JPH0637436A - Printed circuit board and manufacture thereof - Google Patents
Printed circuit board and manufacture thereofInfo
- Publication number
- JPH0637436A JPH0637436A JP18529792A JP18529792A JPH0637436A JP H0637436 A JPH0637436 A JP H0637436A JP 18529792 A JP18529792 A JP 18529792A JP 18529792 A JP18529792 A JP 18529792A JP H0637436 A JPH0637436 A JP H0637436A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- solder
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、表面の半田突起に筐体
等の金属部材の導通部を接触させて固定するためのプリ
ント配線基板およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for fixing a conductive portion of a metal member such as a housing to a solder protrusion on the surface thereof and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】図３は従来の電子機器におけるプリント
配線基板上に筐体等の金属部材を固定するための構造を
示している。図３において、１はプリント配線基板であ
り、２はプリント配線基板１上に形成されたランドパタ
ーンであり、３はランドパターン２上にディップまたは
リフローにより形成された半田突起である。４は筐体等
の金属部材であり、５は金属部材４をプリント配線基板
１に固定するための固定ねじである。2. Description of the Related Art FIG. 3 shows a structure for fixing a metal member such as a casing on a printed wiring board in a conventional electronic device. In FIG. 3, reference numeral 1 is a printed wiring board, 2 is a land pattern formed on the printed wiring board 1, and 3 is a solder protrusion formed on the land pattern 2 by dipping or reflow. Reference numeral 4 is a metal member such as a housing, and 5 is a fixing screw for fixing the metal member 4 to the printed wiring board 1.
【０００３】金属部材４は、固定ねじ５によりプリント
配線基板１上に固定される。これにより、金属部材４
は、その下面の導通部がそれぞれの半田突起３に機械的
および電気的に接触してプリント配線基板１との導通が
図られる。The metal member 4 is fixed on the printed wiring board 1 by fixing screws 5. Thereby, the metal member 4
The conductive portion on the lower surface mechanically and electrically contacts the solder protrusions 3 to establish electrical connection with the printed wiring board 1.
【０００４】このように、上記従来のプリント配線基板
上に金属部材を固定する構造でも、金属部材のプリント
配線基板への固定と電気的導通とを同時に図ることがで
きる。As described above, even in the structure in which the metal member is fixed on the conventional printed wiring board, the fixing of the metal member to the printed wiring board and the electrical conduction can be achieved at the same time.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記従
来の構造では、プリント配線基板１自体の歪みや反りの
ため、プリント配線基板１の固定ねじ５に近い部位で
は、半田突起３と金属部材４とが確実に接触するもの
の、固定ねじ５から離れた部位では、固定ねじ５による
締め付け力が及ばないため、半田突起３と金属部材４と
の接触が不十分であったり、離れていたりする場合があ
り、電気的導通が不確実になって信頼性に欠ける問題が
あった。However, in the above-described conventional structure, due to the distortion and warpage of the printed wiring board 1 itself, the solder protrusion 3 and the metal member 4 are formed in the portion near the fixing screw 5 of the printed wiring board 1. However, since the tightening force by the fixing screw 5 is not exerted at the portion apart from the fixing screw 5, the solder protrusion 3 and the metal member 4 may be insufficiently contacted or separated from each other. However, there is a problem in that electrical continuity becomes uncertain and reliability is poor.
【０００６】本発明は、このような従来の問題を解決す
るものであり、プリント配線基板上の半田突起と金属部
材との電気的導通を確実にとることのできるプリント配
線基板およびその製造方法を提供することを目的とす
る。The present invention solves such a conventional problem, and provides a printed wiring board and a method of manufacturing the printed wiring board which can ensure electrical continuity between the solder protrusions on the printed wiring board and the metal member. The purpose is to provide.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明によるプリント配線基板は、金属部材に対し
導通をとるための半田突起の高さをプリント配線基板の
部位によって変えるようにしたものである。In order to achieve the above object, the printed wiring board according to the present invention is configured such that the height of the solder protrusion for conducting to the metal member is changed depending on the portion of the printed wiring board. It is a thing.
【０００８】また、本発明によるプリントは配線基板の
製造方法は、プリント配線基板上にランドパターンを設
け、その上に大きさの異なる開口部を持つリフローマス
クを配置して半田リフローを行なうことにより、ランド
パターン上に異なる高さの半田突起を形成するようにし
たものである。In the method for manufacturing a printed wiring board according to the present invention, a land pattern is provided on the printed wiring board, and a reflow mask having openings having different sizes is arranged on the land pattern to perform solder reflow. , The solder protrusions having different heights are formed on the land pattern.
