JPH0646675B2 - Ceramic multilayer circuit board and manufacturing method thereof - Google Patents
Ceramic multilayer circuit board and manufacturing method thereofInfo
- Publication number
- JPH0646675B2 JPH0646675B2 JP56209775A JP20977581A JPH0646675B2 JP H0646675 B2 JPH0646675 B2 JP H0646675B2 JP 56209775 A JP56209775 A JP 56209775A JP 20977581 A JP20977581 A JP 20977581A JP H0646675 B2 JPH0646675 B2 JP H0646675B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- conductor
- circuit board
- multilayer circuit
- ceramic multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 (1) 発明の技術分野 本発明はセラミック多層回路基板に関し、特にその表面
に形成するＩＣ素子等の部品接続用導体突起の製造方法
に関するものである。Description: (1) Technical Field of the Invention The present invention relates to a ceramic multilayer circuit board, and more particularly to a method for manufacturing a conductor projection for connecting components such as IC elements formed on the surface thereof.
(2) 技術の背景 ＩＣあるいはLSI等の半導体部品素子はセラミック多層
回路基板上に搭載されて各種半導体装置を構成する。こ
のような半導体部品素子をセラミック基板上に搭載接合
する場合、素子の接続端子部にハンダボールを接合し、
セラミック基板には素子の接続端子部に対応して内部回
路と接続した部品接続用ランドあるいはバンプ等を突出
させて形成し、この部品接続用突出部に上記半導体素子
のハンダボールを載置しこれを加熱してハンダ接合して
いる。一方、セラミック多層回路基板の製造方法とし
て、各層の上下の回路パターンを接続するためのバイア
ホールをグリーンシートに穿設することなく、グリーン
シートに導体ボールを圧入埋設しこのグリーンシートを
積層して焼成し、各導体ボールによりセラミック基板各
層の回路同士を接続させた導体ボール充填方法が開発さ
れている。(2) Background of technology Semiconductor component elements such as ICs and LSIs are mounted on a ceramic multilayer circuit board to form various semiconductor devices. When mounting and bonding such a semiconductor component element on a ceramic substrate, a solder ball is bonded to the connection terminal part of the element,
The ceramic substrate is formed by projecting component connecting lands or bumps connected to the internal circuit corresponding to the connecting terminals of the element, and the solder balls of the semiconductor element are mounted on the projecting portions for component connection. Are heated and soldered. On the other hand, as a method for manufacturing a ceramic multilayer circuit board, conductor balls are press-fitted and embedded in the green sheet without forming via holes for connecting the upper and lower circuit patterns of each layer in the green sheet, and the green sheets are laminated. A conductor ball filling method has been developed in which the conductor balls are fired and the circuits of each layer of the ceramic substrate are connected by the conductor balls.
(3) 従来技術と問題点 従来、セラミック回路基板上にＩＣあるいはLSI等の部
品接続用導体突起を基板表面に形成する場合、内部の回
路パターン形成後のセラミック基板上にスクリーン印刷
あるいはメッキ等の厚膜法又はスパッタ、蒸着、Ｃ．
Ｖ．Ｄ等の薄膜法等により部品接続端子に対応した位置
に導体突起部を形成している。しかしながら、このよう
な方法ではセラミック基板に回路パターンを形成後に新
たに基板表面に導体突起部を形成する工程を必要とし製
造に多くの手間を要しセラミック多層回路基板の製造効
率の低下を来していた。(3) Conventional Technology and Problems Conventionally, when a conductor projection for connecting components such as IC or LSI is formed on the surface of a ceramic circuit board, screen printing or plating etc. is performed on the ceramic board after the internal circuit pattern is formed. Thick film method or sputtering, vapor deposition, C.I.
V. A conductor projection is formed at a position corresponding to the component connection terminal by a thin film method such as D. However, such a method requires a step of newly forming a conductor protrusion on the surface of the substrate after forming a circuit pattern on the ceramic substrate, which requires a lot of time and effort for production, resulting in a decrease in the production efficiency of the ceramic multilayer circuit substrate. Was there.
