JPH0644050Y2 - IC socket - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to an IC socket, in particular, a so-called PGA (Pin Grid) in which a large number of connection pins are arranged in parallel vertically to a plane.
The present invention relates to an IC socket suitable for an Alley type IC package.

[Conventional technology]

Generally, in order to insert and pull out a large number of connection pins of a PGA type IC package to and from the contact pins on the socket all at once, an extremely large force is required, which is not practical.
For this reason, conventionally, an IC socket of this type has been devised in which the connection pin and the contact pin are electrically connected in a so-called non-insertion / removal type.

15 to 18 show an example of this type of IC socket, in which 21 is a socket body and 22 is the socket body 21.
The cover is slidably attached (arrow A), and 23 is the IC
It is a through hole formed in the cover 22 corresponding to the connection pin p of the package P. Further, referring to FIG. 17, in the socket body 21, the contact pieces 25 are arranged in a large number of accommodating holes 24 (one of which is shown in FIG. 17) formed corresponding to the through holes 23. Has been done. As shown in FIG. 18, 26 is a shaft portion 26
The lever a is supported on the socket body 21 side, and the protrusion 26a ₁ is formed at the center of the shaft 26a.

When mounting the IC package P in such an IC socket, first, the lever 26 is set upright from the socket body 21 as shown in FIG. 15, and at this time, the through hole 23 and the contact piece are contacted.
The relationship with 25 is that the through hole 23 is the contact piece 25 as shown in FIG.
The IC package P is placed on the cover 22 by inserting the connecting pins p into the through holes 23. From this, when the lever 26 is rotated and tilted so as to be horizontal (see arrow B in FIG. 16), the projecting portion 26a ₁ pushes one end portion of the cover 22 and slides it. Through hole 23 of cover 22 as shown in
The connecting pin p inserted into the holding portion 25b moves in the direction of arrow C and enters the holding portion 25b. The connection pin p and the contact piece 25 are electrically connected by elastically sandwiching the connection pin p by the sandwiching portion 25b. However, when the IC package P is removed from the socket, the reverse of the above. The following operations are performed.

[Problems to be solved by the device]

According to such a conventional IC socket, the connection pin p of the IC package P can be connected by a force-free insertion / removal method. However, since all the operations are performed manually, this is not only extremely troublesome but also complicated. It was a problem because it became. That is, a large number of small connection pins p must be properly inserted into the corresponding through holes 23 and set on the cover 22, and after the setting, the lever 26 is manually rotated to set the IC package P in this way. Careful attention must be paid to manual operations including mounting and removal.

In view of the above situation, the present invention has an object to provide an IC socket that can be operated very easily because the IC package is operated by a force-free insertion / removal method and can be easily applied to an automatic assembly machine.

[Means and Actions for Solving the Problems]

The IC socket according to the present invention has a structure in which a large number of contact pins having clamping pieces for elastically clamping and connecting the connection pins of the IC package are arranged on the socket body. Is integrally provided with a pressing piece for opening the holding piece against the elastic force, and the socket body is provided with a locking portion and engages with the locking portion of the socket body. A cover having a mating portion and a through hole for inserting the connection pin;
A position of the cover is regulated in the upward direction, and a spring attached to the socket body is mounted so as to be vertically movable in a state of being elastically pressed upward, and further, a cam hole formed corresponding to the contact pin, And a slide plate having a cam portion projectingly formed in the cam hole and capable of engaging with the pressing piece, the cam portion pressing the pressing piece when the slide plate moves downward. And the connecting pin can be inserted into a position where the elastic pinching and connection of the holding piece is possible.

In addition, a guide portion for guiding loading of the IC package is integrally formed at each corner of the slide plate.

When the IC package is set on the cover, the IC package is guided by the guide part of the slide plate to complete the setting easily, but each connecting pin penetrates the cam hole of the slide plate and the top part of the contact pin. It is in contact with the connecting part. When the slide plate is pushed down in such a state, the cam acts on the contact pin so that the contact pin is inserted into the connection portion with no insertion force, and when the slide plate is raised again, the cam acts as the contact pin. The connection pin becomes connected. Therefore, the operations from setting the IC package to connecting the connecting pins are performed simply by moving the slide plate up and down.

