JPH0637397A - Semiconductor component manufacturing apparatus - Google Patents

Abstract

PURPOSE:To perform bonding of a semiconductor chip automatically and continuously by a method wherein a semiconductor component is taken out from a conveying line and held, and the semiconductor component is transferred along a circular arc to provide a semiconductor component main part. CONSTITUTION:A stem assembly is conveyed on a conveying line 35 and a chip tray 71 on which laser diodes are placed is held by a chip tray holding part 34. The stem assembly and the laser diode are fed to a bonding part 33. A replacing part 32 which mounts the laser diode 4 on the stem assembly 6 to bond the diode 4 to the stem assembly 6 takes the stem assembly 6 out of the conveying line 35 and holds it, transfers the laser diode 4 along a circular arc, changes the posture of the stem assembly 6 and replaces the stem assembly 6 onto the bonding part 33. With this constitution, the replacement of the semiconductor component main part can be performed automatically and continuously.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing semiconductor parts such as a semiconductor laser apparatus.

[0002]

2. Description of the Related Art Generally, there is a semiconductor laser device having a structure as shown in FIG. That is, the semiconductor laser device 1 shown in FIG. 6 comprises a stem 2, a heat sink 3, a laser diode (laser chip) 4, and a cap 5. Two terminals 2a, 2a from the stem 2
And the stem 2 is coaxially combined with the annular heat sink 3. Then, the stem 2 and the heat sink 3 are integrated by a method such as resistance welding to form a stem assembly 6 as a semiconductor component body.

The heat sink 3 is formed with a projection 8 having a surface (hereinafter referred to as a bonding surface 7) perpendicular to the radial direction. The laser diode 4 is shown in FIG. Thus, the protrusion 8 is bonded to the bonding surface 7. Further, the cap 5 is coaxially combined with the heat sink 3. Then, the cap 5 covers the projecting portion 8, and the peripheral portion of the heat sink 3 projects outwardly of the cap 5 in a brim shape. Further, in recent years, a device for assembling the semiconductor laser device 1 as described above has been developed, and some steps are automated in this type of device.

In the manufacturing apparatus of the semiconductor laser device 1,
The stem assembly 6 is automatically conveyed with the heat sink 3 oriented almost right above. Then, the stem assembly 6 is transferred to the bonding portion 9 as shown in FIGS. 8A and 8B for bonding the laser diode 4. When supplying the stem assembly 6 to the bonding portion 9, the laser diode 4 can be mounted on the bonding surface 7 of the heat sink 3.
The stem assembly 6 is tilted about 90 °.

The supply of the stem assembly 6 to the bonding stage 9 is done manually. That is, the operator takes out the stem assembly 6 held on the transport line using tweezers, and changes the posture of the stem assembly 6 from the vertical orientation to the horizontal orientation. Then, the operator places the stem assembly 6 on the bonding portion 9 with the bonding surface 7 facing upward and positions it.

The bonding portion 9 holds the stem assembly 6 on the heater block 10 and resistance-heats the heater block 10. A bonding metal 11 is vapor-deposited on the bonding surface 7 of the stem assembly 6,
The heat of the heater block 10 is transferred to the stem assembly 6 and the joining metal 11 is melted. And laser dio-
The lead 4 is aligned with the stem assembly 6 and placed on the bond metal 11 and bonded. Here, as the bonding metal 11, for example, In and A
Compounds such as u are used.

The bonding portion 9 is provided on the installation base 12, and the heater block 10 is fixed on the bus bars 13 and 13 which are power feeding bodies. Below the booth bars 13 and 13, insulating blocks 14 and 14 are provided to insulate the booth bars 13 and 13 from the installation table 12.

The shape of the heater block 10 is set so that the resistance is highest in the lower portion of the stem assembly 6. That is, the notch 1 is formed in the heater block 10.
5 is provided, and the heater block 10 is formed in a U shape. The both ends of the heater block 10 are connected to the bus bars 13 and 13 so that the middle portion faces upward. Then, the stem assembly 6 is mounted on the intermediate portion of the heater block 10.

