル層(2)を介して接着した基板(12)が剥
がれてしまうという問題があった。また、上記基板(1
2)は変形しにくいため、治具(13)の加圧力が及ぶ
基板(12)の個数に限界があり、このため一度の処理
で製造することができるコアチップ数が少なくなって、
コアチップの生産性が悪いという問題があった。
According to the prior art,
The substrate (12), which is a non-magnetic material, is in the shape of a square rod, and therefore is difficult to deform. Therefore, if the substrates (12) are warped or the like, a gap is generated between the substrates (12) when the substrates (12) are aligned, and the jigs (13) cause the plurality of substrates (12) to be aligned. Even if pressure is applied in the alignment direction, the gap between the substrates (12) cannot be closed. Therefore, there was a problem that the substrate (12) could not be bonded uniformly, the bonding strength was weak, and the substrate (12) bonded via the metal layer (2) was peeled off. In addition, the substrate (1
Since 2) is difficult to deform, the number of substrates (12) to which the pressing force of the jig (13) is applied is limited, which reduces the number of core chips that can be manufactured in one process.
There was a problem of poor productivity of core chips.

【0006】さらに、上記構成のコアチップ(1)は、
メタル層(2)が媒体摺接面(5)の幅方向全域に渡っ
て形成されているため、コアチップ(1)により磁気ヘ
ッドを製造すると、媒体摺接面(5)のメタル層(2)
の幅寸法Lが大きくなり、このため磁気ヘッドのインダ
クタンスが高くなるという問題があった。
Further, the core chip (1) having the above structure is
Since the metal layer (2) is formed over the entire width direction of the medium sliding contact surface (5), when the magnetic head is manufactured using the core chip (1), the metal layer (2) of the medium sliding contact surface (5) is formed.
However, there is a problem that the width dimension L of the magnetic head becomes large, and thus the inductance of the magnetic head becomes high.

【0007】本発明は、上記問題点に鑑み提案されたも
ので、一対のコアブロックの接着強度が強く、かつ、イ
ンダクタンスを低くすることができる磁気ヘッド及びそ
の製造方法を提供することを目的としている。
The present invention has been proposed in view of the above problems, and an object of the present invention is to provide a magnetic head in which the adhesive strength of a pair of core blocks is high and the inductance is low, and a manufacturing method thereof. There is.

【0008】[0008]

【課題を解決するための手段】本発明は、上記目的を達
成するため、請求項1の発明は、磁性材料からなるメタ
ル層を非磁性基板で挟み込んでなる一対のコアを、上記
メタル層を対向させて接合一体化し、その媒体摺接面に
磁気ギャップを形成したものにおいて、上記一対のコア
の媒体摺接面側の両側角部に切欠部を夫々形成し、この
切欠部に非磁性ブロックを嵌合固定したものである。
In order to achieve the above object, the present invention provides a pair of cores comprising a metal layer made of a magnetic material sandwiched by non-magnetic substrates. In a structure in which they are opposed to each other and integrally joined, and a magnetic gap is formed in the medium sliding contact surface, cutouts are formed in both side corners of the pair of cores on the medium sliding contact surface side, and the nonmagnetic block is formed in the cutouts. It is fitted and fixed.

【0009】また、請求項2の発明は、非磁性体からな
る複数の角棒状母基板の各長手側の一側端面に、角棒状
非磁性子基板を収納可能な複数の収納溝を櫛歯状に定ピ
ッチに形成すると共に、母基板の片側面に磁性膜及び溶
着用ガラス膜を積層被着する工程と、上記母基板を重ね
合わせ、その各収納溝に上記子基板を嵌合収納して、母
基板と子基板とを格子状に組合わせる工程と、上記子基
板上に溶着用ガラスを載置して母基板を加圧加熱して、
上記ガラス膜及びガラスを溶融させ、母基板同士を子基
板により連結して接合一体化する工程と、上記ガラスを
研磨除去したのち、母基板を長手方向に所定ピッチでス
ライスして、母基板の長手方向スライス面の片側角部に
スライスされた子基板が部分的に嵌合したコアブロック
を形成する工程とからなるものである。
According to a second aspect of the present invention, a plurality of storage grooves capable of storing the square bar-shaped non-magnetic substrate are formed on one end face of each longitudinal side of the plurality of square bar-shaped mother substrates made of a non-magnetic material. In a uniform pitch, and a step of laminating and depositing a magnetic film and a glass film for welding on one side of the mother substrate, the mother substrate is superposed, and the subsidiary substrates are fitted and housed in their respective storage grooves. A step of combining the mother board and the child board in a lattice pattern, placing the glass for welding on the child board and heating the mother board under pressure,
The step of melting the glass film and glass, joining the mother substrates to each other by joining the mother substrates by joining and integrating the substrates, and polishing and removing the glass, and then slicing the mother substrate at a predetermined pitch in the longitudinal direction of the mother substrate. And a step of forming a core block in which a daughter board sliced at one corner of a longitudinal slice surface is partially fitted.

