JPH0638351Y2 - 温度ヒュ−ズ - Google Patents
温度ヒュ−ズInfo
- Publication number
- JPH0638351Y2 JPH0638351Y2 JP1985189909U JP18990985U JPH0638351Y2 JP H0638351 Y2 JPH0638351 Y2 JP H0638351Y2 JP 1985189909 U JP1985189909 U JP 1985189909U JP 18990985 U JP18990985 U JP 18990985U JP H0638351 Y2 JPH0638351 Y2 JP H0638351Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit element
- thermal fuse
- electrode
- electrodes
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 23
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985189909U JPH0638351Y2 (ja) | 1985-12-09 | 1985-12-09 | 温度ヒュ−ズ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985189909U JPH0638351Y2 (ja) | 1985-12-09 | 1985-12-09 | 温度ヒュ−ズ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6298134U JPS6298134U (enrdf_load_stackoverflow) | 1987-06-23 |
| JPH0638351Y2 true JPH0638351Y2 (ja) | 1994-10-05 |
Family
ID=31142632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985189909U Expired - Lifetime JPH0638351Y2 (ja) | 1985-12-09 | 1985-12-09 | 温度ヒュ−ズ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638351Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000011831A (ja) | 1998-06-19 | 2000-01-14 | Nec Kansai Ltd | 抵抗付温度ヒューズ |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4663758B2 (ja) * | 2007-08-20 | 2011-04-06 | 内橋エステック株式会社 | 抵抗付き温度ヒューズ及び電池保護回路板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5367425U (enrdf_load_stackoverflow) * | 1976-11-10 | 1978-06-06 | ||
| JPS6017776Y2 (ja) * | 1981-12-14 | 1985-05-30 | 内橋金属工業株式会社 | 温度ヒユ−ズ |
-
1985
- 1985-12-09 JP JP1985189909U patent/JPH0638351Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000011831A (ja) | 1998-06-19 | 2000-01-14 | Nec Kansai Ltd | 抵抗付温度ヒューズ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6298134U (enrdf_load_stackoverflow) | 1987-06-23 |
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