Further, this type of manufacturing apparatus is provided with a chip tray holding portion 16 as shown in FIG. 9, for example. The chip tray holding section 16 has an XY drive mechanism section 17 and a θ drive mechanism section 18. The XY drive mechanism unit 17 is provided with an X table 19 and a Y table 20 which are linearly displaced in two orthogonal axes, and the tables 19 and 20 are driven by actuators 21 and 22, respectively. To be done.

The θ drive mechanism section 18 is connected to the XY drive mechanism section 17, and has a tray stage 23 at its tip. The tray stage 23 is composed of a plurality of laser diodes 4.
Is held on the tray stage 23 by a method such as mechanical clamping or vacuum suction. In the chip tray 24, the laser diodes 4 ... Are regularly arranged at substantially equal intervals.

An actuator 25 for θ drive is provided on the base end side of the θ drive mechanism section 18. This actuator is
The tray 25 and the tray stage 23 are connected via pulleys 26, 27 and a timing belt 28. The driving force of the actuator 25 is applied to the tray stage 23.
The tray stage 23 is rotationally displaced in the θ direction.

Laser diode 4 on chip tray 24
Are illuminated, and the laser diode 4 is recognized as an image. Then, a suction nozzle (not shown) such as a collet makes contact with the upper surface of the laser diode 4 to suck the laser diode 4, and conveys it to the bonding portion 9.

The above is a description of the case of the laser diode 4 ... In addition to this, for example, in the case of an IC chip or the like,
Hold the IC chip attached to the wafer sheet,
A method may be adopted in which the IC chip is directly extracted from the wafer sheet and supplied to the bonding portion.

[0014]

By the way, the above manufacturing apparatus has the following problems.

That is, when the stem assembly 6 is taken out from the transport line, the bonding metal 11 is damaged by the tweezers, and the bonding bondability between the laser diode 4 and the stem assembly 6 deteriorates. And
Yield and product reliability are reduced.

Since the work of transferring the stem assembly 6 to the bonding portion 9 was manually performed,
When the posture of the stem assembly 6 was changed, it was necessary to change the handle, which required a lot of time for the change, and the productivity was poor.

Since the work of transferring the stem assembly 6 to the bonding portion 9 was performed manually,
In the bonding portion 9, the positioning accuracy of the stem assembly 6 was poor, and it was difficult to improve the bonding accuracy.

Further, the heat capacity of the heater block 10 as shown in FIGS. 8 (a) and 8 (b) is large, so that it takes a lot of time to heat up / cool down the heater block 11 itself. The bonding time was long. And the cycle time was long and the productivity was poor.

Since the heater block 10 has a large heat capacity, it has a large thermal effect on peripheral members, and the fastening members such as screws are easily loosened. And, maintenance was required in a short cycle, and the operation rate was low.

Since the notch 15 was formed in the heater block 10, thermal stress was concentrated in the middle portion of the heater block 10 and the heater block 10 sometimes cracked.
That is, since the life of the expensive heater block 10 is short,
Many maintenance costs were needed.

The laser diode 4 is vulnerable to electrical disturbance such as surge voltage. However, when a current flows directly through the heater block 10, the laser diode 4 has a surge voltage. The yield was low because it could be destroyed by.

When a very small chip such as the laser diode 4 or CMOS is handled, the chip tray 24 is used.
Is tilted, the amount of light from the upper surface of the chip is greatly affected by the tilt, which makes it difficult to perform accurate recognition. Therefore, due to the inclination of the chip tray 24, the bonding accuracy is deteriorated and the operation rate of the manufacturing apparatus as a whole is reduced.

Further, when the chip tray 24 is inclined, it is difficult to obtain high parallelism between the suction nozzle and the laser diode 4. For this reason, a suction error may occur, or an indentation of the suction nozzle may remain on the laser diode, which may reduce the reliability of the product. An object of the present invention is to provide a semiconductor component manufacturing apparatus capable of automatically and continuously bonding semiconductor chips.

