JPH0639703A - Correcting carrier plate for polishing machine - Google Patents

Abstract

PURPOSE:To improve polishing speed, by providing a recessed part for storing a polishing liquid, on both the main plate surfaces of a hard plate. CONSTITUTION:A correcting carrier plate 15 is formed of a cast-iron plate, a recessed part 16 is provided on the middle parts of both the main surfaces of the plate 15, and furthermore narrow grooves 17 are provided crosswisely. The diameter and thickness of the recessed part 16 is made about half of the same of the plate 15 respectively, and the narrow grooves 17 are set to width and depth according to the abrasive grain of a polishing liquid. The polishing liquid 8, flowed from the injection hole 11 of the upper surface plate 1, is flowed into the lower surface plate 2 from a gap with a correction carrier plate 15 to be reserved in the middle recessed part 16. The rotational and revolutional motion of the correction carrier 15 at the time of operation causes the polishing liquid 8, stored in the recessed part 16, to be flowed, and to be moved via the narrow grooves 17. Consequently, the polishing liquid 8 between the upper surface plate 1 and the correction carrier 15 is increased to improve polishing speed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a correction carrier plate for a polishing machine having upper and lower surface plates, and more particularly to a correction carrier plate for maintaining the flatness of the upper and lower surface plates.

[0002]

BACKGROUND OF THE INVENTION A polishing machine having upper and lower stools is widely used in the field of crystal oscillators, for example, a work piece is a crystal piece and both main surfaces thereof are polished flatly. And since the flatness of the crystal piece depends on the upper and lower surface plates,
There is a correction carrier that maintains the flatness of the upper and lower surface plates. In recent years, there has been a demand for a correction carrier that enables quick correction from the operating efficiency of a polishing machine.

[0003]

2. Description of the Related Art FIGS. 3 and 5 are views for explaining a conventional example. FIG. 3 is a sectional view of a polishing machine, FIG. 4 is a plan view, and FIG. 5 is a sectional view of a polishing machine using a correction carrier. It is a figure. The polishing machine comprises upper and lower surface plates 1 and 2, a central sun gear 3, and an outer peripheral internal gear 4. The upper and lower surface plates 1 and 2 are fitted on a main shaft 5 which penetrates the centers of these. In such a structure, a carrier plate 7 for holding a workpiece (for example, a crystal piece 6) is interposed between the upper and lower surface plates 1 and 2, and the outer peripheral portion of the carrier plate 7 is meshed with the sun gear 3 and the internal gear 4. Let Then, while the polishing liquid 8 is being injected between the upper and lower surface plates 1 and 2, the carrier plate 7 is caused to make a planetary motion, so that both main surfaces of the crystal blank 6 are parallel to each other and polished flat. Polishing liquid 8
The abrasive grains 9 are mixed in the liquid 10 and are introduced from a plurality of injection holes 11 provided in the upper surface plate 1. Reference numeral 12 is a holding hole for the crystal piece 6 provided on the carrier plate 7 (FIGS. 3 and 4). From this, the crystal piece 6
Is polished to a predetermined thickness, but the upper and lower surface plates 1 and 2 also abrade the plate surfaces thereof, and their flatness is impaired. Therefore,
A correction carrier plate 13 is required to correct the flatness. The modified carrier plate 13 generally has a thickness larger than that of the carrier plate 7 and has a through hole 14 in the center thereof to maintain mechanical strength and prevent deformation such as warpage (FIG. 5). Then, it is made of a flat metal plate together with the carrier plate 7, and the material thereof is usually cast iron. The carrier plate 7 depends on the thickness of the crystal piece 6, but is approximately 1 m.
m or less, and the correction carrier plate 13 is 6 mm or more.

[0004]

However, in such a modified carrier plate 13, the polishing rates of the upper and lower surface plates 1 and 2 are different, and the polishing rate of the upper surface plate 1 is slower than that of the lower surface plate 2.
There was a problem that it took time to correct upper surface plate 1. That is, the polishing liquid 8 that flows in from the injection hole 11 of the upper surface plate 1 flows out to the lower surface plate 2 from between the through hole 14 of the correction carrier 13 or each correction carrier plate 13. Since the correction carrier plate 13 has a particularly large thickness, the upper and lower surface plates 1,
The polishing liquid 8 interposed between the correction carrier 13 and the upper surface plate 1
It is difficult to capture between and (Fig. 6). Therefore, there is a problem that the polishing liquid 8 (especially the abrasive grains 9) interposed between the two is small, the polishing rate of the upper surface plate 1 is delayed, and it takes time to correct the polishing.