【0010】[0010]

【作用】請求項1の発明によれば、磁気ヘッドの媒体摺
接面に形成されるメタル層の幅寸法が狭くなり、インダ
クタンスが低くなる。
According to the first aspect of the invention, the width of the metal layer formed on the medium sliding contact surface of the magnetic head is narrowed and the inductance is lowered.

【0011】また、請求項2の発明によれば、母基板に
収納溝を形成して櫛歯状にしたので、母基板は整列方向
に変形しやすくなり、しかも母基板は、母基板の収納溝
に格子状に組合せて嵌合された子基板で連結固定される
ので、各母基板の接着強度が強く、母基板は均一に接着
されて剥がれることがない。
Further, according to the second aspect of the present invention, since the storage groove is formed in the mother substrate to form the comb teeth, the mother substrate is easily deformed in the alignment direction, and the mother substrate is stored in the mother substrate. Since the sub-boards that are combined and fitted in the grooves in a lattice shape are connected and fixed, the respective mother boards have high adhesive strength, and the mother boards are evenly adhered and do not peel off.

【0012】[0012]

【実施例】以下本発明の実施例を図1乃至図5を参照し
ながら説明すると次の通りである。
Embodiments of the present invention will be described below with reference to FIGS. 1 to 5.

【0013】図1において、(21)は磁気ヘッドを構
成するコアチップで、このコアチップ(21)は、磁性
材料からなるメタル層(22)を非磁性基板(23)
(23)で挟み込んでなる一対のコア(24)(2
4)、上記メタル層(22)を対向させて接合一体化
し、その媒体摺接面(25)に磁気ギャップを形成する
と共に、一対のコア(24)(24)の媒体摺接面(2
5)側の両側角部を切欠き、この切欠部(26)(2
6’)に非磁性体からなる角棒状の連結ブロック(2
7)(27’)をガラスを介して嵌合接着したもので、
一対のコア(24)(24)の各非磁性基板(23)
(23)は、メタル層(22)と連結ブロック(27)
(27’)を介して接着固定される。
In FIG. 1, reference numeral (21) is a core chip constituting a magnetic head, and the core chip (21) has a metal layer (22) made of a magnetic material and a non-magnetic substrate (23).
A pair of cores (24) (2) sandwiched by (23)
4) The metal layers (22) are made to face each other and joined together to form a magnetic gap in the medium sliding contact surface (25), and the medium sliding contact surface (2) of the pair of cores (24) (24) is also formed.
Notches on both side corners on the 5) side, and the notches (26) (2
6 ') is a square rod-shaped connecting block (2
7) (27 ') is fitted and adhered via glass,
Each non-magnetic substrate (23) of a pair of cores (24) (24)
(23) is a metal layer (22) and a connection block (27)
It is adhesively fixed via (27 ').

【0014】上記コアチップ(21)は、図2乃至図5
に示す要領で製造される。図2乃至図5において、(3
1)はセラミック等の非磁性体からなる複数本の角棒状
の子基板、(32)はセラミック等の非磁性体からなる
複数本の角棒状の母基板で、各母基板(32)の一側端
面に、子基板(31)の収納用の複数の収納溝(33)
を定ピッチに櫛歯状に形成して、収納溝(33)間に凸
部(34)を設けてある。
The core chip (21) is shown in FIGS.
It is manufactured according to the procedure shown in. 2 to 5, (3
1) is a plurality of rectangular bar-shaped child substrates made of a non-magnetic material such as ceramics, and (32) is a plurality of rectangular bar-shaped mother substrates made of a non-magnetic material such as ceramics. A plurality of storage grooves (33) for storing the sub-board (31) are provided on the side end surface.
Are formed in a constant pitch in a comb-tooth shape, and convex portions (34) are provided between the storage grooves (33).