[0024]

In order to achieve the above object, the present invention conveys a semiconductor component body on a conveying line and holds a chip tray on which a semiconductor chip is mounted on a chip tray holding portion. In a semiconductor component manufacturing apparatus that supplies a semiconductor component body and a semiconductor chip to a bonding portion, mounts the semiconductor chip on the semiconductor component body, heats the semiconductor component body, and bonds the semiconductor chip to the semiconductor component body The component is taken out and held, the semiconductor component is moved in an arc shape to change the posture of the semiconductor component main body, and a replacement portion for replacing the semiconductor component main body with the bonding portion is provided. And according to the present invention,
It becomes possible to automatically and continuously replace the semiconductor component body.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The same parts as those described in the section of the prior art are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 1 shows a first embodiment of the present invention. Reference numeral 31 in the drawing is a manufacturing apparatus for a semiconductor laser device as a semiconductor component. In this manufacturing device 31,
A replacement section 32 for replacing the semiconductor laser device 1, a bonding section 33, and a chip tray holding section 34 are provided. Further, the manufacturing apparatus 31 is provided with a linear transfer line 35, and a supply side magazine 36 and a recovery side magazine 37 are provided on both sides of the transfer line 35.

In the supply-side magazine 36, a plurality of carriers 38 formed in the shape of a rectangular plate are vertically arranged, and each carrier 38 has a plurality of stem assemblies 6 as semiconductor component bodies. 38 are arranged in a line along the longitudinal direction. The stem assemblies 6 ... Are inserted into the insertion holes 39 ... Formed in the carrier 38, and the stem 2 is directed almost directly above. Then, the carriers 38 ... Are taken out one by one from the supply-side magazine 36 and placed on the transport line 35.

The carrier 38 is pitch-fed along the carrying line 35 by a carrier carrying unit (not shown) and reaches the intermediate portion of the carrying line 35. As shown in FIG. 2, pilot holes 40 are formed at regular intervals on both side edges of the carrier 38.
Are provided, and a carrier positioning portion (not shown) positions the carrier 38 by using the pilot holes 40.

Stem assemblies 6 ... Are sequentially taken out from the carrier 38 by a replacement portion 32 which will be described later. Each time the stem assembly 6 is taken out, the carrier 38 is pitch-fed and the next stem assembly 6 is positioned at a predetermined position. Then, after the removal of all the stem assemblies 6 ... Is completed, the carrier 38 is sent to the collecting side magazine 37 and is collected in the collecting side magazine.

The replacing section 32 is arranged below the portion in the middle of the transfer line 35. As shown in FIG. 2, a replacement nozzle (hereinafter referred to as a nozzle) 41 and a pulse motor (hereinafter referred to as a motor) 4 are provided in the replacement section 32.
2 and the driving force transmission mechanism portion 43 are provided, and these are supported by the support body 44.

The nozzle 41 is formed in a tubular shape, and is curved in an arc shape from one end to the other end. Further, the nozzle 41 is connected at its one end side to the tip portion of the nozzle holding arm 45. A negative pressure pipe 46 is connected to the tip of the nozzle holding arm 45, and the replacement nozzle 41 communicates with the negative pressure pipe 46. And the replacement nozzle 4
1 communicates with a negative pressure source (not shown) via a negative pressure pipe 46.

The driving force transmission mechanism 43 is provided with two cams 47 and 48, a cam lever 48, a sector gear 50, and a pinion gear 51. The first cam 47 is connected to the output shaft of the motor 42, and the cam surface of the first cam 47 is in contact with the first cam follower 52 fixed to the support body 44. The interlocking plate 53 is attached to the first cam 47, and the cam side lever 49, the sector gear 50, the pinion gear 51, and the like are held by the interlocking plate 53.

The second cam follower 5 is attached to the second cam 48.
4 are in contact with each other, and the second cam follower 54 is attached to the end of the cam side lever 49. Cam side lever -4
9 is connected to the sector gear 50 while freeing the end on the second cam 48 side. The sector gear 50 has teeth 55 on the opposite side to the part connected to the cam lever 49, and the teeth 55 are meshed with the teeth 56 of the pinion gear 51. Further, the pinion gear 51 is connected to the base end portion of the nozzle holding arm 45.