【０００９】[0009]
【作用】したがって、本発明のプリント配線基板によれ
ば、金属部材に対し導通をとるための半田突起の高さを
プリント配線基板の部位によって変えるようにしたの
で、例えば固定ねじから離れるしたがって半田突起の高
さを少しずつ高くしておくことにより、プリント配線基
板が初めから反っていたとしても、その全体にわたって
半田突起と金属部材との電気的導通を確実にとることが
できる。Therefore, according to the printed wiring board of the present invention, the height of the solder projection for establishing conduction with respect to the metal member is changed depending on the portion of the printed wiring board. By gradually increasing the height of the solder, even if the printed wiring board is warped from the beginning, it is possible to ensure electrical continuity between the solder protrusion and the metal member over the entire area.
【００１０】また、本発明のプリント配線基板の製造方
法によれば、プリント配線基板の変更なしに、また大掛
かりな装置なしに、高さの異なる半田突起を容易に作成
することができる。Further, according to the method for manufacturing a printed wiring board of the present invention, solder protrusions having different heights can be easily formed without changing the printed wiring board and without a large-scale device.
【００１１】[0011]
【実施例】図１は本発明の一実施例の構成を示すもので
ある。図１において、１１はプリント配線基板であり、
１２はプリント配線基板１１上に形成されたランドパタ
ーンであり、１３はランドパターン１２上にリフローに
より形成された高さの異なる半田突起である。１４は筐
体等の金属部材であり、１５は金属部材１４をプリント
配線基板１１に固定するための固定ねじである。半田突
起１３は、固定ねじ１５に近い領域Ａの３個と少し離れ
た領域Ｂの３個とさらに離れた領域Ｃの３個とでそれぞ
れ順に高さが少しずつ高くなるように形成されている。
このような領域毎に分けず、個々の半田突起１３を順に
少しずつ高くするようにしてもよい。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the configuration of an embodiment of the present invention. In FIG. 1, 11 is a printed wiring board,
Reference numeral 12 is a land pattern formed on the printed wiring board 11, and 13 is a solder protrusion having a different height formed on the land pattern 12 by reflow. Reference numeral 14 is a metal member such as a housing, and 15 is a fixing screw for fixing the metal member 14 to the printed wiring board 11. The solder protrusions 13 are formed such that the heights thereof are gradually increased in three areas A close to the fixing screw 15, three areas B slightly apart and three areas C further apart. .
The individual solder protrusions 13 may be sequentially raised little by little without dividing into such regions.
【００１２】図２はこのような半田突起１３を形成する
ための方法を示している。その基本は、プリント配線基
板１上に形成されたランドパターン１２に対し、開口部
１６を有するリフローマスク１７を被せてリフローを行
なうことにより、ランドパターン１２上に半田突起１３
を形成するものである。いま、（ａ）のように、開口部
１６の大きさが、ランドパターン１２の大きさよりも小
さい場合は、リフロー時に開口部１６から流入した溶融
半田がランドパターン１２の面積全体を濡らそうとする
ので、その付着量は少なくなって半田突起１３の高さは
低くなる。これに対し（ｂ）のように開口部１６の大き
さをランドパターン１２の大きさと同じにすると、この
開口部１６から流入した溶融半田の量が多くなるので、
半田突起１３の高さも高くなる。FIG. 2 shows a method for forming such a solder protrusion 13. Basically, the land pattern 12 formed on the printed wiring board 1 is covered with a reflow mask 17 having an opening 16 for reflow, so that the solder protrusion 13 is formed on the land pattern 12.
Is formed. When the size of the opening 16 is smaller than the size of the land pattern 12 as shown in FIG. 3A, the molten solder flowing from the opening 16 at the time of reflow tries to wet the entire area of the land pattern 12. As a result, the amount of adhesion is reduced and the height of the solder protrusion 13 is reduced. On the other hand, if the size of the opening 16 is set to be the same as the size of the land pattern 12 as shown in (b), the amount of molten solder flowing from the opening 16 increases,
The height of the solder protrusion 13 also increases.