(4) 発明の目的 本発明は上記従来技術の欠点に鑑みなされたものであっ
て、導体ボール充填方法によるセラミック多層回路基板
製造方法を応用することにより容易に所望位置に部品接
続用導体突起部を形成することができるセラミック多層
回路基板およびその製造方法の提供を目的とする。(4) Object of the invention The present invention has been made in view of the above-mentioned drawbacks of the prior art, and by applying a method for manufacturing a ceramic multilayer circuit board by a method for filling a conductor ball, a conductor projection for connecting components can be easily located at a desired position. It is an object of the present invention to provide a ceramic multilayer circuit board capable of forming a substrate and a method for manufacturing the same.
(5) 発明の構成 この目的を達成するため、本発明に係るセラミック多層
回路基板は表面に部品接続用半球状導体突起部を有し、
このようなセラミック多層回路基板は、導体ボールを埋
設した複数のセラミックグリーンシートを積層して焼成
し、該導体ボールにより積層焼成されたセラミック基板
の回路同士を接続したセラミック多層回路基板の製造方
法において、表面層を構成するセラミック基板のグリー
ンシートの厚さをこのグリーンシートに埋設する導体ボ
ールの大きさに対して焼成後に導体ボールがセラミック
基板表面に突出するような厚さとして焼成後に表面層の
導体ボールにより部品接続用半球状突起を基板表面上に
形成したものである。(5) Structure of the invention In order to achieve this object, the ceramic multilayer circuit board according to the present invention has a hemispherical conductor projection for connecting components on the surface,
In such a ceramic multilayer circuit board, a method for manufacturing a ceramic multilayer circuit board in which a plurality of ceramic green sheets in which conductor balls are embedded are laminated and fired, and circuits of the ceramic substrates laminated and fired by the conductor balls are connected to each other , The thickness of the green sheet of the ceramic substrate forming the surface layer is set so that the conductor balls project onto the surface of the ceramic substrate after firing with respect to the size of the conductor balls embedded in the green sheet. A hemispherical projection for connecting components is formed on the surface of a substrate by a conductor ball.
(6) 発明の実施例 図面は本発明に係るセラミック多層回路基板の製造工程
図である。セラミック焼成前のグリーンシート１に対
し、例えば金からなる導体ボール３を埋設すべき位置に
配置するための型枠２ｂおよびこの導体ボール３を押圧
するための押圧具２ａからなる１対の導体ボール圧入用
器具を用いて導体ボール３をグリーンシート１の所定位
置に圧入埋設する。このグリーンシートの組成は重量比
で例えばアルミナ粉末５０、ホロシリケイトガラス粉末
５０、ポリビニルブチラール９．０、ジブチルフタレー
ト３．５、界面活性３．０、有機溶剤55.0のものを用い
る。導体ボール３の埋設後に導電ペーストのスクリーン
印刷によりグリーンシート表面に回路パターンを形成す
る。回路パターンは必要に応じてグリーンシート裏面に
も形成される。このようなグリーンシート１の厚さは焼
成後導体ボールの径とほぼ等しくなるように予め設定さ
れ、このグリーンシート１によるセラミック層は基板の
内層を構成する。一方、基板の表面層を構成するセラミ
ック層を形成するために焼成後に導体ボールの径より薄
くなるような厚さのグリーンシート５に前記と同様の押
圧具２ａおよび型枠２ｂからなる圧入用器具を用いて導
体ボール３を圧入埋設する。このような表面層用グリー
ンシート５間に内層用グリーンシート１を積層して挾
み、これを焼成すれば内層のセラミック基板１′は導体
ボール３とほぼ同厚となり表面層のセラミック基板５′
上に導体ボール３が突出するためこの突出導体ボール３
により半球状突起部１１が構成されたセラミック多層回
路基板１０が形成される。このようなセラミック多層回
路基板１０上に半導体素子６が搭載される。半導体素子
６の底面にはハンダボール７が接合され、このハンダボ
ール７がセラミック多層回路基板１０の半球状突起部１
１上に搭載され、加熱溶融されて半導体素子６をセラミ
ック多層回路基板１０上の内部回路パターンと導通した
所定の位置に接合する。下側の半球状突起部１１はこの
セラミック多層回路基板１０を搭載支持する基台９の回
路８上に支持され、導電性接着剤等の適当な方法で接合
される。(6) Embodiments of the Invention The drawings are manufacturing process diagrams of a ceramic multilayer circuit board according to the present invention. A pair of conductor balls including a mold 2b for arranging a conductor ball 3 made of, for example, gold at a position to be embedded in the green sheet 1 before firing the ceramic, and a pressing tool 2a for pressing the conductor ball 3. The conductor ball 3 is press-fitted and embedded in a predetermined position of the green sheet 1 using a press-fitting tool. The composition of this green sheet is, for example, alumina powder 50, holosilicate