As shown in FIGS. 3 (a) and 3 (b), the bonding portion 33 includes a heater block 57, a main heater 58, bus bars 59, 59, and insulating blocks 60, 6.
0 and the heat insulating material 61. Installation stand 1
Two insulating blocks 60, 60 are placed on the upper part 2 so as to be separated from each other, and the bus bars 59, 59 are stacked on the insulating blocks 60, 60. Boots bar 59,5
The feeders 62, 62 guided to be substantially horizontal are connected to the outer side of 9.

The main heater 58 is made of a rectangular plate-like member and straddles both the bus bars 59 and 59. Further, both ends of the main heater 58 in the longitudinal direction are placed on the busbars 59 and 59, and the booth bar 5 is attached via fixing screws 63 and 63.
It is bound to 9,59.

The heater block 57 is made of, for example, copper or the like, and is mounted on the main heater 58. The heater block 57 is fixed to the middle portion of the main heater 58 in the longitudinal direction via fixing screws 64, 64. Further, the heater block 57 is designed so that the heat capacity is as small as possible.

That is, the heater block 57 has a base portion 65 and a stem holding portion 66, and the base portion 65 is provided.
The lower surface 67 of the main heater 58 is in full contact with the upper surface 68 of the main heater 58. The stem holding portion 66 is vertically provided along the front edge portion of the base portion 65, and is formed in a trapezoidal shape that narrows toward the upper side. The stem holding portion 66 is formed in a stepped shape so as to match the shape of the stem assembly 6.

A heat insulating material 61 is provided between the two bus bars 59, 59.
Is located, and the heat insulating material 61 is in contact with the main heater 58 from the lower surface side. A fixing plate 69 is attached along one side edge of the lower surface of the heat insulating material 61, and fixing screws 64, 64 screwed into the heater block 57 penetrate the heat insulating material 61 to fix the fixing plate. It has reached 69. And the heat insulating material 6
1 is held on the main heater 58 by fixing screws 64, 64 and a fixing plate 69.

The heater block 57 and the main heater 58 are also included.
Is coated with an electrically insulating material such as TiN, and an electrically insulating film (hereinafter referred to as an insulating film) 70 is formed as shown in FIG. The insulating film 70 is
It is formed on almost the entire surface of the base portion 65 of the heater block 57 except the lower surface 67. The insulating film 70 is formed on the upper surface 68 of the main heater 58. Furthermore, the main heater 5
The insulating film on the upper surface of the base 8 which is in contact with the lower surface 67 of the base 65 is removed.

As shown in FIG. 5, the chip tray holding portion 34 has a tray stage 72 for holding the chip tray 71, a ball seat table 74 having a ball seat 73 in the lower central portion,
Also, a ball seat support 76 having a receiving hole 75 in the center is provided.

Of these, the ball seat table 74 is fitted into the ball seat support 76, and the ball seat 73 is inserted into the receiving hole 75. The ball seat table 74 causes the curved surface of the ball seat 73 to abut on the taper surface 77 of the ball seat pedestal 76, and a gap 78 is provided between the peripheral edge portion and the peripheral edge portion of the ball seat pedestal 76. Is formed.

Further, for example, three or more mounting screws 79 ... Are screwed around the peripheral edge of the ball seat table 74, and the ball seat table 74 and the ball seat cradle 73 are mounted screws 79. Are connected via. By selectively loosening the mounting screws 79 ..., The gap 78 between the ball seat table 74 and the ball seat pedestal 73 is changed, and the ball seat table 74 is moved to the ball seat pedestal 73. Lean against. And these ball table 74,
The ball seat pedestal 73, the mounting screws 79, etc. constitute an inclination adjusting mechanism 80.

