JPH0644137U - Chemical supply nozzle with nozzle cleaning mechanism - Google Patents

Abstract

(57) [Summary] [Object] To provide a chemical solution supply nozzle with a nozzle cleaning mechanism capable of uniformly cleaning the tip of a nozzle. [Structure] The cleaning liquid introduction path 30 is eccentrically oriented toward one side with respect to the center of the nozzle 22. In addition, the nozzle block 2
An uneven portion 32 is provided on the inner peripheral surface near the tip of the through hole 24 of FIG. [Effect] The uneven portion 32 keeps the size of the gap 28 uniform with respect to the outer peripheral surface of the nozzle 22. Then, the cleaning liquid that has flowed into the gap 28 via the cleaning liquid introduction path 30 spirally flows on the outer peripheral surface of the nozzle 22. Further, when the cleaning liquid passes through the uneven portion 32 and is guided from the gap 28 to the tip of the nozzle 22, the cleaning liquid is subjected to the rectifying action by the uneven portion 32 provided near the tip of the through hole 24. Therefore, the cleaning liquid is uniformly supplied to the tip of the nozzle 22, and the entire surface can be cleaned satisfactorily and satisfactorily.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 In this invention, the tip of a nozzle that supplies a chemical liquid such as a photoresist liquid to the surface of a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a mask substrate for semiconductor manufacturing (hereinafter simply referred to as “substrate”) is provided. A chemical supply nozzle with a nozzle cleaning mechanism for cleaning.

[0002]

[Prior art]

 As a device for applying a photoresist solution onto a substrate, for example, a spin coating device is known. In this spin coater, the substrate is placed on a horizontal turntable, a certain amount of chemical solution is dropped from the nozzle onto the center of the upper surface of the substrate, and then the turntable is rotated while the substrate is still loaded. As a result, the chemical solution is expanded and dispersed to form a uniform thin film on the upper surface of the substrate.

By the way, when the chemical solution is dropped, the chemical solution may adhere to the tip portion of the nozzle, and if the adhered chemical solution is left as it is, there arises a problem that the yield of products is reduced. After all, when the chemical liquid adhering to the tip of the nozzle dries, a solidified chemical liquid is formed from the lower end face of the nozzle like icicles, and the chemical liquid from the nozzle discharge port (tip) is formed. This is because the discharge amount, that is, the drop amount changes, and a thin film having a thickness different from the desired film thickness is formed on the substrate. In addition, due to the rotational vibration of the rotating table, the fragments of the chemical liquid dried and fixed to the nozzle may be scattered as powdery dust and adhere to the upper surface of the substrate, resulting in defective products.

Therefore, conventionally, a spin coating apparatus of this type is equipped with a mechanism for cleaning the tip of the nozzle, that is, a nozzle cleaning mechanism. In a conventional nozzle cleaning mechanism, a tubular nozzle is inserted through a through hole provided in a nozzle block to form a cleaning liquid introduction path from the side surface of the nozzle block to the center of the nozzle, and the cleaning liquid introduction path is used to guide the nozzle block. The cleaning liquid was guided to the tip of the outer peripheral surface of the nozzle through the gap between the inner peripheral surface of the through hole and the outer peripheral surface of the nozzle for cleaning.

[0005]

[Problems to be solved by the device]

 However, in the conventional nozzle cleaning mechanism, the gap between the inner peripheral surface of the through hole of the nozzle block and the outer peripheral surface of the nozzle is not uniform over the entire circumference of the nozzle due to the way the nozzle is inserted into the nozzle block. Since the cleaning liquid from the introduction path collides with the outer peripheral surface of the nozzle, the cleaning liquid supplied to the nozzle does not spread evenly over the entire outer peripheral surface of the nozzle, and a sufficient cleaning effect cannot be obtained. I haven't been able to decide.