[0005]

OBJECTS OF THE INVENTION It is an object of the present invention to provide a modified carrier which increases the polishing rate of the upper platen.

[0006]

The present invention is to solve the problem by providing recesses for storing a polishing liquid on both main surfaces of a correction carrier plate. An embodiment of the present invention will be described below.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a view of a modified carrier plate for explaining one embodiment of the present invention. FIG. 1 (a) is a sectional view and FIG. 1 (b) is a plan view. It should be noted that the alternate long and short dash line in the figure is the tooth portion.
The correction carrier plate 15 is made of a cast iron metal flat plate as described above. Further, in this embodiment, the concave portion 16 is provided in the central portion of both main surfaces, and the fine grooves 17 are provided in the vertical and horizontal directions. The recess 16 has a diameter and a thickness that are about half the plate surface diameter and a plate thickness, respectively, and the narrow groove 17 has a width and a depth corresponding to the abrasive grains of the polishing liquid, for example. Modified carrier 15 having such a configuration
If so, the polishing liquid 8 that has flowed in through the injection hole 11 described above.
Flows out from between the correction carrier plates 15 to the lower surface plate 2, but is stored in the recess 16 provided in the central portion. Then, due to the revolving motion of the correction carrier plate 15 during the operation, the stored polishing liquid 8 flows and stays and moves in the fine groove 17 on the surface together with the polishing liquid 8 flowing from the injection hole 11. Therefore, the polishing liquid 8 taken between the upper surface plate 1 and the correction carrier 15 increases, so that the polishing rate of the upper surface plate 1 can be increased. The lower platen 2 is polished as described above.

[0008]

[Other Matters] In the above embodiments, the vertical and horizontal fine grooves 17 are provided on the surface of the correction carrier plate 15. However, basically, if the concave portions 16 are provided, the polishing liquid is stored, so that the fine grooves 17 may be omitted. The effect can be expected. However, the presence of the fine groove 17 is realistic because the polishing liquid 8 from the recess 16 can be easily taken in between the upper surface plate 1 and the surface of the correction carrier 15. Also,
Although the concave portion 16 is provided at one place in the central portion, the effect can be expected even if the concave portion 16 is not necessarily provided in the central portion but a plurality of places. And the correction carrier plate 15 is a flat metal plate,
For example, a hard flat plate such as ceramic may be used, and the present invention can be appropriately modified within the scope of the invention.

[0009]

According to the present invention, since the recesses for storing the polishing liquid are provided on both main surfaces of the correction carrier plate, it is possible to provide the correction carrier for increasing the polishing rate of the upper surface plate.

[Brief description of drawings]

FIG. 1 (a) is a sectional view of a modified carrier for explaining an embodiment of the present invention, and FIG. 1 (b) is a plan view thereof.

FIG. 2 is a sectional view of a polishing machine for explaining the function and effect of the correction carrier of the present invention.

FIG. 3 is a sectional view of a polishing machine for explaining a conventional example.

FIG. 4 is a plan view of a polishing machine for explaining a conventional example.

FIG. 5 is a cross-sectional view for explaining the action of the correction carrier of the conventional example.

FIG. 6 is a schematic partial cross-sectional view for explaining the action of the correction carrier of the conventional example.

[Explanation of symbols]

1 upper surface plate, 2 lower surface plate, 3 sun gear, 4 internal gear, 5 spindle, 6 quartz piece, 7 carrier, 8 polishing liquid, 9 abrasive grains, 10 liquid, 11 injection hole, 12 holding hole, 13, 15 correction carrier , 16 recesses, 17 narrow grooves.

Claims (1)

[Claims] 1. A repair carrier plate for a polishing machine, which comprises a hard flat plate that polishes and corrects opposing main plate surfaces of upper and lower surface plates of a polishing machine for polishing both main surfaces of a work, A correction carrier plate, characterized in that recesses for storing a polishing liquid are provided on both main plate surfaces of the hard flat plate.