A through hole 81 is formed in the ball table 74, and a stepped rotary shaft 82 is inserted into the through hole 81. The rotating shaft 82 is connected to the ball seat table 74 via a bearing 83, and is also connected to the tray stage 72 at the lower central portion. A pulley 84 is attached to the lower end of the rotary shaft 82, and a timing belt 85 is hung on the pulley 84. Then, the power of an actuator (not shown) is transmitted to the rotary shaft 82 via the timing belt 85 and the pulley 84, and the tray stage 72 is rotationally displaced in the θ direction.

The tray stage 72 is a chip tray 71.
The chip tray 71 is placed upward while engaging the peripheral portions of the. Further, the tray stage 72 has a bottom surface 8
6 and the lower surface of the chip tray 71, a space 87 for adsorption.
Is formed. Further, a negative pressure suction passage 88 is formed in the tray stage 72, and one end of the negative pressure suction passage 88 is opened at the center of the bottom surface 86.

On the side surface of the tray stage 72, a connecting member 8
The negative pressure pipe 90 is connected via 9 and the negative pressure pipe 9
0 communicates with the negative pressure suction passage 88. The negative pressure tube 90 is guided to the tray stage 72 from a negative pressure source (not shown).
Then, the suction space 87 is vacuum-sucked through the negative pressure tube 90 and the negative pressure suction passage 88, and the chip tray 71 is suction-held on the tray stage 72. Here, the chip tray holder 34 is placed on the XY table, and the chip tray 71 is positioned in the XYθ directions. Next,
The operation of the manufacturing apparatus 31 described above will be described.

First, when the carrier 38 is stopped at the intermediate portion of the transfer line 35, the replacement section 32 is driven, and the output of the pulse motor 42 is transmitted to the replacement nozzle 41 via the driving force transmission mechanism section 43. The replacement nozzle 41 moves up and down and rotates in the forward and reverse directions of about 90 °. Then, the replacement nozzle 41 moves upward, rotates in the forward direction, stops, rotates in the reverse direction, as indicated by arrows A and B in FIG.
And, each operation of descending is performed in order.

That is, the displacing nozzle 41 moves up and approaches the conveying line 35 from the lower side, and reaches the one stem assembly 6 held by the carrier 38. The terminals 2a, 2 of the stem assembly 6 are attached to the tip of the replacement nozzle 41.
a enters and the open end of the replacement nozzle 41 is closed by the heat sink 3. The inside of the replacement nozzle 41 is vacuum-sucked through the negative pressure pipe 46, and the stem assembly 6 is suction-held by the replacement nozzle 41.

Further, the replacement nozzle 41 is inserted into the insertion hole 39 into which the stem assembly 6 is inserted,
While rotating with the nozzle holding arm 45,
Lift assembly 6. Furthermore, as shown in FIG. 2, the tip of the replacement nozzle 41 is oriented substantially horizontally. At this time, the posture of the stem assembly 6 is changed from vertical to horizontal. The replacement nozzle 41 is a stem
The assembly 6 is moved in an arc shape and sent to the bonding section 33 while changing its posture. Then, the stem assembly 6 is replaced on the heater block 57 of the bonding portion 33.

In the bonding section 33, the main heater 58 is supplied with power from the busbars 59, 59, and the heater block 57 is supplied with electricity via the main heater 58. And
The main heater 58 and the heater block 57 generate juule heat, and the stem assembly 6 on the heater block 57 is resistance-heated. And, for example, the heating temperature is about 250.
℃.

In the chip tray holding section 34, the attitude of the chip tray 71 is kept horizontal by the tilt adjusting mechanism 80. A laser diode (laser chip) as semiconductor chips arranged on the chip tray 71.
4 is image-recognized while being illuminated. Here, reference numeral 92 in FIG. 1 indicates an optical system for image recognition.

The suction nozzle 91, such as a collet, is set to a desired position.
The laser diode 4 is brought into contact with the laser diode 4, and the laser diode is adsorbed and conveyed to the bonding section 33. Then, the transported laser diode 4 is placed on the bonding surface 7 of the stem assembly 6. Here, reference numeral 9 in FIG.
Reference numeral 3 denotes an optical system for image recognition.