The present invention has been made to solve the above problems, and an object thereof is to provide a chemical liquid supply nozzle with a nozzle cleaning mechanism that can uniformly clean the tip of the nozzle.

[0007]

[Means for Solving the Problems]

 This invention is composed of a tubular nozzle for supplying a chemical solution to a rotatably supported substrate, and a nozzle block provided with a vertically penetrating hole, and the nozzle is arranged so that the nozzle is loosely inserted. By supplying the cleaning liquid to the gap between the outer peripheral surface of the nozzle and the inner peripheral surface of the through hole of the nozzle block through the cleaning liquid introduction path provided in the nozzle block so as to communicate with the through hole, the cleaning liquid is supplied to the outer peripheral surface of the nozzle. A chemical solution supply nozzle with a nozzle cleaning mechanism for a rotary processing device, in which a cleaning solution is caused to flow down along the nozzle to clean the nozzle tip, and in order to achieve the above object, the cleaning solution introduction path is the center of the nozzle. Eccentricity to one side with respect to the nozzle block, and at least one of the inner peripheral surface of the through hole of the nozzle block and the outer peripheral surface of the nozzle has an uneven portion. Provided, with its convex portion is kept uniform the size of the gap, through the recesses of their being to guide the washing liquid from the gap to the tip of the nozzle.

[0008]

In the present invention, since the cleaning liquid introduction path is eccentrically oriented toward the center of the nozzle to one side, the outer peripheral surface of the nozzle and the through hole provided in the nozzle block are provided via the cleaning liquid introduction path. The cleaning liquid flowing into the gap with the inner peripheral surface spirally flows down the outer peripheral surface of the nozzle and is supplied to the tip of the nozzle. In addition, a concavo-convex portion is provided on at least one of the inner peripheral surface of the through hole of the nozzle block and the outer peripheral surface of the nozzle, and the convex portion forms the gap between the outer peripheral surface of the nozzle and the inner peripheral surface of the through hole. The size of the cleaning liquid is kept uniform, and the cleaning liquid from the cleaning liquid introducing path flows through the gap and is further guided to the tip of the nozzle through the recess. Further, since the uneven portion provided on the nozzle block reduces the horizontal area of the gap as compared with the position above the portion where the unevenness is provided, the flow rate of the cleaning liquid is made uniform in the circumferential direction of the gap. Generates a rectifying effect.

[0009]

【Example】

 Next, a preferred embodiment of the chemical liquid supply nozzle with a nozzle cleaning mechanism according to the present invention will be described with reference to the drawings. For convenience of description, first, an outline of a spin coating apparatus to which the chemical liquid supply nozzle with a nozzle cleaning mechanism according to the present embodiment can be applied will be described, and then the present embodiment will be described in detail.

FIG. 1 is a diagram showing an example of a spin coating apparatus to which a chemical liquid supply nozzle with a nozzle cleaning mechanism according to the present invention can be applied. The spin coater 2 is provided with a turntable 4 capable of sucking and holding the substrate W. Further, a motor 6 is connected to the turntable 4 so that the substrate W can be horizontally rotated while supporting it horizontally.

As shown in the figure, a cup 8 for preventing the chemical solution from scattering is provided around the rotary table 4 so as to surround the substrate W. An exhaust pipe 10 for forcibly exhausting the intake air inside the chemical solution splash prevention cup 8 and an excess chemical solution accumulated at the bottom of the chemical solution splash prevention cup 8 are used at the bottom of the chemical solution splash prevention cup 8. A discharge pipe 12 for discharging the chemical liquid is connected.

Further, a nozzle 22 made of a tube having a circular cross section for dripping the chemical liquid is arranged above the rotary table 4. The nozzle 22 is three-dimensionally movable by a drive mechanism (not shown).

Next, an embodiment of the chemical liquid supply nozzle with a nozzle cleaning mechanism according to the present invention will be described with reference to FIGS. 2 to 4. This chemical solution supply nozzle with a nozzle cleaning mechanism includes a nozzle block 26 having a through hole 24 in a substantially central portion.