〔Example〕

Hereinafter, a first embodiment of an IC socket according to the present invention will be described with reference to FIGS. In the figure, reference numeral 1 designates a large number of contact pins 2 to be connected to the connection pins p (see FIG. 15) of the IC package P, and an outer periphery of a locking portion 1a for restricting the operation of a slide plate described later Socket bodies 3 which are arranged on the side and cylindrical projections 1b for receiving coil springs, which will be described later, are integrally formed at the four corners are provided on the socket body 1 so as to engage with the engaging portions 1a. The IC package P is engaged with the socket body 1 by the engaged portion 3a and corresponds to the contact pin 2.
The cover 4 having a through hole 3b for inserting the connection pin p is accommodated inside the socket body 1 between the cover 3 and the cover 3 so as to be vertically movable by a certain stroke, and the contact pieces are paired with each other. A cam hole 4a is formed so as to be aligned with the contact pin 2 and the through hole 3b of the cover 3, and a guide portion 4b is raised at each corner so that the cover 3 can be arranged inside thereof. In addition, the slide plate 5 in which the cylindrical protrusion 1b of the socket body 1 and the fitting hole 4c into which the coil spring 5 described later can be loosely fitted are formed are the hole of the cylindrical protrusion 1b of the socket body 1 and the slide plate 4. The coil spring is mounted between the fitting holes 4c. Although the slide plate 4 is normally pushed up by the elasticity of the coil spring 5 so as to come into contact with the cover 3 (see FIG. 5), the claw 3a ₁ of the engaging portion 3a of the cover 3 is locked by the engaging portion 1a. The slide plate 4 is pushed up and held as described above by engaging with.

Here, as shown in FIG. 2, the contact pin 2 has a pair of holding pieces 2a, 2a 'which should be connected by holding the connection pin p and the holding piece 2a, 2 which should be further contacted with the holding pin p.
The contact piece 2b in the direction perpendicular to a'and the cam portion 4d formed so as to project inwardly of the cam hole 4a of the slide plate 4 pushes the contact piece 2a, 2a 'to the connecting pin p. A pair of pressing pieces 2c, 2
It has a c ', and the holding pieces 2a and 2a' are moved toward or away from each other by the vertical movement of the slide plate 4 described above. Further, inside the holding portions 2a ₁ and 2a ₁ ′, there are provided contact pieces 2a and 2a ′ which are formed to project so as to gradually spread toward the contact piece 2b, and these contact portions 2a ₁ and 2a ₁
Connection with the connection pin p is made via 2a ₁ ′. The cross-sectional shape of the cam portion 4d formed in the cam hole 4a of the slide plate 4 is tapered toward the holding pieces 2a, 2a '.

Further, the upper end portion inside the guide portion 4b of the slide plate 4 is guided surface 4b ₁ which is inclined inwardly as shown is formed in the first FIG.

Since the IC socket according to the present invention is constructed as described above, first, the slide plate 4 is normally pushed up by the coil spring 5 as described above. Although such a state is shown in FIG. 6, the IC package P is set in such a state. That is, the connection pins p of the IC package P are inserted into the corresponding through holes 3b and the IC package P is placed on the cover 3. At this time, the guides of the guide portions 4b rising from the respective corners of the cover 3 are placed. The surface 4b ₁ guides the insertion of the IC package P, and the connection pin p is reliably inserted into the through hole 3b even if there is a deviation of ± 2 mm from the normal position, for example.
In this case, since the sandwiching pieces 2a, 2a 'are closed, the through holes 3b are inserted and the tips of the connecting pins p come into contact with the upper ends of the sandwiching pieces 2a, 2a'. Is set to.

Next, when the slide plate 4 is pushed down, as shown in FIG. 7 (see also FIG. 5), the cam portion 4d moves the pressing piece 2c and the pressing piece 2c.
Enter between 2c 'and push them apart, and
As a result of opening 2a and 2a ', the connecting pin p falls between the sandwiching pieces 2a and 2a' due to the weight of the IC package P itself.