Bonding 7 of stem assembly 6
The joining metal 11 is supplied to the stem assembly 6 from the heater block 57 in advance.
It is melted by the heat transferred to. Then, the laser diode 4 is joined to the stem assembly 6 via the joining metal 11.

After the joining of the laser diode 4 is completed, the replacement nozzle 41 descends while holding the stem assembly 6. The stem assembly 6 is returned to the transfer line 35 by the replacement nozzle 41, and is inserted upward into the insertion hole 39 of the carrier 38.

In the manufacturing apparatus 31 as described above, the replacement nozzle 32 is provided in the replacement section 32, and the replacement nozzle 41 moves up and down and rotates in the forward and reverse directions. After the stem assembly 6 is held by the replacement nozzle 41, it is conveyed in an arc shape and placed on the bonding section 33.

Therefore, the posture of the stem assembly 6 can be changed without changing the holding of the stem assembly 6 on the way or stopping the replacement nozzle 41 on the way. Then, the stem assembly 6 can be replaced automatically and continuously.

Further, since the replacement of the stem assembly 6 can be performed without relying on human hands, the joining metal 11 is not damaged by tweezers or the like, and the yield and the product reliability are high.

Further, since the replacement of the stem assembly 6 can be performed without relying on human labor, the transfer of the stem assembly 6 can be easily carried out in a short time and the productivity is high.

Furthermore, since the replacement portion 41 automatically replaces the stem assembly 6 with the bonding portion 33,
The positioning accuracy of the stem assembly 6 is good, and the bonding accuracy can be easily improved.

The bonding portion 33 is provided with a heater block 57 and a main heater 58,
The heater block 57 is supplied with power via the main heater 58. That is, since the heat generating portion is divided into the heater block 57 and the main heater 58, the heat block 57 is divided.
The shape of the heater block 57 is not limited, and the heater block 57 can be freely designed. Since the heater block 57 of the bonding portion 33 is designed to have a small heat capacity, the time required for raising and lowering the heat of the heater block 57 itself is short. Therefore, the bonding time can be shortened,
Cycle time is shortened and productivity is improved.

Since the heat capacity of the heater block 57 is small, the thermal influence on the peripheral members is small, and the fixing screws 63,
Fastening members such as 64 are not easily loosened. The maintenance work cycle is short and the operation rate is high.

Also, the heater block 57 and the main heater 58
Because double heating is done using
The stem assembly 6 can be heated at a conventional temperature of about 60%). Therefore, the heat block 57 and the main heater 58 are less likely to be thermally consumed, and the replacement frequency of the heat block 57 and the main heater 58 is significantly reduced.

The heater block 57 is connected to the busbars 59, 59 via the main heater 58, and since there is no notch in the center of the heater block 57, the heater block 1
It is difficult for thermal stress to concentrate on 0, and cracks in the heater block 57 can be prevented. Therefore, the life of the heater block 57 can be extended and the maintenance cost can be reduced.

Further, the heater block 57 is the main heater 5.
Since it is connected to the boots bars 59, 59 via 8, the shape of the heater block 57 can be set to a simple plate shape, and the maintenance cost can be maintained even if the heater block 57 is treated as a consumable item. Is cheap.

Further, since the insulating film 70 is formed on the heater block 57, it is possible to prevent an electric disturbance such as a surge voltage from being applied to the laser diode 4. Therefore, the laser diode 4 can be prevented from being destroyed by an electric disturbance, and the yield can be improved. The insulating film 70 is used as a target semiconductor component (in this case, a semiconductor laser).
It may be omitted depending on the characteristics of the device 1.

Further, since the tilt adjusting mechanism 80 is provided in the chip tray holding portion 34, the attitude of the chip tray 71 can be kept horizontal. Therefore, the amount of light for recognizing the laser diode 4 is stable, and accurate recognition is possible regardless of the size of the recognition object. Then, the bonding accuracy and operating rate can be improved.