Near the lower end of the nozzle block 26, as shown in FIG. 4, the inner diameter d of the through hole 24 is finished to be larger than the outer diameter D of the nozzle 22, that is, in the lower end region thereof. The nozzle 22 is loosely inserted into the through hole 24, and a gap 28 is formed between the outer peripheral surface of the nozzle 22 and the inner peripheral surface of the through hole 24. The gap 28 is in communication with a cleaning liquid introduction path 30 provided in the nozzle block 26, and the cleaning liquid is introduced into the gap 28 via the connection joint 31 attached to the side surface of the nozzle block 26 and the cleaning liquid introduction path 30. It is designed to allow inflow. Further, as can be seen from FIG. 4, each cleaning liquid introduction path 30 is eccentrically oriented to one side with respect to the center of the nozzle 22. The operational effect obtained by directing the cleaning liquid introduction path 30 in this manner will be described later.

As shown in FIG. 3, an uneven portion 32 is formed near the lowermost end of the inner peripheral surface of the through hole 24 of the nozzle block 26. The plurality of convex portions 34 forming the concave-convex portion 32 are sized so that the convex tip ends contact the outer peripheral surface of the nozzle 22, and the convex portion 34 positions the nozzle 22 with respect to the through hole 24. Thus, the size of the gap 28 is uniform in the radial direction of the through hole 24 (within the plane of FIG. 3). Further, the cleaning liquid flowing into the gap 28 through the concave portion 36 is configured to be supplied to the tip along the outer peripheral surface of the nozzle 22.

Near the center of the nozzle block 26, the inner diameter d of the through hole 24 is finished so as to substantially match the outer diameter D of the nozzle 22, and the nozzle 22 is fitted into the through hole 24 (FIG. 2). reference).

As shown in FIG. 2, near the upper end of the nozzle block 26, a seal ring 38 is inserted between the nozzle 22 and the nozzle block 26, and is pressed down from above by a seal ring presser 40. . In this way, the cleaning liquid that has flowed into the gap 28 is prevented from leaking upward.

Although not shown in the drawings, the connection joint 31 is connected to the cleaning liquid supply tank via an opening / closing valve, and the cleaning liquid is supplied from the cleaning liquid supply tank or the cleaning liquid is supplied. You can stop.

Next, the operation of the chemical liquid supply nozzle with the nozzle cleaning mechanism configured as described above will be described together with the operation of the rotary coating device 2 (chemical liquid coating cycle) of FIG. When the chemical solution is applied onto the substrate W using the spin coater 2, the substrate W is first set on the turntable 4, and then the nozzle 22 is moved onto the substrate W. Then, the nozzle 22 is lowered to an appropriate height on the substrate W, and a predetermined amount of the chemical liquid is dropped on the central portion of the upper surface of the substrate W 1. At this time, the supply of the cleaning liquid is stopped.

Then, after moving the nozzle 22 to a cleaning position (not shown), the motor 6 is driven to rotate the rotating table 4 at a high speed while the substrate W is horizontally supported to rotate the substrate W. The upper chemical solution is diffused outward and applied thinly on the upper surface of the substrate W.

On the other hand, in parallel with the spin coating process, the cleaning process of the nozzle 22 is performed at the cleaning position. That is, the cleaning liquid is supplied from the cleaning liquid supply tank. The cleaning liquid from the tank flows into the gap 28 via the connection joint 31 and the cleaning liquid introduction path 30. At this time, since the cleaning liquid introduction path 30 is eccentrically oriented to the one side with respect to the center of the nozzle 22 as described above, the inflowing cleaning liquid flows spirally along the outer peripheral surface of the nozzle 22. Moreover, since the concavo-convex portion 32 is provided in the vicinity of the lowermost end of the nozzle block 26, the plurality of convex portions 34 forming the concavo-convex portion 32 are brought into contact with the outer peripheral surface of the nozzle 22 to form the gap 28. Becomes uniform over the radial direction of the through hole 24, and the flow of the cleaning liquid from the concave portion 36 is rectified by the rectifying action of the uneven portion 32. Therefore, the cleaning liquid flows evenly to the tip of the nozzle 22, and the chemical liquid adhering to the nozzle 22 is washed out evenly. When the cleaning process of the nozzle 22 is completed, the nozzle 22 is moved to a nozzle standby position (not shown) to wait for the next chemical solution coating cycle.