When the slide plate 4 is raised again, this is performed by the elasticity of the coil spring 5, but the cam portion
As 4d separates from between the pressing pieces 2c, 2c ', the clamping pieces 2a,
2a 'are close to each other, thereby該挟supporting pieces 2a as shown in FIG. 8, 2a' contact portion 2a _1, 2a ₁ of the 'begins to contact the engagement connection pins p are dropped. The slide plate 4 rises to the position shown in FIG. 9 where it abuts the lower surface of the cover 3 by the elastic force of the coil spring 5 and returns to the normal state, while the connecting pin p is in contact with the contact portions of the holding pieces 2a, 2a '. 2
Since a ₁ and 2a ₁ ′ are formed so as to project in an inclined state,
By the approaching motion, the contact parts 2a ₁ and 2a ₁ ′ are pushed and pushed until they come into contact with the contact piece 2b. In this case, the through hole 3b of the cover 3 allows the connecting pin p to be inserted with an appropriate gap so as not to hinder the pushing of the connecting pin p. By the way, the contact portions 2a ₁ and 2a ₁ ′ are inclined with respect to the contact piece 2b as described above, and push the connection pin p in the horizontal direction in line contact with the connection pin p. For this reason, the contact portions 2a ₁ and 2a ₁ ′ exert a wiping effect on the outer surface of the connection pin p with such pushing, which ensures a reliable electrical connection. Thus, slide plate 4
The connection pin p is connected to the contact pin 2 by returning to the normal position, but the cover 3 has the engagement portion 3a engaged with the engagement portion 1a of the socket body 1 as described above. The slide plate 4 is regulated, so that the connection state between the connection pin p and the contact pin 2 is maintained.

On the other hand, the IC package P mounted in the socket body 1
When removing the slide plate 4, push down the slide plate 4,
The connection pin p and the contact pin 2 are disconnected from each other in the opposite manner, and the IC package P can be easily removed from the socket by simply lifting the IC package P in such a state. Slide plate 4
By simply moving up and down, the connection and disconnection of the contact pin 2 and the connection pin p can be easily and reliably performed.
A series of operations including loading, mounting, and removal of the IC package P can be performed easily and efficiently. In addition, such a simple operation can be expected to improve work efficiency by automating the application of an automatic machine. Even when it is automated, the guide portion 4b of the slide plate 4 guides the IC package P so that the connection pin p is inserted into the through hole 3b even if the insertion position of the IC package P is slightly deviated. It is particularly convenient for automation because it is automatically set only by dropping.

Next, a second embodiment of the proposed IC socket will be described. In this example, as the contact pin 2 shown in FIG. 10, the contact portion 12a ₁ provided at the upper portion in the normal state, 12a ₁ 'is a pair of holding pieces 12a of Closed to approach, 12a' and One clamp piece 1
2a has a pair of pressing pieces 12b, 12b 'which project from both sides and whose upper and lower end portions are bent back by appropriate R or formed as comparatively gentle inclined surfaces. On the other hand, referring to FIG. 11, in the through hole 4b of the slide plate 4, when the slide plate 4 is raised, the cam portions arranged so as to be located above the pressing pieces 12b, 12b ', respectively. 14d and 14d 'are formed, and the cam portion 1
The outer surface of 4d has a cam surface 14 whose lower end has an R-shaped cross section.
It is formed as d ₁ , 14d ₁ ′. Since the other configurations are basically the same as those in the first embodiment, the description thereof will be omitted.

In the case of the second embodiment, as in the case of the first embodiment, the IC package P is inserted through the guide portion 4b when the slide plate 4 is raised, but the connection pin p is as shown in FIG. The through hole (3b) is inserted into the upper end of the contact pin (12) to abut the upper end of the contact pin (12). When the slide plate 4 descends from this, the lower ends of the cam portions 14d, 14d 'begin to gradually come into pressure contact with the upper end portions of the pressing pieces 12b, 12b' to separate the holding portion 12a from the holding portion 12a '. When the slide plate 4 reaches the descending end, as shown in FIG. 13, the holding piece 12a is expanded so that the connecting pin p freely falls between the contact portion 12a ₁ and the contact portion 12a ₁ ′. When the slide plate 4 is lifted from such a state, the connecting pin p is clamped by the clamping pieces 12a, 12 as shown in FIG.
It is pinched from both sides by a '.