Further, since the chip tray holding portion 34 is provided with the inclination adjusting mechanism 80, the suction nozzle 91 and the tray are arranged.
The parallelism with the diode 4 can be easily adjusted. Therefore, it is possible to prevent the suction error and the indentation of the suction nozzle on the laser diode 4 ..., and the reliability of the product is improved.

In particular, when the object is very small and the chip tray 71 is tilted, an area where the suction nozzle does not reach occurs on the chip tray 71, and the laser diode within that area is generated.
There was a case that D4 ... remained without being adsorbed. However, if the tilt of the chip tray 71 is adjusted by using the tilt adjusting mechanism 80, the laser diodes 4 ... Can be attracted evenly, and the laser diodes 4 ... Can be prevented from remaining on the chip tray 71. it can. Further, since the ball seat 73 and the taper surface 77 are used for adjusting the inclination of the chip tray 71, the processing is easy. The present invention can be variously modified without departing from the spirit of the invention.

[0068]

As described above, according to the present invention, the semiconductor component main body is conveyed on the conveying line, and the chip tray on which the semiconductor chips are mounted is held on the chip tray holding portion. In the semiconductor component manufacturing apparatus that supplies the semiconductor chip to the semiconductor component body, heats the semiconductor component body to bond the semiconductor chip to the semiconductor component body, removes and holds the semiconductor component from the transfer line, A component is moved in an arc shape to change the posture of the semiconductor component body, and a replacement portion for replacing the semiconductor component body with the bonding portion is provided. Therefore, the present invention has the effect that the semiconductor component body can be replaced automatically and continuously.

[Brief description of drawings]

FIG. 1 is a perspective view showing a part of a main part of an embodiment of the present invention as seen through.

FIG. 2 is a perspective view showing a part of the replacement portion as seen through.

3A and 3B show a bonding portion, FIG. 3A is a side view partially cut away, and FIG. 3B is a front view.

FIG. 4 is an explanatory view showing an insulating film of a bonding portion.

FIG. 5 is a sectional view showing a chip tray holding portion.

FIG. 6 is an exploded perspective view of a general semiconductor laser.

FIG. 7 is an explanatory view showing a bonding state of a laser diode.

8A and 8B show a bonding portion of a conventional manufacturing apparatus, in which FIG. 8A is a partially cutaway side view and FIG. 8B is a front view.

FIG. 9 is a perspective view showing a part of a conventional chip tray holding portion as seen through.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor laser device (semiconductor component), 4 ... Laser diode (semiconductor laser chip), 6 ... Stem assembly (semiconductor component main body), 31 ... Semiconductor component manufacturing apparatus,
32 ... Replacement part, 33 ... Bonding part, 34 ... Chip tray holding part, 35 ... Conveying line, 57 ... Heater block, 58 ... Main heater, 59, 59 ... Boots bar, 60,
60 ... Insulating block, 71 ... Chip tray, 80 ... Inclination adjusting mechanism.

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[Procedure amendment]

[Submission date] September 10, 1993

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

[Figure 1]

Claims (3)

[Claims] 1. A semiconductor component body is conveyed on a conveying line, a chip tray on which a semiconductor chip is mounted is held on a chip tray holding portion, and the semiconductor component body and the semiconductor chip are supplied to a bonding portion. In the semiconductor component manufacturing apparatus for mounting the semiconductor chip on the semiconductor component body, heating the semiconductor component body to bond the semiconductor chip to the semiconductor component body, the semiconductor component is taken out from the transfer line and held, 2. A semiconductor component manufacturing apparatus, comprising: a semiconductor component body moving in an arc shape to change a posture of the semiconductor component body; and a replacement portion for replacing the semiconductor component body with the bonding portion. 2. A heater block for heating the semiconductor component body, a main heater for heating the heater block, and a boots bar for supplying power to the main heater. The semiconductor component manufacturing apparatus according to claim 1, further comprising an insulating block that supports the bus bar. 3. The semiconductor component manufacturing apparatus according to claim 1 or 2, wherein the chip tray holding device has an inclination adjusting mechanism.