【0015】そして、図2及び図3に示すように、一側
面に磁性膜(22’)とガラス膜(35)をスパッタに
より順次被着形成した母基板(32)を整列保持すると
共に、各母基板(32)の収納溝(33)に子基板(3
1)を嵌入させることにより、複数の母基板(32)と
複数の子基板(31)を格子状に組み合わせる。
Then, as shown in FIGS. 2 and 3, a mother substrate (32) having a magnetic film (22 ') and a glass film (35) sequentially deposited on one side by sputtering is aligned and held. The sub-board (3) is placed in the storage groove (33) of the motherboard (32).
By inserting 1), a plurality of mother boards (32) and a plurality of daughter boards (31) are combined in a grid pattern.

【0016】このように組み合わせた状態の子基板(3
1)と母基板(32)を、図3に示すように、治具(3
6)上に整列保持し、かつ、子基板(31)上にガラス
(図示省略)を載置する。しかる後、上記子基板(3
1)及び母基板(32)を加熱しながら、押圧部材(3
7)により母基板(32)を整列方向に加圧する。する
と隣接する母基板(32)が溶融したガラス膜(35)
により溶着され、図4に示すように、母基板(32)間
にメタル層(22)が形成され、又子基板(31)上に
載置したガラスが溶融して、母基板(32)と子基板
(31)との隙間にガラスが流し込まれ、子基板(3
1)は母基板(32)に溶着固定されてウェーハ(3
8)が形成される。
The child board (3
1) and the mother board (32) as shown in FIG.
6) It is aligned and held on the glass substrate, and glass (not shown) is placed on the child substrate (31). After that, the child board (3
1) While heating the mother substrate (32), the pressing member (3
The mother substrate (32) is pressed by 7) in the alignment direction. Then, the glass film (35) in which the adjacent mother substrate (32) is melted
4, the metal layer (22) is formed between the mother substrates (32) as shown in FIG. 4, and the glass placed on the daughter substrate (31) is melted to form the mother substrate (32). Glass is poured into the gap between the child board (31) and the child board (3
1) is welded and fixed to the mother substrate (32) and the wafer (3
8) is formed.

【0017】上記母基板(32)の整列方向への加圧
時、母基板(32)は、一面に定ピッチに収納溝(3
3)を形成してあるため、凸部(34)が自由端とな
り、母基板(32)の整列方向に変形しやすく、したが
って、隣接する母基板(32)間に隙間があっても、治
具(36)の加圧力によって母基板(32)間の隙間は
閉塞され、隣接する母基板(32)は確実、かつ、均一
に接着され、しかも、隣接する母基板(32)は夫々子
基板(31)によって接着されて連結固定されるので、
接着強度がきわめて強い。
When pressure is applied to the mother substrate (32) in the alignment direction, the mother substrate (32) has a storage groove (3) formed on one surface thereof at a constant pitch.
3) is formed, the convex portion (34) serves as a free end and is easily deformed in the alignment direction of the mother substrate (32). Therefore, even if there is a gap between the adjacent mother substrates (32), it can be cured. The gap between the mother substrates (32) is closed by the pressing force of the tool (36), the adjacent mother substrates (32) are reliably and uniformly adhered, and the adjacent mother substrates (32) are each a subsidiary substrate. Since it is glued and connected and fixed by (31),
The adhesive strength is extremely strong.

【0018】こうして母基板(32)と子基板(31)
を格子状の接着固定すると、図4の一点鎖線で示す位置
で、各子基板(31)及び母基板(32)の凸部(3
4)が左右に2分割されるように、母基板(32)を長
手方向に定ピッチにスライスしてコアブロック(41)
(41’)を切出す。そして、図5に示すように、この
切出された一対のコアブロック(41)(41’)の面
(42)(42’)をギャップスペーサとなるSiO2
等の非磁性体薄膜(図示せず)を介して突き合せて接合
一体化する。
Thus, the mother board (32) and the child board (31)
When the grid-shaped adhesive bonding is performed, the convex portions (3
The core block (41) is obtained by slicing the mother substrate (32) at a constant pitch in the longitudinal direction so that 4) is divided into left and right.
Cut out (41 '). Then, as shown in FIG. 5, the surfaces (42) and (42 ′) of the pair of cut out core blocks (41) and (41 ′) serve as gap spacers.
These are abutted and integrated through a non-magnetic thin film (not shown) such as.