As described above, also in the second embodiment, by vertically moving the slide plate 4, it is possible to easily mount and remove the IC package P. However, the pressing pieces 12b, 12b 'described above are used.
May be provided on opposite sides of the sandwiching pieces 12a, 12a 'so that both sandwiching pieces 12a, 12a' can be simultaneously pushed in opposite directions.

Incidentally, it goes without saying that the engaging portion 1a of the socket body 1 and the engaging portion 3a of the cover 3 in each of the above-described embodiments can be arranged in the opposite relationship.

[Effect of device]

As described above, according to the IC socket of the present invention, by simply moving the slide plate up and down after inserting the IC package,
Since the IC package can be attached and detached without inserting and removing force, work efficiency can be significantly improved. Further, it has many advantages such as easy automation.

[Brief description of drawings]

1 is an exploded perspective view of a first embodiment of an IC socket according to the present invention, FIG. 2 is a perspective view of a contact pin according to a first embodiment of the present invention, FIG. 3 is a plan view of the same IC socket, and FIG. Is the same
FIG. 5 is a side view of the IC socket, FIG. 5 is a vertical sectional view showing the IC socket in a pushed-up state and a pushed-down state, and FIGS.
6 (A) and 6 (B) are partial plan views and partially broken vertical sectional views showing the relationship between the cam portion and the contact pin when the IC package is inserted, and FIG. 7 (A). ) And (B) are a partial plan view and a partially broken vertical sectional view showing the relationship between the cam portion and the contact pin in the depressed state of the slide plate, and FIGS. 8 (A) and (B).
Is a partial plan view and a partially broken vertical sectional view showing the relationship between the cam portion and the contact pin in the process of shifting the slide plate to the pushing state, and FIGS. 9 (A) and 9 (B) show the cam portion in the pushing state of the slide plate. FIG. 10 is a perspective view of a contact pin according to a second embodiment of the present invention, and FIG. 11 is a perspective view of the contact pin and the slide plate arranged in the socket body. 12 is a partially broken perspective view showing the positional relationship with the cam portion, FIGS. 12 to 14 are explanatory views of the operation of the IC socket in the second embodiment, and FIG. 12 is a cam portion at the time of inserting the IC package in the second embodiment. FIG. 13 is a partial vertical cross-sectional view showing the relationship with the contact pins, and FIG. 13 is a partial vertical cross-sectional view showing the relationship between the cam portion of the slide plate in the depressed state and the contact pins.
FIG. 14 is a partial vertical cross-sectional view showing the relationship between the cam portion and the contact pin when the contact pin and the connection pin are connected, and FIGS. 15 and 16 are perspective views showing the basic operation of the conventional IC socket, and FIG. Is a partial perspective view showing a positional relationship between a through-hole for a connection pin of a cover and a contact piece in a conventional IC socket,
FIG. 18 is a perspective view of an operating lever of a conventional IC socket. 1 ... Socket body, 2 ... Contact pin, 3 ... Cover, 4 ... Slide plate, 5 ... Coil spring, P ... IC package, p ... Connection pin.

Claims (2)

[Scope of utility model registration request] 1. A structure of an IC socket in which a large number of contact pins having clamping pieces for elastically clamping and connecting the connection pins of an IC package are arranged on a socket body. An integrally provided pressing piece for opening the holding piece against the elastic force, an engaging portion provided on the socket body, and an engaging portion engaging with the engaging portion of the socket body. A cover having a through hole for inserting the connection pin, and an upward position regulation by the cover, and a spring attached to the socket body so as to be movable upward and downward while being elastically pressed upward. And a slide plate having a cam hole formed corresponding to the contact pin, and a cam portion protrudingly formed in the cam hole and capable of engaging with the pressing piece. When the slide plate moves downward, the cam portion acts on the pressing piece to open the holding piece, and the connecting pin is inserted into a position capable of elastically holding and connecting the holding piece. An IC socket characterized in that 2. The slide plate is provided with
The IC socket according to claim (1), characterized in that a guide part capable of guiding insertion of the IC package is integrally formed.