glass powder 50, polyvinyl butyral 9.0, dibutyl phthalate 3.5, surface activity 3.0 and organic solvent 55.0. After embedding the conductor balls 3, a circuit pattern is formed on the surface of the green sheet by screen printing of a conductive paste. The circuit pattern is also formed on the back surface of the green sheet as needed. The thickness of such a green sheet 1 is set in advance so as to be substantially equal to the diameter of the conductor ball after firing, and the ceramic layer of the green sheet 1 constitutes an inner layer of the substrate. On the other hand, in order to form a ceramic layer constituting the surface layer of the substrate, a press-fitting tool composed of a pressing tool 2a and a mold 2b similar to the above to the green sheet 5 having a thickness smaller than the diameter of the conductor ball after firing. The conductor ball 3 is press-fitted and embedded by using. When the green sheet 1 for the inner layer is laminated between the green sheets 5 for the surface layer and sandwiched and fired, the ceramic substrate 1 ′ for the inner layer has substantially the same thickness as the conductor balls 3 and the ceramic substrate 5 ′ for the surface layer.
Since the conductor ball 3 protrudes upward, this protruding conductor ball 3
Thus, the ceramic multilayer circuit board 10 having the hemispherical protrusions 11 is formed. The semiconductor element 6 is mounted on such a ceramic multilayer circuit board 10. Solder balls 7 are bonded to the bottom surface of the semiconductor element 6, and the solder balls 7 are the hemispherical projections 1 of the ceramic multilayer circuit board 10.
The semiconductor element 6 is mounted on the ceramic multi-layer circuit board 1 and is heated and melted to join the semiconductor element 6 to a predetermined position on the ceramic multilayer circuit board 10 where the semiconductor element 6 is electrically connected to the internal circuit pattern. The lower hemispherical projection 11 is supported on the circuit 8 of the base 9 on which the ceramic multilayer circuit board 10 is mounted and supported, and is joined by a suitable method such as a conductive adhesive.
(7) 発明の効果 以上説明したように、本発明においては、セラミック多
層回路基板のバイアホール穿設工程に代えて導体ボール
をグリーンシートに圧入埋設する導体ボール充填方法に
よるセラミック多層回路基板製造方法を利用して、表面
層のグリーンシートを薄くして焼成後に導体ボールを基
板表面に突出させることにより、この突出した導体ボー
ルを部品接続用の突出ランド又はバンプとして用いるこ
とができる。従って、基板の回路パターン形成と同時に
部品接続用突出部が形成され、メッキ、印刷、スパッタ
等による新たな部品接続用突出部の形成工程が不要とな
りセラミック多層回路基板の製造効率が向上する。(7) Effects of the Invention As described above, in the present invention, a method for manufacturing a ceramic multilayer circuit board by a conductor ball filling method in which conductor balls are press-embedded in the green sheet instead of the via hole drilling step of the ceramic multilayer circuit board By making the green sheet of the surface layer thin and firing the conductor balls to the substrate surface after firing, the projecting conductor balls can be used as protruding lands or bumps for connecting components. Therefore, the projecting portion for connecting the component is formed at the same time when the circuit pattern of the substrate is formed, and the step of forming a new projecting portion for connecting the component by plating, printing, sputtering or the like becomes unnecessary, and the manufacturing efficiency of the ceramic multilayer circuit board is improved.
