JPH06426Y2 - Base material for adhesive tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a base material for an adhesive tape using a thermoplastic synthetic fiber filament yarn.

[Conventional technology]

Conventionally, as a base material for an adhesive tape, a woven fabric using rayon yarn, vinylon yarn, acetate yarn and the like and laminated with a polyethylene film has been widely used.

[Problems that Invention devises to solve]

At the same time, since the base material using such a yarn has a great dependence of physical properties (strength, elongation, tearing, etc.) on temperature and humidity, there is a problem of physical property deterioration due to long-term exposure to high temperature and high humidity during package transportation. Yes,
Further, in recent years, along with the increase in demand for packaging and transportation, there is an increasing demand for thinner and thinner adhesive tapes.

In order to solve such a problem, for example, a base material using a thermoplastic synthetic fiber having a low hygroscopic property and capable of being thinned and thinned has been developed.
71570, 57-87079, 577-1
Proposals have been made in 58784, Shokai Sho 60-71735, and the like. However, none have been technically completed and have reached production.

[Means for Solving Problems] As a result of intensive research to solve the above problems, the present invention arranges a filament yarn obtained by composite spinning of a low melting point polymer and a high melting point polymer on a warp, A woven fabric in which a filament yarn made of a single polymer having a melting point higher than that of the high melting point side polymer of the warp is arranged on a woven fabric and having a melting point higher than that of the low melting point side polymer of the warp and a high melting point side polymer of the warp. The present invention has been made, which has a gist of a base material for an adhesive tape, to which a film having a melting point lower than the melting point is fused.

The present invention will be described in detail below with reference to the drawings.

FIG. 1 is an enlarged plan view of a fabric used as a base material for an adhesive tape according to an embodiment of the present invention 1-1, 1-2, 1-
3, 1-4, ... are thermoplastic synthetic fiber filament yarns (50 denier / 15 filaments) obtained by composite spinning of low melting point polymer (polyethylene melting point 125 ° C) and high melting point polymer (polypropylene melting point 170 ° C) ), 2-1, 2-2, 2-3, 2-4, ... are wefts and the high melting point side polymer of the warp (polypropylene melting point 17
0 ° C) thermoplastic synthetic filament yarn (75
Denier / 15 filaments) group. There are no particular restrictions on the combination of polymers other than the present embodiment for the warp, and the use of filament yarn made of the high melting point polymer of the present embodiment or higher for the weft.

FIG. 2 shows a cross section of one single filament of the warp filament yarn. In the present embodiment, the core-sheath type (a) is adopted, and the core 3 is provided with a high melting point polymer (polypropylene). The sheath 4 is provided with a low melting point polymer (polyethylene). The method of arranging both components in the composite spinning is not particularly limited to the above, and for example, the side-by-side type, (c) modified core-sheath type, (d) multileaf coordination type, etc. of FIG.
Are high melting point polymers, and 4 is a low melting point polymer). However, if the low melting point polymer is in a cross section which is not completely surrounded by the high melting point polymer, film welding in a later step is easy.

FIG. 3 shows a longitudinal cross-sectional view of a film welded to the woven fabric, where 1 is a warp yarn, 2 is a weft yarn, and 5 is a film layer. In this embodiment, a polyethylene film (melting point 130
C.), the low melting point polymer side of the warp 1 is melted during film welding, and the film layer 5 is completely integrated.

FIG. 4 is an enlarged view of the welded portion of the warp 1 with the film layer. The low melting point polymer sheath component 4 of the warp 1 is completely integrated with the film layer 5 by welding, and the high melting point polymer core component 3 is the film. It can be seen that the layer 5 and the sheath component 4 are completely buried in the layer.

Of the low-melting point portion and the high-melting point portion that form the warp, the low-melting point portion acts to integrate with the film by welding when laminating the film, and only the high-melting point portion has physical properties as a base material, especially in terms of strength. As a result, the tearability and hand tearability of the base material in the lateral direction become easy.

As shown in FIG. 5, the weft yarn, that is, the high melting point filament yarn, is one in which each of the single fibers constituting the weft 2 is in contact with the film layer 5 and a part of the single fiber is embedded in the film. Since the weft has a high melting point, both have not been fusion-bonded. Therefore, since the physical properties are not deteriorated, the main function of the pressure-sensitive adhesive tape is to cut easily and neatly along the weft when hand-cutting, and problems such as diagonal cutting can be completely prevented.

Further, one of the major features of the present invention lies in the welding of the woven fabric and the film. For this reason, the woven fabric is united with the woven fabric immediately after the film is melted and discharged and when the film itself is at a temperature near the melting point. For this reason, in the production of conventional adhesive tape base materials, it is an essential requirement to apply an adhesive layer to the fabric surface and then bond the film to the coated surface in order to firmly bond the fabric to the film. there were.

In the present invention, since the hot-melt adhesion method is used, there is no need to apply an adhesive layer, which is a great cost advantage in manufacturing an adhesive tape substrate. In addition, it can contribute to thinning, which has been recently required.

[Effect of device]

The base material for adhesive tape of the present invention is low in manufacturing cost, lightweight,
Since it is possible to be thin and the thermoplastic fibers and films are welded, the quality does not deteriorate even under high temperature and high humidity environment during transportation, and the hand tearability when using tape in packaging work is extremely excellent. There is.

[Brief description of drawings]

FIG. 1 is an enlarged plan view of a base material for an adhesive tape of the present invention, FIG. 2 is an exemplary cross-sectional view of a single filament of a warp, and FIG. 3 is a vertical sectional view of a base material for an adhesive tape of the present invention. The figure is an enlarged view of the welded portion of the warp with the film layer, and FIG. 5 is an enlarged view of the joined portion of the weft with the film layer. DESCRIPTION OF SYMBOLS 1 ... Warp 2 ... Weft 3, 4 ... Each polymer component of warp-constituting single fiber 5 ... Film layer

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Hiromi Masaki 2-3-18 Nakanoshima, Kita-ku, Osaka City, Osaka Prefecture Yoshiyuki Kawakami, Examiner, Mitsubishi Rayon Co., Ltd. (56) Reference JP-A-59-126486 (JP, A) ) JP-A-61-146839 (JP, A)

Claims (1)

[Scope of utility model registration request] 1. A filament yarn obtained by composite spinning of a low melting point polymer and a high melting point polymer is arranged on a warp, and a filament yarn made of a single polymer having a melting point higher than the high melting point polymer of the warp is arranged on a weft. A substrate for an adhesive tape, comprising: a woven fabric having a melting point equal to or higher than that of the low melting point side polymer of the warp and lower than the melting point of the high melting point side polymer of the warp.