【００１３】図１において、金属部材１４は、固定ねじ
１５によりプリント配線基板１１上に固定されるが、こ
のときプリント配線基板１５が初めから縁端部に向けて
上向きに反っていたとすると、従来は固定ねじ１５の周
辺領域Ａは確実に金属部材１４と半田突起１３との導通
をとることができるが、固定ねじ１５から離れる領域
Ｂ、Ｃに行くにつれて両者の接触が不確実になる。これ
に対し、本実施例では、半田突起１３の高さが、プリン
ト配線基板の固定ねじ１５から遠ざかる領域ほど高く形
成されているため、プリント配線基板の全領域におい
て、半田突起１３と金属部材１４との電気的導通を確実
にとることができる。In FIG. 1, the metal member 14 is fixed on the printed wiring board 11 by a fixing screw 15. At this time, if the printed wiring board 15 is warped upward toward the edge portion from the beginning, it is conventional. In the peripheral region A of the fixing screw 15, the metal member 14 and the solder protrusion 13 can be surely conducted, but the contact between them becomes uncertain as it goes to the regions B and C away from the fixing screw 15. On the other hand, in the present embodiment, the height of the solder protrusion 13 is formed so as to be higher in the region farther from the fixing screw 15 of the printed wiring board, so that the solder protrusion 13 and the metal member 14 are formed in the entire area of the printed wiring board. It is possible to ensure electrical continuity with.
【００１４】[0014]
【発明の効果】このように、本発明のプリント配線基板
によれば、金属部材との導通をとるための半田突起の高
さをプリント配線基板の部位によって変えるようにした
ので、プリント配線基板が初めから反っていたとして
も、その全体にわたって半田突起と金属部材との電気的
導通を確実にとることができる。As described above, according to the printed wiring board of the present invention, the height of the solder protrusion for establishing conduction with the metal member is changed depending on the portion of the printed wiring board. Even if it warps from the beginning, it is possible to ensure electrical continuity between the solder protrusion and the metal member over the entire area.
【００１５】また、本発明のプリント配線基板の製造方
法によれば、プリント配線基板の変更なしに、また大掛
かりな装置なしに、高さの異なる半田突起を容易に作成
することができる。Further, according to the method for manufacturing a printed wiring board of the present invention, it is possible to easily form solder protrusions having different heights without changing the printed wiring board and without a large-scale device.
【図１】（ａ）本発明の一実施例におけるプリント配線
基板に金属部材を固定する構造の平面図 （ｂ）本発明の一実施例におけるプリント配線基板に金
属部材を固定する構造の断面図FIG. 1A is a plan view of a structure for fixing a metal member to a printed wiring board according to an embodiment of the present invention. FIG. 1B is a sectional view of a structure for fixing a metal member to a printed wiring board according to the embodiment of the present invention.
【図２】（ａ）本発明のプリント配線基板製造方法にお
ける開口部の小さいリフローマスクを使用した場合の模
式図 （ｂ）本発明のプリント配線基板製造方法における開口
部の大きいリフローマスクを使用した場合の模式図FIG. 2 (a) is a schematic view when a reflow mask having a small opening is used in the method for manufacturing a printed wiring board of the present invention. (B) A reflow mask having a large opening is used in the method for manufacturing a printed wiring board of the present invention. Schematic diagram of the case
【図３】（ａ）従来のプリント配線基板に金属部材を固
定する構造の平面図 （ｂ）従来のプリント配線基板に金属部材を固定する構
造の断面図FIG. 3A is a plan view of a structure for fixing a metal member to a conventional printed wiring board, and FIG. 3B is a sectional view of a structure for fixing a metal member to a conventional printed wiring board.
１１ プリント配線基板 １２ ランドパターン １３ 半田突起 １４ 金属部材 １５ 固定ねじ １６ 開口部 １７ リフローマスク 11 printed wiring board 12 land pattern 13 solder protrusion 14 metal member 15 fixing screw 16 opening 17 reflow mask
Claims (2)
的導通をとるためにプリント配線基板に形成される半田
突起の高さを、プリント配線基板の部位に応じて変化さ
せたプリント配線基板。1. A printed wiring board in which the height of a solder protrusion formed on the printed wiring board for electrical conduction to a metal member fixed to the surface is changed according to the site of the printed wiring board. .
設け、その上に大きさの異なる開口部を持つリフローマ
スクを配置して半田リフローを行なうことにより、前記
ランドパターン上に異なる高さの半田突起を形成したプ
リント配線基板の製造方法。2. A land pattern is provided on a printed wiring board, and a reflow mask having openings of different sizes is arranged on the land pattern to perform solder reflow, whereby solder protrusions having different heights are formed on the land pattern. A method for manufacturing a printed wiring board having a structure formed thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04185297A JP3143524B2 (en) | 1992-07-13 | 1992-07-13 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04185297A JP3143524B2 (en) | 1992-07-13 | 1992-07-13 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0637436A true JPH0637436A (en) | 1994-02-10 |
| JP3143524B2 JP3143524B2 (en) | 2001-03-07 |
Family
ID=16168398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04185297A Expired - Lifetime JP3143524B2 (en) | 1992-07-13 | 1992-07-13 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3143524B2 (en) |
-
1992
- 1992-07-13 JP JP04185297A patent/JP3143524B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3143524B2 (en) | 2001-03-07 |
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