【0019】次に、巻線窓(A)の形成後、この一体化
された一対のコアブロック(41)(41’)を、図5
中の2点鎖線で示すようにその長手方向に定ピッチで、
かつ、メタル層(22)と平行な方向でスライスして、
メタル層(2)の部分を所定の厚さで含むように、コア
チップ(21)を切出す。
Next, after the winding window (A) is formed, the pair of integrated core blocks (41) (41 ') is shown in FIG.
As shown by the two-dot chain line in the figure, at a constant pitch in the longitudinal direction,
And slice in the direction parallel to the metal layer (22),
The core chip (21) is cut out so as to include the metal layer (2) portion with a predetermined thickness.

【0020】このようにして切出されたコアチップ(2
1)は、媒体摺接面(25)の両側がスライスされた子
基板により形成された連結ブロック(27)(27’)
で連結固定されており、メタル層(22)は媒体摺接面
(25)の略中央部にのみ露出して、その幅寸法Mが小
さくなるので、このコアチップ(21)により磁気ヘッ
ドを製造すると、インダクタンスが低くなる。
The core chip (2
1) is a connection block (27) (27 ') formed by a child board in which both sides of a medium sliding contact surface (25) are sliced.
Since the metal layer (22) is exposed only at the substantially central portion of the medium sliding contact surface (25) and the width dimension M becomes small, a magnetic head is manufactured by the core chip (21). , The inductance is low.

【0021】[0021]

【発明の効果】本発明によれば、母基板は整列方向に変
形しやすく、しかも子基板で連結固定された状態で接合
されるので、隣接する母基板を隙間なく接着することが
でき、母基板の接着強度が大幅に強くなる。したがっ
て、母基板同士が剥がれたりすることがないと共に、製
造時には、従来に比べて治具により多くの母基板を接着
することが可能となり、一度の処理で製造することがで
きるコアチップ数が多くなり、生産性が向上する。
According to the present invention, since the mother substrates are easily deformed in the alignment direction and are joined in the state where they are connected and fixed by the daughter substrates, the adjacent mother substrates can be adhered to each other without a gap. The adhesive strength of the substrate is significantly increased. Therefore, the mother substrates are not separated from each other, and more mother substrates can be bonded to the jig during manufacturing in comparison with the conventional method, and the number of core chips that can be manufactured in one process increases. , Productivity is improved.

【0022】しかもコアチップの媒体摺接面のメタル層
の幅寸法が小さくなって、インダクタンスが低くなり、
コアチップの高性能化を達成することができる。
Moreover, the width of the metal layer on the medium sliding contact surface of the core chip is reduced, and the inductance is reduced.
Higher performance of the core chip can be achieved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の磁気ヘッドのコアチップの実施例を示
す斜視図。
FIG. 1 is a perspective view showing an embodiment of a core chip of a magnetic head of the present invention.

【図2】本発明に係る製造方法の実施例を示す斜視説明
図。
FIG. 2 is a perspective explanatory view showing an embodiment of a manufacturing method according to the present invention.

【図3】母基板の加圧要領を示す側面図。FIG. 3 is a side view showing a procedure for pressing a mother substrate.

【図4】図2に示す子基板と母基板とを格子状に組合せ
て接着固定した状態を示す斜視図。
FIG. 4 is a perspective view showing a state in which the child board and the mother board shown in FIG.

【図5】図4に示す子基板と母基板から切り出して接合
した一対のコアブロックを示す斜視図。
5 is a perspective view showing a pair of core blocks that are cut out from the mother board and the mother board shown in FIG.

【図6】従来の磁気ヘッドのコアチップの斜視図。FIG. 6 is a perspective view of a core chip of a conventional magnetic head.