When the spin coating process is completed as described above, the substrate W is taken out and the one cycle operation is completed. If the treatment is to be continued, the above operation (chemical solution application cycle) is repeated.

In the above embodiment, the case where two cleaning liquid introduction paths 30 are provided has been described, but the same effect can be obtained when one or three or more cleaning solution introduction paths 30 are provided. Further, in the above embodiment, the uneven portion 32 is formed on the inner peripheral surface of the through hole 24 of the nozzle block 26, but instead, the uneven portion may be formed on the outer peripheral surface of the nozzle 22. In this case, the uneven portion may be formed at least on the outer peripheral surface of the nozzle 22 at a position corresponding to the vicinity of the tip of the through hole 24.

In the above description, the case where the chemical solution supply nozzle with the nozzle cleaning mechanism according to the present invention is applied to the spin coater has been described, but the application target is not limited to this, and is supported rotatably. The present invention can be applied to various rotary substrate processing apparatuses such as a rotary developing apparatus that supplies a developing solution to a substrate and a rotary etching apparatus that supplies an etching solution.

[0025]

[Effect of device]

 According to this invention, the cleaning liquid introduction path is eccentrically oriented to one side with respect to the center of the nozzle, and the projections and depressions are provided on the nozzle block, and the projections come into contact with the outer peripheral surface of the nozzle to form a gap. Since the size of the nozzle is kept uniform and the cleaning liquid from the gap is guided to the tip of the nozzle through the concave portion, the tip of the nozzle can be cleaned well and uniformly over the entire circumference.

[Brief description of drawings]

FIG. 1 is a diagram showing an example of a spin coating device to which a chemical liquid supply nozzle with a nozzle cleaning mechanism according to the present invention can be applied.

FIG. 2 is a diagram showing an embodiment of a chemical liquid supply nozzle with a nozzle cleaning mechanism according to the present invention.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is a sectional view taken along line BB in FIG.

[Explanation of symbols]

 22 Nozzle 24 Through Hole 26 Nozzle Block 28 Gap 30 Cleaning Liquid Introduction Route 32 Concavo-convex Part 34 Convex Part 36 Recessed W Substrate

Continuation of front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location H01L 21/304 341 N 8831-4M

Claims (1)

[Scope of utility model registration request] 1. A tubular nozzle for supplying a chemical solution to a rotatably supported substrate, and a hole penetrating vertically are provided.
The nozzle block is arranged so that the nozzle loosely inserts the through hole, and the outer peripheral surface of the nozzle and the nozzle block penetrate through the cleaning liquid introduction path provided in the nozzle block so as to communicate with the through hole. In a chemical solution supply nozzle with a nozzle cleaning mechanism for a rotary processing device, in which the cleaning solution is caused to flow down along the outer peripheral surface of the nozzle by supplying the cleaning solution to the gap between the inner peripheral surface of the hole and the nozzle tip is cleaned with the cleaning solution. The cleaning liquid introduction path is eccentrically oriented toward one side with respect to the center of the nozzle, and at least one of the inner peripheral surface of the through hole of the nozzle block and the outer peripheral surface of the nozzle is provided with an uneven portion. The convex portion keeps the size of the gap uniform, and the cleaning liquid from the gap is guided to the tip of the nozzle through the concave portion. A chemical solution supply nozzle with a nozzle cleaning mechanism.