図面は本発明に係るセラミック多層回路基板の製造工程
図である。 １，５……グリーンシート、３……導体ボール、４……
回路パターン、６……半導体素子、７……ハンダボー
ル、１０……セラミック多層回路基板。The drawings are manufacturing process diagrams of a ceramic multilayer circuit board according to the present invention. 1,5 ...... Green sheet, 3 ...... conductor ball, 4 ......
Circuit pattern, 6 ... Semiconductor element, 7 ... Solder ball, 10 ... Ceramic multilayer circuit board.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 丹羽 紘一 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 昭56−43796（ＪＰ，Ａ) 特開 昭56−43797（ＪＰ，Ａ) 特開 昭56−54094（ＪＰ，Ａ) 特開 昭56−158498（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Koichi Niwa, Koichi Niwa 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited (56) References JP-A-56-43796 (JP, A) JP-A-56-43797 (JP, A) JP 56-54094 (JP, A) JP 56-158498 (JP, A)
Claims (2)
ンシートに埋設された導体ボールが焼成後のセラミック
基板表面に部品接続用として突出されて成ることを特徴
とするセラミック多層回路基板。1. A ceramic multi-layer circuit board, characterized in that conductor balls embedded in a green sheet of a ceramic board constituting a surface layer are projected on the surface of the fired ceramic board for connecting parts.
リーンシートを積層して焼成し、該導体ボールにより、
積層焼成されたセラミック基板の回路同士を接続したセ
ラミック多層回路基板の製造方法において、表面層を構
成するセラミック基板のグリーンシートの厚さをこのグ
リーンシートに埋設する導体ボールの大きさに対して焼
成後に導体ボールがセラミック基板表面に突出するよう
な厚さとして焼成後に表面層の導体ボールにより部品接
続用半球状突起を基板表面上に形成したことを特徴とす
るセラミック多層回路基板の製造方法。2. A plurality of ceramic green sheets having conductor balls embedded therein are laminated and fired, and the conductor balls are used to
In a method of manufacturing a ceramic multilayer circuit board in which circuits of laminated and fired ceramic boards are connected to each other, the thickness of a green sheet of a ceramic board forming a surface layer is fired with respect to the size of a conductor ball embedded in the green sheet. A method for manufacturing a ceramic multilayer circuit board, characterized in that a semi-spherical projection for connecting components is formed on the surface of a substrate by means of a conductor ball of a surface layer after firing so that the conductor ball has a thickness such that it will protrude to the surface of the ceramic substrate later.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56209775A JPH0646675B2 (en) | 1981-12-28 | 1981-12-28 | Ceramic multilayer circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56209775A JPH0646675B2 (en) | 1981-12-28 | 1981-12-28 | Ceramic multilayer circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58114497A JPS58114497A (en) | 1983-07-07 |
| JPH0646675B2 true JPH0646675B2 (en) | 1994-06-15 |
Family
ID=16578399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56209775A Expired - Lifetime JPH0646675B2 (en) | 1981-12-28 | 1981-12-28 | Ceramic multilayer circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0646675B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0146063B1 (en) * | 1995-03-28 | 1998-08-01 | 문정환 | Semiconductor package and the manufacture method |
| JPH09237948A (en) * | 1996-03-01 | 1997-09-09 | Japan Aviation Electron Ind Ltd | Contact part structure of wiring member |
-
1981
- 1981-12-28 JP JP56209775A patent/JPH0646675B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58114497A (en) | 1983-07-07 |
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