【図7】基板の加圧要領を示す側面図。FIG. 7 is a side view showing the procedure for pressing the substrate.

【図8】従来の製造方法を示す斜視図。FIG. 8 is a perspective view showing a conventional manufacturing method.

【図9】図7に示す基板を切り出して接合した一対のコ
アブロックを示す斜視図。
9 is a perspective view showing a pair of core blocks obtained by cutting out and joining the substrate shown in FIG.

【符号の説明】[Explanation of symbols]

21 コアチップ 22 メタル層 22’ 磁性膜 25 媒体摺接面 26、26’ 切欠部 27、27’ 連結ブロック 31 子基板 32 母基板 33 収納溝 35 ガラス膜 41、41’ コアブロック 21 core chip 22 metal layer 22 'magnetic film 25 medium sliding surface 26, 26' notch 27, 27 'connecting block 31 child substrate 32 mother substrate 33 storage groove 35 glass film 41, 41' core block

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 磁性材料からなるメタル層を非磁性基板
で挟み込んでなる一対のコアを、上記メタル層を対向さ
せて接合一体化し、その媒体摺接面に磁気ギャップを形
成したものにおいて、上記一対のコアの媒体摺接面側の
両側角部に切欠部を夫々形成し、この切欠部に非磁性ブ
ロックを嵌合固定したことを特徴とする磁気ヘッド。
1. A pair of cores in which a metal layer made of a magnetic material is sandwiched by non-magnetic substrates are joined and integrated with the metal layers facing each other, and a magnetic gap is formed on the medium sliding contact surface. A magnetic head, characterized in that notches are formed at both corners of a pair of cores on the medium sliding contact surface side, and nonmagnetic blocks are fitted and fixed to the notches.
【請求項2】 非磁性体からなる複数の角棒状母基板の
各長手側の一側端面に、角棒状非磁性子基板を収納可能
な複数の収納溝を櫛歯状に定ピッチに形成すると共に、
母基板の片側面に磁性膜及び溶着用ガラス膜を積層被着
する工程と、上記母基板を重ね合わせ、その各収納溝に
上記子基板を嵌合収納して、母基板と子基板とを格子状
に組合わせる工程と、上記子基板上に溶着用ガラスを載
置して母基板を加圧加熱して、上記ガラス膜及びガラス
を溶融させ、母基板同士を子基板により連結して接合一
体化する工程と、上記ガラスを研磨除去したのち、母基
板を長手方向に所定ピッチでスライスして、母基板の長
手方向スライス面の片側角部にスライスされた子基板が
部分的に嵌合したコアブロックを形成する工程とからな
る磁気ヘッドの製造方法。
2. A plurality of accommodating grooves capable of accommodating the rectangular rod-shaped non-magnetic child substrates are formed at a constant pitch in a comb-like shape on one end face of each longitudinal side of a plurality of rectangular rod-shaped mother substrates made of a non-magnetic material. With
The step of laminating and depositing the magnetic film and the glass film for welding on one side of the mother substrate, the mother substrates are superposed, and the mother substrates are fitted and housed in the respective storage grooves to form the mother substrate and the mother substrate. Step of combining in a lattice shape, placing the glass for welding on the child substrate, heating the mother substrate under pressure, melting the glass film and glass, and joining and joining the mother substrates by the child substrate After the step of integrating and polishing and removing the glass, the mother substrate is sliced at a predetermined pitch in the longitudinal direction, and the sliced child substrate is partially fitted to one side corner of the longitudinal slice surface of the mother substrate. A method of manufacturing a magnetic head, which comprises the step of forming a core block.
JP29272192A 1992-10-30 1992-10-30 Magnetic head and its manufacture Withdrawn JPH06150224A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29272192A JPH06150224A (en) 1992-10-30 1992-10-30 Magnetic head and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29272192A JPH06150224A (en) 1992-10-30 1992-10-30 Magnetic head and its manufacture

Publications (1)

Publication Number Publication Date
JPH06150224A true JPH06150224A (en) 1994-05-31

Family

ID=17785460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29272192A Withdrawn JPH06150224A (en) 1992-10-30 1992-10-30 Magnetic head and its manufacture

Country Status (1)

Country Link
JP (1) JPH06150224A (en)

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